JPH10135372A5 - - Google Patents

Info

Publication number
JPH10135372A5
JPH10135372A5 JP1996305635A JP30563596A JPH10135372A5 JP H10135372 A5 JPH10135372 A5 JP H10135372A5 JP 1996305635 A JP1996305635 A JP 1996305635A JP 30563596 A JP30563596 A JP 30563596A JP H10135372 A5 JPH10135372 A5 JP H10135372A5
Authority
JP
Japan
Prior art keywords
semiconductor device
insulating substrate
semiconductor element
semiconductor
connection portions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1996305635A
Other languages
English (en)
Japanese (ja)
Other versions
JPH10135372A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP8305635A priority Critical patent/JPH10135372A/ja
Priority claimed from JP8305635A external-priority patent/JPH10135372A/ja
Publication of JPH10135372A publication Critical patent/JPH10135372A/ja
Publication of JPH10135372A5 publication Critical patent/JPH10135372A5/ja
Pending legal-status Critical Current

Links

JP8305635A 1996-10-31 1996-10-31 半導体装置 Pending JPH10135372A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8305635A JPH10135372A (ja) 1996-10-31 1996-10-31 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8305635A JPH10135372A (ja) 1996-10-31 1996-10-31 半導体装置

Publications (2)

Publication Number Publication Date
JPH10135372A JPH10135372A (ja) 1998-05-22
JPH10135372A5 true JPH10135372A5 (enrdf_load_html_response) 2004-10-21

Family

ID=17947512

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8305635A Pending JPH10135372A (ja) 1996-10-31 1996-10-31 半導体装置

Country Status (1)

Country Link
JP (1) JPH10135372A (enrdf_load_html_response)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4944427B2 (ja) * 2005-11-09 2012-05-30 大成プラス株式会社 Ｉｃタグの製造方法
KR100713931B1 (ko) * 2006-03-29 2007-05-07 주식회사 하이닉스반도체 고속 및 고성능의 반도체 패키지

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