JPH10126093A - Carrier system of semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent the separation miss and mark damage, to speed up carriage, and to facilitate standard transfer in the case of the carriage of semiconductor device. SOLUTION: A detection sensor detects that a semiconductor device A at the frontmost end of a carrier 1 continuously belt-conveyed in one line state is carried at the carriage outlet in the downstream end in the carrier direction. Next, the semiconductor device A at the frontmost end is suction-held by a suction nozzle 16 according to the detection signal of the detection sensor. At this time, an endless belt 7 is plunged into a relief trench 17 by the plunge force so as to lower the belt carrier surface on this position that than on the other position. After reversing the following semiconductor by reversing the endless belt 7 in this state on the upstream side on the carriage direction, the semiconductor device A at the frontmost end is carried out of the carriage outlet 14. In such a constitution, the aperture dimension of the outlet 14 in the carriage direction of the carriage outlet 14 is specified to be longer than the length dimension of the carriage direction of one semiconductor device but shorter than that of two semiconductor devices A.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement in a transfer apparatus for continuously transferring a plurality of semiconductor devices by belt, and more particularly to a measure for unloading a frontmost semiconductor device reaching a downstream end in the transfer direction from the transfer apparatus. Things.

[0002]

2. Description of the Related Art In recent years, belt transport has been widely used in various fields because of its simple structure and low cost, and is no exception in the semiconductor industry. Usually, a plurality of semiconductor devices are continuously belt-conveyed in consideration of conveyance efficiency, and are carried into the next operation process. 7 to 10 show an example of such a transport device. The transfer device 101 is installed between a preceding work station (jig) 102 and a next work station (not shown), and transfers the semiconductor device A, which has completed a predetermined operation in the previous work station 102, to the transfer device 101. They are carried in a progressive manner and carried out to the next work station. The procedure of the transfer will be specifically described below.

A plurality of semiconductor devices A, which have completed a predetermined operation at the former work station 102, are carried one by one into a transfer path 103 of a transfer device 101, and are moved around a shaft 105 around a front end and a rear end of a transfer base 104. The drive motor 1 is placed on an endless belt 109 which is stretched over two driven pulleys 106 rotatably mounted and a drive pulley 108 connected to an output shaft 107a of the drive motor 107.
The endless belt 109 is caused to travel toward the next work station side by the activation of 07. As a result, the plurality of semiconductor devices A are continuously transported in a row to the next work station. At this time, the cover member 110 covering the upper surface of the transport base 104 regulates the vertical and horizontal fluctuations of the semiconductor device A.

The semiconductor device A at the forefront end is in the carry-out port 111
When it reaches this side, it is detected by a first detection sensor 112 composed of a pair of left and right photoelectric tubes, and the first detection sensor 112 which is supported by a bracket 114 and installed above by a command of a controller 113 including a CPU or the like receiving the detection signal. The one hydraulic cylinder 115 is extended downward, and the end of the piston rod 115 a is projected into the transport path 103. As a result, the tip of the piston rod 115a of the first hydraulic cylinder 115 stands in front of the frontmost semiconductor device A, abuts against the side surface of the semiconductor device A from the front in the transport direction, and advances all the semiconductor devices A on the transport path 103. Is regulated (see FIG. 8).

A second hydraulic cylinder 116 arranged in parallel with the upstream side of the first hydraulic cylinder 115 in the transport direction is extended downward by a command from the controller 113, and the tip of the piston rod 116 a projects into the transport path 103. Let it. Thereby, the second hydraulic cylinder 11
The tip of the sixth piston rod 116a presses the upper surface of the semiconductor device A following the semiconductor device A at the forefront from above (see FIG. 9).

The first hydraulic cylinder 115 is contracted by a command from the controller 113, and the tip of the piston rod 115 a is retracted from the transport path 103.
As a result, the forward end semiconductor device A is released from the advance regulation and advances to the carry-out port 111, contacts the stopper 117 at the downstream end in the transport direction, and does not further advance. At this time, since the subsequent semiconductor device A is pressed by the tip of the piston rod 116a of the second hydraulic cylinder 116, it does not advance and stops at that position, and the frontmost semiconductor device A and the succeeding semiconductor device A Are separated (see FIG. 9).

The foremost semiconductor device A is a stopper 11
7 is detected by a second detection sensor 118 comprising a pair of left and right photoelectric tubes, and the suction nozzle 119 above the carry-out port 111 is lowered by a command from the controller 113 having received this detection signal to lower the suction nozzle 119. The semiconductor device A at the front end is sucked and held, and the suction nozzle 119 is raised and horizontally moved to be carried out to the next work station. The suction nozzle 119 unloads the semiconductor device A, and then unloads the semiconductor device A.
Returning upward, the next semiconductor device A is prepared for unloading.

When the ascent of the suction nozzle 119 starts, the first hydraulic cylinder 115 is
13 and the piston rod 1
The leading end of the semiconductor device 15a projects into the transport path 103, and waits for the subsequent semiconductor device A. Subsequently, the second hydraulic cylinder 116 is contracted to operate the piston rod 11.
6a The tip is retracted from the transport path 103. This allows
For the succeeding semiconductor device A, the advance regulation is released and the carry-out port 1 is released.
The first fluid pressure cylinder 115 is moved forward by 11 and hits the tip of the piston 115a of the first hydraulic cylinder 115, so that further movement is restricted (see FIG. 8).

While the above operations are sequentially repeated, a plurality of semiconductor devices A are placed one by one in the pre-stage work station 1.
From 02, it is carried into the transport device 101 in a sequential manner and carried out to the next work station.

On the upper surface of the transport base 104, two convex stripes 120 (shown in FIG. 10) are protruded in parallel.
The ridge 120 guides the endless belt 109 so as not to meander left and right. Figures 7-9
Reference numeral 121 denotes a through hole through which the light beam of the first detection sensor 112 passes, and reference numeral 122 denotes a through hole through which the light beam of the second detection sensor 118 passes.

[0011]

However, in the conventional transfer apparatus 101 as described above, when the preceding and following semiconductor devices A are separated, the succeeding semiconductor device A is connected to the second hydraulic cylinder 1.
In the process of transporting the semiconductor device A, if a part of the semiconductor device A following the foremost semiconductor device A overlaps from above, the pressing force is applied to the foremost semiconductor device A. Acting and succeeding semiconductor device A
However, there is a case where a so-called choke stop, which cannot be transported temporarily due to being caught, may occur. As shown in FIG. 11, the overlapping of the semiconductor devices A is particularly caused by the resin package a1.
Tend to occur frequently in the resin-encapsulated semiconductor device A from which a plurality of outer leads a2 protrude. That is, the resin-encapsulated semiconductor device A is one in which a semiconductor chip is mounted on a lead frame, resin-encapsulated, and molded.
When the mold resin leaks from the mating surface of the mold, burrs a3 occur around the side surface of the package a1 of the molded semiconductor device A, and the burrs a in the front and rear semiconductor devices A.
3 overlaps.

Further, since the subsequent upper surface of the semiconductor device A is pressed by the second hydraulic cylinder 116, marks such as a trademark, a product name, and a lot number printed on the package a1 may be damaged.

Further, since the front and rear semiconductor devices A are separated by repeating the extension and contraction operations of the two first and second hydraulic cylinders 115 and 116, there is a problem that the transfer speed is slow.

In addition, the semiconductor device A which has been transported
When a semiconductor device A having a different standard (length and size) is transported, the transport device 101 as described above uses the cover material 11.
0 and the stopper 117 are replaced with ones conforming to semiconductor devices of different standards.
Has to be moved in the elongated hole 114a formed in the bracket 114 in accordance with the length of the semiconductor device A having different standards to adjust the position.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and it is an object of the present invention to prevent separation errors when transporting semiconductor devices, prevent damage to marks, increase the speed of transport, and facilitate standard switching. Is to try.

[0016]

SUMMARY OF THE INVENTION To achieve the above object, the present invention provides a semiconductor device in which the running direction of an endless belt is switched when a semiconductor device is carried out, the shape of a carry-out port and the running of the endless belt. The structure around the downstream end of the transfer base in the transfer direction is devised.

Specifically, according to the present invention, a transport path is formed between a transport base and a cover material that covers the upper surface of the transport base, and an endless belt is supported on the upper surface of the transport base by the transport path. The plurality of semiconductor devices were conveyed continuously in a single row while regulating vertical and horizontal fluctuations with the cover material, and were conveyed to a carry-out port opening above the downstream end in the carrying direction. The following solution is taken for a semiconductor device transporting apparatus which carries out the semiconductor device at the forefront end by sucking and holding it by the suction means above the carry-out port and carrying out the semiconductor device.

That is, a first solution of the present invention is to provide a driving means for starting and reversing the endless belt so that the endless belt travels downstream or upstream in the conveying direction. Further, there is provided a detecting means for detecting that the frontmost semiconductor device has been transported to the carry-out port. Further, the suction means is operated based on the detection signal of the detection means, and the front end semiconductor device is suction-held by the suction means so as not to move. In this state, the driving means is reversely activated to move the endless belt in the transport direction. A control means is provided for retreating the semiconductor device following the foremost semiconductor device by running backward in the upstream direction. Further, the opening dimension in the transport direction of the carry-out port is set to be longer than the length dimension of one semiconductor device in the transport direction and shorter than the length dimension of two semiconductor devices in the transport direction. In addition, a relief groove is formed at a location corresponding to the carry-out port on the upper surface of the transfer base. Then, at the time of suction by the suction means, the endless belt is pushed into the relief groove by a pressing force due to the suction means coming into contact with the semiconductor device, and the belt conveyance surface of the relevant portion is lower than the belt conveyance surface of another portion. It is characterized by having become.

With the above arrangement, in the first solution of the present invention, a plurality of semiconductor devices are mounted on an endless belt, and the conveying paths are continuously arranged in a line while the vertical and horizontal fluctuations are restricted by the cover material. Transported. When the foremost semiconductor device reaches the carry-out port, the detecting means detects this, and based on this detection signal, the attraction means above the carry-out port operates and the foremost semiconductor device is suction-held so as not to move. You.

At this time, the endless belt is pushed into the clearance groove on the upper surface of the transfer base by the pressing force due to the contact of the suction means with the semiconductor device, and the belt transfer surface at the corresponding position is changed to the belt transfer surface at another position. , And the transfer resistance at the position is reduced by that amount, so that the foremost semiconductor device is securely held by the suction means without being displaced.

Further, in this suction holding state, the driving means is reversely started, the endless belt runs backward in the conveying direction, and the semiconductor device following the foremost semiconductor device retreats to the foremost semiconductor device. Is separated from the subsequent semiconductor device.

At this time, even if a subsequent semiconductor device overlaps with the frontmost semiconductor device and is not separated, the opening size of the carry-out port in the carrying direction is larger than the length of one semiconductor device in the carrying direction. Since the length is set to be longer and shorter than the length of the two semiconductor devices in the transport direction, the following semiconductor devices are restricted from moving in the vertical direction by the cover material. Therefore, when the foremost semiconductor device is carried out by the suction means, even if a force for pulling upward is applied to the subsequent semiconductor device, the subsequent semiconductor device can sufficiently resist this force and the subsequent semiconductor device is caught. It will not be repeated and will not interfere with subsequent transport.

Further, since the frontmost semiconductor device and the succeeding semiconductor device are separated by reverse running of the endless belt, two first and second hydraulic cylinders are not required as in the conventional example, and each of the first and second hydraulic cylinders is not required. The semiconductor device is quickly transported without the loss time due to the extension / contraction operation of the fluid pressure cylinder.

Further, since there is no need to press the succeeding semiconductor device from above with a fluid pressure cylinder, marks such as a trademark, a product name, and a lot number printed on the package are not damaged.

In addition, when a semiconductor device having a different standard (length and size) from the semiconductor device which has been transported up to now is transported, the cover material and the stopper are replaced with a semiconductor device having a different standard. Only, and the second
There is no need to adjust the position of the fluid pressure cylinder, and the standard can be easily changed accordingly.

According to a second aspect of the present invention, in the first aspect, the carry-out port can be opened and closed by a shutter.
In the closed state, a space is formed between the shutter and the semiconductor device, the space being narrower than the thickness of the semiconductor device.

With the above arrangement, according to the second solution of the present invention, when the foremost semiconductor device stops at the carry-out port, a subsequent semiconductor device falls under the foremost semiconductor device by an impact, Or even trying to get on top,
The space between the shutter and the succeeding semiconductor device is narrower than the thickness of the semiconductor device, so that the sneaking and climbing are restricted, and the subsequent conveyance is more reliably performed.

[0028]

Embodiments of the present invention will be described below with reference to the drawings.

(Embodiment 1) FIGS. 1 to 4 show a transfer apparatus 1 according to Embodiment 1 of the present invention. The transfer device 1 includes a transfer base 2 made of a horizontally long columnar member. Two driven pulleys 3 are disposed at both front and rear ends of the transfer base 2 so as to be rotatable around a shaft 4. A drive motor 5 as a drive unit is installed on the lower surface of the transfer base 2 in the transfer direction upstream, and a drive pulley 6 is connected to an output shaft 5 a of the drive motor 5. An endless belt 7 is wound around the driven pulley 3 and the driving pulley 6, and the endless belt 7 runs downstream or upstream in the transport direction by the forward / reverse activation of the driving motor 5. On the upper surface of the transport base 2, two ridges 8 (shown in FIG. 4) extending in the transport direction are provided in parallel, and an endless belt 7 is disposed between the ridges 8. Is guided so as not to meander left and right. FIG. 4 (b)
As shown in FIG. 5, the endless belt 7 is supported by the transport base 2 with the belt back surface in contact with the upper surface of the transport base 2, and the belt transport surface, which is the belt surface, is slightly higher than the ridges 8. The back surface of the package a1 of the resin-encapsulated semiconductor device A does not come into contact with the ridge 8 during transportation.

A portion of the upper surface of the transfer base 2 except for the downstream end in the transfer direction is covered with a cover member 9. The cover member 9 is composed of two positioning pins 10 and a magnet (not shown) embedded in the transfer base 2. ). Two slits 9a are formed in the cover member 9 from both ends in the transport direction to the middle, so that the semiconductor device A to be transported can be monitored from the outside. A transfer path 11 is formed between the transfer base 2 and the cover member 9, and the vertical dimension of the transfer path 11 is such that the semiconductor device A to be transferred can move the endless belt 7 and the cover member 9 without any trouble. It is set to the size to be transported. Then, the endless belt 7 is supported on the upper surface of the transport base 2 by the forward rotation of the drive motor 5 and travels on the transport path 11, so that a plurality of the plurality of belts which have been transported after completing the predetermined work in the former-stage work station S. The semiconductor devices A are conveyed continuously in a single row while restricting vertical and horizontal fluctuations by the cover member 9.

A stopper 12 is fixed to the downstream side of the upper surface of the transport base 2 in the transport direction by two positioning pins 13. The stopper 12 is provided with a contact frame 12 a extending in a direction orthogonal to the transport path 11. And the two side frame portions 12b extending from both ends of the contact frame portion 12a to the upstream side in the transport direction are formed in a substantially "U" shape, and the frontmost semiconductor device A transported to the downstream end in the transport direction is brought into contact with the semiconductor device A. It comes into contact with the frame portion 12a and is positioned at that position.

At the downstream end of the transport base 2 in the transport direction, a rectangular outlet 14 opening upward is formed as a release portion between both side frame portions 12b of the stopper 12. As one of the features of the present invention, the opening dimension L1 of the carry-out port 14 in the carrying direction is the length L2 of one semiconductor device A in the carrying direction.
The length is set to be longer and shorter than the length (L2 × 2) in the transport direction of the two semiconductor devices A. In this example, the length is set to about 1.5 times the length of one semiconductor device A. ing.

On both sides of the stopper 12, a detection sensor 15 composed of a pair of left and right photoelectric tubes as detection means is disposed, and a light beam projected from one of the detection sensors 15 is formed in a through hole formed in the both side frame portions 12b. The light is received by the other detection sensor 15 via 12c, and the frontmost semiconductor device A is conveyed to block the light beam,
It is configured to detect that the frontmost semiconductor device A has been transported to the carry-out port 14.

Above the carry-out port 14, a suction nozzle 16 as suction means is disposed so as to be able to move up and down and horizontally move by a moving device (not shown). The suction nozzle 1
Numeral 6 is connected to a vacuum pump (not shown), which operates the vacuum pump to make the internal vacuum evacuation passage 16a a negative pressure to suck and hold the foremost semiconductor device A. It is designed to be carried out to a step work station (not shown).

As another feature of the present invention, a stepped portion which is one step lower than other portions is provided between the two ridges 8 at a position (downstream end in the conveying direction) of the upper surface of the conveying base 2 corresponding to the outlet 14. As a result, an escape groove 17 is formed. Then, as shown in FIG. 2, at the stage where the frontmost semiconductor device A has reached the carry-out port 14 but the suction nozzle 16 has not yet operated, the endless belt 7 does not fall into the escape groove 17 due to its tension. 4B, the belt conveying surface is projected from the ridge 8 so that the lower surface of the package a1 of the semiconductor device A does not contact the ridge 8 as in the other portions shown in FIG. Like that. On the other hand, as shown in FIG. 3, when the suction nozzle 16 sucks the frontmost semiconductor device A, the suction nozzle 16 comes into contact with the frontmost semiconductor device A to generate a pressing force. The endless belt 7 is pushed into the clearance groove 17, and as shown in FIG. 4A, the lower surface of the package a1 of the semiconductor device A is brought into contact with the ridges 8 to be lowered slightly, so that the belt conveying surface at that position is lowered. It is designed to be lower than the belt transport surface at other locations.

The drive motor 5, the detection sensor 15, the vacuum pump for the suction nozzle 16 and the moving device for the suction nozzle 16 are a controller 1 comprising a CPU or the like as control means.
When the semiconductor device A is transported, the drive motor 5 is electrically connected to the controller 18 as shown in FIG.
, The plurality of semiconductor devices A are successively transported in a single row toward the downstream end in the transport direction. At this time, the moving device of the suction nozzle 16 is moved upward by a command from the controller 18, and the suction nozzle 16 is kept on standby above the carry-out port 14. When the semiconductor device A at the forefront reaches the carry-out port 14, a detection signal of the detection sensor 15 detecting this fact is input to the controller 18, and the controller 18 starts the vacuum pump of the suction nozzle 16 based on the detection signal. Let vacuum evacuation passage 1
6a is set to a negative pressure, and thereafter, the moving device of the suction nozzle 16 is lowered to lower the suction nozzle 16 to the carry-out port 14, and the suction nozzle 16 holds the frontmost semiconductor device A by suction so as not to move from above. It has become. Further, in this suction holding state, the drive motor 5 is temporarily stopped by the command of the controller 18 and then started reversely, whereby the endless belt 7 is caused to run backward in the transport direction and to follow the semiconductor device A at the forefront end. The semiconductor device A to be retracted is separated from the following semiconductor device A as shown in FIG. Further, in this separated state, the moving device of the suction nozzle 16 moves upward and horizontally by a command from the controller 18 to carry out the semiconductor device A from the carry-out port 14 to the next work station. At the same time, the drive motor 5 is temporarily stopped by the command of the controller 18 and then started up, so that the endless belt 7 travels downstream in the transport direction, and the next semiconductor device A is carried into the carry-out port 14. It has become.

Next, the procedure for transporting the semiconductor device A by the transport device 1 configured as described above will be described.

The resin-sealed semiconductor devices A that have completed the predetermined work in the preceding work station S are transferred one by one to the transfer device 1.
And carried on the endless belt 7. The drive motor 5 is activated normally by a command from the controller 18, and runs the endless belt 7 toward the next work station. As a result, the plurality of semiconductor devices A are continuously conveyed in a row to the next work station in a state where the vertical and horizontal fluctuations are restricted by the cover member 9.

As shown in FIG. 2, the frontmost semiconductor device A reaches the carry-out port 14 and
a, the frontmost semiconductor device A interrupts the light beam of the detection sensor 15, whereby a command is issued from the controller 18 to the moving device of the suction nozzle 16, and as shown in FIG. Is the exit 14
And contacts the upper surface of the package a1 of the semiconductor device A. At this time, the pressing force pushes the endless belt 7 into the clearance groove 17, and the belt conveying surface is slightly lowered from the other portions.

From the controller 18 to the suction nozzle 16
A command is issued to the vacuum pump, and the vacuum pump is activated, and the vacuum passage 16a becomes a negative pressure, and the frontmost semiconductor device A is held by suction.

A command is issued from the controller 18 to the drive motor 5, and as shown in FIG. 3, the drive motor 5 is temporarily stopped and then started backward, the endless belt 7 runs backward, and the subsequent semiconductor device A retreats. Then, the frontmost semiconductor device A is separated from the subsequent semiconductor device A.

At this time, as described above, the belt conveying surface of the endless belt 7 held by the suction nozzle 16 is lowered by the relief groove 17 of the conveying base 2, and The suction force of the suction nozzle 16 is stronger than the transport resistance due to running, and the semiconductor device A that has been sucked does not shift.

During this time, a command is issued from the controller 18 to the moving device of the suction nozzle 16,
Rises from the carry-out port 14, moves to the next work station, and carries out the semiconductor device A. The suction nozzle 16 that has been carried out returns to above the carry-out port 14 in response to a command from the controller 18 and prepares for carrying out the next semiconductor device A.

At the time of carrying out, even if the burr a3 of the semiconductor device A succeeding the burr a3 of the semiconductor device A at the foremost end overlaps from above, the opening dimension L1 of the carrying-out port 14 in the carrying direction is one. The length L2 is set to about 1.5 times the length L2 of the semiconductor devices A in the transport direction, and approximately half of the following semiconductor devices A are regulated by the cover member 9 so as not to move in the vertical direction. Therefore, even if a force is applied to lift the subsequent semiconductor device A upward due to the unloading operation of the frontmost semiconductor device A, the semiconductor device A can sufficiently resist this force and turn over the subsequent semiconductor device A. It is possible to prevent any trouble in the subsequent conveyance.

Further, since the frontmost semiconductor device A and the succeeding semiconductor device A are separated by reverse running of the endless belt 7, two first and second semiconductor devices for separation as in the conventional example are used.
The fluid pressure cylinders 115 and 116 do not need to be installed, and the semiconductor device A can be quickly transported without a loss time due to the extension and contraction operations of the respective fluid pressure cylinders 115 and 116.

Further, since the subsequent semiconductor device A does not have to be pressed from above by the fluid pressure cylinder, the package a
Marks such as a trademark, a product name, a lot number, and the like printed on 1 can be prevented from being damaged.

In addition, the semiconductor device A which has been transported
When transporting a semiconductor device A having a different standard (length and size), the cover member 9 and the stopper 12 need only be exchanged for a semiconductor device A having a different standard. It is not necessary to adjust the position of the cylinder 116, and the standard can be easily changed.

When the semiconductor device A at the forefront end is carried out of the carry-out port 14, a command is issued from the controller 18 to the drive motor 5, and the drive motor 5 is started from the stopped state to start the endless belt 7 at the next stage. The semiconductor device A is caused to travel to the station side and is advanced until the frontmost semiconductor device A among the retreated semiconductor devices A comes into contact with the stopper 12.

While sequentially repeating the above operation, a plurality of semiconductor devices A are placed one at a time in the preceding work station S.
, And sequentially carried into the transfer device 1 and carried out to the next work station.

(Embodiment 2) FIGS. 5 and 6 show a transfer apparatus 1 according to Embodiment 2 of the present invention. In this embodiment, a shutter 19 is provided at the carry-out port 14, and this shutter 19 is connected to the piston rod 20a of the fluid pressure cylinder 20 so that the carry-out port 14 can be opened and closed by the shutter 19. Further, with the shutter 19 closed, a space 21 having a smaller interval T2 than the thickness T1 of the semiconductor device A is formed between the shutter 19 and the frontmost semiconductor device A. The opening and closing operation of the shutter 19 is performed by a command from the
The shutter 19 is closed except when the semiconductor device A is carried out from the carry-out port 14.

Since the rest of the configuration is the same as that of the first embodiment, the same components are denoted by the same reference numerals, and detailed description thereof will be omitted.

Therefore, in this example, the same operation and effect as in the first embodiment can be obtained.

In addition, in this example, the frontmost semiconductor device A
When the next semiconductor device A stops under the impact at the carry-out port 14 and tries to get under the foremost semiconductor device A or try to get on it, the gap between the shutter 19 and the succeeding semiconductor device A The space T2 between the spaces 21 is smaller than the thickness T1 of the semiconductor device A, so that it is possible to restrict the sneaking and getting on, and to carry out the subsequent conveyance more reliably.

In each of the above examples, SOP (Smal
l, Outline, Package) type IC, but DIP (Dual, Inline,
It goes without saying that a (Package) type IC can also be adopted.

In each of the above examples, the suction nozzle 1
After the lowering of the endless belt 7 has stopped the suction of the suction nozzle 16
The same effect can be obtained by stopping the endless belt 7 when the arrival of the semiconductor device A is detected by the detection sensor 15 before the suction.

[0056]

As described above, according to the first aspect of the present invention, the size of the opening of the carry-out port in the carrying direction is longer than the length of one semiconductor device in the carrying direction, and the number of the openings is two. The length is set shorter than the length of the semiconductor device in the transport direction, and an escape groove is formed at the location corresponding to the exit on the upper surface of the transport base. The semiconductor device at the front end can be reliably sucked and held by the suction means without being displaced. In addition, even if the subsequent semiconductor devices overlap and are not separated from each other, the shape of the carry-out port prevents the following semiconductor devices from being turned over so as not to hinder the subsequent transportation. be able to. Further, since the front and rear semiconductor devices are separated by the reverse running of the endless belt, there is no fluid pressure cylinder which causes a loss time due to the extension / contraction operation, and the semiconductor devices can be transported quickly. Further, since there is no need to press the succeeding semiconductor device from above with a fluid pressure cylinder, it is possible to prevent marks such as trademarks, product names, and lot numbers printed on the package from being damaged. In addition, when a semiconductor device having a different standard (length and size) from the semiconductor device that has been transported is transported, the standard can be easily changed because the position adjustment of the second fluid pressure cylinder as in the conventional example is not required. be able to.

According to the second aspect of the present invention, the shutter is provided at the carry-out port so as to be openable and closable, and in the closed state, a space having a smaller gap than the thickness of the semiconductor device is formed between the shutter and the semiconductor device. As a result, when the foremost semiconductor device is stopped at the exit, the following semiconductor device is prevented from sneaking under the foremost semiconductor device or trying to get on the top by the impact when the subsequent semiconductor device is stopped. Can be transported more reliably.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an entire transfer apparatus according to Embodiment 1 of the present invention.

FIG. 2 is a cross-sectional view showing a state in which the semiconductor device has been transferred to a carry-out port in the transfer device according to the first embodiment of the present invention;

FIG. 3 is a cross-sectional view illustrating a state where the semiconductor device conveyed to the carry-out port is suctioned by the suction nozzle in the transfer device according to the first embodiment of the present invention;

4 (a) is a cross-sectional view taken along IV _a -IV _a line of FIG. 3,
(B) is a cross-sectional view taken along IV _b -IV _b line of FIG.

FIG. 5 is a perspective view showing the entirety of a transfer device according to a second embodiment of the present invention.

FIG. 6 is a cross-sectional view illustrating a state in which a semiconductor device is transferred to a carry-out port in the transfer device according to the second embodiment of the present invention;

FIG. 7 is a perspective view showing the whole of a conventional transport device.

FIG. 8 is a cross-sectional view showing a state in which a semiconductor device is waiting in front of a carry-out exit in a conventional transport device.

FIG. 9 is a cross-sectional view showing a state in which a semiconductor device is transported to a carry-out port in a conventional transport device.

FIG. 10 is a sectional view taken along line XX of FIG. 8;

FIG. 11 is a perspective view of a semiconductor device.

[Explanation of symbols]

 Reference Signs List 1 transfer device 2 transfer base 5 drive motor (drive motor) 7 endless belt 9 cover material 11 transfer path 14 discharge port 15 detection sensor (detection means) 16 suction nozzle (suction means) 17 relief groove 18 controller (control means) 19 Shutter 21 Space A Semiconductor device L1 Opening size of transfer port in transfer direction L2 Length size of transfer direction of semiconductor device T1 Thickness size of semiconductor device T2 Space spacing

Claims (2)

[Claims] 1. A transport path is formed between a transport base and a cover material that covers the upper surface of the transport base, and an endless belt runs on the transport path while being supported by the upper surface of the transport base. Semiconductor devices are continuously transported in a single row while regulating vertical and horizontal fluctuations with the cover material, and the foremost semiconductor device transported to a carry-out port opening above the downstream end in the transport direction is described above. A transfer device for a semiconductor device for sucking, holding and carrying out by suction means above a carry-out port, wherein the endless belt is driven in a forward / reverse direction so as to travel downstream or upstream in the carrying direction; Detecting means for detecting that the semiconductor device has been conveyed to the carry-out port, and operating the suction means based on a detection signal of the detection means to suction-hold the frontmost semiconductor device so as not to move by the suction means. In the above drive Control means for reversely activating the means and reversing the endless belt to the upstream side in the conveying direction to retreat the semiconductor device following the foremost semiconductor device. The length is set to be longer than the length of the two semiconductor devices in the transfer direction and shorter than the length of the two semiconductor devices in the transfer direction. In the case of the suction by the suction means, by the pressing force by the suction means coming into contact with the frontmost semiconductor device,
A transfer device for a semiconductor device, wherein an endless belt is pushed into the clearance groove, and a belt transfer surface at the position is lower than a belt transfer surface at another position. 2. A carry-out port is opened and closed by a shutter, and between the shutter and a frontmost semiconductor device in a closed state.
2. The semiconductor device carrier according to claim 1, wherein a space having a smaller interval than a thickness of the semiconductor device is formed.