JPH10126028A - Printed board - Google Patents
Printed boardInfo
- Publication number
- JPH10126028A JPH10126028A JP8279153A JP27915396A JPH10126028A JP H10126028 A JPH10126028 A JP H10126028A JP 8279153 A JP8279153 A JP 8279153A JP 27915396 A JP27915396 A JP 27915396A JP H10126028 A JPH10126028 A JP H10126028A
- Authority
- JP
- Japan
- Prior art keywords
- copper paste
- printed circuit
- circuit board
- copper
- filling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、電子機器などに使
用される主に多層高密度用としてのプリント基板に関す
るものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board mainly used for a multi-layer, high-density device used in electronic equipment.
【０００２】[0002]
【従来の技術】従来のプリント基板用のビア充填用銅ペ
ーストは、ほとんどが溶剤タイプであり、収縮があって
実用的ではなく、また、無溶剤タイプでは特開平７−１
７６８４６号公報に記載されたものが知られている。2. Description of the Related Art Most of the conventional via-filling copper pastes for printed circuit boards are of a solvent type and are not practical due to shrinkage.
What is described in 76846 is known.
【０００３】このプリント基板用のビア充填用銅ペース
トは、２種類のエポキシ樹脂８〜２０重量％に０．５〜
５重量％の硬化剤を添加し、さらに８５〜９２重量％の
銅粉体を添加混合して構成されており、特に、硬化剤に
ついては安定性、作業性の関係で固形状の潜在性硬化剤
が好ましいとしている。The copper paste for filling a via for a printed circuit board contains 0.5 to 20% by weight of two kinds of epoxy resins.
5% by weight of a hardener is added, and 85 to 92% by weight of copper powder is added and mixed. Particularly, the hardener is a solid latent hardener in terms of stability and workability. Agents are preferred.
【０００４】[0004]
【発明が解決しようとする課題】プリント基板用の繊維
基材プリプレグおよびビア充填用銅ペーストにおいて、
無溶剤銅ペーストのベース樹脂や繊維基材プリプレグの
繊維および含浸樹脂には塩素イオンなどのイオン性不純
物が含まれているために耐湿の信頼性や、半導体などの
直接実装時の絶縁劣化および腐食などの課題がある。SUMMARY OF THE INVENTION In a fiber substrate prepreg for a printed circuit board and a copper paste for via filling,
Solvent-free copper paste base resin, fiber base prepreg fiber and impregnated resin contain ionic impurities such as chloride ions, so they have reliable moisture resistance and insulation deterioration and corrosion when directly mounted on semiconductors. There are issues such as.
【０００５】また、プリント基板への部品実装の際、高
温の熱ストレスが印加されるため、ビア接続の場合は特
にペースト硬化物の可撓性、強靱性および接着性を改善
する必要がある。In mounting components on a printed circuit board, a high-temperature thermal stress is applied. Therefore, in the case of via connection, it is necessary to improve the flexibility, toughness and adhesiveness of a cured paste in particular.
【０００６】主に銅ペーストの熱圧着成形時などで銅粉
体が酸化するため、インナービアなどのビア接続を採用
したプリント基板においては、エポキシ樹脂の種類によ
り、銅ペーストの固有抵抗や、銅箔と銅ペーストとの接
続抵抗値が変動し、さらに銅粉体とベース樹脂の濡れ性
が不十分なため、印刷時などで銅粉体の移動がスムース
ではなく、印刷時の摺動抵抗が大きくなる。[0006] Since copper powder is oxidized mainly at the time of thermo-compression molding of a copper paste, in a printed circuit board employing via connection such as an inner via, the specific resistance of the copper paste and the copper The connection resistance between the foil and the copper paste fluctuates, and the wettability between the copper powder and the base resin is insufficient, so the copper powder does not move smoothly during printing, etc., and the sliding resistance during printing decreases. growing.
【０００７】そしてまた、銅ペーストを低温あるいは室
温に放置や保存をした場合、比重差により銅粉体、エポ
キシ樹脂および潜在アミン硬化剤の三層に分離して均一
な混合体とするのに時間がかかるなどの課題を有してい
る。When the copper paste is left or stored at a low or room temperature, it takes time to separate the copper paste into three layers of a copper powder, an epoxy resin and a latent amine curing agent due to a difference in specific gravity to form a uniform mixture. Have problems such as
【０００８】本発明は前記課題を解決しようとするもの
であり、イオン性不純物を内部で捕獲し、印刷性、導体
抵抗などの固有抵抗や接続抵抗値を改善でき、熱衝撃の
信頼性を向上した繊維基材プリプレグおよびビア充填用
銅ペーストを用いたプリント基板を提供することを目的
とする。SUMMARY OF THE INVENTION The present invention is intended to solve the above-mentioned problems, and captures ionic impurities therein, improves printability, specific resistance such as conductor resistance, and connection resistance, and improves reliability of thermal shock. An object of the present invention is to provide a printed circuit board using the prepared fiber base material prepreg and via-filling copper paste.
【０００９】[0009]
【課題を解決するための手段】前記課題を解決するため
本発明によるプリント基板は、繊維基材プリプレグの含
浸用熱硬化性樹脂ワニスに、樹脂と繊維中に含有するイ
オン性不純物を捕獲する無機イオン交換体を添加した繊
維基材プリプレグで構成したものである。According to the present invention, there is provided a printed circuit board according to the present invention, comprising a thermosetting resin varnish for impregnation of a fiber base prepreg, an inorganic material for capturing ionic impurities contained in the resin and the fiber. It is composed of a fiber base material prepreg to which an ion exchanger has been added.
【００１０】本発明により、塩素イオンを捕獲し、耐湿
の信頼性、絶縁劣化および腐食を安定化するプリント基
板を実現することが可能となる。According to the present invention, it is possible to realize a printed circuit board that captures chlorine ions and stabilizes reliability of moisture resistance, insulation deterioration and corrosion.
【００１１】[0011]
【発明の実施の形態】本発明の請求項１に記載の発明
は、印刷により銅ペーストを充填する貫通孔を形成した
繊維基材プリプレグを使用し、所定個所に銅箔を配置し
て熱圧着硬化した後、所定のパターン形成を行いビア接
続したプリント基板において、繊維基材プリプレグの含
浸用熱硬化性樹脂ワニスに、樹脂と繊維中に含有するイ
オン性不純物を捕獲する無機イオン交換体を添加した繊
維基材プリプレグを用いたものであり、塩素イオンを捕
獲し耐湿の信頼性、絶縁劣化および腐食を安定化すると
いう作用を有する。DETAILED DESCRIPTION OF THE INVENTION The invention according to claim 1 of the present invention uses a fibrous base material prepreg having a through hole for filling a copper paste by printing, and arranging a copper foil at a predetermined position to perform thermocompression bonding. After hardening, a predetermined pattern is formed and via-connected printed circuit boards are added to the thermosetting resin varnish for impregnation of the fiber base material prepreg with an inorganic ion exchanger that captures ionic impurities contained in the resin and fibers. It has a function of capturing chlorine ions and stabilizing reliability of moisture resistance, insulation deterioration and corrosion.
【００１２】請求項２に記載の発明は、繊維基材プリプ
レグの含浸用熱硬化性樹脂ワニスに防錆剤を添加したも
のであり、脱酸素および錆を防止するという作用を有す
る。According to the second aspect of the present invention, a rust inhibitor is added to a thermosetting resin varnish for impregnation of a fiber base material prepreg, and has an effect of preventing deoxidation and rust.
【００１３】請求項３に記載の発明は、印刷により銅ペ
ーストを充填する貫通孔を形成した繊維基材プリプレグ
を使用し、所定個所に銅箔を配置して熱圧着硬化した
後、所定のパターン形成を行いビア接続したプリント基
板において、銅ペースト加工時に銅ペーストに含有する
イオン性不純物を捕獲する無機イオン交換体を添加した
ビア充填用銅ペーストを用いたものであり、塩素イオン
を捕獲し耐湿の信頼性、絶縁劣化および腐食を安定化す
るという作用を有する。According to a third aspect of the present invention, a predetermined pattern is formed by using a fibrous base material prepreg having a through-hole for filling a copper paste by printing, arranging a copper foil at a predetermined location and curing by thermocompression bonding. Formed via-connected printed circuit board, using via-filling copper paste with an inorganic ion exchanger added to capture ionic impurities contained in the copper paste during copper paste processing, capturing chlorine ions and moisture resistance And has the effect of stabilizing insulation deterioration and corrosion.
【００１４】請求項４に記載の発明は、銅ペーストに防
錆剤を添加したビア充填用銅ペーストとしたものであ
り、脱酸素および錆を防止するという作用を有する。According to a fourth aspect of the present invention, there is provided a via-filling copper paste obtained by adding a rust inhibitor to a copper paste, and has an effect of preventing deoxidation and rust.
【００１５】請求項５に記載の発明は、銅ペーストのベ
ース樹脂にダイマー酸単独、ダイマー酸とビスフェノー
ル型エポキシ樹脂、ダイマー酸とビス型ラクトン変性エ
ポキシ樹脂あるいはダイマー酸とエポキシ化ポリブタジ
エンのいずれか１つを使用し、プリント基板加工温度で
の硬化樹脂硬度がショアー硬度８０以下であるビア充填
用銅ペーストとしたものであり、柔軟性を保持するとい
う作用を有する。According to a fifth aspect of the present invention, the base resin of the copper paste is any one of dimer acid alone, dimer acid and bisphenol type epoxy resin, dimer acid and bis type lactone modified epoxy resin, or dimer acid and epoxidized polybutadiene. One is a via-filling copper paste having a cured resin hardness of 80 or less Shore hardness at the processing temperature of the printed circuit board, and has an effect of maintaining flexibility.
【００１６】請求項６に記載の発明は、銅ペーストを構
成している銅粉体表面に高級脂肪酸膜を形成したビア充
填用銅ペーストとしたものであり、酸化防止と抵抗値が
安定するという作用を有する。According to a sixth aspect of the present invention, there is provided a via-filling copper paste in which a higher fatty acid film is formed on the surface of the copper powder constituting the copper paste. Has an action.
【００１７】請求項７に記載の発明は、銅ペースト加工
時に、エチレングリコール、プロピレングリコール、メ
チレングリコールなどのアルキレングリコールを少なく
とも１つ以上添加したビア充填用銅ペーストとしたもの
であり、酸化防止と接続抵抗値を低減するという作用を
有する。According to a seventh aspect of the present invention, there is provided a via-filling copper paste to which at least one alkylene glycol such as ethylene glycol, propylene glycol or methylene glycol is added at the time of processing the copper paste. It has the effect of reducing the connection resistance value.
【００１８】請求項８に記載の発明は、銅ペースト加工
時に界面活性剤を添加したビア充填用銅ペーストとした
ものであり、濡れ性が向上するという作用を有する。The invention described in claim 8 is a via-filling copper paste to which a surfactant is added at the time of processing the copper paste, and has an effect of improving wettability.
【００１９】請求項９に記載の発明は、銅ペースト加工
時にエロジールを添加したビア充填用銅ペーストとした
ものであり、銅粉体の沈降を防止するという作用を有す
る。According to a ninth aspect of the present invention, there is provided a via-filling copper paste to which ergiole is added at the time of copper paste processing, and has an effect of preventing settling of copper powder.
【００２０】請求項１０に記載の発明は、銅ペースト加
工時に窒化ホウ素、二硫化モリブデン、四弗化ポリエチ
レンなどの耐熱潤滑粒子を少なくとも１つ以上添加した
ビア充填用銅ペーストとしたものであり、銅粉体の動作
がスムースになるという作用を有する。According to a tenth aspect of the present invention, there is provided a via-filling copper paste obtained by adding at least one heat-resistant lubricating particle such as boron nitride, molybdenum disulfide or polyethylene tetrafluoride at the time of processing the copper paste. This has the effect that the operation of the copper powder becomes smooth.
【００２１】以下、本発明の実施の形態について説明す
る。図１はインナービアホールなどのビア接続のプリン
ト基板の加工工程例の概要図、図２は同プリント基板の
熱衝撃試験における銅ペーストと銅箔接続境界面ストレ
スのモデル図であり、１は銅ペースト、２はプリプレ
グ、３は貫通孔（ビア）、４はラミネートフィルム、５
は銅箔、６はパターンを形成するための銅箔除去部、７
はスクリーン印刷用のスキージ、８は加熱時発生のスト
レス方向、そして９は冷却時発生のストレス方向であ
る。Hereinafter, embodiments of the present invention will be described. FIG. 1 is a schematic view of an example of a process of processing a printed circuit board for via connection such as an inner via hole. FIG. 2 is a model diagram of a copper paste-copper foil connection interface stress in a thermal shock test of the printed circuit board. 2, 2 prepreg, 3 through hole (via), 4 laminated film, 5
Is a copper foil, 6 is a copper foil removing portion for forming a pattern, 7
Is a squeegee for screen printing, 8 is a stress direction generated during heating, and 9 is a stress direction generated during cooling.
【００２２】図１（ａ）は銅ペースト１をスクリーン印
刷のスキージ７によりプリプレグ２の貫通孔３に銅ペー
スト１を充填した状態、同（ｂ）はプリプレグ２の両面
に銅箔５を配設した状態、同（ｃ）は両面から熱圧着プ
レスした状態であり、２ａは基板の絶縁基材となる。そ
して、同（ｄ）はフォトリソグラフなどのエッチングに
より銅箔除去部６で所定のパターン５ａを形成し完成し
た状態である。FIG. 1A shows a state in which the copper paste 1 is filled in the through-hole 3 of the prepreg 2 by a screen printing squeegee 7 and a copper foil 5 is provided on both surfaces of the prepreg 2. (C) is a state in which thermocompression bonding is performed from both sides, and 2a is an insulating base material of the substrate. (D) shows a state in which a predetermined pattern 5a is formed in the copper foil removing section 6 by etching such as photolithography or the like.
【００２３】銅ペースト１および繊維基材プリプレグ２
のエポキシ樹脂基材には塩素イオンを含有しており、特
に銅ペースト１に使用するダイマー酸には数千ｐｐｍの
塩素が含まれている。Copper paste 1 and fiber base prepreg 2
The epoxy resin base material contains chlorine ions, and particularly, the dimer acid used for the copper paste 1 contains several thousand ppm of chlorine.
【００２４】この遊離塩素の捕獲手段として本発明は無
機イオン交換体を銅ペースト１およびプリプレグ２のエ
ポキシ樹脂に分散させておく。これにより、前記交換体
が遊離塩素イオンを捕獲し、４００℃に加熱しても放出
しない。In the present invention, an inorganic ion exchanger is dispersed in the epoxy resin of the copper paste 1 and the prepreg 2 as a means for capturing free chlorine. Thereby, the exchanger captures free chlorine ions and does not release them even when heated to 400 ° C.
【００２５】また、他の微量の陽あるいは陰イオン性不
純物も両性無機イオン交換体により捕獲でき、各種の環
境試験においてもイオン性不純物は検出されない。な
お、添加量は含有するイオン性不純物の量により最適値
に設定する。Further, other trace amounts of positive or anionic impurities can be captured by the amphoteric inorganic ion exchanger, and no ionic impurities are detected in various environmental tests. The addition amount is set to an optimum value according to the amount of ionic impurities contained.
【００２６】次に気化性防錆剤、酸素吸収剤などの防錆
剤を銅ペースト１およびプリプレグ２のエポキシ樹脂に
分散させる。すなわち、保存中やプリント基板加工中お
よび使用中に脱酸素や防錆の作用により酸化による銅ペ
ーストの固有抵抗あるいは銅箔と銅ペーストとの接続抵
抗値変化を抑える。Next, a rust preventive such as a vaporizable rust preventive or an oxygen absorbent is dispersed in the epoxy resin of the copper paste 1 and the prepreg 2. That is, the specific resistance of the copper paste or the change in the connection resistance value between the copper foil and the copper paste due to oxidation is suppressed by the action of deoxidation and rust prevention during storage, processing of the printed circuit board, and use.
【００２７】次に銅ペースト１のベース樹脂に可撓性を
持たせるためにショアー硬度８０以下の樹脂を使用す
る。すなわち、図２に示すように熱衝撃試験を行った
際、銅ペースト１とパターン５ａの接続境界面に前記構
成材料の熱膨張係数の差異による機械的歪を緩和し、接
続抵抗値の変化が防止できる。Next, a resin having a Shore hardness of 80 or less is used to make the base resin of the copper paste 1 flexible. That is, when the thermal shock test is performed as shown in FIG. 2, the mechanical strain due to the difference in the coefficient of thermal expansion of the constituent material is reduced at the connection interface between the copper paste 1 and the pattern 5a, and the change in the connection resistance value is reduced. Can be prevented.
【００２８】次に図３の銅粉体断面図に示すように、銅
粉体１０の表面全体にステアリン酸などの高級脂肪酸１
１を形成させる。すなわち、銅粉体１０の酸化を防止し
熱圧着プレス時には還元剤の作用をするので、導体抵抗
値は安定する。また、エポキシ樹脂との濡れ性も改善で
きペースト加工時間が短縮されるとともに、高級脂肪酸
膜は熱圧着プレス温度で溶融し、均一分散するため銅粉
体相互の接触すなわち接続抵抗値の増加などが防止でき
る。Next, as shown in the sectional view of the copper powder in FIG. 3, a higher fatty acid such as stearic acid
1 is formed. That is, since the copper powder 10 is prevented from being oxidized and acts as a reducing agent during thermocompression pressing, the conductor resistance value is stabilized. In addition, the wettability with the epoxy resin can be improved, the paste processing time can be shortened, and the higher fatty acid film is melted at the thermocompression pressing temperature and uniformly dispersed, so that the copper powder contacts each other, that is, the connection resistance value increases. Can be prevented.
【００２９】次に銅ペースト１のベース樹脂にエチレン
グリコール、プロピレングリコール、メチレングリコー
ルなどのアルキレングリコールの少なくとも１つ以上を
１〜５ＰＨＲ程度添加する。すなわち、熱圧着プレス時
に銅粉体表面を還元雰囲気に保持でき酸化を防止すると
ともに、アルキレングリコールはエポキシ樹脂とは反応
しないため硬化時の収縮が大きくなり、銅粉体相互の接
触すなわち接続抵抗値を低下させる。Next, about 1 to 5 PHR of at least one of alkylene glycols such as ethylene glycol, propylene glycol and methylene glycol is added to the base resin of the copper paste 1. In other words, the copper powder surface can be kept in a reducing atmosphere during thermocompression pressing to prevent oxidation, and because the alkylene glycol does not react with the epoxy resin, the shrinkage during curing increases, and the contact between the copper powders, that is, the connection resistance value Lower.
【００３０】次に銅ペースト１の製作時に界面活性剤を
添加する。すなわち、銅粉体の表面張力が低下し濡れ性
が向上するため、銅ペースト１の加工時間が短縮できて
含有空気が少なくなり、熱圧着プレス時に銅粉体の酸化
が防止できる。Next, a surfactant is added when the copper paste 1 is manufactured. That is, since the surface tension of the copper powder is reduced and the wettability is improved, the processing time of the copper paste 1 can be shortened, the air content is reduced, and the oxidation of the copper powder during thermocompression pressing can be prevented.
【００３１】次に銅ペーストの製作時にエロジールを添
加する。すなわち、保存中の銅粉体の沈降を防止し、ま
たチクソトロピー性が大きくなり印刷性が向上する。Next, ezilel is added during the production of the copper paste. That is, sedimentation of the copper powder during storage is prevented, and the thixotropy is increased to improve the printability.
【００３２】次に銅ペースト製作時に窒化ホウ素、二硫
化モリブデン、四弗化ポリエチレンなどの耐熱性潤滑剤
を添加する。すなわち、銅ペースト製作時の銅粉体の動
きがスムースになり、分散時間が短縮され、図１（ａ）
に示すスクリーン印刷時などでの摩擦抵抗が減少し、印
刷速度を速くすることができる。また、図１（ｃ）に示
すように貫通孔（ビア）３に充填された銅ペースト１を
熱圧着プレスにより硬化する際、銅粉体の動きがスムー
スになり、細密安定充填を短時間に移行できる。Next, a heat-resistant lubricant such as boron nitride, molybdenum disulfide, and polyethylene tetrafluoride is added during the production of the copper paste. That is, the movement of the copper powder during the production of the copper paste becomes smooth, and the dispersion time is shortened.
The frictional resistance at the time of screen printing as shown in (1) is reduced, and the printing speed can be increased. Further, when the copper paste 1 filled in the through-holes (vias) 3 is hardened by a thermocompression press as shown in FIG. 1C, the movement of the copper powder becomes smooth, and fine and stable filling can be performed in a short time. Can be migrated.
【００３３】（実施の形態１）実施の形態１における組
成構成、樹脂特性、銅ペースト特性および信頼性試験結
果を（表１）に示す。(Embodiment 1) The composition, resin properties, copper paste properties and reliability test results in Embodiment 1 are shown in Table 1.
【００３４】[0034]
【表１】 [Table 1]
【００３５】（表１）に示す組成構成の樹脂および銅粉
体を３本ローラで混練後、スーパーミキサーで硬化剤を
分散して銅ペーストを製作する。次に図１に示すよう
に、上下両面に１８μｍのポリエチレンテレフタレート
フィルムのラミネートフィルム４を形成した０．２ｍｍ
のアラミド繊維基材エポキシ樹脂プリプレグ２に、レー
ザなどにより直径０．２ｍｍの貫通孔３を設け、貫通孔
（ビア）３に図１（ａ）に示すスクリーン印刷すなわ
ち、スキージ７を５０ｍｍ／ｓｅｃの速度で作動させ、
貫通孔３に銅ペースト１を充填する。A resin and a copper powder having the composition shown in Table 1 are kneaded by three rollers, and a hardener is dispersed by a super mixer to produce a copper paste. Next, as shown in FIG. 1, a laminated film 4 of a 18 μm polyethylene terephthalate film was formed on both upper and lower surfaces.
The aramid fiber base epoxy resin prepreg 2 is provided with a through hole 3 having a diameter of 0.2 mm by a laser or the like, and the through hole (via) 3 is screen-printed as shown in FIG. Operating at speed,
The through-hole 3 is filled with the copper paste 1.
【００３６】次にラミネートフィルム４を剥離し、厚み
１８μｍの銅箔５を上下両面に配設した後、２００℃、
５０ｋｇ／ｃｍ2、３０分の熱圧着プレスを行い、その
後フォトリソにより所定のパターン５ａを持つプリント
基板を製作した。Next, the laminate film 4 was peeled off, and copper foil 5 having a thickness of 18 μm was provided on both upper and lower surfaces.
A thermocompression press was performed at 50 kg / cm 2 for 30 minutes, and then a printed board having a predetermined pattern 5a was manufactured by photolithography.
【００３７】また、可撓性エポキシ樹脂（ダイマー酸グ
リシジルエステル）に硬質エポキシ樹脂（ビスフェノー
ルＡ型）を添加し、２００℃で硬化した際の樹脂硬度を
図４に示し、それを２６０℃での熱衝撃試験を１００回
実施した場合の樹脂硬度と抵抗値変化率を図５に示す。
すなわち、ベース樹脂のショアー硬度を８０以下にすれ
ば熱衝撃信頼性が高いことがわかる。FIG. 4 shows the resin hardness when a hard epoxy resin (bisphenol A type) was added to a flexible epoxy resin (glycidyl dimer acid) and cured at 200 ° C. FIG. 5 shows the resin hardness and the rate of change in resistance when the thermal shock test was performed 100 times.
That is, it is understood that the thermal shock reliability is high when the Shore hardness of the base resin is set to 80 or less.
【００３８】（実施の形態２）実施の形態２における組
成構成、プリント基板の特性を（表２）に示す。(Embodiment 2) The composition and the characteristics of the printed circuit board according to Embodiment 2 are shown in Table 2.
【００３９】[0039]
【表２】 [Table 2]
【００４０】プリント基板の製作は実施の形態１と同一
の方法で行い、Ｎｏ．１３，１５のプリント基板製作に
は、エポキシ樹脂プリプレグ製作時に、予め無機イオン
交換体のＩＸＥ５００（東亜合成製）を１ＰＨＲ含浸用
樹脂に添加した樹脂を用いたプリプレグを使用してい
る。The manufacture of the printed circuit board was performed in the same manner as in the first embodiment. For the production of the printed circuit boards 13 and 15, a prepreg using a resin obtained by adding IXE500 (manufactured by Toa Gosei) of inorganic ion exchanger to 1PHR impregnating resin at the time of producing the epoxy resin prepreg is used.
【００４１】そして、完成プリント基板を粉砕し、純水
煮沸抽出における塩素（Ｃｌ）濃度が比較的低いのは、
銅ペースト用のベース樹脂の塩素濃度は約７５００ｐｐ
ｍと高いが、プリプレグの塩素濃度が低いため見かけ上
希釈されるからである。The reason why the finished printed board is pulverized and the chlorine (Cl) concentration in the pure water boiling extraction is relatively low is as follows.
The chlorine concentration of the base resin for copper paste is about 7500pp
m is high, but is apparently diluted due to the low chlorine concentration of the prepreg.
【００４２】無機イオン交換体を使用すると約１／２０
０に塩素濃度を低下させる事ができる。また、銅粉体表
面の高級脂肪酸膜は分散時間と抵抗値に、また防錆剤の
添加で抵抗値変化の防止に有効であることが確認でき
た。When an inorganic ion exchanger is used, about 1/20
The chlorine concentration can be reduced to zero. In addition, it was confirmed that the higher fatty acid film on the copper powder surface was effective for the dispersion time and the resistance value, and that the addition of the rust inhibitor was effective in preventing the resistance value from changing.
【００４３】（実施の形態３）実施の形態３における銅
ペーストの組成構成、プリント基板の特性を（表３）に
示す。(Embodiment 3) The composition of the copper paste and the characteristics of the printed circuit board in Embodiment 3 are shown in Table 3 below.
【００４４】[0044]
【表３】 [Table 3]
【００４５】銅ペースト加工は３本ロール加工にて行
い、プリント基板の製作は実施の形態１と同一の方法で
行った。エチレングリコール、界面活性剤は抵抗値変化
の防止に、またエロジールおよび潤滑剤の添加は印刷速
度の改善に有効であることが確認できた。The copper paste processing was performed by three-roll processing, and the production of the printed circuit board was performed in the same manner as in the first embodiment. It was confirmed that ethylene glycol and a surfactant are effective for preventing a change in resistance value, and that addition of Ezilol and a lubricant is effective for improving a printing speed.
【００４６】[0046]
【発明の効果】以上のように本発明によるプリント基板
は、イオン性不純物を内部で捕獲することができ、抵抗
値変化を防止でき、印刷性や耐熱衝撃信頼性の向上が図
れるという有利な効果が得られる。As described above, the printed circuit board according to the present invention has an advantageous effect that ionic impurities can be trapped inside, a change in resistance can be prevented, and printability and thermal shock reliability can be improved. Is obtained.
【図１】インナービアホールなどのビア接続のプリント
基板の加工工程例の概要図FIG. 1 is a schematic view of an example of a process of processing a printed circuit board for via connection such as an inner via hole.
【図２】同プリント基板の熱衝撃試験における銅ペース
トと銅箔接続境界面ストレスのモデル図FIG. 2 is a model diagram of stress at a boundary surface between a copper paste and a copper foil in a thermal shock test of the printed circuit board.
【図３】銅粉体断面図FIG. 3 is a sectional view of a copper powder.
【図４】ビスフェノールＡ型硬質樹脂を添加し、２００
℃で硬化したベース樹脂基材の添加量率とショアー硬度
特性図FIG. 4 shows the addition of bisphenol A type hard resin,
Characteristic diagram of the addition amount of the base resin substrate cured at ℃ and Shore hardness
【図５】同２６０℃熱衝撃試験を１００回実施した場合
のショアー硬度と抵抗値変化率特性図FIG. 5 is a graph showing the Shore hardness and the rate of change in resistance when the thermal shock test at 260 ° C. is performed 100 times.
１ 銅ペースト ２ プリプレグ ２ａ 絶縁基材 ３ 貫通孔（ビア） ４ ラミネートフィルム ５ 銅箔 ５ａ パターン ６ 銅箔除去部 ７ スキージ ８ 加熱時発生のストレス方向 ９ 冷却時発生のストレス方向 １０ 銅粉体 １１ 高級脂肪酸 DESCRIPTION OF SYMBOLS 1 Copper paste 2 Prepreg 2a Insulating base material 3 Through-hole (via) 4 Laminated film 5 Copper foil 5a Pattern 6 Copper foil removal part 7 Squeegee 8 Stress direction at the time of heating 9 Stress direction at the time of cooling 10 Copper powder 11 High grade fatty acid
───────────────────────────────────────────────────── フロントページの続き (72)発明者 川北 晃司 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 (72)発明者 小川 立夫 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 (72)発明者 杉田 勇一郎 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Koji Kawakita 1006 Kazuma Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. 72) Inventor Yuichiro Sugita 1006 Kadoma Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd.
Claims (10)
を形成した繊維基材プリプレグを使用し、所定個所に銅
箔を配置して熱圧着硬化した後、所定のパターン形成を
行いビア接続したプリント基板において、前記繊維基材
プリプレグの含浸用熱硬化性樹脂ワニスに、樹脂と繊維
中に含有するイオン性不純物を捕獲する無機イオン交換
体を添加した繊維基材プリプレグを用いたプリント基
板。1. A print using a fiber base material prepreg having a through hole for filling a copper paste by printing, arranging a copper foil at a predetermined position, curing by thermocompression bonding, forming a predetermined pattern, and connecting vias. A printed circuit board using a fiber-based prepreg obtained by adding a resin and an inorganic ion exchanger for capturing ionic impurities contained in a fiber to a thermosetting resin varnish for impregnation of the fiber-based prepreg.
を添加した請求項１に記載の繊維基材プリプレグを用い
たプリント基板。2. A printed board using the fiber base prepreg according to claim 1, wherein a rust inhibitor is added to the thermosetting resin varnish for impregnation.
を形成した繊維基材プリプレグを使用し、所定個所に銅
箔を配置して熱圧着硬化した後、所定のパターン形成を
行いビア接続したプリント基板において、銅ペースト加
工時に銅ペーストに含有するイオン性不純物を捕獲する
無機イオン交換体を添加したビア充填用銅ペーストを用
いたプリント基板。3. A print using a fiber base material prepreg having a through-hole for filling a copper paste by printing, arranging a copper foil at a predetermined position, thermocompression-curing, forming a predetermined pattern, and connecting vias. A printed board using a via-filling copper paste to which an inorganic ion exchanger that captures ionic impurities contained in the copper paste is added during processing of the copper paste.
項３に記載のビア充填用銅ペーストを用いたプリント基
板。4. A printed circuit board using the via filling copper paste according to claim 3, wherein a rust inhibitor is added to said copper paste.
酸単独、ダイマー酸とビスフェノール型エポキシ樹脂、
ダイマー酸とビス型ラクトン変性エポキシ樹脂あるいは
ダイマー酸とエポキシ化ポリブタジエンのいずれか１つ
を使用し、プリント基板加工温度での硬化樹脂硬度がシ
ョアー硬度８０以下である請求項３に記載のビア充填用
銅ペーストを用いたプリント基板。5. A dimer acid alone, a dimer acid and a bisphenol type epoxy resin as a base resin of the copper paste,
4. The via filling method according to claim 3, wherein one of dimer acid and bis-lactone-modified epoxy resin or dimer acid and epoxidized polybutadiene is used, and the cured resin hardness at the processing temperature of the printed circuit board is 80 or less in Shore hardness. Printed circuit board using copper paste.
面に高級脂肪酸膜を形成した請求項３に記載のビア充填
用銅ペーストを用いたプリント基板。6. A printed circuit board using a via-filling copper paste according to claim 3, wherein a higher fatty acid film is formed on the surface of the copper powder constituting the copper paste.
コール、プロピレングリコール、メチレングリコールな
どのアルキレングリコールを少なくとも１つ以上添加し
た請求項３に記載のビア充填用銅ペーストを用いたプリ
ント基板。7. The printed circuit board according to claim 3, wherein at least one alkylene glycol such as ethylene glycol, propylene glycol or methylene glycol is added during the processing of the copper paste.
加した請求項３に記載のビア充填用銅ペーストを用いた
プリント基板。8. A printed circuit board using a via-filling copper paste according to claim 3, wherein a surfactant is added during said copper paste processing.
加した請求項３に記載のビア充填用銅ペーストを用いた
プリント基板。9. A printed circuit board using the via-filling copper paste according to claim 3, wherein Ezile is added during the processing of the copper paste.
二硫化モリブデン、四弗化ポリエチレンなどの耐熱潤滑
粒子を少なくとも１つ以上添加した請求項３に記載のビ
ア充填用銅ペーストを用いたプリント基板。10. The method according to claim 10, wherein the copper paste is processed by boron nitride,
4. A printed circuit board using the via-filling copper paste according to claim 3, wherein at least one or more heat-resistant lubricating particles such as molybdenum disulfide and polyethylene tetrafluoride are added.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8279153A JPH10126028A (en) | 1996-10-22 | 1996-10-22 | Printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8279153A JPH10126028A (en) | 1996-10-22 | 1996-10-22 | Printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH10126028A true JPH10126028A (en) | 1998-05-15 |
Family
ID=17607196
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8279153A Pending JPH10126028A (en) | 1996-10-22 | 1996-10-22 | Printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH10126028A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000239416A (en) * | 1999-02-22 | 2000-09-05 | Matsushita Electric Works Ltd | Phenolic resin substrate |
| JP2003036035A (en) * | 2001-07-25 | 2003-02-07 | Kyocera Corp | Display device |
| CN102012540A (en) * | 2010-09-03 | 2011-04-13 | 张莉 | Switch board in optical fiber switching system |
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| JPH05114772A (en) * | 1991-04-29 | 1993-05-07 | Kao Corp | Printed wiring board formed by use of conductive paste |
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| JPH07188391A (en) * | 1993-11-17 | 1995-07-25 | Internatl Business Mach Corp <Ibm> | Via fill composition and method of filling it |
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| JP2000239416A (en) * | 1999-02-22 | 2000-09-05 | Matsushita Electric Works Ltd | Phenolic resin substrate |
| JP2003036035A (en) * | 2001-07-25 | 2003-02-07 | Kyocera Corp | Display device |
| CN102012540A (en) * | 2010-09-03 | 2011-04-13 | 张莉 | Switch board in optical fiber switching system |
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