JP2012117052A - Insulating resin composition for multilayer wiring board, and multilayer wiring board including the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an insulating resin for a multilayer wiring board, and a multilayer wiring board including the insulating resin for a multilayer wiring board.SOLUTION: An insulating resin composition for a multilayer wiring board includes: a polymer resin; and oxidized graphene dispersed in a cured product of the polymer resin. A multilayer wiring board including an insulating resin composition for a multilayer wiring board exhibits outstanding mechanical characteristics and outstanding reliability.

Description

  The present invention relates to an insulating resin composition for a multilayer wiring board and a multilayer wiring board including the same, and more specifically, an insulating resin composition for a multilayer wiring board excellent in mechanical characteristics and reliability, and the same. It is related with the multilayer wiring board containing.

  In general, a printed circuit board (PCB) or a multilayer wiring board is a thin plate on which electrical components such as an integrated circuit, a resistor, or a switch are mounted, and includes various electronic devices and electronic communication devices. Mobile phones, notebook computers, etc. are manufactured in various forms depending on the application, and manufacturing methods are diversified.

  Recently, printed circuit boards are becoming finer, smaller, and more packaged due to the trend toward smaller, thinner, higher density, and packaged electronic products. . In order to form a fine pattern on a printed circuit board, improve reliability, and improve design density, it has been changed to a structure in which circuit layer configurations are combined with changes in raw materials.

  Generally, a semi-cured (B-Stage) prepreg in which a polymer material is impregnated with glass fibers is used as an insulating layer of a printed circuit board. Since the prepreg is impregnated with glass fibers, it has excellent mechanical strength and low coefficient of thermal expansion (CTE). However, in the process of processing and plating micro vias on a printed circuit board using a through hole or a laser, roughness (Roughness) is formed inside the through hole or micro via due to the glass fiber residue (Debris). Can cause problems such as non-plating and floating of plating. In addition, a step occurs at a point where the glass fibers cross each other and a point where the glass fibers do not cross, making it difficult to process a fine circuit, and a local dielectric constant (Dielectric Constant) value is different, thereby realizing a high speed device. There is a problem that it is difficult to do.

  Recently, a polymer material that is not impregnated with glass fiber is used as an insulating layer of a printed circuit board. Such a polymer material is generally produced into a film by a method such as casting by mixing a polymer resin, a filler, a curing agent (Hardner), various additives, and the like. Such a polymer material has an advantage that it can form a fine circuit pattern because it has no glass fiber, exhibits a uniform dielectric constant, and is suitable for a high-speed device. However, since the mechanical strength is weak, the thermal expansion coefficient is large, and the deviation is large, there is a problem that reliability is lowered.

  An object of this invention is to provide the insulating resin composition for multilayer wiring boards excellent in mechanical characteristics and reliability, and a multilayer wiring board containing the same.

  One embodiment of the present invention provides an insulating resin composition for a multilayer wiring board comprising a polymer resin and graphene oxide dispersed in a cured product of the polymer resin.

  The graphene oxide may have at least one functional group among a hydroxyl group, a carboxyl group, and an epoxy group on a surface and an end portion.

  The ratio of carbon number to carbon number (carbon / oxygen) of the graphene oxide may be 1 to 20.

  The content of the graphene oxide may be 0.05 to 40 parts by weight with respect to 100 parts by weight of the polymer resin.

  The polymer resin may have a functional group capable of chemical bonding with the graphene oxide.

  The polymer resin and the graphene oxide can be covalently bonded by a curing reaction.

  The polymer resin may be an epoxy resin.

  The polymer resin may be a thermosetting liquid crystal polymer having a structure represented by the following formula 1.

[Formula 1]

In the above formula, R ₁ and R ₂ are CH ₃ or H, at least one of R ₁ and R ₂ is CH ₃ , and Ar ₁ is an ester, an amide, an ester amide ( It is a divalent aromatic organic group having one or more structural units selected from the group consisting of ester amide, ester imide, and ether imide, and having a molecular weight of 5,000 or less. .

Ar ₁ may include one or more structural units selected from the group represented by Formula 2 below.

[Formula 2]

In the above _formula, Ar _2, Ar 4, Ar ₅ and Ar ₆ is a divalent aromatic organic group, include one or more structural units selected from the group represented by the following formula 3, Ar ₃ is It is a tetravalent aromatic organic group, Comprising: One or more structural units chosen from the group represented by following formula 4 are included, The said n and m are integers of 1-100.

[Formula 3]

[Formula 4]

  The thermosetting liquid crystal polymer may have a molecular weight of 300 to 5,000.

  Another embodiment of the present invention includes a substrate body on which a plurality of insulating layers are stacked, and a circuit pattern formed on the insulating layer, wherein at least one of the plurality of insulating layers is a polymer. Provided is a multilayer wiring board formed of an insulating resin composition containing a resin and graphene oxide dispersed in a cured product of the polymer resin.

  The graphene oxide may have at least one functional group among a hydroxyl group, a carboxyl group, and an epoxy group on a surface and an end portion.

  The ratio of carbon number to carbon number (carbon / oxygen) of the graphene oxide may be 1 to 20.

  The content of graphene oxide in the insulating resin composition may be 0.05 to 40 parts by weight with respect to 100 parts by weight of the polymer resin.

  The polymer resin may have a functional group capable of chemical bonding with the graphene oxide.

  The polymer resin and the graphene oxide can be covalently bonded by a curing reaction.

  The polymer resin may be an epoxy resin.

  The polymer resin may be a thermosetting liquid crystal polymer having a structure represented by the following formula 1.

[Formula 1]

In the above formula, R ₁ and R ₂ are CH ₃ or H, at least one of R ₁ and R ₂ is CH ₃ , and Ar ₁ is an ester, an amide, an ester amide ( It is a divalent aromatic organic group having one or more structural units selected from the group consisting of ester amide, ester imide, and ether imide, and having a molecular weight of 5,000 or less. .

Ar ₁ may include one or more structural units selected from the group represented by Formula 2 below.

[Formula 2]

In the above _formula, Ar _2, Ar 4, Ar ₅ and Ar ₆ is a divalent aromatic organic group, include one or more structural units selected from the group represented by the following formula 3, Ar ₃ is It is a tetravalent aromatic organic group, Comprising: One or more structural units chosen from the group represented by following formula 4 are included, The said n and m are integers of 1-100.

[Formula 3]

[Formula 4]

  The thermosetting liquid crystal polymer may have a molecular weight of 300 to 5,000.

  An insulating resin composition for a multilayer wiring board according to an embodiment of the present invention includes a polymer resin and graphene oxide dispersed in a cured product of the polymer resin, and has a small thermal expansion coefficient. It has excellent mechanical strength.

  A multilayer wiring board including an insulating layer formed of an insulating resin composition according to an embodiment of the present invention has a characteristic that a thermal expansion coefficient is low due to mixing of a polymer resin and graphene oxide. In addition, the mechanical strength is improved by the addition of graphene oxide.

  In the insulating layer according to the present invention, graphene oxide can be dispersed in a cured polymer resin, or a polymer resin and graphene oxide can be chemically bonded to form a composite. As a result, the formation of a circuit pattern by plating and the processability of via holes by a laser or the like are improved, and a high-density pattern can be formed. Further, graphene oxide is well dispersed, the dielectric constant value in the multilayer wiring board becomes uniform, and a high-speed device can be realized.

1 is a cross-sectional view schematically showing a multilayer wiring board according to an embodiment of the present invention. 1 schematically illustrates a portion of a graphene oxide structure according to an embodiment of the present invention.

Specific contents for carrying out the invention

  Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. However, the embodiment of the present invention can be modified in various other forms, and the scope of the present invention is not limited to the embodiment described below. Also, the embodiments of the present invention are provided to more fully explain the present invention to those skilled in the art. Accordingly, the shape and size of elements in the drawings may be exaggerated for a clearer description, and elements denoted by the same reference numerals in the drawings are the same elements.

  FIG. 1 is a cross-sectional view schematically showing a multilayer wiring board according to an embodiment of the present invention.

  Referring to FIG. 1, the multilayer wiring board according to the present embodiment includes a substrate body on which a plurality of insulating layers 11, 12, and 13 are stacked, and a circuit pattern 21 formed on each of the insulating layers.

  More specifically, the second insulating layer 12 and the third insulating layer 13 are laminated on the upper surface and the lower surface of the first insulating layer 11 and the first insulating layer 11 to form a substrate body. In addition, via electrodes 22 and 23 that connect circuit patterns formed in the respective layers are formed in the first to third insulating layers 11, 12, and 13.

  In the present embodiment, a multilayer wiring board having a four-layer structure is illustrated. Can do.

  At least one insulating layer among the insulating layers forming the substrate body may be formed of an insulating resin composition according to an embodiment of the present invention.

  The multilayer wiring board is formed of a multilayer circuit pattern and an insulating layer that insulates the circuit pattern. The multilayer wiring board can have more excellent reliability as the difference in coefficient of thermal expansion (CTE) between the conductive material constituting the circuit and the insulating material that insulates the circuit pattern is smaller.

  An insulating resin composition according to an embodiment of the present invention includes a polymer resin and graphene oxide dispersed in a cured product of the polymer resin, and has a low thermal expansion coefficient and excellent mechanical strength. Has characteristics.

  Hereinafter, the components of the insulating resin composition for a multilayer wiring board according to an embodiment of the present invention and the characteristics thereof will be described more specifically.

  An insulating resin composition for a multilayer wiring board according to an embodiment of the present invention includes a polymer resin and graphene oxide (GO) dispersed in a cured product of the polymer resin.

  Graphene oxide can be formed by oxidation of graphite. Graphite has a layered structure in which graphene, which is a plate-like structure in which carbon atoms are connected by a hexagonal ring, is overlapped. In general, the distance between layers is 3.35 mm (0.335 nm). Since graphene has a structure in which carbon nanotubes are spread in a flat plate shape, it has a high conductivity equivalent to that of carbon nanotubes and has excellent mechanical properties.

  When the graphite powder is oxidized, each layer of graphite is oxidized, and a graphene oxide powder to which a hydroxyl group, a carboxyl group, an epoxy group, etc. are attached is obtained in a state where the layered structure is maintained.

  The graphene oxide powder can be produced by oxidizing graphite powder with an oxidizing agent or oxidizing it with an electrochemical method.

The oxidizing agent include, but are not limited to, for example, nitric _acid, there is NaClO 3, KMnO ₄ and the like, can be used as a mixture thereof alone or in combination.

  The graphene oxide in the present embodiment is preferably sufficiently oxidized so as not to deteriorate the insulating properties of the polymer resin. The graphene oxide is preferably oxidized sufficiently and exhibits little or no electrical conductivity. The ratio of carbon number to carbon number (carbon / oxygen) in graphene oxide can vary depending on the degree of oxidation, and can be, for example, 1 to 20.

  FIG. 2 schematically illustrates a part of a graphene oxide structure according to an embodiment of the present invention.

  Referring to FIG. 2, graphene oxide includes a large number of functional groups such as a hydroxyl group, a carboxyl group, and an epoxy group on the surface and end portions. The kind and number of functional groups may vary depending on the oxidation method or the degree of oxidation of graphene oxide.

  Graphene oxide can be physically dispersed in a cured product of the polymer resin, and can form a chemical bond with the polymer resin by the functional group. The graphene oxide having a functional group can form a covalent bond by a curing reaction with a polymer resin, whereby a composite organically linked to the polymer resin can be obtained.

  More specifically, when graphene oxide is added to an insulating resin composition containing a polymer resin and a curing reaction is performed, a curing reaction between the polymer resin and graphene oxide and a curing reaction between graphene oxide are performed. Can do. Accordingly, a cured product in which a polymer resin and graphene oxide form a network structure can be formed.

  Graphene oxide has a low thermal expansion coefficient and excellent mechanical properties. In order to improve the mechanical strength of the polymer resin, the properties of the polymer resin can be improved even if it is added in a smaller amount than the generally added inorganic filler such as silica.

  The content of the graphene oxide may be 0.05 to 40 parts by weight with respect to 100 parts by weight of the polymer. If the content is less than 0.05 parts by weight, the thermal expansion coefficient of the insulating resin composition may increase. If the content exceeds 40 parts by weight, the processability of the insulating resin composition may be reduced. is there.

  The polymer resin is not particularly limited as long as it is used as an insulating material for a multilayer wiring board. Preferably, a thermosetting polymer resin capable of performing a chemical reaction with the functional group of graphene oxide can be used. Although not limited thereto, for example, an epoxy resin can be used.

  The epoxy resin is not particularly limited, and examples thereof include bisphenol A type epoxy resin, naphthalene modified epoxy resin, cresol novolac epoxy resin, rubber modified epoxy resin and the like, and these can be used alone or in combination of two or more. .

  The naphthalene modified epoxy resin may have an average epoxy equivalent of 100 to 600.

  The cresol novolac epoxy resin may have an average epoxy equivalent of 300 to 600. The cresol novolac epoxy resin is a novolak epoxy resin, and when this is used, an epoxy cured product having high heat resistance can be obtained.

  The rubber-modified epoxy resin may have an average epoxy equivalent of 100 to 500.

In addition, according to an embodiment of the present invention, a thermosetting liquid crystal polymer (Liquid Crystal Thermoset, LCT) having a structure represented by the following formula can be used as the polymer resin. In the thermosetting liquid crystal polymer, both ends of Ar ₁ having various types of functional groups are blocked with maleimide having at least one methyl group.

[Formula 1]

In the above formula, R ₁ and R ₂ are CH ₃ or H, at least one of R ₁ and R ₂ is CH ₃ , and Ar ₁ is an ester, an amide, an ester amide ( It is a divalent aromatic organic group having one or more structural units selected from the group consisting of ester amide, ester imide, and ether imide, and having a molecular weight of 5,000 or less. .

Ar ₁ in the above formula 1 may include one or more structural units selected from the group represented by the following formula 2.

[Formula 2]

In the above _formula, Ar _2, Ar 4, Ar ₅ and Ar ₆ is a divalent aromatic organic group, include one or more structural units selected from the group represented by the following formula 3, Ar ₃ is It is a tetravalent aromatic organic group, Comprising: One or more structural units chosen from the group represented by following formula 4 are included, The said n and m are integers of 1-100.

[Formula 3]

[Formula 4]

  The thermosetting liquid crystal polymer may have a molecular weight of 300 to 5,000. When the molecular weight of the thermosetting liquid crystal polymer is less than 300, the crosslinking density is high and the brittleness may be weakened. When the molecular weight exceeds 5,000, the viscosity of the polymer is high. Mixing with graphene may be difficult.

  The mesogen of the thermosetting liquid crystal polymer preferably has an amide ester structure. For this reason, aromatic dicarboxylic acid, aromatic diamine, dihydroxybenzene, hydroxybenzoic acid, aminobenzoic acid, etc. can be mentioned as usable monomers. When the amide functional group in the thermosetting liquid crystal polymer increases the solubility in a solvent, an aromatic structure, particularly a biphenyl or naphthalene structure is preferable for forming a liquid crystal.

The thermosetting liquid crystal polymer can be chemically bonded to graphene oxide by a functional group contained in the Ar ₁ structural unit. More specifically, the functional group contained in the Ar ₁ structural unit in the polymerization process of the thermosetting liquid crystal polymer can perform an esterification reaction or an amidation reaction with the carboxyl group of graphene oxide.

  For the thermosetting liquid crystal polymer, an aprotic solvent can be used for solvent casting to prevent weakening of mechanical properties due to anisotropy of liquid crystal. The type of the aprotic solvent is not particularly limited. For example, N, N-dimethylacetamide, N-methylpyrrolidone (NMP), N-methylcaprolactam, N, N-dimethylformamide, N, N-diethylacetamide, N -Methyl propionamide, dimethyl sulfoxide, γ-butyl lactone, dimethyl imidazolidinone, tetramethyl phosphoramide, ethyl cellosolve, etc., which can be used alone or in admixture of two or more.

  Moreover, the insulating resin composition for multilayer wiring boards according to an embodiment of the present invention may include a curing agent. A curing agent suitable for the polymer resin used can be included. When an epoxy resin is used as the polymer resin, a curing agent for epoxy curing can be included. Thereby, the curing performance of the polymer resin can be improved, and mixing with graphene oxide can be facilitated.

  The curing agent for epoxy curing is not particularly limited as long as it is usually used, and one having a softening point of 100 to 140 ° C. and a hydroxyl equivalent of 100 to 150 is used. can do.

  Although the said hardening agent for epoxy hardening is not restrict | limited to this, For example, a bisphenol A novolak type hardening | curing agent can be used. The bisphenol A novolak type curing agent having a hydroxyl group equivalent of 100 to 150 has a high molecular weight, and can thereby increase the softening point.

  The bisphenol A novolac type curing agent has a bisphenol structure for a certain number of repeating units between two hydroxyl groups, and when the hydroxyl group equivalent is increased, the molecular weight of the curing agent that links the epoxy chains to each other increases. There is a risk that the final hardened structure will be less dense.

  The content of the curing agent may be 5 to 20 parts by weight with respect to 100 parts by weight of the polymer resin. Within the above range, the desired physical properties can be easily expressed, and the properties excellent in reactivity can be expressed.

  In addition, the insulating resin composition for a multilayer wiring board according to an embodiment of the present invention may further include a curing accelerator.

  As the curing accelerator, an imidazole compound can be used. Although not limited thereto, for example, 2-ethyl-4-methylimidazole, 1-(-2-cyanoethyl) -2-alkylimidazole or 2-phenylimidazole may be used, and one or more of these may be used in combination. it can.

  The content of the curing accelerator may be 0.1 to 1 part by weight with respect to 100 parts by weight of the polymer resin.

  If the content of the curing accelerator is less than 0.1 parts by weight, the curing rate may be slow or uncured, and if it exceeds 1 part by weight, the curing rate increases and the reproducible degree of curing. May be difficult to obtain.

  Moreover, the insulating resin composition for multilayer wiring boards according to an embodiment of the present invention can contain additives such as a softening agent and a plasticizer as necessary.

  Multilayer wiring boards are components used in electronic equipment, and have long-term reliability due to environmental changes and short-term reliability against instantaneous heat and electric shocks that occur when driving semiconductors and various elements mounted on multilayer wiring boards. Must be guaranteed.

  As described above, the multilayer wiring board can have superior reliability as the difference in thermal expansion coefficient between the conductive material constituting the circuit and the insulating layer that insulates the circuit pattern is smaller.

  For example, the thermal expansion coefficient of copper constituting the circuit is 10 to 20 ppm / ° C., and the thermal expansion coefficient of the polymer resin constituting the insulating layer is usually 50 to 80 ppm / ° C. In particular, the polymer resin has a large thermal expansion coefficient at a glass transition temperature (Tg) or higher, but the thermal expansion coefficient at a glass transition temperature of 150 to 200 ° C. is 150 to 180 ppm / ° C.

  When a component such as a semiconductor is mounted on a multilayer wiring board, heat is rapidly applied to the multilayer wiring board at 280 ° C. for 3 to 5 seconds. In such a case, the circuit may crack or the shape of the multilayer wiring board may be deformed.

  In general, in order to reduce the thermal expansion coefficient of a multilayer wiring board, various ceramic fillers (Fillers) are inserted into a polymer insulating material, or glass fibers are impregnated into a polymer insulating material. Yes. However, this deteriorates the workability of the multilayer wiring board, roughens the surface, and there is a problem that it is difficult to implement a high-speed (High Speed) device.

  However, the multilayer wiring board formed of the insulating resin composition according to the present invention has a characteristic that the thermal expansion coefficient is lowered by mixing the polymer resin and graphene oxide. In addition, the mechanical strength is improved by the addition of graphene oxide.

  Moreover, the insulating resin composition according to the present invention can form graphene oxide dispersed in a polymer resin or form a composite by chemical bonding of the polymer resin. Thereby, it is excellent in workability and a high-density pattern can be formed. Further, graphene oxide is well dispersed, the dielectric constant value in the multilayer wiring board becomes uniform, and a high-speed device can be realized.

  As described above, the insulating resin composition for a multilayer wiring board according to an embodiment of the present invention can be used as a build-up insulating material for manufacturing a multilayer wiring board.

  The insulating resin composition for a multilayer wiring board according to an embodiment of the present invention can be formed on an insulating layer having a certain thickness on a base film by a method such as casting, and can be applied to a build-up process.

  A circuit pattern can be formed on the insulating layer by forming via holes and plating, thereby manufacturing a multilayer wiring board as shown in FIG.

  As described above, the insulating resin composition according to the embodiment of the present invention has a small surface roughness, and the surface is not roughened by the glass fiber, and the phenomenon that the residue of the glass fiber exists on the inner wall of the via does not occur. Therefore, it has a feature that is excellent in circuit pattern formation by plating and via hole workability by laser or the like.

  The present invention is not limited by the above-described embodiments and the accompanying drawings, but is limited by the appended claims. Accordingly, various forms of substitutions, modifications and changes can be made by persons having ordinary knowledge in the art within the scope of the technical idea of the present invention described in the claims. It belongs to the scope of the present invention.

11, 12, 13 Insulating layer 21 Circuit pattern 22, 23 Via electrode

Claims (20)

A polymer resin;
Graphene oxide dispersed in a cured product of the polymer resin;
An insulating resin composition for a multilayer wiring board.   The insulating resin composition for a multilayer wiring board according to claim 1, wherein the graphene oxide has at least one functional group among a hydroxyl group, a carboxyl group, and an epoxy group on a surface and an end portion.   2. The insulating resin composition for a multilayer wiring board according to claim 1, wherein a ratio of carbon number to oxygen number of the graphene oxide is 1 to 20. 3.   The insulating resin composition for a multilayer wiring board according to claim 1, wherein the content of the graphene oxide is 0.05 to 40 parts by weight with respect to 100 parts by weight of the polymer resin.   The insulating resin composition for a multilayer wiring board according to claim 1, wherein the polymer resin has a functional group capable of chemical bonding with the graphene oxide.   The insulating resin composition for a multilayer wiring board according to claim 1, wherein the polymer resin and the graphene oxide are covalently bonded by a curing reaction.   The insulating resin composition for a multilayer wiring board according to claim 1, wherein the polymer resin is an epoxy resin. The insulating resin composition for a multilayer wiring board according to claim 1, wherein the polymer resin is a thermosetting liquid crystal polymer having a structure represented by the following formula 1.
[Formula 1]

In the above formula, R ₁ and R ₂ are CH ₃ or H, and at least one of R ₁ and R ₂ is CH ₃ ,
Ar ₁ includes one or more structural units selected from the group consisting of an ester, an amide, an ester amide, an ester imide, and an ether imide. , A divalent aromatic organic group having a molecular weight of 5,000 or less. The insulating resin composition for multilayer wiring boards according to claim 8, wherein Ar ₁ includes one or more structural units selected from the group represented by the following formula 2.
[Formula 2]

In the _formula, Ar _2, Ar 4, Ar ₅ and Ar ₆ is a divalent aromatic organic group, include one or more structural units selected from the group represented by the following formula 3, Ar ₃ is It is a tetravalent aromatic organic group, Comprising: One or more structural units chosen from the group represented by following formula 4 are included, The said n and m are integers of 1-100.
[Formula 3]

[Formula 4]

  The insulating resin composition for a multilayer wiring board according to claim 8, wherein the thermosetting liquid crystal polymer has a molecular weight of 300 to 5,000. A substrate body on which a plurality of insulating layers are laminated;
A circuit pattern formed on the insulating layer,
At least one insulating layer of the plurality of insulating layers is a multilayer wiring board made of an insulating resin composition containing a polymer resin and graphene oxide dispersed in a cured product of the polymer resin.   12. The multilayer wiring board according to claim 11, wherein the graphene oxide has at least one functional group of a hydroxyl group, a carboxyl group, and an epoxy group on a surface and an end portion.   The multilayer wiring board according to claim 11, wherein a ratio of carbon number to oxygen number of the graphene oxide is 1 to 20.   The multilayer wiring board according to claim 11, wherein a content of the graphene oxide is 0.05 to 40 parts by weight with respect to 100 parts by weight of the polymer resin.   The multilayer wiring board according to claim 11, wherein the polymer resin has a functional group capable of chemical bonding with the graphene oxide.   The multilayer wiring board according to claim 11, wherein the polymer resin and the graphene oxide are covalently bonded by a curing reaction.   The multilayer wiring board according to claim 11, wherein the polymer resin is an epoxy resin. The multilayer wiring board according to claim 11, wherein the polymer resin is a thermosetting liquid crystal polymer having a structure represented by the following formula 1.
[Formula 1]

In the above formula, R ₁ and R ₂ are CH ₃ or H, and at least one of R ₁ and R ₂ is CH ₃ ,
Ar ₁ includes one or more structural units selected from the group consisting of an ester, an amide, an ester amide, an ester imide, and an ether imide. , A divalent aromatic organic group having a molecular weight of 5,000 or less. The multilayer wiring board according to claim 18, wherein Ar ₁ includes one or more structural units selected from the group represented by Formula 2 below.
[Formula 2]

In the _formula, Ar _2, Ar 4, Ar ₅ and Ar ₆ is a divalent aromatic organic group, include one or more structural units selected from the group represented by the following formula 3, Ar ₃ is It is a tetravalent aromatic organic group, Comprising: One or more structural units chosen from the group represented by following formula 4 are included, The said n and m are integers of 1-100.
[Formula 3]

[Formula 4]

  The multilayer wiring board according to claim 18, wherein the thermosetting liquid crystal polymer has a molecular weight of 300 to 5,000.

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