JPH10125636A5 - - Google Patents

Info

Publication number
JPH10125636A5
JPH10125636A5 JP1996274353A JP27435396A JPH10125636A5 JP H10125636 A5 JPH10125636 A5 JP H10125636A5 JP 1996274353 A JP1996274353 A JP 1996274353A JP 27435396 A JP27435396 A JP 27435396A JP H10125636 A5 JPH10125636 A5 JP H10125636A5
Authority
JP
Japan
Prior art keywords
polishing
polished
measured value
vibration intensity
time
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1996274353A
Other languages
English (en)
Japanese (ja)
Other versions
JP3747389B2 (ja
JPH10125636A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP27435396A priority Critical patent/JP3747389B2/ja
Priority claimed from JP27435396A external-priority patent/JP3747389B2/ja
Publication of JPH10125636A publication Critical patent/JPH10125636A/ja
Publication of JPH10125636A5 publication Critical patent/JPH10125636A5/ja
Application granted granted Critical
Publication of JP3747389B2 publication Critical patent/JP3747389B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP27435396A 1996-10-17 1996-10-17 研磨方法及び研磨制御装置 Expired - Fee Related JP3747389B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP27435396A JP3747389B2 (ja) 1996-10-17 1996-10-17 研磨方法及び研磨制御装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27435396A JP3747389B2 (ja) 1996-10-17 1996-10-17 研磨方法及び研磨制御装置

Publications (3)

Publication Number Publication Date
JPH10125636A JPH10125636A (ja) 1998-05-15
JPH10125636A5 true JPH10125636A5 (enExample) 2004-09-16
JP3747389B2 JP3747389B2 (ja) 2006-02-22

Family

ID=17540482

Family Applications (1)

Application Number Title Priority Date Filing Date
JP27435396A Expired - Fee Related JP3747389B2 (ja) 1996-10-17 1996-10-17 研磨方法及び研磨制御装置

Country Status (1)

Country Link
JP (1) JP3747389B2 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4924593B2 (ja) * 2008-12-01 2012-04-25 セイコーエプソン株式会社 Ｃｍｐ研磨方法、ｃｍｐ装置、半導体装置及びその製造方法

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