JPH0997820A - Semiconductor wafer - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent the deterioration of the quality of good pellets caused by markings and to recognize optically good or bad of pellet regions precisely by recording layout information of bag pellets on no-pellet regions where elements cannot be formed at the peripheral region of a wafer. SOLUTION: A wafer 1 made of silicon is provided with pellet regions sectioned by scribing lines; these pellet regions 2 include semiconductor elements formed by the diffusion of impurities and forming wiring. The non-pellet regions 2A outside the pellet regions 2 record the layout information of the result of checking the pellet regions with layer or ink as a mask 3. The non-pellet regions 2A, which record the mark 3, are distributed widely on the peripheral part of the wafer 3 and recording can be repeated easily.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor wafer, and more particularly, it relates to a semiconductor wafer in which the inspection result of a pellet region as a product is recorded on the wafer.

[0002]

2. Description of the Related Art In a semiconductor device manufacturing process, elements are formed in a pellet region of a wafer through steps such as impurity diffusion and wiring formation, and then cut from scribe lines and separated into pellets to form islands of a lead frame. It is mounted, but in order to mount only good pellets, the LSI tester determines whether the pellet area is good or bad in the final step of wafer manufacturing. In the case of failure, for example, as shown in FIG. There is used a method of making a mark 8 by scratches or ink or the like on the pellet region 2 by a needle or a laser.

However, in the recording method using this marking, the quality of the non-defective pellet region around the defective pellet region is deteriorated due to the scattering of dust, ink, etc. generated at the time of marking, and the optical quality of the non-defective product and the defective product in the pellet assembling process. There was a drawback that it became difficult to recognize the target.

As a countermeasure against this, as shown in FIG. 5, one of the pellet areas of the wafer 1 is used as a recording pellet area 9, and a pattern of the same array as the array of all the pellet areas on the wafer is provided. For example, Japanese Patent Application Laid-Open No. 3-142945 discloses a method of creating a defect by applying electrical or electrical stress and recording good or bad array information of a pellet region.

[0005]

However, although the above-mentioned conventional method of using the recording pellet area eliminates the drawbacks of the marking method using ink or the like, the recording pellet area of the inspection result is defective in the manufacturing process of the semiconductor wafer. Occurs, a problem arises in that the inspection result is erroneously recognized, and a problem arises in that a special process must be added to the wafer manufacturing process to form the recording pellet region. There is also a problem that it is difficult to change the information once recorded.

An object of the present invention is to provide a semiconductor wafer having a mark recorded thereon, which prevents deterioration of quality of non-defective pellets due to marking, and allows good or bad recognition of good / defective pellet area without adding a special process. To do.

[0007]

A semiconductor wafer according to the present invention is a semiconductor wafer having a plurality of pellet regions in which semiconductor elements are formed. In a non-pellet area where elements cannot be formed in the peripheral portion of the wafer, array information of defective pellet areas is provided. Is recorded.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to the drawings. FIG. 1 is a top view of a wafer for explaining an embodiment of the present invention.

In FIG. 1, a plurality of pellet regions 2 defined by scribe lines are formed on a wafer 1 made of silicon or the like.
Is provided, and a semiconductor element is formed in the pellet region 2 by diffusion of impurities, wiring formation, and the like. And
In the non-pellet area 2A outside the pellet area 2, array information of the inspection result of the pellet area 2 is recorded as a mark 3 by laser or ink. Since the non-pellet area 2A for recording the mark 3 is widely present in the peripheral portion of the wafer 1, re-recording is easy. For example, if re-inspection of the pellet area 2 is required, the mark 3
A mark for cancellation may be provided on the above, and a mark of sequence information of the re-inspection result may be recorded in another non-pellet area 2A.

2A and 2B show the case where the mark 3A made of a bar code is used for recording the array information. Mark 3A composed of the bar code shown in FIG.
Is recorded in the non-pellet area 2A, if the defect 4 exists in the non-pellet area 2A, the other non-pellet area 2A is recorded.
It may be recorded in A, or as shown in FIG.
The defect 4 can be marked by using the information recording interruption mark 5A and the information recording restart mark 5B.

According to the embodiment of the present invention configured as described above, since the array information of the defective product is marked in the non-pellet region 2A, the pellet region of the non-defective product due to dust or ink at the time of marking is conventionally used. No quality degradation of 2 occurs. Therefore, optical recognition of information in the pellet assembly process is extremely easy. Further, since the recording pellet area is not necessary, no special process is required.

FIGS. 3A and 3B are views showing marks of other information. In FIG. 3A, the good / bad array of the pellet region 2 of the wafer 1 is formed by circles (other shapes may be used).
The markings are made by the non-defective mark 6 and the defective mark 7, and FIG. 3B shows the arrangement of defective products by hexadecimal numbers and symbols. For example, since the number "4" is represented as "0100", it indicates that the second pellet region is defective in the first row of the array. Note that these marks 3B and 3C do not necessarily have to be marked in the same arrangement as the arrangement of the pellet regions 2, but if the arrangement order of the marks is predetermined, marking can be done in any order.

[0013]

As described above, according to the present invention, on a wafer in which a semiconductor element is formed, a pellet region according to the inspection result of the wafer is formed in a non-pellet region around the wafer different from the product pellet region. By recording the array information of good and bad of the, it is possible to prevent the quality deterioration of the good pellet due to the marking at the time of inspection, without adding a special process to the manufacturing process of the semiconductor wafer, the base pattern, the defect in the process There is an effect that the accuracy of automatic mark recognition at the time of pellet assembly can be improved without being affected. Further, there is an effect that re-recording can be easily performed by re-inspection in the wafer inspection process.

[Brief description of drawings]

FIG. 1 is a top view of a semiconductor wafer according to an embodiment of the present invention.

FIG. 2 is a diagram showing marks used in the embodiment.

FIG. 3 is a diagram showing another mark used in the embodiment.

FIG. 4 is a top view of a conventional semiconductor wafer.

FIG. 5 is a top view of another conventional semiconductor wafer.

[Explanation of symbols]

 1 Wafer 2 Pellet area 2A Non-pellet area 3, 3A to 3C Mark 4 Defect 5A Interruption mark 5B Restart mark 6 Good mark 7 Bad mark 8 Mark 9 Recording pellet area

Claims (4)

[Claims] 1. A semiconductor wafer having a plurality of pellet regions in which semiconductor elements are formed, wherein the array information of defective pellet regions is recorded in a non-pellet region where the elements cannot be formed in the peripheral portion of the wafer. 2. The semiconductor wafer according to claim 1, wherein the array information of the defective pellet region is recorded by an optically readable mark. 3. The semiconductor wafer according to claim 2, wherein the optically readable mark comprises a bar code. 4. The semiconductor wafer according to claim 2, wherein the optically readable mark is composed of characters and symbols.