JPH0955571A - Electronic circuit board with high insulation section and its production - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic circuit board with high insulation section, and its production method, in which high insulation performance is realized at relatively low production cost and material cost while enhancing the resistance against secular change caused by adhesion of contaminants. SOLUTION: An electronic circuit board 510 is arranged in a hole 522 made in another electronic circuit board 512 and both boards are connected/supported through electronic devices 518, 520. The signal line 516 on the board 510 is a signal line formed on a common board.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates generally to electronic circuit manufacturing techniques for low current applications, and more particularly to providing highly insulated compartments on an electronic circuit board to avoid the effects of leakage currents. And an electronic circuit board and a manufacturing method thereof.

[0002]

2. Description of the Related Art In recent years, as an electronic circuit mounting technique, it is widely used as an inexpensive and highly reliable soldering method to use an automatic soldering device by jet soldering after placing electronic components on an electronic circuit board. It has become popular. However, when forming a circuit that requires high insulation such as handling a minute current on an electronic circuit board, simply forming the connection terminals and signal lines of the components on the electronic circuit board does not lead to other connection terminals and signal lines. It is known that leakage current flowing from the signal line through the surface and the inside of the substrate causes measurement errors and malfunctions. Therefore, conventionally, the following method has been devised and used when the highly insulating portion is provided on the electronic circuit board for the purpose of preventing leakage current.

A: Method of Enclosing Signal Line with Guard FIG. 1 shows an external view of a structure in which a signal line is enclosed with a guard. FIG.
Then, the electronic components 10 and 12 are connected by the signal line 14 on the glass epoxy substrate 18. The guard pattern 16 is mounted so as to surround the signal line and the connection terminal 14, and prevents a leakage current and a current flowing due to dielectric absorption in a route from the surface of the substrate to the signal line. As the guard 16, an active guard or a passive guard is used.

Although this method sacrifices the mounting density of parts to some extent, it can be manufactured without changing the conventional manufacturing process, so that the working cost can be kept low. However, the path of leakage current that can be prevented is limited to the one that travels on the surface of the substrate, and the one that travels inside the substrate cannot be prevented. Further, if dirt adheres to the guard portion on the surface of the substrate due to aging, leakage (current leakage) is likely to occur, which is also a problem.

FIG. 2 shows an improved version of the guard structure of FIG.
It is a perspective view with a section which made the inside of a substrate transparent. In FIG. 2, the same structure as the signal line 218 and the guard 220 on the front surface of the substrate 208 is provided on the rear surface of the substrate as the signal line 230 and the guard 226. Further, the front and back guard patterns are connected by through holes 228 at regular intervals. The structure is such that the influence of the leakage current and the dielectric absorption in the path transmitted on the front surface / the back surface of the substrate is prevented, and the influence of the leakage current and the dielectric absorption in the path passing through the inside of the substrate is prevented to some extent. Note that 210, 212, 21
Reference numerals 4, 216 are through holes for inserting feet of electronic components. Further, in the through holes 228, some of the through holes are omitted for the sake of clarity.

However, with this structure, it is not possible to completely prevent the influence of the leakage current and the dielectric absorption of the path passing through the through holes. Also, the leakage current that propagates on the surface also leaks when the surface becomes dirty, so it leaks.
It also has the drawback of being weak against changes over time.

B: Method of using Teflon and ceramic substrate This is a structure and method of using a Teflon-based or ceramic-based base material having an excellent insulating property as an electronic circuit board. Since the manufacturing process is almost the same as the conventional one except that the substrate material is different, the manufacturing cost can be kept low and high insulation performance can be realized, but the material cost is very high.

C: Method of using Teflon stud (hand-solder type Teflon terminal) FIG. 3 shows a structure of a highly insulated line using the hand-solder type Teflon terminal (Teflon stud). FIG. 3 (1) shows a side view, and FIG. 3 (2) shows a plan view of the same structure. As shown in FIG. 3, Teflon studs 310 and 312 are inserted into the holes of the glass epoxy substrate 314, and a plurality of electronic components are manually soldered to the connection terminals of the Teflon studs 310 and 312 (320, 322) Structure and method. By using Teflon with high insulation for the terminals,
Although leakage current from the board can be prevented, there are disadvantages that the material cost of the Teflon stud is high, and the Teflon stud is manually inserted and soldered, so that the operation cost is high.

D: Method of Using Clover Leaf (Automatic Solder Teflon Terminal) FIG. 4 shows the structure of a highly insulated line using the automatic solder Teflon terminal (crowbar leaf). 4 (1) shows a side view and FIG. 4 (2) shows a plan view of the same structure. As shown in FIG. 4, the clover leafs 410 and 412 are inserted into the holes of the glass epoxy substrate 314, and the electronic components 32 are inserted into the through holes in the clover leaves 410 and 412.
Place 4, 326, 328 feet and solder through holes using an automated soldering machine (418, 420)
Structure and method. Compared with the structure using Teflon studs in Fig. 3, since automatic soldering equipment can be used, the work cost can be kept low, and the material cost of Cloverleaf is cheaper than Teflon studs, but it is better than Method A described above. Since the cost is high and the creepage distance between the connection point of the component terminal and the substrate is short, there are drawbacks that it easily leaks and is vulnerable to dirt.

In addition, when several or more electronic components are connected to one terminal by using a Teflon stud and a clover leaf, it is difficult to solder several electronic components to one Teflon terminal because of the structure. Circuits must be distributed and soldered to several Teflon terminals. In this case, there is also a problem that the area of the Teflon terminal required for the connection on the substrate is significantly larger than that of the method A.

As described above, various methods have been devised in order to provide a highly insulated signal line on an electronic circuit board. However, it is possible to realize highly insulated inexpensively and to prevent a change over time such as leakage due to adhesion of dirt. There was no strong structure and its manufacturing method.

[0012]

SUMMARY OF THE INVENTION It is an object of the present invention to provide an electronic circuit board with a highly insulating partition and a method of manufacturing the same, which has a high insulation performance while keeping the manufacturing cost and the material cost relatively low. .

Another object of the present invention is to provide an electronic circuit board with a highly insulating section and a method for manufacturing the same, which is resistant to aging due to adhesion of dirt.

[0014]

An electronic circuit board with a high insulation partition according to the present invention is an electronic circuit board with a high insulation board in which a parent board and a child board for the high insulation partition are connected / supported only by electronic components. . Here, the high-insulation substrate may be arranged in a hole surrounded by the parent substrate, or may be arranged so that a part of the periphery does not face the parent substrate.

As a result, the high-insulation board is not connected to the parent board from the base material or any extra parts, and since there is only air between the high-insulation board and the parent board, the insulating performance can be remarkably enhanced. . The only components that are connected to the parent board are the electronic components that are connected to the high-insulation substrate, but originally, electronic components used for low-current applications use materials that have characteristics that prevent them from leaking into the body. Therefore, the effect of remarkably preventing the leakage current from the parent board is great. In addition, since such an electronic component is originally made of a material that does not easily get dirty, deterioration of the insulation degree is low even with the lapse of time.

An example of a method for manufacturing an electronic circuit board with a high insulation section according to the present invention is to first form a slit around the portion of the main board where the high insulation section is provided, leaving one or more members, and then arrange the parts. Then, soldering is performed using the automatic soldering device, and finally the member left between the slits is cut.

When soldering is performed in the above manufacturing method, through-hole plating is performed in the slit between the parent board and the high-insulation section, so that the insulating effect between both boards can be further enhanced.

[0018]

FIG. 5 shows a basic embodiment according to the present invention.
FIG. 5 (1) is a side view of the embodiment according to the present invention.
A plan view of the embodiment is shown in (2).

FIG. 5 shows an embodiment using the present invention when it is desired to keep the signal line 516 connecting the electronic components 518 and 520 highly insulated. The electronic component that can be used in the present invention can be used as long as it has a plurality of connection leads such as a resistor, a capacitor, a relay, a diode, a transistor, a FET, and an IC, and has a high resistance and a small capacity. .

As shown in FIG. 5B, another electronic circuit board 510 is arranged in the hole 522 provided in the electronic circuit board 512, and both boards are connected / supported by the electronic components 518 and 520. . The signal line 516 on the substrate 510 is a signal line formed on a normal substrate.

With such a structure, since the signal line 516 is on the substrate 510 whose periphery is insulated by the air in the hole 522, the leakage current from the parent substrate 512 can be almost prevented. As one of ordinary skill in the art will appreciate, air has the highest insulation performance next to vacuum. Also,
The outer peripheries of the electronic components 518 and 520 serve as a path for leakage current to flow from the parent board 512, but in general, electronic components for microcurrent use are unlikely to cause leakage between their own terminals and are resistant to changes over time such as dirt. Since it has a strong structure / material, the leakage current transmitted through electronic parts is extremely small.
Therefore, even though the substrate 510 is structurally equivalent to the parent substrate 512, it functions as a high insulation section / high insulation substrate.

The manufacturing method of the embodiment shown in FIG. 5 will be described in detail with reference to FIG. FIG. 6 is a plan view of a board 552 corresponding to the electronic circuit board 512 of FIG. 5 before mounting electronic components. The substrate 552 has a region 550 which becomes the substrate 510 when separated, slits 532 and 534 which are formed around the region 550, and connecting portions 540 and 542 which support the substrate 552 and the region 550. In the area 550, there are signal line patterns 554 connecting the electronic components, and holes 536 and 538 for inserting legs of the electronic components into the signal line patterns 554. In addition, holes 544 and 54 are formed in the board 552 for inserting the feet on the side different from the side inserted in the area 550 of the electronic component.
6 and a signal line pattern 54 for guiding a signal from each hole
8 and 549 are provided.

Table 1 shows the relationship between the manufacturing cost, the material cost and the insulation performance between the conventional structure and method and the structure and method according to the present invention.

[0024]

[Table 1]

As a preferred method of manufacturing the embodiment shown in FIG. 5, (1) First, a hole 53 for inserting an electronic component in a substrate 552
6, 538, 544, and 546 have electronic components 518 and 52.
0, (2) Next, the board 552 in which the electronic component is still inserted is soldered by using an automatic soldering device or the like, and the region 550 is supported by the electronic component. (3) Finally,
The connection part 540 left in the slit with nippers etc.
And 542 are cut to make the electronic circuit board with high insulation compartments shown in FIG.

However, those skilled in the art will be able to manufacture the substrate shown in FIG. 5 by other methods.

Although FIG. 5 illustrates the case where only two electronic components are connected to the high insulation substrate 510 and the circuit is only the signal line 516, the present invention is not limited to this. More circuits and electronic components can be mounted on the high-insulation substrate 510, and the connection / connection between the substrates 510 and 512 can be performed.
It is possible to further increase the number of electronic components used for supporting, and there may be a component on the substrate 510 to which all terminals are connected. The more components / circuits mounted on the high-insulation section 510, the smaller the area of the terminals on the substrate, and the more advantageous the mounting density, as compared with the mounting using the Teflon stud or the clover leaf.

FIG. 7 shows an improved structure of the embodiment of FIG. FIG. 7 (1) shows a plan view and FIG. 7 (2) shows a side view of the structure. FIG. 7 shows the slits 532 and 534 of FIG.
Through-hole plating is applied to the substrates 510 and 51 of FIG.
Guards 610 to 616 are provided between the two. By configuring the guards 610 to 616 as active guards or passive guards, it is more resistant to leaks through the holes 522 than the embodiment of FIG.

The fact that the guards 610 and 614 or the guards 612 and 616 in FIG. 7 are not connected is due to the manufacturing method in which the connecting portion is cut after the slit is through-hole plated at the time of manufacturing.

That is, as a preferred method for manufacturing the embodiment of FIG. 7, (1) first, the electronic components 518 and 520 are inserted into the holes for inserting the electronic components of the substrate 512, and (2) next, the electronic components are inserted. The substrate 512 with the components still inserted is soldered using an automatic soldering device or the like, and at this time, through hole plating is also applied to the inside of the slit portion. (3) Finally, a method is used in which the connecting portion left in the slit is cut with a nipper or the like to produce the electronic circuit board with the high insulation section shown in FIG. 7.

The method of providing the guards 610 to 616 is not limited to through hole plating,
It will be apparent to those skilled in the art that various methods and materials can be used and that guards that are co-split but are not split, as will be apparent to those skilled in the art. As such, various methods and materials can be used.

A side view of another embodiment is shown in FIG. In FIG. 8, the highly insulating substrate 810 is not coplanar with the parent substrate 812 and is only connected / supported by the electronic components 814 and 816. The pattern 818 is a signal line on the high insulation substrate 810. The high-insulation substrate 810 is supported only by the electronic components 814 and 816 connected between it and the parent substrate 812, and since there is only air around the high-insulation substrate, the same effect is expected.

Further, a plan view of another embodiment is shown in FIG.
In FIG. 9, the high-insulation substrate 910 is arranged so that only one side faces the parent substrate 912. Highly insulating substrate 910
Are supported only by the electronic components 914 to 918 connected to the parent board 912. In addition to this, even when the side where the high-insulation substrate and the parent substrate face each other has two sides and three sides, the same operation can be performed by supporting only the electronic component.

Although the embodiments of the present invention have been described above, the exemplary forms, arrangements, and the like are not limited, and modifications of the configurations are allowed as necessary without departing from the gist of the present invention. .

[0035]

As described above, according to the present invention, it is possible to provide an electronic circuit board with a high insulation section having a high insulation performance and a manufacturing method thereof while suppressing an increase in material cost and working cost. it can. Further, since the creepage distance of the insulating portion can be set sufficiently, it is possible to provide an electronic circuit board with a highly insulating section which is resistant to insulation deterioration due to adhesion of dirt (high reliability) and a method for manufacturing the same.

[Brief description of drawings]

FIG. 1 is an external view of a structure in which a signal line is surrounded by a guard according to a conventional technique.

FIG. 2 is a perspective view with a cross section in which the inside of the substrate is transparent, showing a modified version of the structure of FIG.

FIG. 3 is a view showing a structure of a highly insulated line using a hand-soldered Teflon terminal (Teflon stud). (1) is a side view of the same structure, and (2) is a plan view.

FIG. 4 is a diagram showing a structure of a highly insulated line using an automatic soldering type Teflon terminal (crowbar leaf). (1) is a side view of the same structure, and (2) is a plan view.

FIG. 5 shows a structure of an embodiment according to the present invention. (1)
Is a side view of the same structure, and (2) is a plan view.

FIG. 6 is an electronic circuit board 5 of FIG. 5 before mounting electronic components.
12 is a plan view of a substrate 552 corresponding to 12. FIG.

7 is a diagram showing an improved structure of the embodiment of FIG. (1)
Is a side view of the same structure, and (2) is a plan view.

FIG. 8 is a diagram of another embodiment of the present invention.

FIG. 9 is a diagram of another embodiment of the present invention.

[Explanation of symbols]

 510: Highly insulating substrate 512: Parent substrate 516: Signal line 518, 520: Electronic component 522: Hole 532, 534: Slit 536, 538: Component insertion hole 540, 542: Connection part 544, 546: Component insertion hole 548 549: Signal line pattern 550: Area 552: Substrate 554: Signal line pattern 610, 612, 616, 614: Guard

Claims (6)

[Claims] 1. A first electronic circuit board, a second electronic circuit board, and a plurality of electronic components, wherein the first and second electronic circuit boards are connected only by the electronic components. A characteristic electronic circuit board with highly insulating compartments. 2. The second electronic circuit board is on the same plane as the first electronic circuit board.
The electronic circuit board according to. 3. The electronic circuit board according to claim 1, wherein the second electronic circuit board is arranged in a hole in the first electronic circuit board. 4. The electronic circuit board according to claim 1, wherein a guard is provided on a part of an outer periphery of the second electronic circuit board. 5. A method for manufacturing an electronic circuit board with a high insulation section, which comprises the following steps. (A) a step of providing, on a first electronic circuit board, a section having a slit around which at least one minute connection portion is left, (b) arranging an electronic part that extends inside and outside the section, and Soldering, and (c) cutting the minute connection portion left around the compartment. 6. The manufacturing method according to claim 5, wherein in the step (b), a guard is provided around the partition during the soldering.