JPH0548237A - Circuit substrate - Google Patents

Circuit substrate

Info

Publication number
JPH0548237A
JPH0548237A JP20946591A JP20946591A JPH0548237A JP H0548237 A JPH0548237 A JP H0548237A JP 20946591 A JP20946591 A JP 20946591A JP 20946591 A JP20946591 A JP 20946591A JP H0548237 A JPH0548237 A JP H0548237A
Authority
JP
Japan
Prior art keywords
circuit board
soldering
terminal
electronic component
circuit substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20946591A
Other languages
Japanese (ja)
Inventor
Haruo Tezuka
春雄 手塚
Mayumi Sato
真弓 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wako Denki Co Ltd
Original Assignee
Wako Denki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wako Denki Co Ltd filed Critical Wako Denki Co Ltd
Priority to JP20946591A priority Critical patent/JPH0548237A/en
Publication of JPH0548237A publication Critical patent/JPH0548237A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

PURPOSE:To enable soldering reliability to be improved when electrically connecting a lead terminal of electronic parts to a terminal penetration hole of a circuit substrate by soldering. CONSTITUTION:A terminal penetration hole 6 where a lead terminal 4 of electronic parts 1 is electrically connected by a soldering fillet is formed at a circuit substrate 5. A cutout portion 7 reaching an outer side of a bottom portion 3 of the electronic parts 1 which are nearly adhered to the circuit substrate 5 from a location near the terminal penetration hole 6 is formed at the circuit substrate 5, thus enabling a gas which is generated due to soldering heat to be emitted through the cut-out portion 7 without going through the terminal penetration hole 6. Generation of an air bubble at the soldering fillet due to gas can be prevented, thus enabling soldering reliability to be improved.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】本発明は、電子部品のリード端子
がはんだフィレットを介して電気的に接続される回路基
板に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit board to which lead terminals of electronic parts are electrically connected via solder fillets.

【０００２】[0002]

【従来の技術】従来、例えば電子部品のリード端子を回
路基板に形成された導電パターンに電気的に接続するた
めに、回路基板に、前記導電パターンに導通する端子挿
通孔を形成した構造が採られている。そして、この端子
挿通孔に電子部品のリード端子を挿通し、はんだフィレ
ットにてリード端子を端子挿通孔に固着することで、電
子部品を回路基板に電気的に接続している。2. Description of the Related Art Conventionally, for example, in order to electrically connect a lead terminal of an electronic component to a conductive pattern formed on a circuit board, a structure has been adopted in which a terminal insertion hole for conducting the conductive pattern is formed on the circuit board. Has been. Then, the lead terminal of the electronic component is inserted into the terminal insertion hole, and the lead terminal is fixed to the terminal insertion hole by the solder fillet, whereby the electronic component is electrically connected to the circuit board.

【０００３】[0003]

【発明が解決しようとする課題】上記回路基板に、電子
部品として、例えば円筒形のコンデンサ本体の底部から
リード端子が導出された構造の電解コンデンサを電気的
に接続する際、リード端子を端子挿通孔に挿通すると、
コンデンサ本体の底部は回路基板に略密着する。そし
て、この電解コンデンサを回路基板に対してはんだ付け
を行うと、はんだ付けの熱によりコンデンサ本体の底部
と回路基板との間のわずかな空間に生じたガスは、コン
デンサ本体の底面と回路基板とが略密着しているため
に、回路基板の端子挿通孔を通過して発散する。このた
め、はんだフィレットに前記ガスによる気泡が発生する
ことがあり、この気泡によりはんだ付けの信頼性が著し
く低下する問題が生じている。When electrically connecting, as an electronic component, an electrolytic capacitor having a structure in which a lead terminal is led out from the bottom of a cylindrical capacitor body to the circuit board, the lead terminal is inserted into the circuit board. When you insert it into the hole,
The bottom of the capacitor body is in close contact with the circuit board. When this electrolytic capacitor is soldered to a circuit board, the gas generated in the slight space between the bottom of the capacitor body and the circuit board due to the heat of soldering will not be able to contact the bottom surface of the capacitor body and the circuit board. Because they are in close contact, they pass through the terminal insertion holes of the circuit board and diverge. Therefore, bubbles may be generated in the solder fillet due to the gas, and the bubbles cause a problem that the soldering reliability is significantly reduced.

【０００４】本発明の目的は、上記問題点に鑑みなされ
たもので、電子部品のリード端子と回路基板の端子挿通
孔とを電気的に接続するはんだフィレットに気泡が生じ
ない構造の回路基板を提供することにある。An object of the present invention is to solve the above problems and to provide a circuit board having a structure in which bubbles are not generated in a solder fillet for electrically connecting a lead terminal of an electronic component and a terminal insertion hole of a circuit board. To provide.

【０００５】[0005]

【課題を解決するための手段】本発明の回路基板は、電
子部品のリード端子がはんだフィレットを介して電気的
に接続される端子挿通孔が形成された回路基板におい
て、この回路基板に、前記端子挿通孔近傍からこの回路
基板に略密着する前記電子部品の底部の外側まで切欠部
を形成したものである。A circuit board according to the present invention is a circuit board having a terminal insertion hole through which a lead terminal of an electronic component is electrically connected via a solder fillet. A cutout is formed from the vicinity of the terminal insertion hole to the outside of the bottom of the electronic component that is in close contact with the circuit board.

【０００６】[0006]

【作用】本発明の回路基板には、電子部品のリード端子
がはんだフィレットを介して電気的に接続される端子挿
通孔が形成されるとともに、この端子挿通孔近傍からこ
の回路基板に略密着する電子部品の底部の外側まで切欠
部が形成されている。このため、電子部品を回路基板に
対してはんだ付けを行う際、はんだ付けの熱により電子
部品と回路基板との間に形成された空間に生じたガス
は、電子部品が回路基板に略密着していても、前記端子
挿通孔を通過することなく前記切欠部を通過して、電子
部品の底部の外側になる回路基板の表面より発散される
ので、前記はんだフィレットにガスによる気泡が生じる
ことを防ぐ。The circuit board of the present invention is formed with a terminal insertion hole through which the lead terminal of the electronic component is electrically connected via the solder fillet, and the circuit board is closely adhered from the vicinity of the terminal insertion hole. A cutout is formed to the outside of the bottom of the electronic component. For this reason, when soldering an electronic component to a circuit board, the gas generated in the space formed between the electronic component and the circuit board due to the heat of soldering causes the electronic component to substantially adhere to the circuit board. Even though it passes through the cutout portion without passing through the terminal insertion hole and is diffused from the surface of the circuit board that is outside the bottom portion of the electronic component, bubbles due to gas may be generated in the solder fillet. prevent.

【０００７】[0007]

【実施例】本発明の回路基板の一実施例を図１および図
２に基づいて説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the circuit board of the present invention will be described with reference to FIGS.

【０００８】図１および図２において、１は電子部品と
しての電解コンデンサで、この電解コンデンサ１は、円
筒形のコンデンサ本体２の底部３から対をなすリード端
子４がそれぞれ導出されている。1 and 2, reference numeral 1 denotes an electrolytic capacitor as an electronic component. In this electrolytic capacitor 1, a pair of lead terminals 4 is led out from a bottom portion 3 of a cylindrical capacitor body 2.

【０００９】また、５は絶縁性部材からなる回路基板
で、導電パターンが形成されている。そして、前記電解
コンデンサ１の各リード端子４に対応した端子挿通孔６
が、導電パターンに導通して回路基板５に形成されてい
る。Reference numeral 5 is a circuit board made of an insulating material, on which a conductive pattern is formed. Then, a terminal insertion hole 6 corresponding to each lead terminal 4 of the electrolytic capacitor 1
Are formed on the circuit board 5 so as to be electrically connected to the conductive pattern.

【００１０】さらに、回路基板５には、図２に示すよう
に、矩形の切欠部７が、一端7aを回路基板５の端子挿通
孔６近傍としての例えばコンデンサ本体２の中心部と対
向する部分とし、他端7bを回路基板５に略密着するコン
デンサ本体２の密着部としての底部３よりも外側の部分
として、細長溝状に回路基板５を切り欠いて形成されて
いる。Further, in the circuit board 5, as shown in FIG. 2, a rectangular notch portion 7 is a portion where one end 7a faces the central portion of the capacitor body 2 near the terminal insertion hole 6 of the circuit board 5, for example. The other end 7b is formed outside the bottom portion 3 as the close contact portion of the capacitor body 2 that is in close contact with the circuit board 5 by cutting out the circuit board 5 in the shape of an elongated groove.

【００１１】次に、本実施例の作用について説明する。Next, the operation of this embodiment will be described.

【００１２】前記電解コンデンサ１を回路基板５に対し
てはんだ付けを行う場合について説明する。まず、回路
基板５の各端子挿通孔６にそれぞれ電解コンデンサ１の
リード端子４を挿通すると、コンデンサ本体２の底部３
は回路基板５に略密着する。A case where the electrolytic capacitor 1 is soldered to the circuit board 5 will be described. First, when the lead terminals 4 of the electrolytic capacitor 1 are inserted into the terminal insertion holes 6 of the circuit board 5, respectively, the bottom portion 3 of the capacitor body 2 is inserted.
Substantially adheres to the circuit board 5.

【００１３】次に、回路基板５をはんだ槽に搬入して電
解コンデンサ１のはんだ付けを行うと、図示しないはん
だフィレットによりリード端子４が端子挿通孔６に固着
されて、電解コンデンサ１が回路基板５に電気的に接続
される。Next, when the circuit board 5 is carried into a solder bath and the electrolytic capacitor 1 is soldered, the lead terminal 4 is fixed to the terminal insertion hole 6 by a solder fillet (not shown), and the electrolytic capacitor 1 is connected to the circuit board. 5 electrically connected.

【００１４】また、はんだ付けの熱によりコンデンサ本
体２と回路基板５との間のわずかな空間にガスが生じる
が、このガスは、コンデンサ本体２の底部３と回路基板
５とが密着していても、端子挿通孔６を通過することな
く前記切欠部７を通過して、コンデンサ本体２の底部３
よりも外側の回路基板５の表面より発散される。このた
め、前記はんだフィレットにガスによる気泡が生じるこ
とを防止できる。Gas is generated in a slight space between the capacitor body 2 and the circuit board 5 due to the heat of soldering, and this gas is in close contact with the bottom portion 3 of the capacitor body 2 and the circuit board 5. Also passes through the cutout portion 7 without passing through the terminal insertion hole 6 and reaches the bottom portion 3 of the capacitor body 2.
It is diverged from the surface of the circuit board 5 on the outer side. Therefore, it is possible to prevent gas bubbles from being generated in the solder fillet.

【００１５】従って、はんだ付けの信頼性が向上し、気
泡発生によるはんだフィレットの修正の手間がなくな
る。Therefore, the reliability of soldering is improved and the trouble of correcting the solder fillet due to the generation of bubbles is eliminated.

【００１６】なお、上記実施例では、はんだ付けの熱に
てコンデンサ本体２と回路基板５との間のわずかな空間
に生じたガスによりはんだフィレットに生じる気泡につ
いて説明したが、これに限らず、はんだ付けの熱により
コンデンサ本体２から生じるガスや、はんだ付けに用い
られたフラックスから生じるガスなどにより、はんだフ
ィレットに生じる気泡に対しても、同様の作用効果を期
待できる。In the above embodiment, the bubbles generated in the solder fillet by the gas generated in the small space between the capacitor body 2 and the circuit board 5 due to the heat of soldering have been described, but the invention is not limited to this. Similar effects can be expected for bubbles generated in the solder fillet due to the gas generated from the capacitor body 2 due to the heat of soldering, the gas generated from the flux used for soldering, and the like.

【００１７】また、上記実施例では、電子部品として電
解コンデンサ１を用いて説明したが、これに限らず、抵
抗器やコイルなどの適宜の電子部品を用いても同様の作
用効果を期待できる。In the above embodiment, the electrolytic capacitor 1 is used as the electronic component, but the present invention is not limited to this, and similar electronic components such as a resistor and a coil can be used to obtain the same effect.

【００１８】[0018]

【発明の効果】本発明によれば、電子部品のリード端子
を回路基板にはんだ付けにて電気的に接続する際、はん
だ付けの熱により電子部品と回路基板との間のわずかな
空間に生じたガスは、電子部品の底部と回路基板とが略
密着しているために、切欠部を通過して回路基板の表面
より発散されるので、前記リード端子を端子挿通孔に固
着するはんだフィレットに、前記ガスによる気泡が生じ
ることを防止できる。このため、はんだ付けの信頼性を
向上させることができ、気泡発生によるはんだフィレッ
トの修正の手間をなくすことができる。According to the present invention, when the lead terminals of the electronic component are electrically connected to the circuit board by soldering, the heat generated by the soldering causes a slight space between the electronic component and the circuit board. Since the bottom of the electronic component and the circuit board are in close contact with each other, the gas escapes from the surface of the circuit board after passing through the notch. It is possible to prevent bubbles from being generated by the gas. Therefore, the reliability of soldering can be improved, and the trouble of correcting the solder fillet due to the generation of bubbles can be eliminated.

【図面の簡単な説明】[Brief description of drawings]

【図１】本発明の回路基板の一実施例を示し、この回路
基板の端子挿通孔に電子部品のリード端子を挿通した状
態を説明する図である。FIG. 1 is a view showing an embodiment of a circuit board of the present invention and explaining a state in which a lead terminal of an electronic component is inserted into a terminal insertion hole of the circuit board.

【図２】同上回路基板の下側からの平面図である。FIG. 2 is a plan view from the lower side of the same circuit board.

【符号の説明】[Explanation of symbols]

１ 電子部品としての電解コンデンサ ３ 底部 ４ リード端子 ５ 回路基板 ６ 端子挿通孔 ７ 切欠部 1 Electrolytic capacitor as an electronic component 3 Bottom part 4 Lead terminal 5 Circuit board 6 Terminal insertion hole 7 Notch

Claims (1)

【特許請求の範囲】[Claims] 【請求項１】 電子部品のリード端子がはんだフィレッ
トを介して電気的に接続される端子挿通孔が形成された
回路基板において、 この回路基板に、前記端子挿通孔近傍からこの回路基板
に略密着する前記電子部品の底部の外側まで切欠部を形
成したことを特徴とする回路基板。1. A circuit board having a terminal insertion hole through which a lead terminal of an electronic component is electrically connected via a solder fillet, wherein the circuit board is closely adhered to the circuit board from the vicinity of the terminal insertion hole. A circuit board, wherein a cutout is formed up to the outside of the bottom of the electronic component.
JP20946591A 1991-08-21 1991-08-21 Circuit substrate Pending JPH0548237A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20946591A JPH0548237A (en) 1991-08-21 1991-08-21 Circuit substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20946591A JPH0548237A (en) 1991-08-21 1991-08-21 Circuit substrate

Publications (1)

Publication Number Publication Date
JPH0548237A true JPH0548237A (en) 1993-02-26

Family

ID=16573321

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20946591A Pending JPH0548237A (en) 1991-08-21 1991-08-21 Circuit substrate

Country Status (1)

Country Link
JP (1) JPH0548237A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09232712A (en) * 1996-02-23 1997-09-05 Nec Corp Printed circuit board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09232712A (en) * 1996-02-23 1997-09-05 Nec Corp Printed circuit board

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