JPS5857779A - Method of mounting chip part on printed board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Chip components are often used to make electrical equipment smaller.

However, as shown in Figure 1, the chip part A.

When A, . . . are used together with IC (B) and capacitor C, they cannot be soldered at the same time. In other words, while chip components A are soldered using the reflow soldering method, general electronic components such as ICs, capacitors C, and printed board relays are soldered by inserting terminals and lead wires into small holes in the printed board. However, since the method involved soldering the copper foil and the terminals on the back side of the printed board, it was not possible to solder them at the same time.

Therefore, when chip components and general electronic components such as ICs and relays for printed circuit boards are mixed, the packaging density will be high, but in order to mount them, it is necessary to separate the soldering process for general electronic components and the soldering process for chip components. Since it is divided into two steps, the efficiency is low and the steps are long, which is not preferable in terms of manufacturing.

The present invention provides a method for mounting chip components on a printed board, which allows simultaneous soldering even when chip components and electronic components such as ICs and printed board relays are mixed together.

The present invention will be described in detail below based on one embodiment.

In the figure, I is a printed board. 2 is an ICl3 capacitor, and 4.4 is a chip component socket into which chip components 5, 5°, . . . are mounted.

For example, sockets for chip components as shown in FIGS. 3 to 5 can be considered. That is, the top opening where the chi knob part 5 is attached 6,6. ... is installed in the body 7,
At this point 6, a conductor 11 having a contact spring part 8, a terminal part 9 to be attached to a printed board, and a stopper claw 10 is attached to the body 7.
The mounting system is inserted into the hole 12 provided on the bottom of the base 6. Reference numeral 13 denotes a notch into which a bottle set or the like is inserted when the tip portion 5 is taken out from the recess. The chip component 5 in this case is shown in Figure 3 (c).
As shown in the figure, it has a cylindrical shape, and both ends 5a, 5a, and 5b near both ends are electrodes. The chip component socket 4'' shown in FIG. 4 has a structure in which a chip component is mounted vertically at an angle of 5 degrees. Socket 4 for chip components shown in Fig. 5
`` is a type for mounting a square chip component 5'', and 15 is a chip component holding plate, which is installed in the grooves 14 and 14 on both sides of the body 7''.The width l is longer than the middle l of the groove. Then, as shown in FIG. 5(a), bend it downward and attach it.

First, the chip components 5, 5 are mounted on the chip component socket 4, and the chip component sockets, ICs, and capacitors are inserted into the small holes provided in the printed board.

Attach the print relay and solder the copper foil and terminals using an automatic soldering bath.

As described above, according to the three claimed inventions, the chip components are attached to sockets with soldered terminals made by stretching the conductive plate in contact with each electrode of each chip component in one direction, and printed together with electronic components such as ICs and capacitors. A method of mounting chip components on a printed circuit board by attaching them to the board and soldering them all at once. Because it is closed, even when soldering a mixture of chip parts and general electronic parts such as ICs and relays for printed circuit boards, the chip parts are once installed in the sockets for chip parts, so ICs and printed circuit boards can be soldered together. Since it can be attached to a printed board and soldered like a board relay, the soldering process can be simplified. Another major advantage is that chip components can be mounted on printed circuit boards without the need for special soldering equipment.

[Brief explanation of the drawing]

FIG. 1 is a partial perspective view showing a conventional example of the present invention. 2 to 5 are drawings for explaining an embodiment of the present invention, in which FIG. 2 is a partial perspective view, FIG. Figure (B) is a partial perspective view, Figure (C) is a perspective view of a chip component, Figure 4 (A) is a sectional view taken along line AA' in Figure (B), and Figure (B) is a partial perspective view. , the same figure (
)\) is a perspective view of the chip component, Figure 5 (a) is a sectional view of the same figure (b), Figure 5 (b) is a partially exploded perspective view, and Figure 5 (c) is a cross-sectional view of the same figure (b).
shows a perspective view of the chip component. 1 Niblint plate, 2: IC, 3: Capacitor, 4
．． 4'4": Socket for chip components. 5.5'5#, Chip components. Patent applicant: Matsushita Electric Works Co., Ltd. Representative patent attorney: Toshimaru Takemoto and 2 others (5) Figure 5 (a) (Eight Shao

Claims (1)

[Claims] (1) A conductive plate in contact with each electrode of each chip component is stretched in one direction and attached to a socket with soldered terminals, and is attached to a printed board together with electronic components such as ICs and capacitors. A method of mounting chip components on a printed board by soldering them all at once.