JPH09510500A - 立方晶窒化硼素より成る層を形成する方法 - Google Patents
立方晶窒化硼素より成る層を形成する方法Info
- Publication number
- JPH09510500A JPH09510500A JP7522636A JP52263695A JPH09510500A JP H09510500 A JPH09510500 A JP H09510500A JP 7522636 A JP7522636 A JP 7522636A JP 52263695 A JP52263695 A JP 52263695A JP H09510500 A JPH09510500 A JP H09510500A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- substrate
- target
- boron nitride
- voltage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/0021—Reactive sputtering or evaporation
- C23C14/0036—Reactive sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/0641—Nitrides
- C23C14/0647—Boron nitride
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Glass Compositions (AREA)
Abstract
Description
Claims (1)
- 【特許請求の範囲】 1.直流アーク放電または直流で稼働するマグネトロン−カソードによってプラ ズマを発生する、不平衡マグネトロンとしての運転法において、高周波または直 流電圧にてアトマイジングすることによって立方晶窒化硼素より成る耐摩耗性層 または立方晶窒化硼素を含有する耐摩耗性層を製造する方法において、出発ター ゲットとして導電性炭化硼素より成るターゲットを使用しそして層の化学量論を 、反応工程を進めながらN2およびArの供給下に調節することを特徴とする、 上記方法。 2.窒化硼素より成るターゲットを70〜90原子%の硼素と10〜30原子% の炭素より成る組成範囲で使用する請求項1に記載の方法。 3.B4Cより成るターゲットを使用する請求項2に記載の方法。 4.付着する層の炭素の割合を5原子%以下の値に低下させる請求項1〜3のい ずれか一つに記載の方法。 5.立方晶窒化硼素より成る層の接合性の改善のためにプロセスガス組成および プロセス条件を段階的にまたは連続的に変更することによって、減圧を中断する ことなしに基体に下塗層を付着させる請求項1〜4のいずれか一つに記載の方法 。 6.被覆工程前に、0.1〜0.5μmの層厚さを有する炭化硼素/窒化硼素よ り成る層で基体ホルダーを被覆する請求項1〜5のいずれか一つに記載の方法。 7.高周波アトマイジングさせる場合、ターゲット側および基体側への高周波負 荷を行ない、その際に100〜1000Vの範囲内のマイナスのバイアス電圧を 利用し、ターゲットの所で3〜17W/cm2の面積電力をそして基体の所で1 〜11W/cm2の面積電力を印加し、被覆工程の間の基体温度は300〜50 0℃に維持し、5%から100%近くのN2含有量のAr/N2−ガス混合物より 成るプロセスガスを使用しそしてプロセス圧を1〜50μbarに調節する、請 求項1〜6の何れか一つに記載の方法。 8.基体に直流電圧を印加する請求項7に記載の方法。 9.ターゲットの所で6W/cm2の面積電力をそして基体の所で2W/cm2 の面積電力を印加し、被覆工程の間、基体を350℃の平衡温度に維持し、10 〜70%のN2を含有するArとN2とのプロセスガス混合物および20μbar のプロセス圧を利用する請求項7または8に記載の方法。 10.不平衡マグネトロンとしての運転法において直流電圧マグネトロン−アト マイジングする場合には、ターゲットの所で2〜13W/cm2の面積電力をそ して基体の所で0.4〜8W/cm2の面積電力を印加し、基体ホルダーを回転 可能に設置し、プロセス圧が1〜10μbarの範囲内にあり、プロセスガスと して10から100%近くのN2含有量を有するAr/N2−ガス混合物を1〜1 0μbarの範囲に維持しそして基体ホルダーの所に100〜800V(直流電 圧)のバイアス電圧または100〜1000V(高周波電圧)のバイアス電圧を 印加する請求項1〜6の何れか一つに記載の方法。 11.ターゲットの所で5W/cm2の面積電力をそして基体の所で1W/cm2 の面積電力を印加し、50%のN2含有量のプロセスガス流および4μbarの プロセス圧に調整する請求項10に記載の方法。 12.方法を磁場で支援しながら実施し、その際に容器中に4〜7mTの磁束密 度を有するコイルが組み込まれている請求項11に記載の方法。 13.最大イオン流密度が基体の所で達成されるように追加的なマグネットまた は電磁コイルが構成されている場合に、追加的に磁場で支援する請求項12に記 載の方法。 14.プロセスガスに硼素含有ガスを添加する請求項1〜13の何れか一つに記 載の方法。 15.プロセスガスにジボロンまたはトリメチルボラジンを供給する請求項14 に記載の方法。 16.被覆工程の際に100℃〜600℃の温度を使用する請求項1〜15の何 れか一つに記載の方法。 17.請求項1〜16の何れか一つに記載の方法を耐摩耗性工具の製造に用いる 方法。 18.機械的摩耗および/または接合の負荷が掛かる要素並びに軸受および/ま たは軸受部材に用いる請求項17に記載の方法。 19.請求項1〜16の何れか一つに記載の方法を立方晶窒化硼素で被覆された ピックアップ−カートリッジおよび磁気テープのテープガイド要素の製造に用い る方法。 20.請求項1〜16の何れか一つに記載の方法を電子用途分野のために、特に 微量物質含有または不含の電子部材の製造に使用する方法。 21.請求項1〜16の何れか一つに記載の方法を耐食性層および絶縁層の製造 に用いる方法。 22.請求項1〜16の何れか一つに記載の方法を被覆層および機械的負荷に対 しての保護層を有する光学要素の製造に用いる方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE4407274A DE4407274C1 (de) | 1994-03-04 | 1994-03-04 | Verfahren zur Herstellung von verschleißfesten Schichten aus kubischem Bornitrid und ihre Anwendung |
DE4407274.0 | 1994-03-04 | ||
PCT/DE1995/000315 WO1995023879A1 (de) | 1994-03-04 | 1995-03-03 | Verfahren zur herstellung von schichten aus kubischem bornitrid |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH09510500A true JPH09510500A (ja) | 1997-10-21 |
JP3452578B2 JP3452578B2 (ja) | 2003-09-29 |
Family
ID=6511889
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP52263695A Expired - Fee Related JP3452578B2 (ja) | 1994-03-04 | 1995-03-03 | 立方晶系窒化硼素より成る耐摩耗性層を形成する方法およびその用途 |
Country Status (8)
Country | Link |
---|---|
US (1) | US5723188A (ja) |
EP (1) | EP0748395B1 (ja) |
JP (1) | JP3452578B2 (ja) |
KR (1) | KR100343654B1 (ja) |
CN (1) | CN1072276C (ja) |
AT (1) | ATE158028T1 (ja) |
DE (2) | DE4407274C1 (ja) |
WO (1) | WO1995023879A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002356770A (ja) * | 2001-05-31 | 2002-12-13 | Ulvac Japan Ltd | 高密度へリコンプラズマを利用した緻密な硬質薄膜の形成装置及び形成方法 |
WO2009104567A1 (ja) | 2008-02-18 | 2009-08-27 | 株式会社神戸製鋼所 | 立方晶窒化硼素含有皮膜の形成方法 |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5928771A (en) * | 1995-05-12 | 1999-07-27 | Diamond Black Technologies, Inc. | Disordered coating with cubic boron nitride dispersed therein |
DE19535560C1 (de) * | 1995-09-12 | 1996-10-31 | Fraunhofer Ges Forschung | Verfahren zur Bestimmung des Anteils an kubischem Bornitrid, der Dicke einer Schicht aus kubischem Bornitrid und des Beginns der Abscheidung von kubischem Bornitrid bei ionengestützten Beschichtungsverfahren |
US5948541A (en) * | 1996-04-04 | 1999-09-07 | Kennametal Inc. | Boron and nitrogen containing coating and method for making |
US5976716A (en) * | 1996-04-04 | 1999-11-02 | Kennametal Inc. | Substrate with a superhard coating containing boron and nitrogen and method of making the same |
US5885666A (en) * | 1997-05-06 | 1999-03-23 | General Motors Corporation | Conversion of hexagonal-like BN to cubic-like BN by ion implantation |
US6352626B1 (en) | 1999-04-19 | 2002-03-05 | Von Zweck Heimart | Sputter ion source for boron and other targets |
US6593015B1 (en) * | 1999-11-18 | 2003-07-15 | Kennametal Pc Inc. | Tool with a hard coating containing an aluminum-nitrogen compound and a boron-nitrogen compound and method of making the same |
CH696179A5 (de) * | 2000-06-08 | 2007-01-31 | Satis Vacuum Ind Vertriebs Ag | Plasma-Verdampfungsquelle für eine Vakuum Beschichtungsanordnung zum Aufbringen von Vergütungsschichten auf optische Substrate. |
US7954570B2 (en) * | 2004-02-19 | 2011-06-07 | Baker Hughes Incorporated | Cutting elements configured for casing component drillout and earth boring drill bits including same |
DE102004028112B4 (de) | 2004-06-09 | 2019-12-12 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Werkzeugsubstrat mit borhaltigem Schichtsystem, bestehend aus einer Borcarbid-, einer B-C-N und einer kohlenstoffmodifizierten kubischen Bornitridschicht sowie Verfahren zur Herstellung eines solchen Schichtsystems und Verwendung |
EP1609882A1 (de) * | 2004-06-24 | 2005-12-28 | METAPLAS IONON Oberflächenveredelungstechnik GmbH | Kathodenzerstäubungsvorrichtung und -verfahren |
CN1721346B (zh) * | 2004-07-16 | 2011-03-23 | 鸿富锦精密工业(深圳)有限公司 | 模造玻璃的模仁制造方法 |
DE102004042407A1 (de) * | 2004-09-02 | 2006-03-23 | Forschungszentrum Karlsruhe Gmbh | Schichtverbund mit kubischen Bornitrid |
US20070173925A1 (en) * | 2006-01-25 | 2007-07-26 | Cornova, Inc. | Flexible expandable stent |
US20080215132A1 (en) * | 2006-08-28 | 2008-09-04 | Cornova, Inc. | Implantable devices having textured surfaces and methods of forming the same |
US7836978B2 (en) * | 2007-06-15 | 2010-11-23 | Baker Hughes Incorporated | Cutting elements for casing component drill out and subterranean drilling, earth boring drag bits and tools including same and methods of use |
US7954571B2 (en) * | 2007-10-02 | 2011-06-07 | Baker Hughes Incorporated | Cutting structures for casing component drillout and earth-boring drill bits including same |
CZ304905B6 (cs) * | 2009-11-23 | 2015-01-14 | Shm, S.R.O. | Způsob vytváření PVD vrstev s pomocí rotační cylindrické katody a zařízení k provádění tohoto způsobu |
CN102127743A (zh) * | 2011-02-15 | 2011-07-20 | 江苏大学 | 一种Ta-C-N薄膜的制备方法 |
CZ201661A3 (cs) * | 2016-02-05 | 2017-06-07 | Shm, S. R. O. | Způsob nanášení otěruvzdorných vrstev na bázi bóru a otěruvzdorná vrstva |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4415420A (en) * | 1983-02-07 | 1983-11-15 | Applied Coatings International, Inc. | Cubic boron nitride preparation |
US4412899A (en) * | 1983-02-07 | 1983-11-01 | Applied Coatings International, Inc. | Cubic boron nitride preparation utilizing nitrogen gas |
US4683043A (en) * | 1986-01-21 | 1987-07-28 | Battelle Development Corporation | Cubic boron nitride preparation |
JPS63239103A (ja) * | 1987-03-27 | 1988-10-05 | Ulvac Corp | 立方晶窒化硼素被覆体およびその製造法 |
US5096740A (en) * | 1990-01-23 | 1992-03-17 | Sumitomo Electric Industries, Ltd. | Production of cubic boron nitride films by laser deposition |
-
1994
- 1994-03-04 DE DE4407274A patent/DE4407274C1/de not_active Expired - Fee Related
-
1995
- 1995-03-03 AT AT95911214T patent/ATE158028T1/de not_active IP Right Cessation
- 1995-03-03 WO PCT/DE1995/000315 patent/WO1995023879A1/de active IP Right Grant
- 1995-03-03 US US08/700,430 patent/US5723188A/en not_active Expired - Lifetime
- 1995-03-03 JP JP52263695A patent/JP3452578B2/ja not_active Expired - Fee Related
- 1995-03-03 EP EP95911214A patent/EP0748395B1/de not_active Expired - Lifetime
- 1995-03-03 DE DE59500649T patent/DE59500649D1/de not_active Expired - Lifetime
- 1995-03-03 CN CN95192087A patent/CN1072276C/zh not_active Expired - Fee Related
- 1995-03-03 KR KR1019960704864A patent/KR100343654B1/ko not_active IP Right Cessation
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002356770A (ja) * | 2001-05-31 | 2002-12-13 | Ulvac Japan Ltd | 高密度へリコンプラズマを利用した緻密な硬質薄膜の形成装置及び形成方法 |
JP4677123B2 (ja) * | 2001-05-31 | 2011-04-27 | 株式会社アルバック | 高密度へリコンプラズマを利用した緻密な硬質薄膜の形成装置及び形成方法 |
WO2009104567A1 (ja) | 2008-02-18 | 2009-08-27 | 株式会社神戸製鋼所 | 立方晶窒化硼素含有皮膜の形成方法 |
JP2009191344A (ja) * | 2008-02-18 | 2009-08-27 | Kobe Steel Ltd | 立方晶窒化硼素含有皮膜の形成方法 |
Also Published As
Publication number | Publication date |
---|---|
ATE158028T1 (de) | 1997-09-15 |
KR970701803A (ko) | 1997-04-12 |
WO1995023879A1 (de) | 1995-09-08 |
KR100343654B1 (ko) | 2002-11-30 |
EP0748395B1 (de) | 1997-09-10 |
JP3452578B2 (ja) | 2003-09-29 |
EP0748395A1 (de) | 1996-12-18 |
DE4407274C1 (de) | 1995-03-30 |
CN1072276C (zh) | 2001-10-03 |
CN1143983A (zh) | 1997-02-26 |
US5723188A (en) | 1998-03-03 |
DE59500649D1 (de) | 1997-10-16 |
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