JPH0933609A - Automatic sorting apparatus for chip-shaped electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain an automatic sorting apparatus in which it is not required to use a disk whose electric insulating property is required when the electric characteristic of a chip-shaped electronic component is measured, whose costs are lowered consequently, which enhances the production efficiency of the chip- shaped electronic component and whose operating expenses are lowered. SOLUTION: Chip-shaped resistors as chip-shaped electronic components are conveyed linearly and continuously along a conveyance passage 6. The chip-shaped resistors which have been conveyed are separated one by one by a separation means 15. The resistance value as the electric characteristic of every separated chip-shaped resistor is measured by a measuring means 16. On the basis of a measured result, good chip-shaped resistors and defective chip-shaped resistors are sorted by a sorting means 17. As required, the measured chip-shaped resistors are measured and sorted again by a measuring means 18 and a sorting means 19. Since the chip-shaped resistors are separated while conveyed linearly so as to measure their resistance value, it is not required to use a disk whose electric insulating propery is required.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention separates chip-shaped electronic components such as leadless rectangular plate-shaped chip resistors, which are continuously supplied from a parts feeder, one by one, and the electrical values such as their resistance values are separated. TECHNICAL FIELD The present invention relates to an automatic sorting device for chip-shaped electronic components used for, for example, measuring good characteristics and sorting good and bad and supplying non-defective chip-shaped electronic components to the next step such as taping.

[0002]

2. Description of the Related Art Heretofore, as an example of this kind of automatic sorting apparatus, a configuration described in Japanese Utility Model Laid-Open No. 1-109016 has been known. The outline of this conventional example will be described. When the chip-shaped electronic component is continuously supplied to the linear supply path by the discharge pressure of the parts feeder, the leading chip-shaped electronic component is stopped by the advance of the first stopper. . When the storage recess of the intermittently rotating sorting disk faces the leading chip-shaped electronic component, the second chip-shaped electronic component is stopped by advancing the second stopper, and the leading chip is retracted by retracting the first stopper. Release the electronic components. The released chip-shaped electronic component is supplied to the accommodating recess of the sorting disc by suction by a vacuum device or the like.
After the supply, the first stopper is moved forward, the second stopper is moved backward, the second chip-shaped electronic component is released, moved forward by the discharge pressure of the parts feeder, and stopped by the first stopper.

Thereafter, by repeating the above operation, the chip-shaped electronic components can be sequentially supplied to the accommodating recesses of the discs for sorting which are intermittently rotated. Then, during the transportation of the chip-shaped electronic component supplied to the storage recess by intermittent rotation of the transport disk, the electrical characteristics such as the resistance value are measured, and the defective chip-shaped electronic component is discharged from the storage recess. Then, only good chip-shaped electronic components are supplied to the next process such as taping.

The chip-shaped electronic components separated by the first and second stoppers one by one as described above are easily transported to the electric characteristic measurement position by using the sorting disk having the storage recess on the outer periphery. can do. And
Since the disc for selection used for such measurement of electric characteristics is required to have electric insulation, it is formed of an epoxy resin mixed with glass fiber or a ceramic material typified by zirconia.

[0005]

When an epoxy resin mixed with glass fiber is used as a disc for selection,
Since it is manufactured by cutting by machining, it can be easily processed. However, it is difficult to secure the accuracy, and eventually the cost cannot be reduced. Moreover, it wears quickly, and if it is used for 7 hours a day, it will last about 1 week.

On the other hand, when a ceramic material is used as the disc for selection, it is produced by firing or firing a polishing plate after firing. In either case, accuracy can be secured, but since it is difficult-to-cut material processing, the processing cost is high and the cost cannot be reduced. Further, it is hard to wear, but it is fragile, and the outer circumference of the disc is damaged by a relatively small external force, so that care must be taken in handling such as maintenance.

Further, when any of the above materials is used as a disc for selection, it must be discarded when it is worn, damaged, or has poor precision, and its replacement cycle is 7 to 15 days in normal use. It is economical. Moreover, the time required for replacement is 10 to 30 minutes, and the production line must be stopped during this period, which is a big problem at the production site.

The present invention solves the conventional problems as described above, and it is not necessary to use a disk which is required to have an electrical insulation property for measuring the electrical characteristics of a chip-shaped electronic component. It is an object of the present invention to provide an automatic sorting device for chip-shaped electronic components, which can improve the manufacturing efficiency of chip-shaped electronic components, reduce the running cost, etc. .

[0009]

The technical means of the present invention for achieving the above object is to convey a chip-shaped electronic component linearly, and to convey it in a continuous state in the middle of this conveyance path. Separating means for separating the chip-shaped electronic components
Measuring means for stopping the chip-shaped electronic parts separated one by one by the separating means and conveyed to the downstream side of the conveying path to measure the electrical characteristics, and releasing the chip-shaped electronic parts after the measurement. It is provided with a selecting means for selecting good and defective chip-shaped electronic components based on the measurement result of the measuring means.

[0010] Another technical means of the present invention for achieving the above object is that the measuring means and the selecting means in the above technical means are arranged in a plurality of stages.

As the separating means in each of the above technical means, the chip-shaped electronic components which are provided so as to be able to move forward and backward in the middle of the conveying path and which are conveyed along the conveying path at the forward position are stopped and at the retracted position. A first stopper that releases the component and a chip-shaped electronic component that is provided so as to be able to move forward and backward on the upstream side of the first stopper in the transport direction of the chip-shaped electronic component, and stop the chip-shaped electronic component that is transported through the transport path at the forward position. ,
A second stopper for releasing the chip-shaped electronic component in the retracted position and the second stopper are advanced before the first stopper releases the chip-shaped electronic component, and the first stopper is the chip-shaped electronic component. And a drive device for retracting the second stopper after stopping.

Further, as a measuring means in each of the above technical means, a chip-shaped electronic component which is provided so as to be able to advance and retreat in the middle of the conveying path and which is conveyed on the conveying path at the forward position is stopped and at the retracted position the chip-shaped electronic component is stopped. A stopper that releases the component, a drive device that moves the stopper forward and backward, and a chip-shaped electronic component that is provided to be movable forward and backward on the upstream side in the transport direction of the chip-shaped electronic component with respect to the stopper and that is transported in the transport path at the forward position. Stop, the chip-shaped electronic component is released at the retracted position, the measuring terminal for measuring the electrical characteristics of the chip-shaped electronic component in a stopped state, and the above before the stopper releases the chip-shaped electronic component. And a drive device for moving the measuring terminal forward and for moving the measuring terminal backward after the stopper stops the chip-shaped electronic component.

Further, as a sorting means in each of the above technical means, a plurality of storing portions for storing chip-shaped electronic components are provided at evenly-divided positions on the outer periphery and are made of a non-electrical insulating material having wear resistance. A disc, a driving device for intermittently rotating the disc for selection, and a chip-shaped electronic component which is provided on the outer peripheral portion of the disc for selection and has a good measurement result of electric characteristics to pass a defective chip-shaped electronic component. And a sorting ejector for ejecting the parts from the sorting disc.

Of the non-electrically insulating materials such as metal having excellent wear resistance, it is preferable that the above-mentioned disc for selection is made of cemented carbide.

Further, as a sorting means in each of the above technical means, a sorting transport path is provided so as to extend the transport path and linearly transports the chip-shaped electronic components, and a sorting transport path is provided in the middle of the sorting transport path. It is possible to provide a sorting discharge device that allows a chip-shaped electronic component having a good electrical characteristic measurement result to pass therethrough and discharges a defective chip-shaped electronic component from the sorting transport path.

As the sorting discharge device, a discharging port provided in the middle of the sorting conveying path, a gate for opening and closing the discharging port, and a chip-shaped electronic component having a good electric characteristic measurement result are passed. A drive device for holding the gate in the closed position and moving the gate to the open position so as to eject the defective chip-shaped electronic component;
A suction device that sucks and discharges the defective chip-shaped electronic component from the opened discharge port.

According to the present invention configured as described above,
When the chip-shaped electronic components are continuously conveyed in a straight line along the conveying path, the separating means separates the chip-shaped electronic components one by one, and then the electrical characteristics of the chip-shaped electronic components are measured. Based on the above, it is possible to sort into good and bad chip-shaped electronic components. As described above, since the chip-shaped electronic components are separated while being linearly conveyed and the electrical characteristics are measured, it is not necessary to use a disk which is required to have electrical insulation.

[0018]

Embodiments of the present invention will be described below with reference to the drawings. First, a first embodiment of the present invention will be described. 1 to 15 show an automatic device for sorting chip-shaped electronic components according to a first embodiment of the present invention. FIG. 1 is a partially cutaway front view, FIG. 2 is a plan view, and FIG.
Is a partial side view of the separating part, FIG. 4 is a partially cutaway side view of the measuring part, and FIGS.

In this embodiment, a case where a chip resistor R is used as a chip electronic component and the chip resistor R having a good resistance value is supplied to a taping process will be described. The chip resistor R is provided with electrodes r2 on both sides of the short side of a resistor element r1 made of ceramic (alumina) (see FIG. 5).

As shown in FIGS. 1 to 4, a bottom guide member 2 made of an insulating material is provided on a substrate 1, and both sides of the bottom guide member 2 are provided on the substrate 1 at desired intervals. Side guide members 3 are provided, and upper face guide members 4 and 5 made of an insulating material are provided in series at desired intervals over the side face guide members 3, and the bottom face guide member 2 and the side face guide members are provided. A linear conveyance path 6 surrounded by 3 and the upper surface guide members 4 and 5 is formed. In the transfer path 6, as shown by an arrow X, a discharge pressure from a parts feeder (not shown) and a suction force from a downstream side in the transfer direction of the chip resistor R by a vacuum pump (not shown) which will be described later are used as indicated by an arrow X. R is linearly and continuously conveyed with one electrode r2 side facing forward (see FIGS. 5 to 15). The bases of the upper surface guide members 4 and 5 are supported by support bases 7 and 8 on the bottom plate 1 so as to be rotatable in the vertical direction by shafts 9 and 10. When the bases are rotated upward, the transport path 6 is opened. Chip-shaped resistor R
Can be removed. The guide members 4 and 5 are held in a fixed state at a position where the pressing members 13 and 14 detachably fixed to the support bases 7 and 8 detachably rotate downward to close the conveyance path 6. There is.

In the middle of the transfer path 6, a separating means 15 for separating the chip resistors R one by one along the transfer direction of the chip resistors R, and the resistance value of the separated chip resistors R are measured. Measuring means 16 and the measured chip resistor R
Selecting means 17 for selecting good and defective of the above, and the measuring means 1
The measuring means 18 similar to 6 and the selecting means 19 similar to the selecting means 17 are sequentially arranged. That is, the measuring means 16 and 18 and the selecting means 17 and 19 are arranged in two stages so that the measurement and selecting accuracy of the chip resistor R can be improved.

Explaining the separating means 15, a first stopper 20 which engages with the front side of the chip-shaped resistor R in the middle of the conveying path 6 and regulates its advance is formed in the upper surface guide member 4 in the vertical direction. The hole 21 is slidably supported in the vertical direction. Large-diameter step portion and hole 21 at the base of the first stopper 20
The compression spring 22 is interposed between the lower end and the small-diameter portion of the lower end, and the elasticity of the compression spring 22 urges the first stopper 20 backward (upward). The substrate 1 has a second stopper 23.
Is provided. The second stopper 23 restricts the forward movement of the chip resistor R at the front by the first stopper 20, and moves the chip resistor R located second on the upstream side in the transport direction to the upper surface guide members 4, 5. It is arranged so that it can be pressed against and regulate its forward movement, and is configured to have a cushioning function. That is, in the second stopper 23, a piston-like portion is supported by the cylinder so that the piston-like portion can expand and contract, and a shock absorbing spring (not shown) is inserted.
The second stopper 23 is slidably supported in a vertical direction in a hole 24 formed in the substrate 1 in the vertical direction. Second
A compression spring 25 is interposed between the large diameter step of the base of the stopper 23 and the small diameter of the upper end of the hole 24, and the elasticity of the compression spring 25 urges the second stopper 23 rearward (downward). There is.

Holes 26 and 27 are formed in the upper surface guide member 4 and the substrate 1 so as to face each other in the vertical direction, and actuating shafts 28 and 29 are vertically movable through the bearings 30 and 31 in the holes 26 and 27, respectively. The lower end surface of the operating shaft 28 and the upper end surface of the operating shaft 29 are in contact with each other. A support frame 32 is fixed to the lower side of the substrate 1, a solenoid 33 is supported by the support frame 32, and a solenoid shaft 34 is connected to the lower end of the operating shaft 29. A large diameter hole 35 is formed in the upper surface guide member 4 on the outer periphery of the operating shaft 28. Large hole 35
In the inside, the base portion of the rod-shaped linking member 36 is connected to the operating shaft 28, and the upper end surface of the first stopper 20 is brought into contact with the tip end portion of the linking member 36 by the elasticity of the compression spring 22.
8 and the first stopper 20 can be moved integrally via the linking member 36. A disc-shaped linking member 37 is integrally provided below the substrate 1 at the base of the operating shaft 29, and the lower end surface of the second stopper 23 is brought into contact with the outer peripheral portion of the linking member 37 by the elasticity of the compression spring 25. The operating shaft 29 and the second stopper 23 can move integrally via the linking member 37. On the outer periphery of the operating shaft 28, a return compression spring 38 is interposed between the linking member 36 and the upper end portion of the upper guide member 4, so that the elasticity of the compression spring 38 is stronger than that of the compression spring 22. It is set. Therefore, the elasticity of the compression spring 38 urges the operating shaft 28, the first stopper 20 and the like downwards against the elasticity of the compression spring 22, and the lower end surface of the operating shaft 28 moves toward the operating shaft 29.
It is pressed against the upper end surface of the and can move integrally.

Then, by exciting the solenoid 33, the solenoid shaft 34, the operating shafts 29 and 28, and the second stopper 23.
Rises against the elasticity of the compression spring 38 and the second stopper 23 advances into the conveyance path 6, while the first stopper 20 slightly delays the rise of the second stopper 23 and the elasticity of the compression spring 22 increases. Rises and retracts outside the transport path 6 (see FIGS. 6, 7, 9, 10, 12, 13, and 15). On the contrary, demagnetization of the solenoid 33 causes the operating shafts 28, 29,
The elasticity of the compression spring 38 lowers the first stopper 20 against the elasticity of the compression spring 22 to move the first stopper 20 forward into the transport path 6, and the second stopper 23 causes the first stopper 20 to move. The elasticity of the compression spring 25 causes a slight delay with respect to the downward movement, and then moves back out of the conveyance path 6. (Figs. 5, 8,
11, 14).

Since the measuring means 16 and 18 have the same structure, the same parts are designated by the same reference numerals and will be described. Conveyance path 6
4 which regulates the forward movement of the chip resistor R in the middle of
0 is a hole 41 formed in the upper surface guide members 4 and 5 in the vertical direction.
It is slidably supported in the vertical direction. Stopper 40
A compression spring 42 is interposed between the large-diameter step portion of the base portion and the small-diameter portion of the lower end of the hole 41, and the elasticity of the compression spring 42 urges the stopper 40 rearward (upward). A support frame 43 is fixed on the upper guide members 4 and 5, and a solenoid 44 is supported on the support frame 43. A compression spring 46 is interposed between the base of the solenoid shaft 45 and the upper end of the support frame 43, and the elasticity of the compression spring 46 presses the solenoid shaft 45 downward so that the lower end surface of the solenoid shaft 45 is above the stopper 40. It is in contact with the end face. The elasticity of the compression spring 46 is set to be stronger than the elasticity of the compression spring 42. Then, when the solenoid 44 is excited, the solenoid shaft 45 is retracted (raised) against the elasticity of the compression spring 46, and accordingly, the stopper 40 is raised against the elasticity of the compression spring 42 and is conveyed. 6 Back out (see FIGS. 12 and 15). On the contrary, demagnetization of the solenoid 44 causes the solenoid shaft 45 to move forward (lower) due to the repulsive elasticity of the compression spring 46, and accordingly, the stopper 40 lowers against the elasticity of the compression spring 42 to move the conveyance path 6 It is designed to be projected inward (FIGS. 5 to 11 and FIG. 1).
3 and 14).

Four measuring terminals 47 for measuring the resistance value of the second chip resistor R from the stopper 40 are provided on the upstream side of the stopper 40 in the conveying direction of the chip resistor R. Each pair of measuring terminals 47 is arranged so as to be able to contact the electrodes r2 before and after the chip-shaped resistor R, and its base is fixed to the holder 48. On the other hand, a support frame 49 is fixed to the lower side of the substrate 1, and a movable base 51 is provided with a bearing 52 on a guide shaft 50 fixed to the support frame 49 in a vertical direction.
The movable base 51 is supported by a holder 48 so as to be able to move up and down.

A solenoid 53 is supported on the support frame 49, and a solenoid shaft 54 is connected to the movable base 51. The support shaft 55 is hung from the upper surface plate of the support frame 49, and the lower part thereof is inserted into the upper part of a large-diameter spring receiving hole 56 recessed in the central part of the movable table 51, and the outer periphery of the support shaft 55 and the spring receiving hole. A shock absorbing compression spring 57 fitted on the inner circumference of the support member 56 is interposed between the lower surface of the upper plate of the support frame 49 and the bottom surface of the spring receiving hole 56. Then, by exciting the solenoid 53, the solenoid shaft 54, the movable base 51, the holder 48, and the measurement terminal 47 are raised,
A hole of an insulating material 58 made of plastic or the like attached to the cutout portion of the substrate 1 and the bottom guide member 2 at the tip of the measurement terminal 47
(Not shown) is inserted into the chip-shaped resistor R and pressed against the electrodes r2 on both front and rear sides of the chip-shaped resistor R to hold the chip-shaped resistor R in a fixed state so that the resistance value can be measured by the four-terminal measuring method. (See FIGS. 11, 12, 14, and 15). At this time, the shock absorbing compression spring 57 can prevent damage to the chip resistor R and damage to the measuring terminal 47. On the contrary, when the solenoid 53 is demagnetized, the solenoid shaft 54, the movable base 51, the holder 48 and the measurement terminal 47 are lowered, so that the measurement terminal 47 is released.
Is designed to release the chip resistor R (Fig. 5).
(See FIGS. 10 and 13).

Since the selecting means 17 and 19 have the same structure, the same parts are designated by the same reference numerals and described. A support member 60 is fixed to the lower surface of the substrate 1, and the holes 6 of the support member 60 are
1, a disk shaft 63 is rotatably supported in a hole 62 of the substrate 1 via a bearing 64, and a disc 65 for selection is provided on an upper protruding portion of the disk shaft 63 so as to rotate integrally therewith. The sorting disc 65 is formed of a non-electrically insulating material such as a metal having excellent wear resistance, particularly preferably cemented carbide, and has a plurality of storage portions 66 (see FIGS. 2 and 12) at the outer periphery at equal division positions. It is formed by a notch. A guide 67 is provided on the outer peripheral portion of the sorting disc 65 excluding the transport path 6, and a lid 68 for preventing the chip-shaped resistor R from popping out is provided on the outer peripheral portion of the sorting disc 65.
A stepping motor 69 is supported on the lower end of the support member 60, and an output shaft 70 thereof is connected to the disc shaft 63 by a coupling 71. Then, by driving the stepping motor 69, the output shaft 70, the disc shaft 63, the disc 65 for sorting, etc. are intermittently rotated.

A suction hole 72 is formed in the substrate 1 at a position downstream of the stopper 40 of the measuring means 16 and 17 in the carrying direction of the chip resistor R and below the outer peripheral portion of the sorting disk 66. The upper part of the suction hole 72 corresponds to the outer peripheral part of the sorting disk 65, that is, the small hole 73 formed in the bottom guide member 2 located below the storage part 66, and the lower part communicates with a vacuum pump (not shown). ing. Then, by driving the vacuum pump, the suction hole 72, the small hole 73, and the storage portion 6
The chip-shaped resistor R that has been sucked via 6 and released from the stopper 40 can be stored in the storage portion 66. Therefore, the chip-shaped resistor R housed in the housing portion 66 is guided on the bottom guide member 2 by the intermittent rotation of the sorting disk 65 as described above.
7, the lid 68 prevents the detachment and the sheet is conveyed.

The supply position and the discharge position of the chip resistor R on the sorting disk 65 (the transport path 6 on the downstream side in the rotation direction).
The suction / exhaust holes 74 are formed in the substrate 1 at the outer peripheral portion of the intermediate portion of (position). The upper portion of the suction / exhaust hole 74 corresponds to the outer peripheral portion of the sorting disc 65, that is, the small hole 75 formed in the bottom guide member 2 located below the storage portion 66, and the lower portion thereof is a vacuum pump via a bifurcated pipe. And a compressor (both not shown). Then, when the resistance value of the chip-shaped resistor R conveyed as described above is good, suction and exhaust holes 74, by driving the vacuum pump,
The chip-shaped resistor R in the storage portion 66 is held in the suction state through the small hole 75, and when the resistance value of the chip-shaped resistor R is defective, the suction and exhaust holes 7 are driven by driving the compressor.
4, air is ejected into the storage portion 66 through the small hole 75,
The chip resistor R in the storage portion 66 is discharged to the outside.

A loading tape T for taping is located on the lower surface of the bottom guide member 2 by the driving means (not shown) on the discharge side of the good chip resistor R in the sorting disk 65 of the sorting means 19 in the latter stage. It runs horizontally. The loading tape T has a loading recess t1 and a feed hole t2 arranged in a row, and the feed hole t2 is used for running the loading tape T. A loading device 76 is provided above the discharge side of the good chip resistor R in the sorting disk 65. An example of the loading device 76 will be described.
8 is movably supported in the vertical direction via a bearing 79,
The loading pin 78 is urged in the backward direction (upward) by a compression spring 80 interposed between the large-diameter step portion of the base portion and the substrate 77. The loading pin 78 has a hole (not shown) opened from the base to the tip, and the base side of the hole is connected to a vacuum pump (not shown) supported on the substrate 77 by a hose 82. A support 83 is fixed on the substrate 77,
A solenoid 84 is supported on the support base 83, and the lower end surface of the solenoid shaft 85 is in contact with the upper end surface of the loading pin 78.

Therefore, when the vacuum pump is driven, the solenoid shaft 85 is moved forward (downward) by the excitation of the solenoid 84, and the loading pin 78 causes the compression spring 8 to move.
By advancing (lowering) against the elasticity of 0, the chip-shaped resistor R housed in the housing portion 66 is held in an attracted state, and the loading recess of the loading tape T is inserted from the hole 86 of the bottom guide member 2. It can be loaded at t1. On the contrary, the demagnetization of the solenoid 84 causes the solenoid shaft 85 to retract (raise), and accordingly, the loading pin 78 retracts (rises) against the elasticity of the compression spring 80.

The operation of the above arrangement will be described below with reference to FIGS. First, FIG.
As described above, the first stopper 20 of the separating means 15 is advanced into the conveyance path 6 by the elasticity of the compression spring 38 due to the demagnetization of the solenoid 33 as described above, and as shown by the arrow X by the discharge pressure of the parts feeder. Among the chip-shaped resistors R conveyed in the conveying path 6 in a continuous state, they are engaged with the leading end surface of the leading chip-shaped resistor R and stopped. Next, FIG.
As shown in FIG. 3, the second stopper 23 is moved forward by the excitation of the solenoid 33 to press the second chip resistor R against the upper guide member 4 and stop it. At this time, the built-in shock absorbing spring can prevent the chip-shaped resistor R from being damaged. As the second stopper 23 moves forward, as the compression spring 38 is compressed, the first stopper 20 is slightly delayed from the forward movement of the second stopper 23 due to the impact resilience of the compression spring 22, as shown in FIG. As described above, the leading chip resistor R is released. At the same time, the stopper 40 of the first-stage measuring means 16 is advanced into the conveyance path 6 by exciting the solenoid 44. Along with this, the leading chip resistor R sucked through the suction hole 72, the small hole 73, and the storage portion 66 is advanced,
The stopper 40 is engaged and stopped.

Next, as shown in FIG.
The elasticity of the compression spring 38 due to demagnetization causes the first stopper 20 to move forward into the conveyance path 6, and the second stopper 23 moves backward with the impact resilience of the compression spring 25 slightly behind the advance of the first stopper 20. Then, the second chip resistor R is released. Along with this, the second chip resistor R is advanced by the subsequent chip resistor R,
It is stopped by the first stopper 20. Next, as shown in FIG. 9, the second stopper 23 is moved forward by the excitation of the solenoid 33, and the third chip resistor R is pressed against the upper surface guide member 4 and stopped. Similar to the above, the first stopper 20 is retracted as shown in FIG. 10 with a timing slightly behind the advance of the second stopper 23, and the second chip resistor R is released. With this, as above,
The second chip resistor R is advanced by suction, and is stopped following the first chip resistor R stopped by the stopper 40.

Next, as shown in FIG. 11, the solenoid 3
The elasticity of the compression spring 38 due to the demagnetization of 3 causes the first stopper 20 to move forward into the conveyance path 6, and the second stopper 23 to move backward with a slight delay in timing from the advance of the first stopper 20. Release the resistor R. Along with this, the third chip resistor R is advanced by the subsequent chip resistor R and stopped by the first stopper 20. During this period, the measuring terminal 47 of the measuring means 16 is moved forward against the elasticity of the compression spring 57 by the excitation of the solenoid 53, and the electrodes r2 before and after the second chip resistor R are pressed and pressed against the upper guide member 4. Measure the resistance value while stopped.

Next, as shown in FIG. 12, the solenoid 3
By the excitation of 3, the second stopper 23 is advanced to press the fourth chip resistor R against the upper surface guide member 4 and stop it. Similar to the above, the first stopper 20 is retracted as shown in FIG. 13 with a little timing behind the advance of the second stopper 23, and the third chip resistor R is released. During this time, as shown in FIG. 12, the stopper 40 of the measuring means 16 is retracted to the outside of the conveying path 6 by the repulsive elasticity of the compression spring 42 due to the demagnetization of the solenoid 44, and the first chip-shaped resistor R is released and sucked. Thus, the disc 65 for sorting is stored in the storage portion 66 that is aligned with the transport path 6. Subsequently, by exciting the solenoid 44, the stopper 40 is advanced against the elasticity of the compression spring 42 into the conveyance path 6 as shown in FIG. At the same time, the measurement terminal 47 is retracted by the repulsive elasticity of the compression spring 57 accompanying the demagnetization of the solenoid 53, and the second chip resistor R is released. Along with this, as shown in FIG. 13, the second chip-shaped resistor R advances by suction and stops by the stopper 40.
Since the second chip resistor R is also released from the first stopper 20 as described above, it advances by suction and stops following the second chip resistor R. In this way, the resistance value is measured in a fixed state in which the chip-shaped resistor R is pressed against the upper surface guide member 4 by the measuring terminal 47. At this time, the subsequent chip-shaped resistor R is stopped by the first stopper 20. Since there is no possibility of being applied to the measurement terminal 47 from the rear, breakage or the like can be prevented.

Next, as shown in FIG. 14, the solenoid 3
The elasticity of the compression spring 38 due to the demagnetization of 3 causes the first stopper 20 to move forward into the conveyance path 6, and the second stopper 23 to move backward with a little delay in timing from the advance of the first stopper 20 and the fourth chip. Release the resistor R. Along with this, the fourth chip resistor R is advanced by the subsequent chip resistor R and stopped by the first stopper 20. During this time, the measuring terminal 47 of the measuring means 16 is moved forward against the elasticity of the compression spring 57 by the excitation of the solenoid 53, and the electrodes r2 before and after the third chip resistor R are pressed and pressed against the upper guide member 4. Measure the resistance value while stopped.

Next, as shown in FIG. 15, the solenoid 3
By the excitation of 3, the second stopper 23 is moved forward to press the fifth chip resistor R against the upper surface guide member 4 and stop it. During this time, the stopper 40 of the measuring means 16 is retracted to the outside of the conveying path 6 by the repulsive elasticity of the compression spring 42 due to the demagnetization of the solenoid 44, the second chip-shaped resistor R is released, and the conveying is performed on the sorting disc 65 by suction. It is stored in the storage portion 66 which is in line with the path 6.

Hereinafter, by repeating the above operation, the chip resistor R is continuously conveyed along the conveying path 6 in a straight line.
It is possible to measure the resistance value by sequentially separating each one. After the measurement, the chip-shaped resistor R housed in the housing portion 66 of the sorting disc 65 that rotates intermittently is the sorting disc 6
With the intermittent rotation of 5, the sheets are sequentially transported to the downstream side. During this time, the chip-shaped resistor R having a good (normal) resistance value passes through the position of the small hole 75 of the bottom guide member 2 as it is, and when it corresponds to the transport path 6 on the downstream side, it is sucked from the downstream side as described above. And is conveyed along the conveying path 6 to the second-stage measuring means 18 on the downstream side. On the other hand, when the chip resistor R having a poor resistance value reaches the position of the small hole 75 of the bottom guide member 2, the air is ejected as described above and discharged to the outside of the storage section 66.

The chip-shaped resistor R that has passed through the first-stage measuring means 16 and the selecting means 17 is subjected to the same measuring work and selecting work by the second-stage measuring means 18 and the selecting means 19. Then, when the good chip resistors R after sorting are intermittently conveyed to the loading position for the loading tape T, the loading device 76 is driven to drive the loading tape T from the hole 86 of the bottom guide member 2 as described above. It is sequentially loaded in the loading recess t1.

Next, a second embodiment of the present invention will be described. FIG. 16 and FIG. 17 are a plan view and a vertical cross-sectional view of a sorting means used in the automatic chip-shaped electronic component sorting apparatus according to the second embodiment of the present invention.

As shown in FIGS. 16 and 17, a sorting transport path 87 for linearly transporting the chip resistor R is provided so as to extend the transport path 6. Sorting transport path 8
In the middle of 7, a discharge port 88 is formed in the substrate 1 and the bottom guide member 2 so as to communicate with the sorting conveyance path 87.
A gate 89 that can open and close the discharge port 88 is slidably supported by the. A suction hole 90 communicating with the discharge port 88 when the discharge port 88 is opened is formed in the substrate 1. One end of a suction pipe 91 is inserted and fixed in the vertical portion of the suction hole 90, and the other end of the suction pipe 91 is connected to a vacuum pump (not shown). Other configurations are the same as those in the first embodiment.

Then, as in the first embodiment, the chip resistors R are separated and measured one by one and sent to the sorting conveyance path 87. Here, when the chip-shaped resistor R has a good measurement result, the discharge port 88 remains blocked by the gate 89, passes through the discharge port 88 to the downstream side, and is conveyed to the next step. On the other hand, in the case of the chip-shaped resistor R whose measurement result is poor, the gate 89 is a driving device (not shown).
The suction pipe 91 and the suction hole 90 have a negative pressure due to the driving of the vacuum pump, so that the discharge port 88 is opened and the suction port 90 is opened from the discharge port 88 through the suction hole 90 and the suction pipe 91. It is designed to be discharged outside.

In each of the above embodiments, separation, measurement,
A means for detecting the front and back of the chip-shaped resistor R, cracks (breaks), etc. is provided in the desired step of sorting, and in the case of reverse orientation or cracks (breaks), it is discharged as a defective product out of the device by the sorting means. You may do it. Further, the suction hole 90 and the suction pipe 91 in the second embodiment are replaced with an exhaust hole and an exhaust pipe, and the exhaust pipe is communicated with a compressor. Alternatively, 89 may be lowered, and air may be discharged from the discharge port 88 through the exhaust pipe and the exhaust hole to discharge the chip resistor R above (outward) the sorting conveyance path 87.
In addition, the present invention can be modified in various ways without departing from the basic technical idea thereof.

[0045]

As described above, according to the present invention, when chip-shaped electronic components are continuously conveyed in a straight line along the conveying path, the separating means separates the chip-shaped electronic components one by one, The electrical characteristics of the chip-shaped electronic component are measured, and good or defective chip-shaped electronic components can be selected based on the measurement result. As described above, since the chip-shaped electronic components are separated while being linearly conveyed and the electrical characteristics are measured, it is not necessary to use a disk which is required to have electrical insulation. Therefore, it is possible to reduce the cost, improve the manufacturing efficiency of the chip-shaped electronic component, and reduce the running cost.

[Brief description of drawings]

FIG. 1 is a partially cutaway front view showing an automatic sorting device for chip-shaped electronic components according to a first embodiment of the present invention.

FIG. 2 is a plan view showing the automatic sorting device.

FIG. 3 is a partial side view showing a separating section of the automatic sorting apparatus.

FIG. 4 is a partially cutaway side view showing a measuring section of the automatic sorting apparatus.

FIG. 5 is an operation explanatory view of the automatic sorting apparatus.

FIG. 6 is an operation explanatory view of the automatic sorting apparatus.

FIG. 7 is an operation explanatory view of the automatic sorting apparatus.

FIG. 8 is an operation explanatory view of the automatic sorting apparatus.

FIG. 9 is an operation explanatory view of the automatic sorting apparatus.

FIG. 10 is an operation explanatory view of the automatic sorting apparatus.

FIG. 11 is an operation explanatory view of the automatic sorting apparatus.

FIG. 12 is an operation explanatory diagram of the automatic sorting apparatus.

FIG. 13 is an operation explanatory view of the automatic sorting apparatus.

FIG. 14 is an operation explanatory view of the automatic sorting apparatus.

FIG. 15 is an explanatory diagram of an operation of the automatic sorting device.

FIG. 16 is a plan view showing a sorting means used in the chip-shaped electronic component automatic sorting apparatus according to the second embodiment of the present invention.

FIG. 17 is a vertical sectional view showing the sorting apparatus.

[Explanation of symbols]

 6 Conveyance Path 15 Separation Means 16 Measuring Means 17 Sorting Means 18 Measuring Means 19 Sorting Means 20 First Stopper 23 Second Stopper 33 Solenoid 40 Stopper 44 Solenoid 47 Measuring Terminal 53 Solenoid 65 Sorting Disc 66 Storage Section 69 Stepping Motor 72 Suction hole 74 Suction and exhaust hole 76 Loading device R Chip resistor T Loading tape

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Tomoyuki Kojima 3-26 Tanimotomura-cho, Shinjuku-ku, Tokyo Masawa Industrial Co., Ltd. (72) Seiji Yoshizawa 3-26 Tanimoto-mura, Shinjuku-ku, Tokyo Masakazu Within Industry Co., Ltd.

Claims (8)

[Claims] 1. A transportation path for linearly transporting chip-shaped electronic components, a separation means for separating the chip-shaped electronic components transported in a continuous state one by one in the middle of this transportation path, and this separation means. By measuring the electrical characteristics by stopping the chip-shaped electronic component that is separated by and is conveyed to the downstream side of the conveying path, after the measurement, a measuring means for releasing the chip-shaped electronic component,
An automatic sorting device for chip-shaped electronic components, comprising: sorting means for sorting into good and defective chip-shaped electronic components based on the measurement result of the measuring means. 2. The automatic sorting device for chip-shaped electronic components according to claim 1, wherein the measuring means and the sorting means are arranged in a plurality of stages. 3. A first separating means is provided so as to be capable of advancing and retracting in the middle of the conveying path, and stops the chip-shaped electronic component conveyed on the conveying path at the forward position and releases the chip-shaped electronic component at the retracted position. And the stopper, and the chip-shaped electronic component that is provided on the upstream side of the first stopper in the conveying direction of the chip-shaped electronic component so as to advance and retreat. A second stopper for releasing the electronic component, and advancement of the second stopper before the first stopper releases the chip-shaped electronic component,
The automatic sorting device for chip-shaped electronic components according to claim 1 or 2, further comprising: a driving device that retracts the second stopper after the first stopper stops the chip-shaped electronic components. 4. A stopper that is provided so as to be able to move forward and backward in the middle of the conveying path, and that stops the chip-shaped electronic component conveyed on the conveying path at the forward position and releases the chip-shaped electronic component at the retracted position. , A driving device for advancing and retracting the stopper, and a chip-like electronic component which is provided so as to be able to advance and retreat on the upstream side in the conveying direction of the chip-like electronic component with respect to the stopper, and stops the chip-like electronic component conveyed along the conveying path at the forward position, and the retracted position With the release of the chip-shaped electronic component, the measurement terminal for measuring the electrical characteristics of the chip-shaped electronic component in a stopped state,
4. A drive device for advancing the measuring terminal before the stopper releases the chip-shaped electronic component, and retracting the measuring terminal after the stopper stops the chip-shaped electronic component. The automatic sorting device for chip-shaped electronic components described in. 5. A sorting disc having a plurality of storage portions for storing chip-shaped electronic components on its outer periphery at evenly-divided positions and made of a non-electrically insulating material having abrasion resistance, and a sorting disk. A drive device for intermittently rotating the disc, and a chip-shaped electronic component which is provided on the outer peripheral portion of the selection disc and has a good electrical characteristic measurement result, and a defective chip-shaped electronic component is passed through the selection disc. An automatic sorting device for chip-shaped electronic components according to any one of claims 1 to 4, further comprising a sorting discharging device for discharging the chips. 6. The automatic sorting device for chip-shaped electronic components according to claim 5, wherein the sorting disk is made of cemented carbide. 7. A sorting means is provided so as to extend the transporting path, and transports a chip-shaped electronic component linearly, and a sorting transporting path is provided in the middle of the sorting transporting path. The chip-shaped electronic device according to any one of claims 1 to 4, further comprising: a sorting discharge device that allows a chip-shaped electronic component having a good measurement result to pass therethrough and discharges a defective chip-shaped electronic component from the sorting transport path. Automatic parts sorting equipment. 8. A sorting discharging device passes a discharging port provided in the middle of a sorting conveyance path, a gate for opening and closing the discharging port, and a chip-shaped electronic component having a good electrical characteristic measurement result. Holding the gate in the closed position and moving the gate to the open position so that the defective chip-shaped electronic component is discharged, and the defective chip-shaped electronic component is discharged and released. 8. An automatic sorting device for chip-shaped electronic components according to claim 7, further comprising a suction device for sucking and discharging from an outlet.