JP2905425B2 - Automatic sorter for chip-shaped electronic components - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention separates chip-like electronic components such as leadless square chip-type resistors which are continuously supplied from a parts feeder or the like, and separates them one by one. The present invention relates to an automatic sorting apparatus for chip electronic components used for measuring good characteristics, selecting good or bad, and supplying good chip electronic components to a next process such as taping.

[0002]

2. Description of the Related Art Hitherto, as an example of this kind of automatic sorting apparatus, a configuration as described in Japanese Utility Model Laid-Open No. 1-109016 has been known. To explain the outline of this conventional example, when the chip-shaped electronic component is continuously supplied to the linear supply path by the discharge pressure of the parts feeder, the leading chip-shaped electronic component is stopped by advancing the first stopper. . When the accommodating concave portion of the sorting disk that rotates intermittently faces the leading chip-shaped electronic component, the second chip-shaped electronic component is stopped by advancing the second stopper, and the leading chip is retracted by retreating the first stopper. Release electronic components. The released chip-shaped electronic components are supplied to the storage recess of the sorting disk by suction or the like by a vacuum device.
After the supply, the first stopper is moved forward, the second stopper is moved backward, the second chip-shaped electronic component is released, the second chip-shaped electronic component is moved forward by the discharge pressure of the parts feeder, and stopped by the first stopper.

[0003] By repeating the above operation, the chip-shaped electronic components can be sequentially supplied to the accommodating recesses of the sorting disk that rotates intermittently. In the course of transporting the chip-shaped electronic component supplied to the storage recess by the intermittent rotation of the transport disk, the electrical characteristics such as the resistance value are measured, and the defective chip-shaped electronic component is discharged from the storage recess. Then, only non-defective chip-shaped electronic components are supplied to the next process such as taping.

As described above, the chip-shaped electronic components separated into one by the first and second stoppers can be easily conveyed to the position for measuring the electrical characteristics by using the disc for discriminating having the storage recess on the outer periphery. can do. And
Since the disc for selection used for the purpose of measuring the electric characteristics is required to have electric insulation, it is formed of an epoxy resin containing glass fiber or a ceramic material represented by zirconia.

[0005]

When an epoxy resin mixed with glass fiber is used as a disc for discrimination,
Since it is manufactured by cutting by mechanical processing, it can be easily processed. However, it is difficult to secure the accuracy, and as a result, the cost cannot be reduced. Moreover, the wear is fast, and the life is about one week when used for 7 hours a day.

On the other hand, when a ceramic material is used as a disc for discrimination, the disc is burned and then polished or a polished plate is processed by laser. In either case, the accuracy can be ensured, but since it is a difficult-to-cut material, the processing cost is high and the cost cannot be reduced. Also, it is difficult to wear, but it is fragile, and the outer periphery of the disk is damaged by a relatively small external force.

Further, when any of the above-mentioned materials is used as a disc for sorting, the disc must be discarded due to wear, breakage, inaccuracy, etc. The replacement cycle is 7 to 15 days in normal use. It is economical. In addition, the time required for replacement is 10 to 30 minutes, during which time the production line must be stopped, which is a major problem at the production site.

SUMMARY OF THE INVENTION The present invention solves the above-mentioned conventional problems, and eliminates the need to use a disk which requires electrical insulation for measuring the electrical characteristics of chip-shaped electronic components, and therefore reduces the cost. It is an object of the present invention to provide an automatic sorting device for chip-shaped electronic components, which is capable of improving the production efficiency of chip-shaped electronic components, reducing running costs, and the like, as well as being able to achieve chip formation. .

[0009]

The technical means of the present invention for achieving the above object comprises a transport path for linearly transporting chip-shaped electronic components, and a transport path in a continuous state along the transport path. Separating means for separating the chip-shaped electronic component,
Measuring means for stopping the chip-shaped electronic components which are separated one by one by this separation device and conveyed to the downstream side of the conveyance path to measure the electrical characteristics, and after the measurement, release the chip-shaped electronic components; A selecting means for selecting good or bad chip-shaped electronic components based on the measurement result of the measuring means ;
The measuring means is provided so as to be able to advance and retreat in the middle of the transport path.
Stops the chip-shaped electronic components transported along the transport path at the advanced position.
Stop and release the chip-shaped electronic components in the retracted position.
And a drive device for moving the stopper forward and backward, and
Of the chip-like electronic component with respect to the
Provided to be retractable and transported on the transport path at the forward position
Stop the chip-shaped electronic component and set the chip-shaped electronic
Release the component and stop the chip-shaped electronic component.
A measurement terminal for measuring electrical characteristics and the stopper
Moves the measurement terminal before releasing the chip-shaped electronic component
And the stopper is moved forward to the stop position of the chip-shaped electronic component.
And a drive device for retracting the measurement terminal after the advance .

[0010] Another technical means of the present invention for achieving the above object is that the measuring means and the selecting means in the above technical means are arranged in a plurality of stages.

The separation means in each of the technical means is provided so as to be able to advance and retreat in the middle of the transport path, stops the chip-shaped electronic components transported on the transport path at the forward position, and stops at the retracted position. A first stopper for releasing the component, and a retractable upstream and downstream side of the chip-like electronic component with respect to the first stopper in the direction of transport of the chip-like electronic component. ,
A second stopper for releasing the chip-shaped electronic component at the retracted position; and a second stopper for advancing the second stopper before the first stopper releases the chip-shaped electronic component, wherein the first stopper is for the chip-shaped electronic component. And a driving device for retracting the second stopper after stopping the operation.

[0012] In the above-mentioned technical means, as a sorting means, a plurality of storing portions for storing chip-shaped electronic components on the outer periphery are arranged at equally-divided positions, and the selecting means is made of a non-electrically insulating material having wear resistance. A disc, a driving device for intermittently rotating the disc for discrimination, and a chip-shaped electronic component provided on an outer peripheral portion of the disc for discrimination and having good electrical characteristic measurement results and passing defective chip-shaped electronic components. parts of Ki de be provided with a sorting discharge apparatus for discharging from said sorting disc, among the upper Symbol sorting discs of non-electrical insulating material such as excellent metal wear resistance, in particular, the cemented carbide Preferably, it is formed.

[0013] Further , as a sorting means in each of the above technical means, a sorting path provided to extend the transport path and transports the chip-shaped electronic component in a straight line, and a sorting path provided in the middle of the sorting path is provided. is, the measurement results of the electrical characteristics passed through a good chip-like electronic component, a defective chip-like electronic component can be provided with a sorting discharge apparatus for discharging from the transport path for the sorting discharge upper Symbol selection As a device, a discharge port provided in the middle of the sorting conveyance path, a gate for opening and closing the discharge port, and a gate for closing the gate so as to pass a chip-shaped electronic component having a good measurement result of electrical characteristics. A driving device that holds the moving state and moves the gate to the open position so as to discharge the defective chip-shaped electronic component; and suctions and discharges the defective chip-shaped electronic component from the opened discharge port. It may include a drawing device.

According to the present invention configured as described above,
When the chip-shaped electronic components are continuously conveyed in a straight line along the conveyance path, the chip-shaped electronic components are separated one by one by a separating means, and then the electrical characteristics of the chip-shaped electronic components are measured. Based on this, it is possible to sort out good and bad chip-shaped electronic components. As described above, since the chip-shaped electronic components are separated and conveyed in a straight line and the electrical characteristics are measured, it is not necessary to use a disk requiring electrical insulation.

[0015]

Embodiments of the present invention will be described below with reference to the drawings. First, a first embodiment of the present invention will be described. 1 to 15 show an apparatus for automatically selecting chip-shaped electronic components according to a first embodiment of the present invention. FIG. 1 is a partially cutaway front view, FIG. 2 is a plan view, and FIG.
4 is a partial side view of the separation unit, FIG. 4 is a partially cutaway side view of the measurement unit, and FIGS.

In this embodiment, a case where a chip-shaped resistor R is used as a chip-shaped electronic component and a chip-shaped resistor R having a good resistance value is supplied to a taping step will be described. In the chip-shaped resistor R, electrodes r2 are provided on both sides on the short side of the resistor element r1 made of ceramic (alumina) (see FIG. 5).

As shown in FIGS. 1 to 4, a bottom guide member 2 made of an insulating material is provided on a substrate 1, and on both sides of the bottom guide member 2 on the substrate 1 at a desired interval. Side guide members 3 are provided, and upper surface guide members 4 and 5 made of an insulating material are provided in series at desired intervals over these side guide members 3, and these bottom guide members 2 and side guide members are provided. 3 and a straight conveyance path 6 surrounded by the upper surface guide members 4 and 5 are formed. As shown by an arrow X, a discharge pressure from a parts feeder (not shown) and a suction force from a downstream side of the chip-shaped resistor R in the conveyance direction by a vacuum pump (not shown) described later are applied to the transfer path 6. R is continuously transported linearly with one electrode r2 side forward (see FIGS. 5 to 15). The base of each of the upper surface guide members 4 and 5 is rotatably supported in the vertical direction by shafts 9 and 10 on support bases 7 and 8 on the bottom plate 1, and the conveyance path 6 is opened by being rotated upward. Resistor R in the clogged state
Can be removed. Each of the guide members 4 and 5 is held in a fixed state at a position where the guide members 4 and 5 are rotated downward by the pressing members 13 and 14 that are detachably fixed to the support bases 7 and 8 by bolts 11 and 12 and close the transport path 6. I have.

[0018] measuring the separation means 15 in the middle of the conveyance path 6 for separating one by one the chip-like resistor R along the transport direction of the chip-resistors R, the resistance value of the separated chip-like resistor R Measuring means 16 and the measured chip resistor R
Means 17 for selecting good or bad, and measuring means 1
A measuring unit 18 similar to the unit 6 and a selecting unit 19 similar to the selecting unit 17 are sequentially arranged. That is, the measuring means 16 and 18 and the selecting means 17 and 19 are arranged in two stages, so that the measurement and the selecting accuracy of the chip-shaped resistor R can be improved.

The separating means 15 will be described. A first stopper 20 which engages with the front side of the chip-shaped resistor R in the middle of the transport path 6 and regulates the advance thereof is formed in the upper surface guide member 4 in the vertical direction. It is slidably supported in the hole 21 in the vertical direction. The base large-diameter step portion of the first stopper 20 and the hole 21
A compression spring 22 is interposed between the lower end and the small-diameter portion of the lower end, and the elasticity of the compression spring 22 urges the first stopper 20 rearward (upward). The substrate 1 has a second stopper 23
Is provided. The second stopper 23 moves the second chip resistor R, which is located on the upstream side in the transport direction, to the upper surface guide members 4, 5, while the first stopper 20 restricts the forward movement of the first chip resistor R. Is arranged so as to be able to be pressed against to restrict its advance, and is configured to have a cushioning function. That is, the second stopper 23 has a piston-shaped portion supported by a cylinder so as to be extendable and contractable, and a shock absorbing spring (not shown) is interposed.
The second stopper 23 is vertically slidably supported in a hole 24 formed in the substrate 1 in the vertical direction. Second
A compression spring 25 is interposed between the large-diameter step portion at the base of the stopper 23 and the small-diameter portion at the upper end of the hole 24, and the elasticity of the compression spring 25 urges the second stopper 23 rearward (downward). I have.

[0020] The upper surface guide members 4 and the substrate 1 is formed vertically opposite holes 26 and 27, the operating shaft 28 to each well 26 and 27 and 29 via the bearings 30 and 31, movable in the vertical direction , And the lower end surface of the operating shaft 28 and the upper end surface of the operating shaft 29 are in contact with each other. A support frame 32 is fixed to the lower side of the substrate 1, and a solenoid 33 is supported on the support frame 32, and a solenoid shaft 34 is connected to a lower end of the operation shaft 29. A large-diameter hole 35 is formed in the upper surface guide member 4 on the outer periphery of the operating shaft 28. Large diameter hole 35
In the inside, the base of a rod-shaped linking member 36 is connected to the operating shaft 28, and the upper end surface of the first stopper 20 is brought into contact with the distal end of the linking member 36 by the elasticity of the compression spring 22.
The first stopper 20 and the first stopper 20 can be integrally moved via a linking member 36. A disc-shaped linking member 37 is integrally provided below the substrate 1 at the base of the operating shaft 29, and the lower end surface of the second stopper 23 abuts on the outer periphery of the linking member 37 by the elasticity of the compression spring 25. The operation shaft 29 and the second stopper 23 can be moved integrally via a linking member 37. On the outer periphery of the operating shaft 28, a return compression spring 38 is interposed between the linking member 36 and the upper end of the upper surface guide member 4 so that the elasticity of the compressive spring 38 is stronger than the elasticity of the compressive spring 22. Is set. Therefore, the elasticity of the compression spring 38 urges the operating shaft 28, the first stopper 20 and the like downward against the elasticity of the compression spring 22, and the lower end surface of the operating shaft 28
Is pressed by the upper end surface of the slab and can be moved integrally.

When the solenoid 33 is excited, the solenoid shaft 34, the operating shafts 29 and 28, the second stopper 23
Rises against the elasticity of the compression spring 38 and the second stopper 23 advances into the transport path 6, and the first stopper 20 is slightly delayed from the elevation of the second stopper 23 so that the elasticity of the compression spring 22 is reduced. And retreats outside the transport path 6 (see FIGS. 6, 7, 9, 10, 12, 13, and 15). On the contrary, the operating shafts 28, 29,
The first stopper 20 descends against the elasticity of the compression spring 22 due to the elasticity of the compression spring 38 to advance the first stopper 20 into the transport path 6, and the second stopper 23 moves to the first stopper 20. Is slightly delayed by the elasticity of the compression spring 25, and retreats outside the transport path 6. (FIGS. 5, 8,
11, 14).

Since the measuring means 16 and 18 have the same structure, the same parts will be described with the same reference numerals. Conveyance path 6
Stopper 4 that regulates advance of chip resistor R in the middle of
0 is a hole 41 formed in the upper surface guide members 4 and 5 in a vertical direction.
Are slidably supported in the vertical direction. Stopper 40
A compression spring 42 is interposed between the large-diameter stepped portion of the base and the small-diameter portion at the lower end of the hole 41, and the elasticity of the compression spring 42 urges the stopper 40 rearward (upward). A support frame 43 is fixed on the upper surface guide members 4 and 5, and a solenoid 44 is supported on the support frame 43. A compression spring 46 is interposed between the base of the solenoid shaft 45 and the upper end of the support frame 43, and the elasticity of the compression spring 46 pushes the solenoid shaft 45 downward, so that the lower end surface of the solenoid shaft 45 is It is in contact with the end face. The elasticity of the compression spring 46 is set to be stronger than the elasticity of the compression spring 42. Then, the solenoid shaft 45 by the solenoid 44 is energized is retracted against the resilience of the compression spring 46 (increase) As a result, the transport path 6 outside the stopper 40 is more increased to the elasticity of the compression spring 42 (See FIGS. 12 and 15). Conversely, solenoid 4
4, the solenoid shaft 45 is moved forward (downward) by the repulsive resilience of the compression spring 46, and the stopper 4
0 descends against the elasticity of the compression spring 42 and projects into the transport path 6 (FIGS. 5 to 11, FIG.
14).

On the upstream side in the transport direction of the chip-shaped resistor R with respect to the stopper 40, four measuring terminals 47 for measuring the resistance value of the second chip-shaped resistor R from the stopper 40 are provided. Each pair of measurement terminals 47 is arranged so as to be able to contact the electrodes r2 before and after the chip-shaped resistor R, and its base is fixed to the holder 48. On the other hand, a support frame 49 is fixed to the lower side of the substrate 1, and a movable table 51 is mounted on a guide shaft 50 fixed to the support frame 49 in a vertical direction.
The holder 48 is connected to the movable table 51 so as to be able to move up and down integrally.

A solenoid 53 is supported on the support frame 49, and a solenoid shaft 54 is connected to the movable base 51. The support shaft 55 is suspended from the upper surface plate of the support frame 49, and the lower part thereof is inserted into the upper part of the large-diameter spring receiving hole 56 recessed in the center of the movable base 51, and the outer periphery of the support shaft 55 and the spring receiving hole A compression spring 57 for absorbing shock, which is fitted on the inner periphery of the support frame 56, is interposed between the lower surface of the upper plate of the support frame 49 and the bottom surface of the spring receiving hole 56. When the solenoid 53 is excited to raise the solenoid shaft 54, the movable base 51, the holder 48, and the measuring terminal 47,
The tip of the measuring terminal 47 is inserted into a hole (not shown) of an insulating material 58 such as plastic attached to the cutout portion of the substrate 1 and the bottom guide member 2 and is pressed against the electrodes r2 on both front and rear sides of the chip-shaped resistor R. Thus, the chip-shaped resistor R is held in a fixed state, and the resistance value can be measured by a four-terminal measuring method (see FIGS. 11, 12, 14, and 15). At this time, damage to the chip resistor R and damage to the measuring terminal 47 can be prevented by the compression spring 57 for absorbing shock. Conversely, the demagnetization of the solenoid 53 causes the solenoid shaft 54, the movable base 51, the holder 48 and the measuring terminal 47 to move downward, so that the measuring terminal 47
Release the chip-shaped resistor R (FIG. 5).
To FIG. 10 and FIG. 13).

Since the selecting means 17 and 19 have the same configuration, the same parts will be described with the same reference numerals. A support member 60 is fixed to the lower surface of the substrate 1, and a hole 6 of the support member 60 is provided.
A disk shaft 63 is rotatably supported in a hole 62 of the substrate 1 and the substrate 1 via a bearing 64. An upper protruding portion of the disk shaft 63 is provided with a sorting disk 65 so as to be integrally rotatable. Sorting disc 65 is used for measuring electrical characteristics
Since it is not used and does not require electrical insulation, it is formed of a non-electrical insulating material such as a metal having excellent wear resistance, particularly preferably a cemented carbide, and has a plurality of storage portions 66 ( 2 and 12) are formed by notches. A guide 67 is provided on the outer periphery of the sorting disk 65 except for the transport path 6, and a lid 68 for preventing the chip-shaped resistor R from popping out is provided on the outer periphery of the sorting disk 65. A stepping motor 69 is supported at the lower end of the support member 60, and its output shaft 70 is coupled to a coupling 71.
Is connected to the disk shaft 63 by Then, the output shaft 70, the disk shaft 63, the sorting disk 65 and the like are intermittently rotated by the driving of the stepping motor 69.

A suction hole 72 is formed in the substrate 1 at a position downstream of the stopper 40 of the measuring means 16, 17 in the transport direction of the chip-shaped resistor R and below the outer peripheral portion of the sorting disk 66. The upper part of the suction hole 72 corresponds to the outer peripheral part of the sorting disk 65, that is, the small hole 73 formed in the bottom guide member 2 located below the storage part 66, and the lower part is connected to a vacuum pump (not shown). ing. Then, the suction hole 72, the small hole 73, and the storage section 6 are driven by driving the vacuum pump.
The chip-shaped resistor R sucked through the stopper 6 and released from the stopper 40 can be stored in the storage section 66. Therefore, the chip-shaped resistor R accommodated in the accommodating portion 66 is guided on the bottom guide member 2 by the intermittent rotation of the sorting disk 65 as described above.
7. It is transported while being prevented from being detached by the lid 68.

The conveyance of the supply position and the discharge position of the chip-resistor R of the sorting disk 65 (the rotation direction downstream side path 6
(Position), a suction / exhaust hole 74 is formed in the substrate 1 at an outer peripheral portion of the intermediate portion. The upper portion of the suction / exhaust hole 74 corresponds to the outer peripheral portion of the sorting disk 65, that is, the small hole 75 formed in the bottom guide member 2 located below the storage portion 66, and the lower portion is provided with a vacuum pump through a forked pipe. And a compressor (both not shown). Then, when the resistance value of the chip-shaped resistor R conveyed as described above is good, the suction and exhaust holes 74,
The chip-shaped resistor R in the storage section 66 is held in a suction state through the small hole 75, and when the resistance value of the chip-shaped resistor R is defective, the suction and exhaust holes 7 are driven by driving the compressor.
4. Air is ejected into the storage section 66 through the small hole 75,
The chip-shaped resistor R in the storage section 66 is discharged to the outside.

On the discharge side of the good chip-shaped resistor R in the sorting disk 65 in the sorting means 19 in the subsequent stage, a taping loading tape T is positioned on the lower surface of the bottom guide member 2 by driving means (not shown). It is run horizontally. The loading tape T has a loading recess t1 and a feed hole t2 arranged in a row, and the feed hole t2 is used for running the loading tape T. A loading device 76 is provided above the discharge side of the good chip-shaped resistor R in the sorting disk 65. An example of the loading device 76 will be described.
8 is supported movably in the vertical direction via a bearing 79,
The loading pin 78 is urged in the retreating direction (upward) by a compression spring 80 interposed between the large-diameter stepped portion of the base and the substrate 77. The loading pin 78 has a hole (not shown) opened from the base to the tip, and the base of the hole is connected to a vacuum pump (not shown) supported on the substrate 77 by a hose 82. A support 83 is fixed on the substrate 77,
A solenoid 84 is supported on the support base 83, and the lower end surface of the solenoid shaft 85 is in contact with the upper end surface of the loading pin 78.

[0029] Thus, the solenoid shaft 85 is advanced (downward) by the excitation of the solenoid 84 in a state where the vacuum pump is driven, with this, the loading pin 78 is a compression spring 8
By moving forward (falling) against the elasticity of 0, the chip-shaped resistor R accommodated in the accommodating portion 66 is held in a suction state, and the loading recess of the loading tape T is inserted through the hole 86 of the bottom guide member 2. It can be loaded at t1. Conversely, the demagnetization of the solenoid 84 causes the solenoid shaft 85 to retreat (up), and accordingly, the loading pin 78 retreats (up) against the elasticity of the compression spring 80.

[0030] In the above configuration, it will be described below with reference to FIGS. 5 to 15 for operation thereof. First, FIG.
As shown in the figure, the first stopper 20 of the separating means 15 is advanced into the transport path 6 by the elasticity of the compression spring 38 due to the demagnetization of the solenoid 33 as described above, and as shown by the arrow X by the discharge pressure of the parts feeder. among is conveyed in a conveying path 6 in a continuous state Ruchi-up shaped resistor R, engage stops on the distal end surface of the head of the chip-like resistor R. Next, as shown in FIG. 6, the second stopper 23 is advanced by the excitation of the solenoid 33, and the second chip-shaped resistor R is pressed against the upper surface guide member 4 and stopped. At this time, damage of the chip-shaped resistor R can be prevented by the built-in shock absorbing spring. When the second stopper 23 moves forward,
As the compression spring 38 is compressed, the first stopper 2
0 is the second stopper 23 due to the rebound resilience of the compression spring 22.
The timing is slightly delayed from the forward movement, and as shown in FIG. 7, the head moves backward to release the leading chip-shaped resistor R. At the same time, the stopper 40 of the first-stage measuring means 16 is advanced into the transport path 6 by the repulsive elasticity of the compression spring 46 accompanying the demagnetization of the solenoid 44. Accordingly, the suction hole 72, the small hole 7
The leading chip-shaped resistor R sucked through the third and storage sections 66 is moved forward, engaged with the stopper 40 and stopped.

Next, as shown in FIG. 8, the solenoid 33
The first stopper 20 is advanced into the conveyance path 6 by the elasticity of the compression spring 38 due to the demagnetization, and the second stopper 23 is retracted by slightly delaying the timing from the advance of the first stopper 20 by the repulsive elasticity of the compression spring 25. Then, the second chip-shaped resistor R is released. Along with this, the second chip resistor R is advanced by the subsequent chip resistor R,
It is stopped by the first stopper 20. Next, as shown in FIG. 9, the second stopper 23 is advanced by the excitation of the solenoid 33, and the third chip-shaped resistor R is pressed against the upper surface guide member 4 and stopped. Similarly to the above, the first stopper 20 retreats a little later than the advance of the second stopper 23 as shown in FIG. 10, and releases the second chip-shaped resistor R. Accordingly, as above,
The second chip-shaped resistor R is advanced by suction, and is stopped following the first chip-shaped resistor R stopped by the stopper 40.

[0032] Next, as shown in FIG. 11, the solenoid 3
The first stopper 20 is advanced into the conveyance path 6 by the elasticity of the compression spring 38 due to the demagnetization of No. 3, and the second stopper 23 is retracted with a timing slightly delayed from the advance of the first stopper 20 so that the third chip Release the resistor R. Accordingly, the third chip-shaped resistor R is advanced by the subsequent chip-shaped resistor R, and is stopped by the first stopper 20. During this time, the measuring terminal 47 of the measuring means 16 is advanced by the excitation of the solenoid 53 against the elasticity of the compression spring 57, and the electrodes r2 before and after the second chip-shaped resistor R are pressed and pressed against the upper surface guide member 4. Measure the resistance value while stopping.

Next, as shown in FIG. 12, the solenoid 3
The second stopper 23 is advanced by the excitation of 3, and the fourth chip-shaped resistor R is pressed against the upper surface guide member 4 and stopped. Similarly to the above, the first stopper 20 retreats as shown in FIG. 13 a little later than the advance of the second stopper 23, and releases the third chip-shaped resistor R. In the meantime, as shown in FIG. 12, the stopper 40 of the measuring means 16 is retracted out of the transport path 6 against the repulsive elasticity of the compression spring 42 by exciting the solenoid 44 to release the first chip-shaped resistor R. Disc 65 by suction
Is stored in the storage section 66 corresponding to the transport path 6 in the above. Followed by compression spring 46 due to the demagnetization of the solenoid 44
Impact resilience by advancing the stopper 40 to the conveying path 6 as shown in FIG. 1 3. At the same time, the rebound of the compression spring 57 accompanying the demagnetization of the solenoid 53 causes the measurement terminal 47
And the second chip-shaped resistor R is released. Accordingly, as shown in FIG. 13, the second chip-shaped resistor R moves forward by suction and stops by the stopper 40,
Since the third chip resistor R is also released from the first stopper 20 as described above, it moves forward by suction and
It stops following the th chip resistor R. As described above, the chip-shaped resistor R is connected to the upper surface guide member 4 by the measuring terminal 47.
The resistance value is measured in a fixed state pressed against
The subsequent chip-shaped resistor R is stopped by the first stopper 20, and there is no possibility that the chip-shaped resistor R will be added to the measuring terminal 47 from behind, so that breakage and the like can be prevented.

[0034] Next, as shown in FIG. 14, the solenoid 3
The first stopper 20 is advanced into the conveyance path 6 by the elasticity of the compression spring 38 due to the demagnetization of No. 3, the second stopper 23 is retracted slightly later than the advance of the first stopper 20, and the fourth tip is moved. Release the resistor R. Accordingly, the fourth chip-shaped resistor R is advanced by the subsequent chip-shaped resistor R, and is stopped by the first stopper 20. During this time, the measuring terminal 47 of the measuring means 16 is advanced by the excitation of the solenoid 53 against the elasticity of the compression spring 57, and the electrodes r2 before and after the third chip-shaped resistor R are pressed and pressed against the upper surface guide member 4. Measure the resistance value while stopping.

Next, as shown in FIG. 15, the solenoid 3
The second stopper 23 is advanced by the excitation of 3, and the fifth chip-shaped resistor R is pressed against the upper surface guide member 4 and stopped. During this time, the stopper 40 of the measuring means 16 is retracted out of the transport path 6 against the repulsive elasticity of the compression spring 42 by the excitation of the solenoid 44, and the second chip-shaped resistor R is released and sucked. Thus, the disc is stored in the storage section 66 corresponding to the transport path 6 of the sorting disk 65.

[0036] Hereinafter, by repeating the above operation, the chip-shaped resistor R conveyed on the conveying path 6 in continuous straight line
Can be sequentially separated one by one to measure the resistance value. After the measurement, the chip-shaped resistor R accommodated in the accommodating portion 66 of the sorting disk 65 that rotates intermittently is the sorting disk 6.
With the intermittent rotation of No. 5, they are sequentially conveyed to the downstream side. During this time, the chip-shaped resistor R having a good (normal) resistance value passes through the position of the small hole 75 of the bottom surface guide member 2 as it is, and if it corresponds to the downstream transport path 6, it is sucked from the downstream side in the same manner as described above. Then, it is transported along the transport path 6 to the second-stage measuring means 18 on the downstream side. On the other hand, when the chip-shaped resistor R having a poor resistance value reaches the position of the small hole 75 of the bottom surface guide member 2, the air is blown out and discharged out of the storage section 66 as described above.

The chip-shaped resistor R that has passed through the first-stage measuring means 16 and the sorting means 17 is subjected to the same measuring and sorting operations as described above by the second-stage measuring means 18 and the sorting means 19. When the good chip-shaped resistor R after the sorting is intermittently conveyed to the loading position for the loading tape T, the loading device 76 is driven by the loading device 76 to drive the loading tape T out of the hole 86 of the bottom guide member 2 as described above. It is sequentially loaded into the loading recess t1.

[0038] As described above, the stop
One upstream from the chip resistor R stopped at
By measuring the resistance value of the chip resistor R,
During the measurement operation, the downstream chip resistor R (operation start
In some cases, the resistance value has not been measured, and
Release the resistance value) from the stopper 40 and
To the first stopper 20 and the second stopper
The operation of the stopper 23 allows the chip resistor R
Separation work can be performed. That is, chip-shaped resistor
Performing the resistance measurement work and separation work of the vessel R in parallel
Can be.

Next, a description will be given of a second embodiment of the present invention. FIG. 16 and FIG. 17 are a plan view and a longitudinal sectional view of a sorting means used in an automatic sorting device for chip-shaped electronic components according to the second embodiment of the present invention.

As shown in FIGS. 16 and 17, a sorting conveying path 87 for conveying the chip-shaped resistor R linearly is provided so as to extend the conveying path 6. Sorting transport path 8
7, a discharge port 88 is formed in the substrate 1 and the bottom surface guide member 2 so as to communicate with the sorting conveyance path 87.
A gate 89 that can open and close the discharge port 88 is slidably supported at the bottom. The substrate 1 is formed with a suction hole 90 communicating with the discharge port 88 when the discharge port 88 is opened. One end of a suction pipe 91 is inserted and fixed in a vertical portion of the suction hole 90, and the other end of the suction pipe 91 is connected to a vacuum pump (not shown). Other configurations are the same as those in the first embodiment.

[0041] Then, in the first embodiment similarly to the chip-shaped resistor R is separated one by one and sent to the sorting conveying path 87 is measured. Here, in the case of the chip-shaped resistor R having a good measurement result, the outlet 88 remains closed by the gate 89, passes through the outlet 88 downstream, and is conveyed to the next step. On the other hand, when the measurement result is a defective chip-shaped resistor R, the gate 89 is driven by a driving device (not shown).
, The discharge port 88 is opened, and the suction pipe 91 and the suction hole 90 are set to a negative pressure by the driving of the vacuum pump. It is designed to be discharged outside.

In each of the above embodiments, separation, measurement,
A means for detecting the front and back and cracks (chips) of the chip-shaped resistor R in a desired step of selection is provided, and in the case of reverse orientation or cracks (chips), the chip is discharged out of the apparatus by the sorting means as a defective product. You may make it. In addition, the suction hole 90 and the suction pipe 91 in the second embodiment are replaced with an exhaust hole and an exhaust pipe, and the exhaust pipe is connected to a compressor. 89 may be lowered to discharge air from the discharge port 88 through an exhaust pipe and an exhaust hole to discharge the chip-shaped resistor R above (outward of) the sorting conveyance path 87.
In addition, the present invention can be variously changed in design without departing from the basic technical idea.

[0043]

As described above, according to the present invention, when the chip-shaped electronic components are continuously conveyed along the conveying path in a straight line, the chip-shaped electronic components are separated one by one by the separating means. By measuring the electrical characteristics of the chip-shaped electronic component, it is possible to select good or defective chip-shaped electronic components based on the measurement results. As described above, since the chip-shaped electronic components are separated and conveyed in a straight line and the electrical characteristics are measured, it is not necessary to use a disk requiring electrical insulation. Therefore, it is possible to reduce the cost, improve the production efficiency of the chip-shaped electronic component, reduce the running cost, and the like.

[Brief description of the drawings]

FIG. 1 is a partially cutaway front view showing an automatic sorting device for chip-shaped electronic components according to a first embodiment of the present invention.

FIG. 2 is a plan view showing the automatic sorting device.

FIG. 3 is a partial side view showing a separation unit of the automatic sorting device.

FIG. 4 is a partially cutaway side view showing a measuring unit of the automatic sorting device.

FIG. 5 is an explanatory diagram of the operation of the automatic sorting device.

FIG. 6 is an operation explanatory view of the automatic sorting device.

FIG. 7 is an explanatory diagram of the operation of the automatic sorting device.

FIG. 8 is an explanatory diagram of the operation of the automatic sorting device.

FIG. 9 is an explanatory diagram of the operation of the automatic sorting device.

FIG. 10 is an explanatory diagram of the operation of the automatic sorting device.

FIG. 11 is an explanatory diagram of the operation of the automatic sorting device.

FIG. 12 is an explanatory diagram of the operation of the automatic sorting device.

FIG. 13 is an explanatory diagram of the operation of the automatic sorting device.

FIG. 14 is a diagram illustrating the operation of the automatic sorting device.

FIG. 15 is a diagram illustrating the operation of the automatic sorting device.

FIG. 16 is a plan view illustrating a sorting unit used in an automatic sorting device for chip-shaped electronic components according to a second embodiment of the present invention.

FIG. 17 is a longitudinal sectional view showing the same sorting device.

[Explanation of symbols]

 6 Conveying path 15 Separating means 16 Measuring means 17 Sorting means 18 Measuring means 19 Sorting means 20 First stopper 23 Second stopper 33 Solenoid 40 Stopper 44 Solenoid 47 Measurement terminal 53 Solenoid 65 Sorting disk 66 Storage section 69 Stepping motor 72 Suction hole 74 Suction / exhaust hole 76 Loading device R Chip-shaped resistor T Loading tape

Continuation of the front page (72) Inventor Tomoyuki Kojima 3-26, Tanimotomura-cho, Shinjuku-ku, Tokyo Masakazu Sangyo Co., Ltd. (56) References JP-A-61-222232 (JP, A) JP-A-57-52147 (JP, A) JP-A-57-17871 (JP, A) JP-A-1-109016 (JP, U) 59-31246 (JP, U) (58) Fields investigated (Int. Cl. ⁶ , DB name) G01R 31/26 B07C 5/344 B65G 47/78 H01L 21/66 H01L 21/68

Claims (4)

(57) [Claims] 1. A transport path for transporting chip-shaped electronic components in a straight line, separating means for separating chip-shaped electronic components being transported continuously in the middle of the transport path, and a separating means. Measuring the electrical characteristics by stopping the chip-shaped electronic components that are separated by the conveyance path and conveyed to the downstream side, and after the measurement, measuring means for releasing the chip-shaped electronic components,
Based on the measurement result of this measuring means, good, provided with a sorting means to sort the defective chip-shaped electronic component, the measuring means,
It is provided to be able to advance and retreat in the middle of the transport path, and
Stops chip-shaped electronic components conveyed along the route and retracts
And a stopper that releases the chip-shaped electronic components.
A driving device for moving the stopper
It is provided so that it can move forward and backward on the upstream side of the
The chip-shaped electronic part is transported along the transport path at the forward position.
Stop the product, release the chip-shaped electronic components in the retracted position,
The electrical characteristics of the above-mentioned chip-shaped electronic components are measured while stopped.
Measurement terminal for measurement and the stopper
Before releasing the part, advance the measuring terminal and
After the hopper has advanced to the stop position of the chip
An automatic sorting device for chip-shaped electronic components, comprising a driving device for retracting a measuring terminal . 2. The automatic sorting device for chip-like electronic components according to claim 1, wherein the measuring means and the sorting means are arranged in a plurality of stages. 3. A discriminating means comprising a plurality of accommodating portions for accommodating chip-shaped electronic components on the outer periphery at equally divided positions, and a discriminating disc made of a non-electrically insulating material having abrasion resistance; A driving device for intermittently rotating the disc, and a disc-shaped disc provided on an outer peripheral portion of the disc for discriminating and passing defective chip-shaped electronic components having good electrical characteristics measurement results. automatic sorting apparatus of the electronic chip component according to claim 1 or 2, wherein and a sorting discharge apparatus for discharging from. 4. A sorting means provided to extend the transport path, a sorting transport path for transporting the chip-shaped electronic component in a straight line, and a sorting means provided in the middle of the sorting transport path to provide electrical characteristics. 3. The automatic sorting of chip-shaped electronic components according to claim 1 or 2, further comprising a sorting discharge device for passing the chip-shaped electronic components having good measurement results and discharging the defective chip-shaped electronic components from the sorting transport path. apparatus.