JPS59139642A - Inspecting device for wafer - Google Patents
Inspecting device for waferInfo
- Publication number
- JPS59139642A JPS59139642A JP856784A JP856784A JPS59139642A JP S59139642 A JPS59139642 A JP S59139642A JP 856784 A JP856784 A JP 856784A JP 856784 A JP856784 A JP 856784A JP S59139642 A JPS59139642 A JP S59139642A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- loader
- section
- unloader
- inspection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】 本発明にウェーハ検査装置に関する。[Detailed description of the invention] The present invention relates to a wafer inspection apparatus.
半導体工業ではシリコンからなる半導体ウェーハ上に回
路素子を整列形成するとともに、この回路素子ととに分
断してペレットとし、このベレットをもとにして各種の
半導体装置および集積回路装置を製造している。In the semiconductor industry, circuit elements are aligned and formed on semiconductor wafers made of silicon, and these circuit elements are separated into pellets, and various semiconductor devices and integrated circuit devices are manufactured based on these pellets. .
ところで、前記半導体ウェーハ上に形成した回路素子の
状態を製造の途中又は製造後に検査する作業がある。従
来、この検査装置（たとえば、外観検査装置、比抵抗測
定機、プローブ検査機等）としてげ、第１図で示す装置
が用いられている。By the way, there is a task of inspecting the state of circuit elements formed on the semiconductor wafer during or after manufacturing. Conventionally, an apparatus shown in FIG. 1 has been used as this inspection apparatus (for example, a visual inspection apparatus, a resistivity measuring apparatus, a probe inspection apparatus, etc.).
この装置の各部の配＠げ次のようになっている。The arrangement of each part of this device is as follows.
すなわち、ウェーハ１を供給するローダ部２と。That is, the loader section 2 supplies the wafer 1.
検査後の不良品ウェーハな収納する第１アンローダ部３
と、検査後の良品ウエーノ・な収納する第２アンローダ
部４とは並設されている。また、前記ローダ部２と第２
アンローダ部４の前面から互いに平行に供給用コンベア
５および第１搬出用コンベア６が配設されている。また
、前記供給用コンベア５と第１搬出用コンベア６との先
端部間には移送用コンベア７が設けられている、そして
、この移送用コンベア７の中央部にはウエーノ・を検査
する検査部（検査ポジション）８が設けられているうま
た、前記移送用コンベア７と平行となり、供給用コンベ
ア５と第１搬出用コンベア６と）の間を結ぶ第２搬出用
コンベア９が設げられるとともに、この第２搬出用コン
ベア９と第１アンローダ部３との間を結ぶ第３搬出用コ
ンベア１０が設けられている。また、ローダ部２．第１
・第２アンローダ部３，４に臨むそれぞれのコンベア先
端はローダ部２．第１・第２アンローダ部３．４内にま
で入っている。また、ローダ部２．第１・第２アンロー
ダ部３．４上には第２図で示す構造のウェーハ収納治具
１１が載置され、Ｉｌ［Ｉｉｉ次上昇又は下降してロー
ディング、アンローディングな行なうようになっている
。The first unloader section 3 stores defective wafers after inspection.
and a second unloader section 4 for storing non-defective wafers after inspection are arranged in parallel. Moreover, the loader section 2 and the second
A supply conveyor 5 and a first unloading conveyor 6 are arranged parallel to each other from the front surface of the unloader section 4. Further, a transfer conveyor 7 is provided between the tips of the supply conveyor 5 and the first discharge conveyor 6, and in the center of the transfer conveyor 7 is an inspection section for inspecting the waeno. (Inspection position) 8 is provided, and a second delivery conveyor 9 is provided which is parallel to the transfer conveyor 7 and connects between the supply conveyor 5 and the first delivery conveyor 6. A third unloading conveyor 10 is provided which connects the second unloading conveyor 9 and the first unloader section 3. In addition, the loader section 2. 1st
- The tip of each conveyor facing the second unloader parts 3 and 4 is the loader part 2. It extends into the first and second unloader sections 3.4. In addition, the loader section 2. A wafer storage jig 11 having the structure shown in FIG. 2 is placed on the first and second unloader parts 3.4, and is adapted to be lifted or lowered for loading and unloading. .
つぎに、このような装置の使用状態について簡単に説明
するうまず、ローダ部２にウェー／・１を収納したウェ
ーハ収納治具■１を載置するとともに、第１・第２アン
ローダ部３，４上に空のウェーハ収納治具１１）ｋ載置
するっこの際、ローダ部２上のウェーハ収納治具１１は
最も高い位置にセットされ、ローディングの都度−ステ
ップずつ下降し、順次最下段のウェーハから供給用コン
ベア５上に移るようになっているう一方、第１・第２ア
ンローダ部３，４上のウェーハ収納治具１１にあっては
最も低い位置にセットされ、アンローディングされるた
びに−ステップずつ上昇し、順次最上段の空のウェーハ
収納溝１２にウェーハ１が収納されるようになっている
。この状態で、ウェーハ１にローダ部２から供給用コン
ベア５および移送用１コンベア７の搬送動作によって、
順次検査部８に送られ、検査部８で検蕎されて良品とな
った良品ウェーハ１３は移送用コンベア７および第１搬
出用コンベア６によって第２アンローダ部４上のウェー
ハ収納治具１１内に収納される。また、不良と判断され
た不良ウェーハ１４は移送用コンベア７、第１搬出用コ
ンベア６、第２搬出用コンベア９および第３搬出用コン
ベアＩＯを介して第１アンローダ部３上のウェーハ収納
治具１１内に収納される。また、この装置における各コ
ンベアは前述のような一方向にウェーハを移送するよう
になっている。Next, we will briefly explain how such an apparatus is used. First, we will place the wafer storage jig (1) containing wafers/.1 in the loader section 2, and the first and second unloader sections 3, When placing an empty wafer storage jig 11)k on the loader section 2, the wafer storage jig 11 on the loader section 2 is set at the highest position, and each time it is loaded, it is lowered one step at a time, and then the empty wafer storage jig 11) is placed on the lowest stage. On the other hand, the wafer storage jig 11 on the first and second unloader sections 3 and 4 is set at the lowest position, and every time the wafer is unloaded, the wafer is moved onto the supply conveyor 5. The wafers 1 are raised step by step, and the wafers 1 are sequentially stored in the empty wafer storage grooves 12 at the top. In this state, the wafer 1 is transferred from the loader section 2 to the supply conveyor 5 and the transfer conveyor 7.
The non-defective wafers 13 that have been sequentially sent to the inspection section 8 and inspected by the inspection section 8 are transferred to the wafer storage jig 11 on the second unloader section 4 by the transfer conveyor 7 and the first unloading conveyor 6. It will be stored. Furthermore, the defective wafers 14 determined to be defective are transferred to the wafer storage jig on the first unloader section 3 via the transfer conveyor 7, the first unloading conveyor 6, the second unloading conveyor 9, and the third unloading conveyor IO. It is housed in 11. Furthermore, each conveyor in this apparatus is adapted to transport wafers in one direction as described above.
しかし、このような装置でに、一つのウェーハ収納治具
に収納されているウェーハ全数に対して検査を行なう全
数検査の場合にぼ支障ぼないが、一つのウェーハ収納治
具内の数枚について抜取検査を行なう抜取検査の場合に
はつぎのような欠点が生じる。すなわち、前記ローダ部
２にあってに、ウェーハ１ば下方からしか抜き出せない
。したがって、ウェーハ収納治具１１の如何なる位置か
ら自由に抜き取れない。また、下方のウエーノ・から順
次数枚のウェーハを抜き取る方法では、抜取検査終了時
には２〜３枚のウェー／’Ｈ第１アンローダ部３又は第
２アンローダ部４内のウェーハ収納治具ｌｌ内に入れら
れるが、残りの多数のウェーハ１げローダ部２のウエー
ノ・収納治具１１内に入った状態となっている。そこで
、作業者は第２アンローダ部４のウエーノ・収納治具１
１内にある良品ウェーハ１３をローダ部側のウエーノ・
収納治具１１に移し換えしなげればならない、また、こ
の場合、ウェーハなビンセットで挾んで移すため。However, with this kind of equipment, there is no problem in the case of 100% inspection in which all the wafers stored in one wafer storage jig are inspected, but when several wafers in one wafer storage jig are inspected, In the case of sampling inspection, the following disadvantages arise. That is, in the loader section 2, the wafer 1 can only be extracted from below. Therefore, the wafer cannot be freely removed from any position on the wafer storage jig 11. In addition, in the method of sequentially picking out several wafers from the lower wafer, at the end of the sampling inspection, 2 to 3 wafers/'H are placed in the wafer storage jig ll in the first unloader section 3 or the second unloader section 4. However, the remaining large number of wafers 1 are placed in the wafer storage jig 11 of the loader section 2. Then, the operator
The good wafer 13 in 1 is transferred to the wafer on the loader side.
The wafer must be transferred to the storage jig 11, and in this case, the wafer is transferred by being held in a wafer bottle set.
ウエーノ・に傷が入り易いとともに、一枚ずつ移し換え
を行なうことから作業能率が極めて低い。The paper is easily damaged, and work efficiency is extremely low as the paper is transferred one by one.
したかって１本発明の目的はウエーノ・の抜取検査にお
いて、ウェーハ収納治具１１のいかなる位置からもウェ
ーハを自由に抜き取ることができ、抜取検査が自動で行
なえるウェーハ検査装置を提供することにある。Therefore, an object of the present invention is to provide a wafer inspection device that can freely pull out wafers from any position of the wafer storage jig 11 in the sampling inspection of wafers, and can automatically perform the sampling inspection. .
このような目的を達成するために本発明は、ローダ機構
においては、ウェーハブツシャを用いて、治具の如何な
る場所からも一枚ずつウエーノ・を取り出すことのでき
る構造としたものである。In order to achieve this object, the present invention has a structure in which the loader mechanism uses a wafer pusher to take out wafers one by one from any location on the jig.
以下実施例により本発明を説明する。The present invention will be explained below with reference to Examples.
第３図は本発明のウェーハ検査装置の一実施例を示す概
要図である。同図には離間してローダ部１５とアンロー
ダ部１６が配置されている。また。FIG. 3 is a schematic diagram showing an embodiment of the wafer inspection apparatus of the present invention. In the figure, a loader section 15 and an unloader section 16 are arranged apart from each other. Also.
前記ローダ部１５とアンローダ部１６との前面側には、
ウェーハ１７をローダ部１５からアンローダ部１６に案
内するテーブル１８が配設され、このテーブル１８には
２列の小孔群からなるエアーコンベア構造の第１搬送機
構１９が設けられている。このエアーコンベア構造に、
第４図に示すように、左上がりの傾斜した小孔２０から
なるとともに、これらの小孔２０はテーブル１８内のエ
アー供給孔２１に連通しているっしたがって、ウェーハ
１７は小孔２０から噴き出されるエアーによっテ−ブル
１８上面から浮き上がるとともＶＣ，、噴射方向が傾斜
しているため、左方向に搬送される。On the front side of the loader section 15 and unloader section 16,
A table 18 is provided to guide the wafer 17 from the loader section 15 to the unloader section 16, and the table 18 is provided with a first transport mechanism 19 having an air conveyor structure consisting of two rows of small holes. This air conveyor structure
As shown in FIG. 4, the wafer 17 is made up of small holes 20 that are inclined upward to the left, and these small holes 20 communicate with air supply holes 21 in the table 18. The ejected air lifts the VC from the top surface of the table 18, and since the injection direction is inclined, the VC is conveyed to the left.
また、テーブル１８の中央部には一部切欠き部が設けら
れ、この切欠き部にはウェーハ１７を載置する試料台２
２が配設されている。この試料台２２１ｄ千面ＸＹ方向
に自在に移動調整できるＸＹテーブル２３上に固定され
るとともに、この試料台２２の中央部にはウェーハ１７
を真空吸着する吸着孔２４からなる吸着機構が設けられ
ている。Further, a notch is provided in the center of the table 18, and a sample stage 2 on which the wafer 17 is placed is provided in the notch.
2 are arranged. This sample stand 221d is fixed on an XY table 23 which can be freely adjusted in a thousand planes in the XY direction, and a wafer 17 is placed in the center of this sample stand 22
A suction mechanism consisting of suction holes 24 for vacuum suction is provided.
また、前記試料台２２上にローダ部１５から搬送されて
きたウェーハ１７を停止させる停止機構としてストッパ
２５がテーブル１８上方に設けられるとともに、吸着孔
２６からなる真空ストッパカナ−フル１８面に設けられ
ている。前者のストッパ２５は上下に移動し、ウェーハ
１７を停止させるとぎにテーブル上に下降し、ウェーハ
１７の移動経路を遮断して停止させる。また、後者の真
空ストッパ′はウェーハ１７をテーブル面に真空吸着し
て移動を停止させるようになっている。Further, a stopper 25 is provided above the table 18 as a stopping mechanism for stopping the wafer 17 transferred from the loader section 15 onto the sample table 22, and a stopper 25 is provided on the surface of the vacuum stopper full 18 consisting of suction holes 26. There is. The former stopper 25 moves up and down, and when the wafer 17 is stopped, it is lowered onto the table, blocking the movement path of the wafer 17 and stopping it. The latter vacuum stopper' is adapted to vacuum-adsorb the wafer 17 to the table surface and stop its movement.
一方、試料台２２挿入部とローダ部１５との間には、第
１搬送機構１９に沿って、第５図で示すように右上がり
の小孔２７とエアー供給孔２８とからなるエアーコンベ
ア構造の第２搬送機構２９が設けられている。そして、
この第２搬送機構２９では、試料台２２上のウェーハ１
７をローダ側如移送するようになっているう
また。前記ローダ部１５の背面側にげ、アンローダ用押
出棒３０が配設され、このアンローダ用押出棒３０の一
回の前進によって一枚のウェーハをその先端で、第２図
に示す構造のウェーハ収納治具３１にあるウェー／・１
７を第１搬送機構１９および第２搬送機構２９の一端の
テーブル１８上に押し出すようになっている。また、前
記アンローダ用押出棒３０ｉ後退時はその先端がウェー
ハ収納治具３１から背面孔の外に外れ、ローダ部１５の
上下部に支障を来たさないようになっている。On the other hand, between the sample stage 22 insertion part and the loader part 15, an air conveyor structure is provided along the first conveyance mechanism 19, which consists of a small hole 27 and an air supply hole 28, which are angled upward to the right, as shown in FIG. A second transport mechanism 29 is provided. and,
In this second transport mechanism 29, the wafer 1 on the sample stage 22 is
7 is transferred to the loader side. An unloader push rod 30 is disposed on the rear side of the loader section 15, and by one advance of the unloader push rod 30, one wafer is stored at the tip of the unloader push rod 30 as shown in FIG. Way in jig 31/・1
7 onto the table 18 at one end of the first transport mechanism 19 and the second transport mechanism 29. Further, when the unloader push rod 30i is retreated, its tip comes off the wafer storage jig 31 to the outside of the back hole, so that it does not interfere with the upper and lower parts of the loader section 15.
また、前記ローダ部１５の前面テーブル１８端には、第
１搬送機構１９および第２搬送機構２９の一端上に載置
されるウェーハ１７をローダ部１５上のウェーハ収納治
具３１円に挿入するローダ用押出棒３２が配設され、−
回の前進でウエーノ１１７をウェーハ収納治具３１の収
納溝に送り込むようになっているうまた。前記ローダ部
１５の前記テーブル１８端には小孔３３が設けられ、真
空吸着によってウエーノＳ１７を吸着するようになって
（＼る。この吸着機構では試料台２２から移送されて来
たウエーノ・１７を定位置に一時的に吸着停止する役割
を果し、前記ローダ用押出棒３２の前進動作によってウ
エーノ・１７をローダ側のウエーノ・収納治具３１に収
納する際、ウエーノ・が不所望部分に接触して破損する
ことな防ぐようになっている。Further, at the end of the front table 18 of the loader section 15, the wafer 17 placed on one end of the first transport mechanism 19 and the second transport mechanism 29 is inserted into a wafer storage jig 31 on the loader section 15. A push rod 32 for a loader is arranged, -
The wafer 117 is sent into the storage groove of the wafer storage jig 31 by advancing the wafer 117 twice. A small hole 33 is provided at the end of the table 18 of the loader section 15, and the Ueno S17 is sucked by vacuum suction. When the Ueno 17 is stored in the Ueno storage jig 31 on the loader side by the forward movement of the loader push rod 32, the Ueno 17 is prevented from falling into an undesired part. It is designed to prevent damage from contact.
他方、前記第１搬送機構１９の他端と、アンローダ部１
６との間にはエアーコンベアからなる第３搬送機構３４
が設けられ、第１搬送機構１９によって移送されて来た
ウエーノ・１７をアンローダ部１６側のウエーノ′−収
納治具３１に収納するよう罠なっている。また、この第
３搬送機構３４を設けたアンローダ部側のテーブル１８
の先端に、ウェーハ収納治具の内部にまで延び、確実に
ウェーハ１７のローディングを行なうようになっている
口さらに、この第３搬送機構３４はその構造は第１搬送
機構１９と全く同じである。したがって、第１搬送機構
１９と第３搬送機構は一体の構造としてもよいう
なお、前記ローダ部１５およびアンローダ部１６に上下
に移動自在となっている。また、ウェーハ１７の移動経
路に沿ってテーブル１８の両級にはガイド３５が配設さ
れている。On the other hand, the other end of the first transport mechanism 19 and the unloader section 1
6, there is a third conveyance mechanism 34 consisting of an air conveyor.
is provided, and serves as a trap for storing the wafer 17 transferred by the first transport mechanism 19 in the wafer storage jig 31 on the unloader section 16 side. Also, the table 18 on the unloader section side provided with this third transport mechanism 34
The third transport mechanism 34 has a port extending into the inside of the wafer storage jig to ensure loading of the wafer 17. Furthermore, the structure of the third transport mechanism 34 is exactly the same as that of the first transport mechanism 19. . Therefore, the first conveyance mechanism 19 and the third conveyance mechanism may have an integral structure, but are vertically movable to the loader section 15 and unloader section 16. Further, guides 35 are provided on both sides of the table 18 along the moving path of the wafer 17.
つぎに、このようなウェーハ検査装置の使用状態につい
て説明する。まず、ローダ部１５上にウェーハ１７を収
納したウェーハ収納治具３１を載置するとともに、アン
ローダ部１６上には空のウェーハ収納治具３１を取り付
ける。この際、たとえば、ローダ部１５およびアンロー
ダ部１６はともに最も低い位置にセットし、順次上方に
移動するようにしてお（。つぎに、アンローダ用押出棒
３０の一回の前進および第１搬送機構１９の作動によっ
て、ウェーハ１７を試料台２２上に移送させる。そして
、ＸＹテーブル２３を移動させて中央の検査位置３６ま
で試料台２２を移動させ検査（測定）を行なうつその後
、再びＸＹテーブル２３を移動させてテーブルの試料台
挿入部に試料台２２を戻し、ウェーハ１７を第１・第２
・第３搬送機構上に臨ませる。ついで良品ウェーハと判
断されたものは第２搬送機構２９およびローダ用押出棒
３２の作動によって、ローダ部１５のウェーハ収納治具
３１の取り出される前の元の収納溝内に挿し込まれる。Next, the usage condition of such a wafer inspection apparatus will be explained. First, a wafer storage jig 31 containing a wafer 17 is placed on the loader section 15, and an empty wafer storage jig 31 is attached on the unloader section 16. At this time, for example, the loader section 15 and the unloader section 16 are both set at the lowest position and moved upward in sequence. 19, the wafer 17 is transferred onto the sample stage 22. Then, the XY table 23 is moved and the sample stage 22 is moved to the central inspection position 36 for inspection (measurement). The sample table 22 is returned to the sample table insertion part of the table, and the wafer 17 is placed in the first and second positions.
・Facing the third transport mechanism. Next, the wafer determined to be a good quality wafer is inserted into the original storage groove of the wafer storage jig 31 of the loader section 15 before being taken out by the operation of the second transport mechanism 29 and the loader push rod 32.
また、不良ウェーハ３７と判断されたものに、第１搬送
機構１９および第３搬送機構３４によってアンローダ部
１６のウェーハ収納治具３１内に収納される。Further, the wafers 37 determined to be defective are stored in the wafer storage jig 31 of the unloader section 16 by the first transport mechanism 19 and the third transport mechanism 34.
なお、一つのウェーハ収納治具内に抜取検査によって一
枚でも不良ウェーハが存在した場合にに。In addition, if even one defective wafer is found in one wafer storage jig during sampling inspection.
全ウェーハを再処理することを前提としているときに、
検査部で検査されたウェーハは全てローダ側のウェーハ
収納治具内に納めるようにすればよ（１゜
このような実施例によれば、抜取検査時に良品ウェーハ
または不良ウェーハは自動的に元のウェーハ収納治具内
忙挿し込まれるので、検査後に各ウェーハ収納治具間に
おけるウェーハの移し換え作業が不要となり、作業性が
向上する。When assuming that all wafers will be reprocessed,
All wafers inspected in the inspection department should be stored in the wafer storage jig on the loader side (1°) According to such an embodiment, good wafers or defective wafers are automatically returned to the original wafers during the sampling inspection. Since the wafer is inserted into the wafer storage jig, there is no need to transfer the wafer between the wafer storage jigs after inspection, improving work efficiency.
また、ウェーハの移し換え作業は不要となるとともに、
ウェーハは従来のようにピンセットで挾持されない。こ
のため、ウェーハの破損や破損によって生じた微粉末の
他のウェーハへの耐着などは生じなくなり、高品質、高
歩留の半導体装置の製造につながる。In addition, wafer transfer work is no longer necessary, and
The wafer is not held with tweezers as in the conventional method. Therefore, damage to the wafer or adhesion of fine powder caused by the damage to other wafers does not occur, leading to the manufacture of high-quality, high-yield semiconductor devices.
また、この実施例によれば、アンローダ用押出棒および
ローダ用押出俸機構等のウェーハブツシャの採用によっ
て、ウェーハ収納治具内のどこからもウェーハを抜き取
りかつ入れることができるので、抜き取り検査を自動で
行なうことができるようになった。Furthermore, according to this embodiment, by employing a wafer hub pusher such as a push rod for an unloader and a push-out mechanism for a loader, wafers can be taken out and put in from anywhere within the wafer storage jig, so sampling inspection can be automatically performed. Now you can do it.
なお１本発明は前記実施例に限定されるものではな（、
ウェーハ収納治具の上下動機構、ウェーハの搬送機構に
他の一般の機構でもよい。Note that the present invention is not limited to the above embodiments (
Other general mechanisms may be used for the vertical movement mechanism of the wafer storage jig and the wafer transport mechanism.
以上のように１本発明のウェーハ検査装置ｌＫよれば、
ウェーハの抜取検査時にローディング、アンローディン
グが自動的に行なうことができるので、作業性が向上す
る。As described above, according to the wafer inspection apparatus IK of the present invention,
Since loading and unloading can be performed automatically during wafer sampling inspection, work efficiency is improved.
第１図は従来のウェーハ検査装置の概要を示す平面図、
第２図にウェーハを収容する治具の斜視図、第３図は本
発明のウエーノ・検査装置の概要な示す平面図、第４図
に上記第３図に示したウェーハ検査装置の第１・第３搬
送機構のエアコンベアを示すテーブルの一部断面図、第
５図は第２搬送機構のエアコンベアを示すテーブルの一
部断面図である。
１・・・ウェーハ、２・・・ｏ−ダｇ、ａ・・・第１ア
ンローダ部、４．・・・第２アンローダ部、５・・・供
給用コンベアＶ７”、〜ｚ謔、Ｍ、ｒ；、＜、７ 、・
・・検査部（検査ポジション）、９・・・第２搬出用コ
ンベア、１０・・・第３搬出用コンベア、１１・・・ウ
ェーハ収納治具、１２・・・ウェーハ収納溝、１３・・
・良品ウェーハ、１４・・・不良品ウェーハ、１５・・
・ローダ部、１６・・・アンローダ部、１７・・・ウェ
ーハ、１８・・・テーブル、１９・・・第１搬送機構、
２０・・・小孔、２１・・・エアー供給孔、２２・・・
試料台、２３・・・ＸＹテーブル、２４・・・吸着孔、
２５・・・ストッパ、２６・・・吸着孔、２７・・・小
孔、２８・・・エアー供給孔、２９・・・第２搬送機構
、３０・・・アンローダ用押出棒、３１・・・ウェーハ
収納治具１．３２・・・ローダ用押出棒５３３・・・小
孔、３４第３搬送機構、３５・・・ガイド、３６・・・
検査位置、３７・・・不良ウェーハ。
第 １ 図
第 ２ 図FIG. 1 is a plan view showing an outline of a conventional wafer inspection device;
FIG. 2 is a perspective view of a jig for accommodating wafers, FIG. 3 is a plan view schematically showing the wafer inspection apparatus of the present invention, and FIG. FIG. 5 is a partial cross-sectional view of the table showing the air conveyor of the third transport mechanism, and FIG. 5 is a partial cross-sectional view of the table showing the air conveyor of the second transport mechanism. DESCRIPTION OF SYMBOLS 1... Wafer, 2... O-da g, a... First unloader part, 4. ...Second unloader section, 5...Feeding conveyor V7'',~z謔,M,r;,<,7,・
...Inspection section (inspection position), 9...Second carry-out conveyor, 10...Third carry-out conveyor, 11...Wafer storage jig, 12...Wafer storage groove, 13...
・Good wafer, 14... Defective wafer, 15...
- Loader section, 16... Unloader section, 17... Wafer, 18... Table, 19... First transport mechanism,
20...Small hole, 21...Air supply hole, 22...
Sample stage, 23... XY table, 24... Suction hole,
25... Stopper, 26... Adsorption hole, 27... Small hole, 28... Air supply hole, 29... Second transport mechanism, 30... Push rod for unloader, 31... Wafer storage jig 1.32... Loader push rod 533... Small hole, 34 Third transport mechanism, 35... Guide, 36...
Inspection position, 37...defective wafer. Figure 1 Figure 2
Claims (1)
を取り出して検査ポジションに移送するローダ機構と、
検査ポジションからウェーハなアンローダ側の治具に移
送収納するアンローダ機構を有するウェーハ検査装置に
おいて、少な（とも前記ローダ機構は、ウェーハブツシ
ャを用いて治具の如何なる場所からも一枚ずつウェーハ
を取り出すことのできる構造としたことを特徴とするウ
ェーハ検査装置っ1. A loader mechanism that takes out the wafer from the jig on the loader side that houses the wafer and transfers it to the inspection position;
In a wafer inspection apparatus having an unloader mechanism that transfers and stores wafers from an inspection position to a jig on the unloader side, the loader mechanism uses a wafer hub pusher to take out wafers one by one from any location on the jig. Wafer inspection equipment is characterized by a structure that allows
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP856784A JPS59139642A (en) | 1984-01-23 | 1984-01-23 | Inspecting device for wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP856784A JPS59139642A (en) | 1984-01-23 | 1984-01-23 | Inspecting device for wafer |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7318176A Division JPS52156552A (en) | 1976-06-23 | 1976-06-23 | Wafer inspection apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59139642A true JPS59139642A (en) | 1984-08-10 |
Family
ID=11696637
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP856784A Pending JPS59139642A (en) | 1984-01-23 | 1984-01-23 | Inspecting device for wafer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59139642A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05175292A (en) * | 1992-05-22 | 1993-07-13 | Tokyo Seimitsu Co Ltd | Method for sampling wafer |
| JPH088313A (en) * | 1995-07-17 | 1996-01-12 | Tokyo Seimitsu Co Ltd | Wafer drawing apparatus |
| CN101908496A (en) * | 2009-06-05 | 2010-12-08 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Substrate transmitting device and semiconductor processing equipment |
-
1984
- 1984-01-23 JP JP856784A patent/JPS59139642A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05175292A (en) * | 1992-05-22 | 1993-07-13 | Tokyo Seimitsu Co Ltd | Method for sampling wafer |
| JPH088313A (en) * | 1995-07-17 | 1996-01-12 | Tokyo Seimitsu Co Ltd | Wafer drawing apparatus |
| JP2500006B2 (en) * | 1995-07-17 | 1996-05-29 | 株式会社東京精密 | Wafer extractor |
| CN101908496A (en) * | 2009-06-05 | 2010-12-08 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Substrate transmitting device and semiconductor processing equipment |
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