JPH09331198A - Electronic component mounting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To replace or replenish electronic components without letting an operator move over to the rear of an electronic component going around the end of a board production line by a method wherein a drive means is formed of a plane linear motor, and a component feeder is arranged on either a left or a right side of a pedestal. SOLUTION: A drive means is formed of a plane linear motor 10, and a conveyer 92 for transferring a circuit board 81 is arranged in a horizontal posture on the upside of a cabinet 12 as a pedestal. A platen 29 which serves as a stator of the plane linear motor 10 is arranged above the conveyer 92 in parallel with it. Component feeders 3 to 5 are arranged at least on either a right or a left side of the cabinet. By this setup, electronic components 78 are fed to the component feeders 3 to 5 provided on either the front or rear side and either the left or right of a device main body, so that an operator is not required to go over to the opposite side of a board production line.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus for mounting electronic components on a circuit board.

[0002]

2. Description of the Related Art Conventionally, as an electronic component mounting apparatus for mounting electronic components on a circuit board, a component mounting head is moved in the X and Y axis directions using a motor as a drive source, and is provided on the front surface or the rear surface of the apparatus main body. An electronic component mounting apparatus is known in which an electronic component is adsorbed by a nozzle provided in a component mounting head in a component supply unit and the adsorbed electronic component is mounted at a predetermined position on a circuit board (Japanese Patent Laid-Open No. HEI-HEI). 6-2169
No. 5).

In the electronic component mounting apparatus 80 according to the embodiment of the above-mentioned publication shown in FIG. 8, guide rails 85 and 87 are provided above a conveyor 71 which conveys a circuit board 81. The guide rails 85 and 87 are the conveyor 7
A frame 88 parallel to 1 is supported so as to be movable in the front-rear direction in FIG. Further, the component mounting head 72 is attached to the frame 88 by the guide rail 86.
It is supported so that it can run along 8. Therefore, the component mounting head 72 is configured to be movable in the X and Y axis directions by the guide rails 85, 86, 87 and the frame 88. Screws 82, 83 and motors 84, 89 for rotating them are used as drive sources for moving the frame 88 and the component mounting head 72, respectively.

On the other hand, as shown in FIG. 10, the electronic component mounting apparatus 80 is generally used as a part of a series of board manufacturing lines 90 rather than as a single body. The substrate manufacturing line 90 includes the following steps. The stacked circuit boards 81 are placed on the conveyor section 96 of the printing machine 93 by the loader 91.
As a result, paste-like cream solder is applied to a predetermined position on the circuit board 81.

Subsequently, after the required electronic components are mounted on the circuit board 81 by the electronic component mounting apparatus 80, when the circuit board 81 is heated in the reflow device 94, the circuit board 8 is heated.
The cream solder applied to 1 melts and the leads of the electronic component and the conductive parts of the circuit board 81 are soldered. Finally, the circuit board 81 is recovered by the unloader 95 from the conveyor section 97 of the reflow device 94. As described above, the substrate manufacturing line 90 has a form in which a plurality of types of devices are connected, and the total length thereof is 10 m or more.

[0006]

However, as shown in the plan view of FIG. 9, the screws 82, 83 and the guide rail 8 are attached to the linear movement mechanism of the component mounting head 72 in the X and Y axis directions.
The guide rail 8 can be used by combining 5, 86 and 87.
5, 87 itself becomes an obstacle and X of the component mounting head 72
It narrows the movable area in the axial direction. For this reason, the installation places of the component supply units 75 and 76 are limited to the front surface 73 or the rear surface 74 of the electronic component mounting apparatus 80 main body.
As described above, when the component supply units 75 and 76 are arranged on the front surface or the rear surface of the electronic component mounting apparatus body 80, as shown in FIG.
A board manufacturing line 90 in which a plurality of types of devices shown in FIG.
At the time of replacement of a component at the time of setup change or component replenishment at the time of component exhaustion, an operator loads the loader 91 or the unloader 95
Had to detour around and move to the parts supply section on the other side. Therefore, it takes time to replenish the components, and the electronic component mounting apparatus 80 is stopped during that time. As a result, the manufacturing cost of the circuit board 81 on which the electronic components are mounted is increased.

The present invention has been made to solve the above-mentioned problems, and an operator replaces or replenishes electronic components without bypassing the end of the board manufacturing line and going to the back side of the electronic component mounting apparatus. It is an object of the present invention to provide an electronic component mounting apparatus that can perform the above.

[0008]

In order to achieve this object, an electronic component mounting apparatus of the present invention is arranged on at least one of a front surface and a rear surface of a base on which a circuit board is mounted and houses electronic components. The electronic component is mounted on the circuit board by a component mounting head driven by a drive unit from a component supply unit. Particularly, the drive unit is configured by a plane linear motor, and the left side or the right side of the base. The component supply unit is disposed on at least one side of the.
Therefore, it suffices to replenish electronic components to at least one side of the front surface or the back surface of the apparatus main body and the component supply section provided on at least one side of the left side or the right side of the main body of the substrate manufacturing line including the electronic component mounting apparatus. The operator does not have to go around to the other side.

[0009]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of an electronic component mounting apparatus 1 of the present invention will be described below with reference to the drawings.

FIG. 1 shows an electronic component mounting apparatus 1 according to this embodiment.
Figure 3 is a perspective view of Figure 1, which is constructed as follows. A conveyor section 92 for carrying the circuit board 81 is horizontally arranged on the upper surface of the cabinet 12 as a base.
A platen 29, which is a stator of the plane linear motor 10, is arranged above the conveyor section 92 in parallel with the conveyor section 92.
Movable element 39 is attached so as to be movable in the X and Y axis directions. The mover 39 is provided with a component mounting head 2 for rotating and moving up and down after adsorbing the electronic component 78. A suction nozzle 77 having a hollow cylindrical shape is provided at the lower end of the component mounting head 2.
The upper end of the suction nozzle 77 is connected to a vacuum generator (not shown) by a tube (not shown). A CCD camera 79 is provided on the front side of the conveyor section 92 and is fixed so as to capture an image of an upper object. The front surface of the cabinet 12 includes a component supply unit 3 for storing electronic components 78.
Is arranged. Further, the component supply units 5 and 4 are arranged on the left and right sides of the cabinet 12, respectively. Each of the component supply units 3, 4, and 5 detachably supports the reel 14 around which the tape having the electronic components 78 attached at equal intervals is wound.

Next, a general operation principle of the electronic component mounting apparatus 1 will be described.

First, the circuit board 81 is intermittently conveyed from one end of the conveyor section 92. The feeding of the conveyor unit 92 is temporarily stopped when the circuit board 81 reaches the component mounting work position. Next, after the mounting head 2 is moved to the component supply unit 3, 4 or 5, the suction nozzle 77
To lower. At the same time, a vacuum generator (not shown) connected to the suction nozzle 77 by a tube (not shown) is operated to reduce the pressure in the suction nozzle 77. If the lower end of the suction nozzle 77 is brought into contact with the electronic component 78 in the component supply unit 3, 4 or 5 as it is, the electronic component 78 is sucked to the end of the suction nozzle 77 due to the pressure difference between the inside and the outside of the suction nozzle 77. In this state, while raising the suction nozzle 77, the mounting head 2 is moved to a position above the CCD camera 79 so that the suction nozzle 77 comes and then stopped. The CCD camera 79 captures an image of the sucked electronic component 78, and an image processing device (not shown) measures the positional deviation and angular deviation of the electronic component 78 with respect to the suction nozzle 77. Then, the mounting head 2 is moved onto the circuit board 81, and the circuit board 8 is moved based on the displacement amount obtained by the image processing apparatus.
1. The electronic component 78 which is being sucked is properly placed at a predetermined position on the position 1 and the vacuum generator is stopped.
To rise.

At this time, in order to accurately position the sucked electronic component 78, the CCD camera 79 and the image processing device (not shown) measure the positional deviation and angular deviation of the sucked electronic component 78 with respect to the suction nozzle 77. hand,
When the electronic component 78 was mounted on the circuit board 81, the position and angle of the electronic component 78 were corrected. However, as shown in the above-mentioned JP-A-6-21695, the electronic component 78 was sucked by the correction arm provided on the mounting head 2. The electronic component 78 may be mechanically corrected with respect to the suction nozzle 77 and then mounted at a predetermined position on the circuit board 81.

Next, the structure of the planar linear motor will be described with reference to FIGS. The plane linear motor 10 includes a mover 39 and a platen 29. Mover 3
Four forcers 40, 41, 42, 43 are arranged on the bottom surface of 9 so that the forcers 40, 42 generate thrust in the X-axis direction and the forcers 41, 43 generate thrust in the Y-direction. ing. These forcers 40, 41, 42,
The thrust force of 43 causes the mover 39 to move XY on the platen 29.
Positioned freely in any direction. A blowout port 44 for compressed air is provided on the bottom surface of the mover 39, and the tube 11
The compressed air supplied via the is ejected. This allows the mover 39 to move smoothly on the platen 29.

On the other hand, as shown in FIG. 5, the platen 29 has teeth 31 formed on the surface of a steel plate 30 made of a magnetic material at equal intervals in the XY axis directions, and the grooves 32 of the teeth 31 are made of a non-magnetic material. For example, the epoxy resin 33 is filled. The driving principle of the planar linear motor 10 will be described with reference to FIG. FIG. 6 is a cross-sectional view of the forcer 40 shown in FIG. 4 and the platen 29 shown in FIG. The planar linear motor 10 is a PM type linear pulse motor, which is a so-called “soya motor”, and is disclosed in Japanese Patent Publication No. 53-73. The forcer 40 has two electromagnets 48,
The electromagnets 48 and 49 further include permanent magnets 50 and 51, and magnetic poles 61, 62, 63, 64, 65 and 6 respectively arranged at the ends of the permanent magnets 50 and 51.
6, 67, 68 and excitation windings 52, 53. Two
The path of the bias magnetic flux generated by the two permanent magnets 50 and 51 to and from the platen 29 side is defined by the excitation windings 52 and 53, and the magnetic poles 61, 62, 63, 64,
It is selected from among 65, 66, 67 and 68. The magnetic poles 61 and 62, 63 and 64, 65 and 66, and 67 and 6
When the pitches of the teeth 31 of the platen 29 are τ, 8 are offset from each other by τ / 2. Also, the magnetic poles 61 and 6
3, 65 and 67 are each shifted by an integer multiple of τ,
The magnetic poles 61 and 65 are arranged so as to be offset by τ / 4.

Here, for example, when the excitation winding 52 is energized in the direction shown in FIG. 6, the magnetic force is doubled in the magnetic poles 61 and 63 and the magnetic force is canceled in the magnetic poles 62 and 64. Stop at position a). At this time, the magnetic force of the electromagnet 49 is well balanced.

Next, as shown in FIG. 7B, the excitation winding 53
When a current flows in the direction shown in the figure, the magnetic force is canceled at the magnetic poles 66 and 68 of the electromagnet 49 and the magnetic force is doubled at the magnetic poles 65 and 67, so that the forcer 40 is reduced by half the tooth width, that is, τ / 4. Move to the left.

Next, as shown in FIGS. 7 (c) and 7 (d), a current flows in the electromagnets 48 and 49 in the opposite direction to that in FIGS. Move left by four.

In this way, the forcer 40 is moved by passing the rectangular wave current through the electromagnets 48 and 49 as described above. At this time, a smooth thrust can be obtained by making the current sinusoidal.

According to the principle described above, the mover 39 of the planar linear motor 10 moves on the platen 29, and the mover 39 can move to all positions on the platen 29 without being obstructed by obstacles. Becomes In other words, the installation area of the platen 29 becomes the moving area of the mover 39 in full. At this time, as the size of the platen 29, the one surrounded by the guide rails 85 and 87 used in the embodiment of the prior art shown in FIG. 9 is accommodated in the electronic component mounting apparatus 1 having the same outer dimension. be able to. Therefore, as is apparent from the plan view of FIG. 2, when the component mounting head 2 is provided on the mover 39 of the planar linear motor 10, the component mounting head 2 has no object that blocks its movement in the X-axis direction, and the platen. Since the upper part 29 can be moved from the left end to the right end in the figure, the installation places of the component supply parts 3, 4, 5 are not limited to the front face 6 or the rear face 7 of the electronic component mounting apparatus 1, but can be the left side 8 or the right side 9. It will be good. Then, the mounting head 2 can suck the electronic component 78 (not shown) in the same manner from the component supply units 3, 4, and 5 installed at any position and mount it on the circuit board 81.

Next, the electronic component mounting apparatus 1 of this embodiment
A work for exchanging or replenishing electronic parts in the board manufacturing line 13 using is explained with reference to FIG.

When the model of the circuit board 81 to be manufactured is changed and the electronic parts of the parts supply section 3, 4 or 5 must be replaced for setup change, or when the parts are exhausted and new electronic parts are replenished. If necessary, the reel 14 of the component supply unit 3, 4, 5 is replaced from the front side of the electronic component mounting apparatus 1. Therefore, in the electronic component mounting apparatus 1, the work of component replacement and component supply is performed on the board manufacturing line 1.
Since all can be performed from one side of 3, the operator does not need to bypass the loader 91 or the unloader 95 and move to the opposite side of the electronic component mounting apparatus 1, and the work is completed in a short time. Therefore, the stop time of the electronic component mounting apparatus 1 due to the work is shortened, and as a result, the manufacturing cost of the circuit board 81 can be kept low.

In the electronic component mounting apparatus 1 of this embodiment, the component supply units 3, 4 and 5 are arranged on the front and left and right side portions of the cabinet 12, respectively. May be arranged on the back side. Furthermore, you may arrange | position the component supply part 3 in the front surface and the back surface.

[0024]

As is apparent from the above description, by using the plane linear motor as the drive source of the component mounting head of the electronic component mounting apparatus of the present invention, the movable area of the component mounting head is widened, and the component supply unit is provided. Since the components are provided not only on the front surface or the rear surface of the main body but also on the left side or the right side, it is possible to perform the work of component replacement and the component supply from the front surface of the main body of the apparatus, and it is possible to shorten the work time.

[Brief description of drawings]

FIG. 1 is a perspective view of an electronic component mounting apparatus according to the present embodiment.

FIG. 2 is a plan view of the electronic component mounting apparatus according to the present embodiment.

FIG. 3 is a plan view of a board manufacturing line using the electronic component mounting apparatus of the present embodiment.

FIG. 4 is a perspective view of a mover of the planar linear motor according to the present embodiment.

FIG. 5 is a perspective view of a platen of the planar linear motor of the present embodiment.

FIG. 6 is a sectional view of a mover and a platen of the planar linear motor of the present embodiment.

FIG. 7 is an explanatory diagram of an operation principle of the planar linear motor of the present embodiment.

FIG. 8 is a perspective view of a conventional electronic component mounting apparatus.

FIG. 9 is a plan view of a conventional electronic component mounting apparatus.

FIG. 10 is a plan view of a board manufacturing line using a conventional electronic component mounting apparatus.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 2 Component mounting head 3 Component supply unit 29 Platen 39 Movable element 78 Electronic component 81 Circuit board 92 Conveyor unit

Claims (1)

[Claims] 1. A circuit for mounting the electronic component on the circuit by a component mounting head driven by driving means from a component supply unit arranged on at least one of a front surface and a rear surface of a base on which a circuit board is mounted and storing the electronic component. An electronic component mounting apparatus to be mounted on a board, wherein the driving means is composed of a planar linear motor, and a component supply unit is arranged on at least one of the left side and the right side of the base.