JPH09321437A - Manufacture of multialyr printed wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method wherein a conductor circuit inside an electronic component containing hole is not contaminated in a manufacturing method of a multilayer printed wiring board with an electronic component containing hole wherein a conductor circuit is exposed and a throughhole whereto plating is applied. SOLUTION: A plurality of substrates 1 are eliminated, pressurize and bonded for forming a lamination body 10 while forming an electronic component containing hole 2 wherein a conductor circuit 5 is exposed. A lid body 7 covering an opening edge face of the electronic component containing hole 2 and a bonding member 4 with an opening part enclosing the lid body 7 are arranged in a surface, further laminated arranging a conductive material 7 and then pressurized and bonded for forming a multilayer board. A throughhole is formed, plating is applied thereto, an outer layer circuit is formed and a lid body is removed from a multilayer board. Thereafter, plating is applied to a conductor circuit inside an electronic component containing hole.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pin grid array (PG) for mounting electronic parts such as semiconductor chips.
A), a method of manufacturing a multilayer printed wiring board used for a device for mounting electronic components such as a ball grid array (BGA) and a chip carrier.

[0002]

2. Description of the Related Art In recent years, electronic parts such as semiconductor chips and chip parts have been reduced in size and weight. Along with this, the density of multilayer printed wiring boards for mounting electronic components has been increasing. Conventionally, a ceramic material was used as the substrate for mounting the semiconductor chip, but even if it is a resin material, high heat dissipation can be achieved by using a copper core, and it is also excellent in terms of signal speed. Therefore, a multilayer printed wiring board using an organic substrate which is a resin material has come to be used. The substrate on which the semiconductor chip is mounted is provided with a flat mounting portion for mounting the semiconductor chip and a conductor circuit having a gold film on the surface for joining or bonding (bonding) with the mounted semiconductor chip. Is common.

As a conventional method of manufacturing a multilayer printed wiring board for mounting a semiconductor chip, for example, Japanese Patent Publication No.
There is one shown in No. 41039. This method is illustrated in FIG.
And FIG. 6 will be described. The board 1 used at the lowermost part having the electronic component mounting portion 3 and the conductor circuit 5, the board 1 which is arranged on the board 1 and serves as the outermost layer on the upper side, and an interposing between these boards as necessary. At least one that is mounted and has an opening 13 corresponding to the mounting portion 3 and a conductor circuit 5
The two intermediate substrates 1 are pressure-bonded to each other via the adhesive member 4 (FIG. 5 (a) → FIG. 5 (b)), and the electronic component mounting portion 3 is present using the substrate 1 serving as the uppermost outer layer. The multilayer board 11 in a state where the electronic component storage hole 2 is protected is obtained. Next, a through hole 8 is formed so as to simultaneously penetrate the pressure-bonded substrates (FIG. 6C). Then, after plating the through hole 8, an outer layer circuit 9 is formed on the surface of the substrate 1, which is the outermost layer (FIG. 6D). Next, the opening 13 for communicating the electronic component storage hole 2 to the outside is formed in the substrate 1 located in the uppermost outermost layer (FIG. 6E).

The above is the outline of the manufacturing method disclosed in Japanese Patent Publication No. 5-41039. However, in this manufacturing method, since the electronic component storage hole 2 is protected by using the substrate 1 which is the outermost layer, in order to form the opening 13 for communicating the electronic component storage hole 2 to the outside, the router is required. It is necessary to cut the outermost substrate 1 by using the above method. Along with this cutting process, resin scraps and the like generated adhere to the inside of the electronic component housing hole 2. Since the conductor circuit 5 exposed in the electronic component housing hole 2 is a portion for wire bonding, it is common that the conductor circuit 5 is nickel-plated or gold-plated. Adhesion of resin scraps or the like seriously affects the quality of the product. It should be noted that it is difficult to completely remove the resin debris even if the resin debris or the like is removed using high-pressure water washing or the like. Further, when the outermost substrate 1 is cut by a router or the like, in order to prevent the conductor circuit 5 located therebelow from being cut, a groove 14 is formed at the position where the outermost substrate 1 is cut by a counterbore process. However, it is necessary to increase the thickness of the outermost substrate 1 in order to form the groove 14, and therefore the total thickness of the multilayer board is increased. There was also the problem of becoming.

[0005]

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and an object of the present invention is to provide an electronic component housing hole in which a conductor circuit is exposed, and this electronic component. A method for manufacturing a multilayer printed wiring board having a plated through hole in a place other than a storage part, wherein no resin scraps are generated when the electronic part storage hole is opened, and a conductor in the electronic part storage hole It is an object of the present invention to provide a method for manufacturing a multilayer printed wiring board in which a circuit is not contaminated.

[0006]

A method for manufacturing a multilayer printed wiring board according to a first aspect of the present invention is a method for manufacturing a multilayer printed wiring board comprising the following steps. (1) A laminated body having a plurality of substrates forming a conductor circuit, which are stacked and pressure-bonded while forming an electronic component storage hole in which the conductor circuit is exposed at a predetermined position, and having an electronic component storage hole (2) A lid that covers the opening end face of the electronic component storage hole and an adhesive member that surrounds the outer periphery of the lid and that has an opening that is larger than the lid are arranged on the surface of the laminate. , Furthermore, a conductive material is arranged and laminated so as to cover the lid and the adhesive member, and then,
(3) A step of forming a through hole at a position other than the position where the lid is present and plating the through hole; (4) Multilayer A step of forming an outer layer circuit on the surface of the board; (5) a step of removing the lid body from the multilayer board; (6) a step of plating the conductor circuit in the electronic component housing hole.

According to a second aspect of the present invention, in the method of manufacturing a multilayer printed wiring board according to the second aspect, in the step (2), before arranging the lid body on the surface of the laminated body, the periphery of the opening end face of the electronic component storage hole is covered. It is characterized in that a peeling layer is formed on the surface of the laminated body in contact with the lid body by using a masking material having peelability.

[0008]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to FIG.
This will be described with reference to FIGS.

As shown in FIGS. 1 (a) and 1 (b),
A plurality of substrates 1 on which the conductor circuits 5 are formed are stacked while forming a concave electronic component housing hole 2 having a flat bottom surface and exposing the conductor circuits 5 at a predetermined position. As the substrate 1 for forming the conductor circuit 5, an epoxy resin glass cloth base material copper clad laminate, a polyimide resin glass cloth base material copper clad laminate, or the like is used. As the bonding member 4 for bonding the substrates 1, an epoxy resin film, a polyimide resin film, an epoxy resin glass cloth base prepreg, a polyimide resin glass cloth base prepreg, or the like is used. A plurality of substrates 1 on which conductor circuits 5 are formed are stacked and pressure-bonded to form a laminated body 10 having an electronic component housing hole 2.
As shown in (b), the substrate 1 not provided with the conductor circuit 5
May be laminated on the top. Further, in this embodiment, the conductive material 6 made of copper foil or the like is provided on the outer surface side of the lowermost substrate 1.

Next, a lid 7 for covering the opening end face of the electronic component housing hole 2 and an adhesive member 4 surrounding the outer periphery of the lid 7 and having an opening larger than the lid 7 are provided on the surface of the laminate 10. Then, a conductive material 6 made of a metal foil such as a copper foil is arranged so as to cover the lid 7 and the adhesive member 4 as shown in FIG. 1C, and laminated, and then pressure-bonded. As shown in FIG. 2D, the multi-layer plate 11 covered with the conductive material 6 is formed.
The lid 7 may be any substrate as long as it has a size capable of closing the opening end face of the electronic component housing hole 2, and the material is not limited, and various laminated plates can be used, for example. Also,
An epoxy resin film, a polyimide resin film, an epoxy resin glass cloth base material prepreg, a polyimide resin glass cloth base material prepreg, or the like is used as the adhesive member 4 that surrounds the outer periphery of the cover body 7. It is desirable that the thickness be almost the same as the thickness. In this embodiment, the opening end face of the electronic component housing hole 2 is present only on one surface of the laminated body 10. However, a substrate attached to a multilayer printed wiring board such as a copper core is mounted as an electronic component mounting portion. When used, it is possible to form an opening also on the bottom surface side of the electronic component housing hole 2 and perform similar processing on the opening end surface on the bottom surface side to manufacture a multilayer printed wiring board. .

Next, through holes 8 are formed in the multilayer plate 11 at positions other than the position where the lid 6 is present (see FIG. 2).
(E)) The through holes 8 are plated (not shown).

Next, resist coating, exposure, development and etching are performed on the surface of the multilayer board 11 to form the outer layer circuit 9 on the surface of the multilayer board 11 (FIG. 2 (f)). In the step of forming the outer layer circuit 9, the conductive material 6 on the lid 7 is formed.
Is preferably removed by etching because the lid 7 can be easily removed in the next step.

Next, the lid 7 is removed from the multi-layer plate 11 and the electronic component storage hole 2 is communicated with the outside (FIG. 3). Next, the conductor circuit 5 in the electronic component housing hole 2 is plated to form a nickel-plated or gold-plated layer.

In this embodiment, since the electronic component storage hole 2 is protected by using the detachable lid 7, the router is used to form the opening for communicating the electronic component storage hole 2 to the outside. Since it is not necessary to cut the outermost layer substrate by means such as resin, there is no generation of resin scraps, and therefore the electronic component storage hole 2
The conductor circuit 5 exposed inside is not contaminated. Also, since it is not necessary to cut the outermost layer substrate with a router, it is not necessary to form a groove in the outermost layer substrate by counterboring, and it is necessary to increase the thickness of the outermost layer substrate particularly. Nor. Therefore, it is possible to reduce the thickness of the entire multilayer board.

Further, in the above-described embodiment, before placing the lid 7 covering the opening end face of the electronic component storage hole 2 on the surface of the laminated body 10, as shown in FIG. 4, the opening of the electronic component storage hole 2 is performed. When the peeling layer 12 is formed by printing and semi-curing a masking material having releasability on the surface of the laminated body 10 around the end face and in contact with the lid body 7, the lid body 4 and the laminated body 10 are formed.
Since the gap between the layers is surely closed by the peeling layer 12, when the conductive material 6 on the lid 8 is removed by etching in the step of forming the outer layer circuit, the etching liquid enters the electronic component storage hole 2. It is desirable because it can prevent intrusion. The material for forming the peeling layer 12 is not particularly limited, and is a material that can be finally separated / removed from the laminated body 10 to close the gap between the lid body 7 and the laminated body 10. I wish I had it.

[0016]

In the method for manufacturing a multilayer printed wiring board according to the first and second aspects of the present invention, when the through hole is plated, the removable lid is used to protect the electronic component storage hole. I have to. Therefore, according to the method for manufacturing a multilayer printed wiring board of the present invention according to claim 1 and claim 2, after the through hole is plated, an opening for communicating the electronic component accommodating hole to the outside can be formed. Since it is not necessary to cut the outermost substrate with a router or the like, resin scraps and the like are not generated and the problem that the conductor circuit in the electronic component housing hole is contaminated does not occur. Therefore, it becomes possible to manufacture a multilayer printed wiring board with stable quality.

[Brief description of drawings]

FIG. 1 is a cross-sectional view schematically illustrating a process of a method for manufacturing a multilayer printed wiring board according to the present invention.

FIG. 2 is a cross-sectional view illustrating a process following FIG. 1 as a model.

FIG. 3 is a cross-sectional view schematically illustrating a process following FIG. 2;

FIG. 4 is a cross-sectional view for explaining, as a model, part of the steps of the method for manufacturing a multilayer printed wiring board according to the second aspect of the invention.

FIG. 5 is a cross-sectional view schematically illustrating a process of a conventional method for manufacturing a multilayer printed wiring board.

FIG. 6 is a cross-sectional view schematically illustrating a step following FIG. 5 of the step of the conventional method for manufacturing a multilayer printed wiring board.

[Explanation of symbols]

 1 Substrate 2 Electronic Component Storage Hole 3 Electronic Component Mounting Portion 4 Adhesive Member 5 Conductor Circuit 6 Conductive Material 7 Lid Body 8 Through Hole 9 Outer Layer Circuit 10 Laminated Body 11 Multilayer Board 12 Release Layer 13 Opening

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Daisuke Kanaya 1048, Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Works Co., Ltd. (72) Shoji Ishikawa, 1048, Kadoma, Kadoma City, Osaka Matsushita Electric Works Co. 72) Inventor Kaneko Daiji Matsuda Electric Works Co., Ltd. 1048 Kadoma, Kadoma, Osaka Prefecture

Claims (2)

[Claims] 1. A method for manufacturing a multilayer printed wiring board comprising the following steps. (1) A laminated body having a plurality of substrates forming a conductor circuit, which are stacked and pressure-bonded while forming an electronic component storage hole in which the conductor circuit is exposed at a predetermined position, and having an electronic component storage hole (2) A lid that covers the opening end face of the electronic component storage hole and an adhesive member that surrounds the outer periphery of the lid and that has an opening that is larger than the lid are arranged on the surface of the laminate. , Furthermore, a conductive material is arranged and laminated so as to cover the lid and the adhesive member, and then,
(3) A step of forming a through hole at a position other than the position where the lid is present and plating the through hole; (4) Multilayer A step of forming an outer layer circuit on the surface of the board; (5) a step of removing the lid body from the multilayer board; (6) a step of plating the conductor circuit in the electronic component housing hole. 2. In the step (2), before arranging the lid on the surface of the laminated body, peeling is performed on the surface of the laminated body around the opening end surface of the electronic component storage hole and in contact with the lid. The method for manufacturing a multilayer printed wiring board according to claim 1, wherein the release layer is formed using a masking material having properties.