CN114531793A - Manufacturing method of eight-layer HDI board combining softness and hardness - Google Patents
Manufacturing method of eight-layer HDI board combining softness and hardness Download PDFInfo
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- CN114531793A CN114531793A CN202210179773.5A CN202210179773A CN114531793A CN 114531793 A CN114531793 A CN 114531793A CN 202210179773 A CN202210179773 A CN 202210179773A CN 114531793 A CN114531793 A CN 114531793A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
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Abstract
The invention relates to a manufacturing method of an eight-layer HDI board combined by soft and hard materials, which comprises the following steps: s1, manufacturing an inner layer double-sided soft board; s2, manufacturing a primary base material laminated plate; s3, manufacturing a four-layer plate; s4, manufacturing a secondary base material laminated plate; s5, manufacturing a six-layer plate; s6, manufacturing eight-layer plates; s7, manufacturing eight layers of HDI boards combined by soft and hard, wherein in the method, a window is opened at a position on an inner medium layer corresponding to a soft board area, and a cover film is reversely pasted at a position on an outer medium layer corresponding to the soft board area, so that the whole waste material area is opened with the window, when the cover is opened, the waste material area on the soft board and the hard board waste material area are simultaneously opened, and the cover opening efficiency is improved by more than 90%; the soft board area exposes the inner covering film, and the hard board waste area still has connection points, so that the expansion and shrinkage stability and small deformation in the product processing process are ensured.
Description
Technical Field
The invention relates to the technical field of manufacturing processes of a rigid-flexible HDI board, in particular to a manufacturing method of an eight-layer rigid-flexible HDI board.
Background
HDI is an abbreviation for High Density interconnect (High Density interconnect) and is a technique for producing printed circuit boards, a relatively High line Density circuit board using micro-blind buried via technology.
Eight layers of soft or hard HDI boards that combine possess the characteristic of FPC board and PCB board simultaneously, and there is certain flexible region, also has certain rigid region, can save product inner space, reduces the product volume, improves product property ability.
In the traditional rigid-flex board manufacturing method, in order to avoid the pollution of the covering film/flexible board area caused in the manufacturing process, the protective film is reversely pasted on the covering film/flexible board area, then the whole flexible board area is uncovered by waste materials, but in the process, the product expansion and shrinkage can be unstable, the SMT (surface mount technology) workpiece hitting of a client is affected, the quality is not up to the standard, and the actual production efficiency is extremely low due to the fact that the single piece is uncovered, and the mass production is not facilitated.
Disclosure of Invention
Based on the expression, the invention provides a manufacturing method of an eight-layer HDI board combining hardness and softness, and aims to solve the technical problem that in the prior art, the final quality of a product cannot reach the standard due to unstable expansion and shrinkage of the product caused by uncovering of waste materials.
The technical scheme for solving the technical problems is as follows:
the manufacturing method of the eight-layer HDI board combined with soft and hard is characterized by comprising the following steps:
s1, providing a substrate, and respectively manufacturing inner layer circuit layers on the surfaces of the two sides of the substrate to obtain an inner layer double-sided soft board;
s2, adhering inner covering films on two side faces of the inner-layer double-sided flexible printed circuit board, manufacturing an inner dielectric layer on the surface of each inner covering film, windowing the position, corresponding to the flexible printed circuit board area, on the inner dielectric layer, stacking inner hard board layers in the position, corresponding to the hard board area, on the surface of the inner dielectric layer, and then pressing to obtain a primary substrate laminated board;
s3, drilling holes on the primary base material laminated plate, and manufacturing secondary inner layer circuit layers on the upper end face and the lower end face to obtain a four-layer plate;
s4, manufacturing secondary inner dielectric layers on the surfaces of the two sides of the four-layer plate, wherein a window is formed in the position, corresponding to the flexible plate area, of each secondary inner dielectric layer; stacking a secondary inner hard board layer on the surface of the secondary inner medium layer at a position corresponding to the hard board area, and then laminating to obtain a secondary base material laminated board;
s5, drilling holes on the secondary base material laminated board, and manufacturing secondary outer layer circuit layers on the upper end face and the lower end face to obtain a six-layer board;
s6, manufacturing outer dielectric layers on the surfaces of the two sides of the six-layer plate, reversely pasting covering films at the positions of the outer dielectric layers corresponding to the soft plate area, stacking outer hard plate layers at the positions of the surfaces of the outer dielectric layers corresponding to the hard plate area, and then pressing to obtain an eight-layer plate; wherein the reverse side of the covering film is an insulating layer without viscosity, and a seam is punched at the junction of the hard board area and the soft board area of the outer dielectric layer;
and S7, manufacturing outer layer circuit layers on the surfaces of the two sides of the eight-layer plate, and then uncovering to obtain the eight-layer soft-hard combined HDI plate.
Compared with the prior art, the technical scheme of the application has the following beneficial technical effects:
the method has the advantages that the inner medium layer is windowed at the position corresponding to the soft board area, the outer medium layer is reversely pasted with the covering film at the position corresponding to the soft board area, the whole waste material area is windowed, when the cover is uncovered, the waste material on the soft board and the hard board waste material area are uncovered at the same time, and the uncovering efficiency is improved by more than 90%; the soft board area exposes the inner covering film, and the hard board waste area still has connection points, so that the expansion and shrinkage stability and small deformation in the product processing process are ensured.
On the basis of the technical scheme, the invention can be further improved as follows.
Furthermore, the substrate is a non-adhesive double-sided copper substrate with an insulating layer in the middle and pure copper foil layers on two sides.
Furthermore, the positions of the inner dielectric layer and the secondary inner dielectric layer corresponding to the soft board area are windowed by taking the soft and hard cross-connecting line as a boundary.
Further, in step S6, a gap between the hard plate region and the soft plate region of the outer dielectric layer is not greater than 2 mm.
Further, the uncovering in step S7 includes routing a 1.0mm by 3.0mm groove in the position of the scrap region of the outer hard board layer, and then uncovering the entire position of the outer dielectric layer corresponding to the position of the soft board region.
Further, the method also comprises the following steps: and S8, performing solder mask, gold melting, routing shape and electric measurement on the eight-layer soft and hard combined HDI board according to the process until a finished product is obtained.
Drawings
FIG. 1 is a schematic structural diagram of an inner layer double-sided soft board in the implementation process of the manufacturing method of the invention;
FIG. 2 is a schematic structural diagram of the inner layer double-sided flexible printed circuit board covered with the inner cover film in the implementation process of the manufacturing method of the invention;
FIG. 3 is a schematic structural view of a primary substrate laminated board in the implementation of the manufacturing method of the present invention;
fig. 4 is a schematic structural diagram of an eight-layer HDI board combined by soft and hard layers in the implementation process of the manufacturing method of the present invention.
Detailed Description
To facilitate an understanding of the present application, the present application will now be described more fully with reference to the accompanying drawings. Embodiments of the present application are set forth in the accompanying drawings. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.
It will be understood that spatial relationship terms, such as "under", "below", "beneath", "below", "over", "above", and the like, may be used herein to describe one element or feature's relationship to another element or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements or features described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the exemplary terms "under" and "under" can encompass both an orientation of above and below. In addition, the device may also include additional orientations (e.g., rotated 90 degrees or other orientations) and the spatial descriptors used herein interpreted accordingly.
It will be understood that when an element is referred to as being "connected" to another element, it can be directly connected to the other element or be connected to the other element through intervening elements. The "connection" in the following embodiments is understood as "electrical connection", "communication connection", or the like if the connected circuits, modules, units, or the like have electrical signals or data transmission therebetween.
As used herein, the singular forms "a", "an" and "the" may include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises/comprising," "includes" or "including," or "having," and the like, specify the presence of stated features, integers, steps, operations, components, parts, or combinations thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof.
The embodiment of the application provides a manufacturing method of an eight-layer HDI board combining soft and hard, which comprises the following steps:
s1, providing a substrate, and respectively manufacturing inner layer circuit layers on the surfaces of the two sides of the substrate to obtain an inner layer double-sided soft board;
that is, as shown in fig. 1, an upper inner layer circuit layer L4 is formed on the upper layer of the substrate, and a lower inner layer circuit layer L5 is formed on the lower layer of the substrate, wherein the substrate is a non-adhesive double-sided copper substrate having an insulating layer PI in the middle and pure copper foil layers on both sides.
S2, adhering inner covering films to two side surfaces of the inner double-sided flexible printed circuit board, manufacturing an inner dielectric layer on the surface of each inner covering film, windowing the position of the inner dielectric layer corresponding to the flexible printed circuit board area, and laminating an inner hard board layer after the inner hard board layer is stacked on the surface of the inner dielectric layer corresponding to the hard board area to obtain a primary base material laminated board;
that is, as shown in fig. 2, an inner cover film CVL1 is adhered to the surface of the upper inner layer circuit layer L4, and a lower inner cover film CVL2 is adhered to the surface of the lower inner layer circuit layer L5, so that the inner cover film can effectively protect the inner layer circuit layer from being damaged and exposed; an upper inner dielectric layer PP34 is manufactured on the surface of an upper inner covering film CVL1, a lower inner dielectric layer PP56 is manufactured on the surface of a lower inner covering film CVL2, and specifically, a No Flow inner dielectric layer is windowed by taking a soft and hard cross-connecting line as a boundary; then, the upper inner hard board layer L3, the upper inner dielectric layer PP34, the inner double-sided soft board with the inner cover film adhered thereto, the lower inner dielectric layer PP56, and the lower inner hard board layer L6 are stacked and placed, and primary base material lamination is performed to obtain a primary base material laminated board, as shown in fig. 3.
S3, drilling a hole on the primary substrate laminated board, and manufacturing a secondary inner layer circuit layer on the lower end face of the primary substrate laminated board to obtain a four-layer board, wherein the copper foil in the flexible board area can be etched away during circuit etching, and the cover film in the flexible board area is exposed.
S4, manufacturing secondary inner dielectric layers (PP23 and PP67) on the surfaces of two sides of the four-layer board according to the modes of S2 and S3, wherein a window is formed in the position, corresponding to the soft board area, of each secondary inner dielectric layer; after the secondary inner hard board layer (L2, L7) is stacked at the position of the surface of the secondary inner medium layer (PP23, PP67) corresponding to the hard board area, pressing is carried out to obtain a secondary base material laminated board;
specifically, the positions of the inner dielectric layer and the secondary inner dielectric layer corresponding to the flexible board area are windowed by taking the flexible-hard intersection line as a boundary.
S5, drilling holes in the secondary base material laminated plate, and manufacturing secondary outer layer circuit layers on the upper end face and the lower end face to obtain a six-layer plate;
s6, manufacturing outer dielectric layers (PP12, PP78) on the surfaces of two sides of the six-layer plate, reversely attaching covering films at positions of the outer dielectric layers (PP12, PP78) corresponding to the soft plate area, stacking outer hard plate layers (L1, L8) at positions of the surface of the outer dielectric layers corresponding to the hard plate area, and then pressing to obtain an eight-layer plate; wherein the reverse side of the covering film is an insulating layer without viscosity, a seam is punched at the junction of the hard board area and the soft board area of the outer medium layer, and a 2mm micro-connection point is reserved, wherein the covering film is in a strip shape, so that the cover can be conveniently uncovered in the later process.
And S7, completing the procedures of target drilling, drilling and copper plating on the eight-layer board, completing the outer layer circuit layer, and then uncovering to obtain the eight-layer soft-hard combined HDI board.
Specifically, when the circuit is etched, the surface copper of the boundary area of the soft board and the hard board is etched, a 1.0 mm-3.0 mm groove is milled in the hard board of the waste area by a milling machine after the circuit is completed, then the whole position of the outer dielectric layer (PP12, PP78) corresponding to the soft board area is uncovered, at the moment, the dielectric waste of the soft board area is uncovered to expose the inner layer soft board area, the secondary inner dielectric layers (PP23, PP67) of the hard board area are connected, compared with a single piece uncovering cover, the strip uncovering efficiency is improved by 90%, and the expansion and shrinkage of a product are stable.
And S8, performing solder mask, gold melting, routing appearance and electrical measurement on the eight-layer soft-hard combined HDI board according to the flow until a finished product is obtained.
The method has the advantages that the inner medium layer is windowed at the position corresponding to the soft board area, the outer medium layer is reversely pasted with the covering film at the position corresponding to the soft board area, the whole waste material area is windowed, when the cover is uncovered, the waste material on the soft board and the hard board waste material area are uncovered at the same time, and the uncovering efficiency is improved by more than 90%; the soft board area exposes the inner covering film, and the hard board waste area still has connection points, so that the expansion and shrinkage stability and small deformation in the product processing process are ensured.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (6)
1. The manufacturing method of the eight-layer HDI board combined with soft and hard is characterized by comprising the following steps:
s1, providing a substrate, and respectively manufacturing inner layer circuit layers on the surfaces of the two sides of the substrate to obtain an inner layer double-sided soft board;
s2, adhering inner covering films on two side faces of the inner-layer double-sided flexible printed circuit board, manufacturing an inner dielectric layer on the surface of each inner covering film, windowing the position, corresponding to the flexible printed circuit board area, on the inner dielectric layer, stacking inner hard board layers in the position, corresponding to the hard board area, on the surface of the inner dielectric layer, and then pressing to obtain a primary substrate laminated board;
s3, drilling holes on the primary base material laminated plate, and manufacturing secondary inner layer circuit layers on the upper end face and the lower end face to obtain a four-layer plate;
s4, manufacturing secondary inner dielectric layers on the surfaces of the two sides of the four-layer plate, wherein a window is formed in the position, corresponding to the flexible plate area, of each secondary inner dielectric layer; stacking a secondary inner hard board layer on the surface of the secondary inner medium layer at a position corresponding to the hard board area, and then laminating to obtain a secondary base material laminated board;
s5, drilling holes in the secondary base material laminated plate, and manufacturing secondary outer layer circuit layers on the upper end face and the lower end face to obtain a six-layer plate;
s6, manufacturing outer dielectric layers on the surfaces of the two sides of the six-layer plate, reversely pasting covering films at the positions of the outer dielectric layers corresponding to the soft plate area, stacking outer hard plate layers at the positions of the surfaces of the outer dielectric layers corresponding to the hard plate area, and then pressing to obtain an eight-layer plate; wherein the reverse side of the covering film is an insulating layer without viscosity, and a seam is punched at the junction of the hard board area and the soft board area of the outer dielectric layer;
and S7, manufacturing outer layer circuit layers on the surfaces of the two sides of the eight-layer plate, and then uncovering to obtain the eight-layer soft-hard combined HDI plate.
2. The method for manufacturing the eight-layer HDI (hard-soft) composite plate as recited in claim 1, wherein the substrate is a non-adhesive double-sided copper substrate with an insulating layer in the middle and pure copper foil layers on two sides.
3. The method for manufacturing the eight-layer HDI board combined with soft and hard materials according to claim 1, wherein the positions of the inner dielectric layer and the secondary inner dielectric layer corresponding to the soft board area are windowed by taking a soft and hard cross connecting line as a boundary.
4. A method for making an eight-layer HDI rigid-flexible printed circuit board as claimed in claim 1, wherein in step S6, the gap between the rigid and flexible areas of the outer dielectric layer is not greater than 2 mm.
5. The method of claim 1, wherein the step of uncovering comprises routing a 1.0mm by 3.0mm groove in the position of the scrap region of the outer hard board layer, and then uncovering the entire position of the outer dielectric layer corresponding to the position of the soft board region in step S7.
6. The method for manufacturing the eight-layer HDI board combined with soft and hard materials according to claim 1, further comprising:
and S8, performing solder mask, gold melting, routing appearance and electrical measurement on the eight-layer soft-hard combined HDI board according to the flow until a finished product is obtained.
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| CN202210179773.5A CN114531793A (en) | 2022-02-25 | 2022-02-25 | Manufacturing method of eight-layer HDI board combining softness and hardness |
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| CN202210179773.5A CN114531793A (en) | 2022-02-25 | 2022-02-25 | Manufacturing method of eight-layer HDI board combining softness and hardness |
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Citations (7)
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|---|---|---|---|---|
| JPH09321437A (en) * | 1996-05-24 | 1997-12-12 | Matsushita Electric Works Ltd | Manufacture of multialyr printed wiring board |
| CN1816258A (en) * | 2005-02-06 | 2006-08-09 | 华通电脑股份有限公司 | Method for making hard-soft composite circuit board |
| CN101170877A (en) * | 2007-11-21 | 2008-04-30 | 健鼎（无锡）电子有限公司 | Combination method of soft and hard printed circuit board |
| CN103687346A (en) * | 2013-11-18 | 2014-03-26 | 广州兴森快捷电路科技有限公司 | Rigid-flexible combined printed circuit board preparation method |
| CN105472906A (en) * | 2014-09-11 | 2016-04-06 | 富葵精密组件(深圳)有限公司 | Flexible and hard combined circuit board and manufacturing method thereof |
| KR20160080855A (en) * | 2014-12-29 | 2016-07-08 | 삼성전기주식회사 | Multi layer rigid-flexible printed circuit board and method of manufacturing the same |
| CN113141736A (en) * | 2021-05-07 | 2021-07-20 | 上海展华电子(南通)有限公司 | Preparation method of rigid flexible circuit board |
-
2022
- 2022-02-25 CN CN202210179773.5A patent/CN114531793A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09321437A (en) * | 1996-05-24 | 1997-12-12 | Matsushita Electric Works Ltd | Manufacture of multialyr printed wiring board |
| CN1816258A (en) * | 2005-02-06 | 2006-08-09 | 华通电脑股份有限公司 | Method for making hard-soft composite circuit board |
| CN101170877A (en) * | 2007-11-21 | 2008-04-30 | 健鼎（无锡）电子有限公司 | Combination method of soft and hard printed circuit board |
| CN103687346A (en) * | 2013-11-18 | 2014-03-26 | 广州兴森快捷电路科技有限公司 | Rigid-flexible combined printed circuit board preparation method |
| CN105472906A (en) * | 2014-09-11 | 2016-04-06 | 富葵精密组件(深圳)有限公司 | Flexible and hard combined circuit board and manufacturing method thereof |
| KR20160080855A (en) * | 2014-12-29 | 2016-07-08 | 삼성전기주식회사 | Multi layer rigid-flexible printed circuit board and method of manufacturing the same |
| CN113141736A (en) * | 2021-05-07 | 2021-07-20 | 上海展华电子(南通)有限公司 | Preparation method of rigid flexible circuit board |
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