CN113141736A - Preparation method of rigid flexible circuit board - Google Patents
Preparation method of rigid flexible circuit board Download PDFInfo
- Publication number
- CN113141736A CN113141736A CN202110493390.0A CN202110493390A CN113141736A CN 113141736 A CN113141736 A CN 113141736A CN 202110493390 A CN202110493390 A CN 202110493390A CN 113141736 A CN113141736 A CN 113141736A
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- China
- Prior art keywords
- circuit board
- flexible circuit
- film
- adhesive
- bulge
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
Abstract
The application discloses a method for preparing a rigid-flexible circuit board, which comprises the following steps: forming a protrusion defining a cap area on a surface of one side of the flexible circuit board; placing a glue-blocking film covering the uncovering area and the bulge on the flexible circuit board; placing the adhesive film to fix the adhesive-blocking film on the flexible circuit board; placing an adhesive sheet on one side of the adhesive film, which is far away from the adhesive-resistant film, wherein the adhesive sheet is provided with a gap corresponding to the bulge; placing a rigid circuit board on one side of the bonding sheet, which is far away from the flexible circuit board, and butting a circuit pattern, which is arranged on the surface of one side of the rigid circuit board, facing the flexible circuit board and corresponds to the bulge, with the bulge, so as to obtain a semi-finished circuit board; carrying out pressing treatment on the semi-finished circuit board; and cutting the pressed semi-finished circuit board on one side of the rigid circuit board, which is far away from the flexible circuit board, so as to expose the uncapping area defined by the bulge. The preparation method can avoid glue overflow at the joint of the rigid flexible circuit board.
Description
Technical Field
The application relates to the technical field of circuit boards, in particular to a method for manufacturing a rigid flexible circuit board.
Background
According to the assembly requirements of electronic products, the rigid-flexible circuit board is applied to mobile phones, automobiles, servers and the like, but due to the special design of the rigid-flexible circuit board, the control of glue overflow at the rigid-flexible joint becomes a key point for manufacturing the rigid-flexible circuit board.
The inventor of the present application finds that the existing scheme for controlling glue overflow on the rigid flexible circuit board has defects, and needs to be further improved.
Disclosure of Invention
The technical problem mainly solved by the application is to provide a method for preparing a rigid-flexible circuit board, and the method can avoid glue overflow at the joint of the rigid-flexible circuit board.
In order to solve the technical problem, the application adopts a technical scheme that: provided is a method for manufacturing a rigid-flexible circuit board, the method including: forming a protrusion defining an uncapping area on one side surface of the flexible circuit board; placing a glue blocking film covering the uncovering area and the bulge on one side of the bulge, which is far away from the flexible circuit board; placing an adhesive film on one side of the adhesive film, which is far away from the flexible circuit board, and fixing the adhesive film on the flexible circuit board; placing an adhesive sheet on one side of the adhesive film, which is far away from the adhesive-resistant film, wherein the adhesive sheet is provided with a gap corresponding to the bulge; placing a rigid circuit board on one side of the bonding sheet, which is far away from the flexible circuit board, and butting a circuit pattern, which is arranged on the surface of one side of the rigid circuit board, facing the flexible circuit board and corresponds to the bulge, with the bulge, so as to obtain a semi-finished circuit board; carrying out pressing treatment on the semi-finished circuit board; and cutting the semi-finished circuit board subjected to the pressing treatment at one side of the rigid circuit board, which is far away from the flexible circuit board, so as to expose the uncapping area defined by the bulge.
Wherein, the glue-blocking film is a Polyimide (PI) film.
Wherein the adhesive film is made of an acrylic hot melt adhesive (AD adhesive) film.
Wherein, the material of the projection is ink.
Wherein, the step of forming a protrusion defining a cap opening area on one side surface of the flexible circuit board includes: and forming the bulge for defining the uncovering area on the surface of one side of the flexible circuit board in a spray printing mode.
Wherein, the step of forming a protrusion defining a cap opening area on one side surface of the flexible circuit board includes: forming a covering film on one side surface of the flexible circuit board; and forming the bulge for defining the uncapping area on the surface of one side of the cover film, which is far away from the flexible circuit board.
Wherein, the step of forming the cover film on one side surface of the flexible circuit board comprises: forming a first protective sub-film with viscosity on one side surface of the flexible circuit board; and fixing a second protective sub-film on the first protective sub-film at the side of the first protective sub-film far away from the flexible circuit board.
The step of cutting the semi-finished circuit board subjected to the pressing treatment on the side, far away from the flexible circuit board, of the rigid circuit board to expose the uncovering area defined by the bulges comprises the following steps of: cutting the semi-finished circuit board subjected to the pressing treatment at one side of the rigid circuit board, which is far away from the flexible circuit board, so as to form a cutting groove on the surface of the semi-finished circuit board, wherein the cutting groove penetrates into the adhesive blocking film, but a preset distance is reserved between the bottom of the cutting groove and the surface of the adhesive blocking film, which faces the flexible circuit board; and blowing air to the cut semi-finished circuit board by using an air gun so as to expose the uncapping area defined by the bulge.
Wherein, the orthographic projection of the glue film on the flexible circuit board covers the orthographic projection of the glue-blocking film on the flexible circuit board.
The bonding sheet is a prepreg.
The beneficial effect of this application is: according to the preparation method, the protrusions on the covering film and the circuit patterns on the rigid circuit board are butted in the pressing process, so that glue (formed by melting of the bonding sheets) in the pressing process can be prevented from flowing onto the uncovering area on the covering film from the joint between the glue film and the covering film, namely, the outflow of overflowed glue is closed through the butt joint of the circuit patterns and the protrusions, the follow-up uncovered area without glue can be ensured, the glue blocking effect is good, and the rejection rate can be reduced. Simultaneously because the glue-blocking film does not have viscidity, consequently after the cutting, can directly use the air gun to uncap in order to expose the region of uncapping, whole process of uncapping can need not the manual work and tear the membrane, and is efficient, and whole process need not to use viscidity glue-blocking film, can reduce cost.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts. Wherein:
fig. 1 is a schematic flow chart of an embodiment of a method for manufacturing a rigid-flexible printed circuit board according to the present application;
FIG. 2 is a diagram of a manufacturing process corresponding to the manufacturing method of FIG. 1;
FIG. 3 is a continuation of FIG. 1;
FIG. 4 is a top view of the cover film of FIG. 2;
fig. 5 is an enlarged schematic view at a in fig. 3.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Referring to fig. 1 to 3, in an embodiment, a method of manufacturing a rigid-flexible circuit board includes:
s110: a cover film 1200 is formed on one side surface of the flexible circuit board 1100.
Specifically, the flexible circuit board 1100 is a double-sided board (may also be a single-sided board) including a first dielectric layer 1110 and first conductive layers 1120 disposed on both sides of the first dielectric layer 1110.
The material of the first dielectric layer 1110 may be Polyimide (PI), and the material of the first conductive layer 1120 may be copper (Cu). The flexible circuit board 1100 may be any one of flexible circuit boards with any structure in the prior art, that is, the structure of the flexible circuit board 1100 is not limited in this application.
The cover film 1200 is used to protect the flexible circuit board 1100 and prevent the first conductive layer 1120 from being oxidized by external moisture, harmful gas, etc.
The cover film 1200 includes a first protective sub-film 1210 and a second protective sub-film 1220, wherein the first protective sub-film 1210 has adhesiveness, and the second protective sub-film 1220 has no adhesiveness, and when the cover film 1200 is formed, the first protective sub-film 1210 having adhesiveness is fixed on the flexible circuit board 1100, and then the second protective sub-film 1220 is fixed on the first protective sub-film 1210 through the adhesiveness of the first protective sub-film 1210. The first protective sub-film 1210 is an AD adhesive (acrylic hot melt adhesive) film, and the second protective sub-film 1220 is a PI (polyimide) film.
It should be noted that the structure of the cover film 1200 is not limited thereto, and in other embodiments, the cover film 1200 may also have other structures, such as only one material layer, or other three, four or more material layers, which are not limited herein, as long as they can protect the flexible circuit board 1100.
S120: a projection 1202 defining an open-cover region 1201 is formed on the surface of the cover film 1200 on the side away from the flexible circuit board 1100.
Specifically, in conjunction with fig. 2 and 4, a projection 1202 is provided on the surface of the cover film 1200, which defines a closed uncapped area 1201 on the surface of the cover film 1200.
In this embodiment, the material of the bump 1202 is ink, and the processing method of the bump 1202 is: the protrusions 1202 are formed on the surface of the cover film 1200 by inkjet printing, that is, the protrusions 1202 are text inkjet lines.
In the present application, the material and the formation method of the protrusion 1202 are not limited, and for example, in another embodiment, a material layer may be formed on the surface of the cap film 1200, and then the material layer may be etched to form the protrusion 1202.
In short, the protrusion 1202 may be protruded on the surface of the cover film 1200 and define a closed uncapped area 1201.
S130: a resist film 1300 covering the open-cover region 1201 and the bumps 1202 is placed on the side of the bumps 1202 facing away from the flexible circuit board 1100.
Specifically, the adhesive blocking film 1300 is a non-adhesive film that covers the uncapping area 1201 and the protrusion 1202.
The adhesive-blocking film 1300 may be a Polyimide (PI) film.
S140: the adhesive film 1400 is disposed on a side of the adhesive film 1300 opposite to the flexible circuit board 1100, so as to fix the adhesive film 1300 on the flexible circuit board 1100.
Specifically, the adhesive film 1400 is a film having adhesiveness, which is used to fix the adhesive-blocking film 1300 on the cover film 1200.
In order to fix the adhesive film 1300 on the cover film 1200, the orthographic projection of the adhesive film 1400 on the flexible circuit board 1100 covers the orthographic projection of the adhesive film 1300 on the flexible circuit board 1100, that is, the size of the adhesive film 1400 is larger than that of the adhesive film 1300.
S150: the adhesive sheet 1500 is disposed on the side of the adhesive film 1400 away from the adhesive-resistant film 1300, wherein the adhesive sheet 1500 has a slit 1501 corresponding to the protrusion 1202.
Specifically, the adhesive sheet 1500 is used to fix the rigid circuit board 1600 and the flexible circuit board 1100 together through a subsequent pressing process, which will be described later.
The adhesive sheet 1500 is provided with a slit 1501 corresponding to the protrusion 1202, the size of the slit 1501 being slightly larger than the size of the protrusion 1202.
The material of the adhesive sheet 1500 may be a prepreg (PP).
S160: the rigid circuit board 1600 is placed on the side of the adhesive sheet 1500 away from the flexible circuit board 1100, and the circuit pattern 1601 corresponding to the protrusion 1202 provided on the surface of the side of the rigid circuit board 1600 facing the flexible circuit board 1100 is butted against the protrusion 1202, thereby obtaining the semi-finished circuit board 1.
Specifically, the rigid circuit board 1600 is a double-sided board (or a single-sided board in other embodiments), and includes a second dielectric layer 1610 and a second conductive layer 1620 disposed on two sides of the second dielectric layer 1610.
For convenience of description, the material of the second dielectric layer 1610 may be FR4, and the material of the second conductive layer 1620 may be copper (Cu), where the material of the second conductive layer 1620 is copper. The rigid circuit board 1600 may be any one of the rigid circuit boards in the prior art, that is, the present application does not limit the structure of the rigid circuit board 1600.
Meanwhile, a circuit pattern 1601 corresponding to the protrusion 1202 is disposed on a surface of the rigid circuit board 1600 facing the flexible circuit board 1100, and the size of the circuit pattern 1601 may be the same as the size of the protrusion 1202, may be slightly larger than the size of the protrusion 1202, or may be slightly smaller than the size of the protrusion 1202. It is understood that similar to the bumps 1202, the trace pattern 1601 also defines a capped area on the surface of the second dielectric layer 1610, which corresponds to the uncapped area 1201.
Specifically, during the manufacturing process, when the second conductive layer 1620 is etched, the circuit pattern 1601 corresponding to the bump 1202 is left on the surface of the second dielectric layer 1610, i.e. the position corresponding to the bump 1120 is subjected to a "copper-remaining" process.
When the rigid circuit board 1600 is placed on the flexible circuit board 1100, the wiring pattern 1601 passes through the slit 1501 on the adhesive sheet 1500 and abuts the bump 1202. It is understood that when the circuit pattern 1601 is abutted to the bump 1202, the adhesive film 1300 and the adhesive film 1400 are still present therebetween, but the adhesive sheet 1500 is not present therebetween.
S170: and carrying out pressing treatment on the semi-finished circuit board 1.
Specifically, after the press-fitting process, the flexible circuit board 1100 and the rigid circuit board 1600 are fixed together as a single body.
Meanwhile, during the pressing process, the adhesive sheet 1500 melts and then solidifies, thereby fixing the flexible circuit board 1100 and the rigid circuit board 1600 together.
S180: the semi-finished circuit board 1 after the pressing process is cut on the side of the rigid circuit board 1600 away from the flexible circuit board 1100, so as to form a cutting groove 1001 on the surface of the semi-finished circuit board 1, wherein the cutting groove 1001 extends deep into the adhesive blocking film 1300, but the bottom of the cutting groove 1001 and the surface of the adhesive blocking film 1300 facing the flexible circuit board 1100 have a predetermined distance.
Specifically, when the semi-finished circuit board 1 is cut, the cutting mode may be laser cutting or various modes such as mechanical cutting, and the cutting mode is not specifically limited in the present application.
In order to avoid damaging the cover film 1200 during the cutting process, as shown in fig. 5, the bottom of the cutting groove 1001 and the surface of the cover film 1300 facing the flexible circuit board 1100 have a predetermined distance, i.e., the surface of the cover film 1200 is not cut all the way through during the cutting process, and the cover film 1300 is not completely cut.
S190: an air gun is used to blow air against the cut semi-finished circuit board 1 to expose the uncapped area 1201 defined by the bumps 1202.
Specifically, after the cutting, although the adhesive-blocking film 1300 is not completely cut, the adhesive-blocking film 1300 has no viscosity, so that the adhesive-blocking film 1300, the adhesive film 1400, the adhesive sheet 1500, and the rigid circuit board 1600 in the area above the uncapping area 1201 can be removed as a whole by the air gun, thereby exposing the uncapping area 1201.
Specifically, in the prior art, in order to ensure that the uncapping area 1201 on the cover film 1200 is free of glue after uncapping, an adhesive glue film, such as a PI tape, is used in the preparation process and attached to the uncapping area 1201, and then the adhesive glue film is manually removed from the uncapping area 1201 during uncapping. This process needs the manual work to tear off the viscidity glued membrane, and the inefficiency of uncapping, and viscidity glued membrane itself has glues, remains easily on the surface of covering membrane 1200, and the gluey in-process still can get into uncapping region 1201 from the handing-over department between cover membrane 1200 and the viscidity glued membrane in addition, hinders gluey effect and is not ideal, and the cost of viscidity glued membrane is also higher.
In this embodiment, it can be seen from fig. 3 that the protrusion 1202 on the cover film 1200 is butted with the circuit pattern 1601 on the rigid circuit board 1600 during the pressing process, so that the situation that the glue flows from the joint between the glue-blocking film 1300 and the cover film 1200 to the uncovering area 1201 on the cover film 1200 during the pressing process can be avoided, that is, the overflow of the glue is closed through the butting between the circuit pattern 1601 and the protrusion 1202, and therefore, it can be ensured that the subsequently exposed uncovering area 1201 has no glue, the glue-blocking effect is good, and the rejection rate can be reduced. Simultaneously because it does not have viscidity to hinder glued membrane 1300, consequently after the cutting, can directly use the air gun to uncap in order to expose uncap regional 1201, whole uncap process can need not the manual work and tear the membrane, and is efficient, also can use the PI film of inviscid to replace sticky PI sticky tape in addition, can reduce cost.
The above description is only for the purpose of illustrating embodiments of the present application and is not intended to limit the scope of the present application, and all modifications of equivalent structures and equivalent processes, which are made by the contents of the specification and the drawings of the present application or are directly or indirectly applied to other related technical fields, are also included in the scope of the present application.
Claims (10)
1. A method for manufacturing a rigid-flexible circuit board, the method comprising:
forming a protrusion defining an uncapping area on one side surface of the flexible circuit board;
placing a glue blocking film covering the uncovering area and the bulge on one side of the bulge, which is far away from the flexible circuit board;
placing an adhesive film on one side of the adhesive film, which is far away from the flexible circuit board, and fixing the adhesive film on the flexible circuit board;
placing an adhesive sheet on one side of the adhesive film, which is far away from the adhesive-resistant film, wherein the adhesive sheet is provided with a gap corresponding to the bulge;
placing a rigid circuit board on one side of the bonding sheet, which is far away from the flexible circuit board, and butting a circuit pattern, which is arranged on the surface of one side of the rigid circuit board, facing the flexible circuit board and corresponds to the bulge, with the bulge, so as to obtain a semi-finished circuit board;
carrying out pressing treatment on the semi-finished circuit board;
and cutting the semi-finished circuit board subjected to the pressing treatment at one side of the rigid circuit board, which is far away from the flexible circuit board, so as to expose the uncapping area defined by the bulge.
2. The method of claim 1, wherein the glue-blocking film is a Polyimide (PI) film.
3. The method as claimed in claim 1, wherein the adhesive film is made of acrylic hot melt adhesive (AD adhesive) film.
4. The method of claim 1, wherein the material of the protrusions is ink.
5. The manufacturing method according to claim 4, wherein the step of forming a projection defining an uncapped region on one side surface of the flexible circuit board includes:
and forming the bulge for defining the uncovering area on the surface of one side of the flexible circuit board in a spray printing mode.
6. A manufacturing method according to claim 1, wherein the step of forming a projection defining an uncapped region on one side surface of the flexible circuit board includes:
forming a covering film on one side surface of the flexible circuit board;
and forming the bulge for defining the uncapping area on the surface of one side of the cover film, which is far away from the flexible circuit board.
7. The method according to claim 6, wherein the step of forming a cover film on one side surface of the flexible circuit board comprises:
forming a first protective sub-film with viscosity on one side surface of the flexible circuit board;
and fixing a second protective sub-film on the first protective sub-film at the side of the first protective sub-film far away from the flexible circuit board.
8. The manufacturing method according to claim 1, wherein the step of cutting the semi-finished circuit board subjected to the press-fitting process on the side of the rigid circuit board away from the flexible circuit board to expose the open-cover region defined by the protrusion includes:
cutting the semi-finished circuit board subjected to the pressing treatment at one side of the rigid circuit board, which is far away from the flexible circuit board, so as to form a cutting groove on the surface of the semi-finished circuit board, wherein the cutting groove penetrates into the adhesive blocking film, but a preset distance is reserved between the bottom of the cutting groove and the surface of the adhesive blocking film, which faces the flexible circuit board;
and blowing air to the cut semi-finished circuit board by using an air gun so as to expose the uncapping area defined by the bulge.
9. The manufacturing method according to claim 1, wherein an orthographic projection of the adhesive film on the flexible circuit board covers an orthographic projection of the adhesive-blocking film on the flexible circuit board.
10. The method according to claim 1, wherein the adhesive sheet is a prepreg.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110493390.0A CN113141736B (en) | 2021-05-07 | 2021-05-07 | Preparation method of rigid flexible circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110493390.0A CN113141736B (en) | 2021-05-07 | 2021-05-07 | Preparation method of rigid flexible circuit board |
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| CN113141736A true CN113141736A (en) | 2021-07-20 |
| CN113141736B CN113141736B (en) | 2022-07-12 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202110493390.0A Active CN113141736B (en) | 2021-05-07 | 2021-05-07 | Preparation method of rigid flexible circuit board |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114531793A (en) * | 2022-02-25 | 2022-05-24 | 黄石西普电子科技有限公司 | Manufacturing method of eight-layer HDI board combining softness and hardness |
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| CN101409976A (en) * | 2007-10-12 | 2009-04-15 | 比亚迪股份有限公司 | Multilayer flexible circuit board |
| CN205961580U (en) * | 2016-08-24 | 2017-02-15 | 惠州市贝斯特膜业有限公司 | A compound glued membrane component that hinders for production of printed circuit board |
| TWM570577U (en) * | 2018-08-02 | 2018-11-21 | 興普科技股份有限公司 | Glue stopping structure for empty cavity printed circuit board |
| CN112165764A (en) * | 2020-10-20 | 2021-01-01 | 苏州维信电子有限公司 | Manufacturing method of flexible circuit board convenient for tearing off waste materials |
| CN112272445A (en) * | 2020-10-29 | 2021-01-26 | 昆山工研院新型平板显示技术中心有限公司 | Flexible circuit board, display panel and display device |
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2021
- 2021-05-07 CN CN202110493390.0A patent/CN113141736B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101409976A (en) * | 2007-10-12 | 2009-04-15 | 比亚迪股份有限公司 | Multilayer flexible circuit board |
| CN205961580U (en) * | 2016-08-24 | 2017-02-15 | 惠州市贝斯特膜业有限公司 | A compound glued membrane component that hinders for production of printed circuit board |
| TWM570577U (en) * | 2018-08-02 | 2018-11-21 | 興普科技股份有限公司 | Glue stopping structure for empty cavity printed circuit board |
| CN112165764A (en) * | 2020-10-20 | 2021-01-01 | 苏州维信电子有限公司 | Manufacturing method of flexible circuit board convenient for tearing off waste materials |
| CN112272445A (en) * | 2020-10-29 | 2021-01-26 | 昆山工研院新型平板显示技术中心有限公司 | Flexible circuit board, display panel and display device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114531793A (en) * | 2022-02-25 | 2022-05-24 | 黄石西普电子科技有限公司 | Manufacturing method of eight-layer HDI board combining softness and hardness |
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| CN113141736B (en) | 2022-07-12 |
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Denomination of invention: Preparation method of rigid and flexible circuit boards Effective date of registration: 20230508 Granted publication date: 20220712 Pledgee: Jiangsu Zhangjiagang rural commercial bank Limited by Share Ltd. Nantong branch Pledgor: Shanghai Zhanhua Electronics (Nantong) Co.,Ltd. Registration number: Y2023980039876 |
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