JP5003528B2 - Manufacturing method of electronic component module - Google Patents

Description

  The present invention relates to a method for manufacturing an electronic component module in which an electronic component is mounted on a base wiring layer on which a wiring pattern is formed, and an electronic component module having a configuration in which the electronic component and the wiring pattern are sealed with a sealing resin layer is manufactured. It is.

  Electronic components such as semiconductor elements are generally incorporated into electronic devices in the form of electronic component modules in which electronic components mounted on a base wiring layer such as a resin substrate are sealed with resin. Along with the trend to require higher mounting density in electronic component modules, electronic component modules in the form of so-called component-embedded substrates in which electronic components are mounted on the inner layer of a plurality of stacked electrode patterns have come to be used. (For example, refer to Patent Document 1). In this patent document example, an electronic component is embedded in an inner layer by sequentially laminating a prepreg which is a thermosetting sheet for forming a sealing resin layer between a plurality of electrode patterns.

The base wiring layer is formed by bonding a metal thin film such as a copper foil to a thin resin substrate. This metal thin film is partially patterned and used as a wiring pattern for electrically connecting electronic components, and also has a role of supplementing the rigidity of a thin and flexible resin substrate. When laminating the base wiring layer after component mounting and the prepreg which is a thermosetting sheet, it is necessary to make the prepreg adhere to the surface of the metal thin film, but the thermosetting resin constituting the prepreg is different from the surface of the metal thin film. Therefore, a roughening treatment for improving the adhesion is performed by roughening the surface of the metal thin film to form a fine anchor pattern prior to the lamination step. In this roughening treatment, generally, a wet roughening treatment in which a metal surface such as a strong acid or a strong alkali is chemically eroded is used.
International Publication No. 2005/004567 Pamphlet

  However, when the above roughening process is performed on the base wiring layer after the electronic component is mounted, the roughening process acts on the solder joint that connects the land part of the base wiring layer and the terminal part of the electronic component. The following inconvenience arises due to the fact that this also acts. That is, as described above, the treatment liquid used for the roughening treatment has an action of eroding the surface of the metal, so that the surface of the solder joint portion is also eroded in the roughening treatment. At this time, the toe portion of the solder fillet of the solder joint portion is particularly susceptible to erosion, and when this portion is eroded, a defective portion such as a microcrack that is a starting point of breakage is likely to be formed.

  And in such a state where such a defective portion has occurred, when a thermosetting sheet is laminated on the base layer after component mounting to form a resin sealing layer and pressure and heating are performed, such a defective portion is removed. As a starting point, there is a risk of causing fatal problems such as breakage of the solder joint. As described above, in the conventional method for manufacturing an electronic component module, a defect portion is likely to be generated in the solder joint portion in the roughening process performed in order to improve the adhesion to the thermosetting sheet, and the joint reliability is ensured. There was a problem that it was difficult.

  Therefore, an object of the present invention is to provide a method for manufacturing an electronic component module that can prevent a defective portion that becomes a starting point of fracture from occurring in a solder joint portion and can ensure joint reliability.

In the method of manufacturing an electronic component module according to the present invention, an electronic component having a main body portion and a terminal portion is formed on the base wiring layer in which a wiring pattern having a land portion for connecting an electronic component on the upper surface is formed of a metal thin film. An electronic device that is mounted in a state where the terminal portion is connected, and the electronic component and the surrounding wiring pattern are sealed by a sealing resin layer formed in close contact with the upper surface of the base wiring layer and the main body portion. A method of manufacturing an electronic component module for manufacturing a component module, the roughening step of roughening the surface of the metal thin film including the wiring pattern by roughening the upper surface of the base wiring layer, and the roughening step A bonding material disposing step of disposing a bonding material containing solder particles in a thermosetting resin in a range covering at least the land portion on the upper surface of the later base wiring layer; An electronic component holding step for holding the electronic component by the base wiring layer by aligning a child portion with the land portion and adhering at least the terminal portion to a bonding material covering the land portion, and the sealing resin layer The thermosetting sheet for forming the electronic component is bonded to the upper surface of the base wiring layer after the electronic component holding step and thermocompression bonding is performed at a heating temperature higher than the melting point temperature of the solder particles of the bonding material. And a pressing step of simultaneously curing the cured sheet, curing the bonding material, and soldering the terminal portion to the land portion.

  According to the present invention, the roughening process of roughening the surface of the metal thin film including the wiring pattern is first performed by roughening the upper surface of the base wiring layer, and the base wiring layer after the roughening process is targeted. By sequentially performing the bonding material arranging step, the electronic component bonding step, and the pressing step, it is possible to eliminate the occurrence of micro cracks in the solder bonding portion in the roughening process, and to ensure bonding reliability.

  Next, embodiments of the present invention will be described with reference to the drawings. 1, 2 and 3 are process explanatory views showing a method of manufacturing an electronic component module according to one embodiment of the present invention.

  First, a method for manufacturing an electronic component module will be described. 1, 2, and 3 show a base wiring layer in which a wiring pattern having a land portion for connecting an electronic component on an upper surface is formed of a metal thin film, and an electronic component having a main body portion and a terminal portion on a land portion. The electronic component module is manufactured by sealing the electronic component and the surrounding wiring pattern with the sealing resin layer formed in close contact with the upper surface of the base wiring layer and the main body. The method is shown in the order of steps.

  In FIG. 1A, the base wiring layer 1 has a configuration in which a wiring pattern 3 and a wiring pattern 4 made of a metal thin film such as a copper foil are formed on the upper surface 2a and the lower surface 2b of the insulating resin substrate 2, respectively. . A part of the wiring pattern 3 is a land portion 3a for connecting terminals of the electronic component, and the base wiring layer 1 is formed with the wiring pattern 3 having the land portion 3a for connecting the electronic component on the upper surface 2a. It has a form. The land portion 3a includes electronic components such as chip-type small components in which connection terminals are formed at both ends, such as resistors and capacitors, and semiconductor chips in which metal bumps are formed on the lower surface as connection terminal portions. Implemented. Note that the wiring patterns 3 and 4 mentioned here are not only those having a function as an actual wiring circuit, but are simply metal thin films that are left on the surface of the base wiring layer 1 in patterning and have no function as a wiring circuit. Are also included.

  The base wiring layer 1 is first subjected to a roughening process for the purpose of improving adhesion to a prepreg in a subsequent process, and includes a wiring pattern 3 and a wiring pattern 4 by roughening the upper surface of the base wiring layer 1. The surface of the metal thin film is roughened (roughening step). That is, as shown in FIG. 1B, the surface 3b of the wiring pattern 3 and the surface 4a of the wiring pattern 4 are oxidized by performing a blackening process in which the base wiring layer 1 is immersed in a processing solution 5 such as a strong acid solution. By roughening, an anchor pattern made of fine irregularities is formed on these surfaces.

  As described above, the blackening process is performed in a state in which the electronic component is not yet mounted on the base wiring layer 1, so that the blackening process is performed after the electronic component is mounted on the base wiring layer 1 by solder bonding. That is, there is an advantage that a defective portion such as a microcrack does not occur when the processing liquid used for the roughening treatment erodes the surface of the solder joint portion. As a roughening treatment method, plasma treatment or the like may be used in addition to the blackening treatment in which the base wiring layer 1 is immersed in the treatment liquid.

  Next, as shown in FIG. 1C, the surface of the base wiring layer 1 after the roughening step (upper surface 2a) has an active action of removing the solder oxide film in a range covering at least the land portion 3a. The bonding material 6 containing the solder particles 6a in the thermosetting resin 6b is arranged (bonding material arrangement process). As the solder particles 6a, for example, solder particles having a composition of SnBi58 and a melting point temperature of about 139 ° C. are used. As the thermosetting resin 6b, for example, epoxy resin, acrylate resin, polyimide, polyurethane, phenol resin, unsaturated resin are used. Polyester resin is used.

  As a method of disposing the bonding material 6 on the surface of the base wiring layer 1, depending on the shape and range of the object to be disposed, such as screen printing, application by a dispenser, and a method of pasting a resin film previously formed into a film shape Various methods can be selected. Here, the bonding material 6 is arranged so as to cover not only the range covering the surface of the land portion 3 a but also the entire range where the metal thin film including the wiring pattern 3 exists on the upper surface 2 a of the resin substrate 2. In the example shown in FIG. 1C, since the range in which the bonding material 6 is disposed covers the entire range in which the metal thin film including the wiring pattern 3 is formed on the upper surface 2a of the resin substrate 2, the bonding material 6 is used as a film. It shows a method of arranging the bonding material 6 by sticking a shaped resin film.

  Thereafter, as shown in FIG. 2A, the main body 7a and the terminal portions 7b provided at both ends of the main body 7a are connected to the base wiring layer 1 in which the bonding material 6 is disposed in the land 3a. The chip-type electronic component 7 is mounted. Here, the terminal part 7b of the electronic component 7 is aligned with the land part 3a, and at least the terminal part 7b is bonded to the bonding material 6 covering the surface of the land part 3a, whereby the electronic part 7 is attached to the base wiring layer 1. (Electronic component holding step).

  As a result, the electronic component 7 is held by the base wiring layer 1 via the adhesive bonding material 6. At this time, as shown in FIG. 2B, the bonding material 6 is arranged on the upper surface of the base wiring layer 1 not only in the portion covering the land portion 3 a but also in the range corresponding to the main body portion 7 a of the electronic component 7. Therefore, the electronic component 7 is in a state where not only the terminal portion 7b but also the main body portion 7a is bonded to the bonding material 6, and is held on the base wiring layer 1 via the bonding material 6 with a sufficient fixing force.

  Next, the base wiring layer 1 on which the electronic component 7 is mounted is sent to a curing device and heated as shown in FIG. Thereby, the thermosetting reaction of the thermosetting resin 6b contained in the bonding material 6 proceeds. At this time, the thermosetting reaction is stopped halfway without completely curing the thermosetting resin 6b by heating control, and a so-called semi-cured state is obtained. That is, here, after the electronic component holding step, the bonding material 6 to which the electronic component 7 is bonded is heated and semi-cured (bonding material temporary curing step). Thereby, the holding force of the electronic component 7 by the bonding material 6 can be increased. Note that this temporary bonding material curing step is not an essential process. If the bonding strength of the electronic component 7 due to the viscosity of the bonding material 6 is sufficient and there is no risk of the electronic component 7 dropping or misalignment, the temporary bonding material temporary curing step is required. The curing step may be omitted.

Thereafter, the base wiring layer 1 is sent to a pressing process. In this pressing step, a thermosetting sheet for forming a sealing resin layer for sealing the electronic component 7 and the surrounding wiring pattern 3 on the upper surface 2a of the resin substrate 2 constituting the base wiring layer 1 is provided. A prepreg and a plurality of wiring layers are laminated and thermocompression bonded by a press device provided with a heating device. Here, the sealing resin layer is formed in close contact with the upper surface 2a of the resin substrate 2 and the electronic component 7 and surrounding the electronic component 7 from the periphery.

  First, as shown in FIG. 3A, a wiring layer 11 having a configuration in which a copper foil 13 is attached to the upper surface side of the prepreg 10 and the prepreg 12 provided with an opening 10a corresponding to the position of the electronic component 7, The base wiring layer 1 is sequentially overlapped on the upper surface 2 a side, and the wiring layer 14 having a configuration in which the copper foil 16 is attached to the lower surface side of the prepreg 15 is overlapped on the lower surface side of the base wiring layer 1.

  Next, as shown in FIG. 3B, the laminated body 17 composed of the wiring layer 14, the base wiring layer 1, the prepreg 10 and the wiring layer 11 is pressed at 150 ° C. while being pressed with a press device at a pressure of about 30 kg / cm 2. Heat at a temperature of about ~ 200 ° C. The heating temperature at this time is set to be higher than the melting point temperature of the solder particles 6 a of the bonding material 6. By this heating, the resin impregnated in each layer of the prepregs 12, 10, and 15 is once softened, and the contacting interfaces are fused to each other, and the prepreg 10 and the prepreg 15 are in close contact with the surface 3 b and the surface 4 a, respectively. . At this time, since the fine anchor pattern is formed on the surface 3b and the surface 4a in the roughening treatment step, good adhesion is ensured.

  Further, the resin impregnated in the prepregs 12 and 10 fills the gap portion in the opening 10 a by pressurization and heating, and adheres to the electronic component 7. Further, when the heating is continued, the electronic component 7 and the bonding material 6 are heated. At this time, since the heating temperature in the pressing step is higher than the melting point temperature of the solder particles 6a contained in the bonding material 6, the solder particles 6a are melted, and the solder joint for joining the terminal portion 7b to the land portion 3a via solder. Is done. In other words, in the electronic component 7, the melted solder in which the solder particles 6 a are melted wets the surfaces of the land portion 3 a and the terminal portion 7 b, thereby forming a solder fillet-like solder joint portion 6 a *.

  Together with this solder bonding, the thermosetting resin 6b of the bonding material 6 is thermoset by heating. Thereby, the resin part 6b * which seals the clearance gap on the lower surface side of the first electronic component 6 and covers the solder joint part 6a * is formed. Then, these reactions due to heating proceed in parallel, whereby the resin in the prepreg 10 is fused at the interface with the resin portion 6b *, and the electronic component 7, the resin portion 6b * and the like on the upper surface 2a of the resin substrate 2 A sealing resin layer 10 * for sealing the wiring pattern 3 is formed.

  That is, in this pressing step, the prepreg 10 which is a thermosetting sheet for forming the sealing resin layer 10 * for sealing the electronic component 7 and the surrounding wiring pattern 3 is formed on the base after the bonding material temporary curing step. By bonding to the upper surface 2a of the wiring layer 1 and performing thermocompression bonding, the prepreg 10 is cured, the bonding material 6 is cured, and the terminal portion 7b is solder-bonded to the land portion 3a at the same time. The sealing resin layer 10 * thus formed is in close contact with the upper surface 2a of the base wiring layer 1 and the main body 7a of the electronic component 7.

  In this pressing process, the soldering of the terminal part 7b to the land part 3a is simultaneously performed, thereby eliminating the occurrence of defective parts such as microcracks in the soldering part in the roughening process, which has been a problem in the conventional method. It is possible to do. That is, in the manufacturing method of the electronic component module shown in the present embodiment, the roughening treatment for improving the adhesion of the prepreg to the base wiring layer 1 is performed before the electronic component is mounted on the base wiring layer 1. Since this is performed, there is no occurrence of the above-described defect due to the roughening treatment after the electronic component is soldered.

Therefore, the defect caused by these defective parts in the conventional method, that is, when the pressing process is performed on the base wiring layer 1 after component mounting in a state where such a defect has occurred, It is possible to eliminate a fatal problem that the solder joint breaks as a starting point, and to ensure stable joint reliability.

  Next, as shown in FIG. 3C, a plating layer is formed on the inner surface of the through hole that penetrates the multilayer body 17, whereby the wiring pattern 3 of the base wiring layer 1 and the copper foils 13, 16 of the wiring layers 11, 14. Are formed (interlayer wiring process), and the copper foils 13 and 16 of the wiring layers 11 and 14 are patterned to form wiring circuits 13a and 16a (circuit forming process). ).

  Thereby, the electronic component 7 having the main body portion 7a and the terminal portion 7b is connected to the land portion 3a and the terminal portion 7b is connected to the base wiring layer 1 having the wiring pattern 3 having the land portion 3a for connecting the electronic component on the upper surface. The electronic component formed by sealing the electronic component 7 and the surrounding wiring pattern 3 with the sealing resin layer 10 * formed in close contact with the upper surface 2a of the base wiring layer 1 and the main body 7a. Module 19 is completed. The electronic component module 19 manufactured in this way is further subjected to component mounting, and electronic components are mounted on the wiring layer 11 on the surface layer and, if necessary, on the wiring layer 14 on the lower layer, thereby completing a mounting substrate.

  The method of manufacturing an electronic component module according to the present invention has an advantage that it is possible to prevent the occurrence of a defective portion as a starting point of breakage in a solder joint portion and to secure joint reliability, and a plurality of wiring layers This is useful in the field of manufacturing electronic component modules configured by stacking layers.

Process explanatory drawing which shows the manufacturing method of the electronic component module of one embodiment of this invention Process explanatory drawing which shows the manufacturing method of the electronic component module of one embodiment of this invention Process explanatory drawing which shows the manufacturing method of the electronic component module of one embodiment of this invention

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Base wiring layer 2 Resin board 3 Wiring pattern 3a Land part 5 Processing liquid 6 Bonding material 6a Solder particle 6b Thermosetting resin 7 Electronic component 7a Main body part 7b Terminal part 10 Prepreg 11, 14 Wiring layer 17 Laminate body 19 Electronic component module

Claims (3)

A wiring pattern having a land portion for connecting an electronic component on the upper surface is mounted on a base wiring layer formed of a metal thin film in a state where the electronic component having a main body portion and a terminal portion is connected to the land portion. An electronic component module manufacturing method for manufacturing an electronic component module in which the electronic component and a surrounding wiring pattern are sealed by a sealing resin layer formed in close contact with the upper surface of the base wiring layer and the main body. Because
A roughening step of roughening a surface of the metal thin film including the wiring pattern by roughening an upper surface of the base wiring layer;
A bonding material arranging step of arranging a bonding material containing solder particles in a thermosetting resin in a range covering at least the land portion on the upper surface of the base wiring layer after the roughening step;
An electronic component holding step of holding the electronic component by the base wiring layer by aligning the terminal portion with the land portion and bonding at least the terminal portion to a bonding material covering the land portion;
A thermosetting sheet for forming the sealing resin layer is bonded to the upper surface of the base wiring layer after the electronic component holding step , and thermocompression bonding is performed at a heating temperature higher than the melting point temperature of the solder particles of the bonding material. And a pressing step for simultaneously curing the thermosetting sheet, curing the bonding material, and soldering the terminal portion to the land portion.   The method of manufacturing an electronic component module according to claim 1, further comprising a bonding material temporary curing step in which the bonding material to which the electronic component is bonded is heated to a semi-cured state after the electronic component holding step.   3. The method of manufacturing an electronic component module according to claim 1, wherein in the bonding material arranging step, the bonding material is arranged in the base wiring layer in a range where at least the metal thin film is formed. .

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