JPH09318324A - Part recognizing apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To achieve fast and highly accurate positional recognition about PGA(pin-grid array) and BGA(ball-grid array) parts. SOLUTION: This apparatus is made up of an image memory 2 to store an image data of a part to be recognized, an image data transfer means 1 to transfer an image data of an area with the position and the size thereof optional of those within the image memory 2 to a pin array detecting part 8 and a part position calculating means 7 to calculate the position of the part based on a pin array by the pin array detecting part 8. The pin array detecting part 8 comprises arithmetic means 41 and 42 which perform a projective computation in the directions horizontal and vertical for the image data of any area transferred from the image memory 2 by the image data transfer means 1, a link memory means 5 to link and store the results of projective computation in the horizontal and vertical directions and a pin position detection detecting means 6 to detect the pin position of the part from a results of the projective computation data transferred from the link memory means 5.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component position recognition device for recognizing a component position based on a component image.

[0002]

2. Description of the Related Art With the miniaturization and weight reduction of electric products, further densification is required for an electronic component automatic mounting apparatus for automatically mounting chip-shaped electronic components on a printed circuit board.

In order to realize the mounting accuracy that satisfies the demand, it is indispensable to perform the positioning process of the electronic parts by applying the image processing technique. Standard data such as pre-registered shapes and sizes of parts are used for position recognition of electronic parts to which image processing technology is applied.

By the way, the electronic components mounted by the electronic component automatic mounting apparatus include components having different shapes and sizes such as a small angle chip, a semi-fixed volume, and an IC.

However, since the image pickup conditions such as resolution are fixed, the input component image is not always an image for performing suitable component positioning for all electronic components.

Therefore, the shape, size, and accurate position of the electronic component may not be recognized accurately. Also, recent electronic parts are not only IC parts such as QFP in which leads are arranged on the four sides of the mold, but also PG in which a large number of pins are arranged in a matrix on the front or back surface of the mold.
A (Pin Grid Array) and BGA (Bal
The number of packages of 1Grid Array) is increasing.

If the number of pins is increased as described above, the position detection in the length direction and the width direction is performed for each pin, which requires time and effort for calculation, and the standard data cannot be created at high speed.

[0008]

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems of the prior art, and particularly PGA and BG.
It is an object of the present invention to provide a method and an apparatus capable of performing high-speed and highly accurate position recognition of an A part.

[0009]

SUMMARY OF THE INVENTION A component position recognition apparatus according to the present invention comprises an image memory for storing image data of a component to be recognized, and image data of an area of an arbitrary position and size of the image data in the image memory. Of image data to a pin array detection unit, and a component position calculation unit that calculates a component position based on the pin array detected by the pin array detection unit.

Then, the pin array detection unit performs projecting operations in horizontal and vertical directions on image data of an arbitrary area transferred from the image memory by the image data transfer unit, and the horizontal and vertical operation units. It comprises connection storage means for connecting and storing the projection calculation results in the vertical direction, and pin position detection means for detecting the pin position of the component from the projection calculation result data transferred from the connection storage means.

The component position recognizing method of the present invention further comprises a step of storing in the image memory the image data of the recognized component captured by the image pickup means, and a predetermined area of the image data stored in the image memory. For each of the areas, the step of performing a projection operation in the horizontal and vertical directions on the transferred image data of an arbitrary area, and the obtained projection of each direction for each area A step of linking and storing the calculation results, a step of detecting the pin position using the stored two-dimensional projection calculation result as one-dimensional array data, and a step of calculating the position of the part based on the obtained pin position And consists of.

[0012]

BEST MODE FOR CARRYING OUT THE INVENTION An embodiment in which a component position recognition apparatus of the present invention and a method using the same are applied to PGA components will be described in detail below with reference to the drawings.

FIG. 1 is a block diagram showing the hardware configuration of the apparatus. In the figure, reference numeral 1 is an image data transfer means for transferring image data of an area of an arbitrary position and size among image data stored in an image memory described later to a pin array detection unit described later, and 2 is a CCD camera not shown. An image memory for storing image data of the parts captured by the image pickup means 3, such as 41, 42 is horizontal with respect to the image data in the predetermined area of the recognized parts sequentially read from the image memory 2. Alternatively, the projection calculation means 5 in each direction for performing the projection calculation in the vertical direction connects the calculation results by the projection calculation means 41, 42 in each direction, and two types of 1
Projection calculation result storage means for storing as three-dimensional array data,
Reference numeral 6 is a pin position detecting means for performing edge detection processing or the like on the two types of one-dimensional array data read from the connection storage means 5 to detect the center position of each pin as a pin position, and 7 is the above-mentioned. It is a component position calculating means for calculating the gravity center position and the tilt angle of the entire component based on all the pin positions obtained by the pin position detecting means 7.

The horizontal and vertical projection calculation means 41, 42, the projection calculation result connection storage means 5, and the pin position detection means 6 are collectively referred to as a pin arrangement detection section 8. In the image memory 2, for example, as shown in FIG.
A component image (see FIG. 3) in which the pin arrangement on the bottom surface of the GA component can be clearly distinguished is, for example, 2 with a size of 512 × 512 pixels.
It is stored as a 56-gradation grayscale image.

The image data transfer means 1 detects the image data of a rectangular area of an arbitrary position and size by the pin array detection unit 8
The rectangular area has a function of transferring to a rough position detection result (for example, a rough part detected by a general rough position detecting method of a component by image processing or mechanical processing that has been widely used in the past. Of the center of gravity and inclination of the component obtained from the image of PGA), and the standard dimension data of the component, such as the pin interval and size, the pin position with respect to the center position of the component, and the like.
A processing area including the entire pins is set for each pin of the GA part (see FIG. 4), and the image data in the area is sequentially transferred as a rectangular area.

The horizontal and vertical projection calculation means 41, 4
2 performs projection calculation in the horizontal and vertical directions in the rectangular area based on the sequentially transferred image data. The projection calculation results in the respective directions, which are obtained by the number of pins, are connected in the horizontal and vertical directions and stored by the projection calculation result connection storage means 5.

The pin position detection means 6 is the storage means 5
Edge detection processing such as differential processing is performed on the projection calculation results obtained as two types of one-dimensional array data in the horizontal and vertical directions transferred from the device, and the center position of each pin is detected as the pin position. To do.

That is, as shown in FIG. 5, when the differential calculation is applied to the projection calculation results in each direction, a portion where the distribution of the projection calculation results changes sharply (two locations in each direction) is detected as an edge.

Since the detected edge coincides with the width of the pin, the midpoint of each edge is detected as the pin position along with the size check. The component position calculating means 7 checks the bending and the number of pins based on all the pin positions detected as described above, and then detects the center of gravity position of the entire component and the inclination angle of the component.

In the above description, the pin position is obtained by the method of edge detection by the projection calculation and the differential processing in the pin array detection unit 8. However, in the case of PGA parts, the pin shape (imaging state) is circular. It is needless to say that the pin arrangement can be determined by a method such as blob analysis or template matching because it is stable.

FIG. 6 shows a flow chart for explaining the above-mentioned series of processing procedures, and the operation will be described with reference to FIG. In step S1, the image data of the component to be recognized is captured via the image pickup means 3.

In step S2, the captured image data is stored in the image memory 2 as it is. In step S3, a rectangular transfer area including pins is set using the data of the coarse position detection result obtained in advance via the image data transfer means 1, and the image data of the set transfer area is converted into image data. In response to a command from the transfer means 1, the data is transferred to the pin array detection unit 8 in step S4.

The projected image data of each transferred area is calculated by the horizontal and vertical direction projection calculation means 41 and 42, respectively (steps S5 and S6). The calculated projection calculation results are connected in step S7 via the projection calculation result connection storage means 5 to form two types of one-dimensional array data.

In step S8, the one-dimensional array data is differentiated to detect edges. Further step S9
The pin center position is calculated from the edge obtained in step 3.

Finally, in step S10, the barycentric position and inclination of the component are obtained based on all pin positions, and the component position recognition is completed.

[0026]

As described above, according to the present invention, the position recognition of the parts is performed by the PG.
Even in the case of a component having an extremely large number of pins, such as the component A, an effect that it can be performed at high speed and with high precision can be expected.

[Brief description of drawings]

FIG. 1 is a block diagram showing a configuration of a component position recognition device of the present invention.

FIG. 2 is a schematic perspective view of a PGA component.

FIG. 3 is a bottom view image of a captured PGA component.

FIG. 4 is a diagram showing an image transfer area for pin position detection.

FIG. 5 is an explanatory diagram showing a procedure of pin center position detection.

FIG. 6 is a flowchart illustrating an operation of the component position recognition method of the present invention.

[Description of Reference Signs] 1 image data transfer means 2 image memory 3 image pickup means 41 horizontal direction projection calculation means 42 vertical direction projection calculation means 5 projection calculation result connection storage means 6 pin position detection means 7 component position calculation means

Claims (3)

[Claims] 1. An image memory for storing image data of a component to be recognized, and image data transfer means for transferring image data in an area of an arbitrary position and size of the image data in the image memory to a pin array detection unit. A component position recognizing device comprising component position calculating means for calculating a component position based on the pin arrangement detected by the pin arrangement detecting unit. 2. The pin array detection unit includes a calculation unit that performs a projection calculation in horizontal and vertical directions on image data of an arbitrary area transferred from the image memory by the image data transfer unit, and the horizontal and vertical calculation units. 2. The connection storage means for connecting and storing the projection calculation result in the vertical direction, and the pin position detection means for detecting the pin position of the component from the projection calculation result data transferred from the connection storage means. The component position recognition device described. 3. A step of storing, in an image memory, image data of a component to be recognized captured by an image pickup means, and image data in the area for each predetermined area of the image data stored in the image memory. And the step of performing a projection operation in the horizontal and vertical directions on the transferred image data of an arbitrary area, and the obtained projection operation results in each direction for each area are concatenated and stored. And a step of calculating the position of the component based on the obtained pin position, and a step of detecting the pin position by using the stored projection calculation results in the two directions as one-dimensional array data.