JP2009239150A - Component recognition method in electronic-component mounting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a component recognition method in an electronic-component mounting device that achieves improvement in productivity of an electronic-component mounting device by preventing image processing errors associated with a brightness difference. <P>SOLUTION: In a step S2, an image of an electronic component 25 is obtained as a gray value by an imaging device 70. In a step S3, a blob is obtained by binarizing the gray value on the basis of a threshold. In a step S4, the blob and a reference blob are compared with each other so as to determine whether the image processing result is normal or abnormal. In a step S8, when determined that the image processing result is abnormal and determined by a worker that the electronic component 25 is normal, the threshold and the blob are corrected. In a step S9, a reference threshold and the reference blob are calculated on the basis of the corrected threshold and the corrected blob so as to store the reference threshold and the reference blob. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a component recognition method in an electronic component mounting apparatus in which an electronic component supplied from a component supply apparatus is sucked by a suction nozzle and an electronic component recognized by an imaging device is mounted on a printed board.

  Conventionally, a component recognition method in an electronic component mounting apparatus described in Patent Literatures 1 and 2 is known. The component recognition method in the electronic component mounting apparatus described in Patent Document 1 measures the dimensions of the electronic component supplemented by the imaging device, compares the data about the dimension with the data about the dimension of the electronic component before supplementation, If the dimensional difference is within the allowable range, the production is continued.

  Further, the component recognition method in the electronic component mounting apparatus described in Patent Document 2 calculates the size of the electronic component by processing the image of the electronic component imaged by the imaging device, and within an allowable range based on the learning value. It is determined whether or not there is. If the calculated size is within an allowable value range based on the learning value, a new learning value is calculated and recognition is normal. If the calculated size is outside the allowable value range based on the learning value, it is determined whether the calculated size is within the allowable value range based on the part library data. If the calculated size is within the permissible range based on the part library data, it is determined whether or not the part has just been generated. If it is immediately after the occurrence of a component cut, the learning value is cleared and the recognition is normal. In addition, when it is not immediately after the occurrence of a component cut, a new learning value is calculated and recognition is normal.

According to the component recognition method in the electronic component mounting apparatus described in these Patent Documents 1 and 2, if the component is out of stock and a new electronic component is replenished, the size of the electronic component is within a predetermined allowable range. Production can be continued, and the creation of the electronic component data of the worker and the registration work to the apparatus can be omitted.
JP-A-7-326900 (second page, third page, FIG. 1) JP 2003-249799 A (page 6, page 7, FIG. 9)

  However, in the component recognition method in the conventional electronic component mounting apparatus described in Patent Documents 1 and 2 described above, although an allowable range is provided for the size of the electronic component, brightness is not considered. For this reason, between electronic components that have the same electronic component but have a difference in brightness, such as the body and leads, as a result of image processing, it is determined that the size of the electronic component is significantly different, and production cannot be continued. Can happen. In particular, in front light illumination that illuminates an electronic component from the side facing the suction end face of the suction nozzle, a brightness difference between the body and the lead greatly affects the image processing result, so that an image processing error is likely to occur.

  SUMMARY OF THE INVENTION The present invention has been made in view of the above-described conventional problems. Component recognition in an electronic component mounting apparatus that can improve the productivity of the electronic component mounting apparatus by preventing image processing errors due to brightness differences. A method is provided.

  In order to solve the above-mentioned problem, a feature of the component recognition method in the electronic component mounting apparatus according to claim 1 is that the electronic component supplied from the component supply device is sucked by the suction nozzle and recognized by the imaging device. In the component recognition method for an electronic component mounting apparatus for mounting a circuit board on a printed circuit board, an image acquisition step for obtaining an image of the electronic component as a gray value by the imaging device, and binarizing the gray value based on a threshold value to obtain a blob The image processing result is compared with the threshold value and the blob, and the reference threshold value and the reference blob to determine whether the image processing result is normal or abnormal, and the image processing result is determined in the image processing result determining step. An image processing correcting step for correcting the threshold value and the blob when the electronic component is determined to be normal by an operator, Wherein the reference threshold and the reference blobs based on a threshold and blob calculated, is to and a storage step of storing the reference threshold and reference blob after.

  The feature of the component recognition method in the electronic component mounting apparatus according to claim 2 is that the electronic component supplied from the component supply device is sucked by a suction nozzle and the electronic component recognized by the imaging device is mounted on a printed board. In the component recognition method in the apparatus, an image acquisition step of obtaining an image of the electronic component as a gray value by the imaging device, an image processing step of binarizing the gray value based on a threshold value to obtain a blob, and the threshold value and the blob And the reference threshold value and the reference blob to determine whether the image processing result is normal or abnormal. In the image processing result determining step, the image processing result is determined to be abnormal. The threshold value and the blob are corrected when the electronic components are within a predetermined number and the operator determines that the electronic components are normal. An image processing correction process, the reference threshold and the reference blobs calculated on the basis of the threshold and blob after correction is to and a storage step of storing the reference threshold and reference blob.

  In the component recognition method in the electronic component mounting apparatus according to claim 1, in the image processing correction step, the image processing result is determined to be abnormal in the image processing result determination step, and the electronic component is determined to be normal by the operator. Sometimes, the threshold value and the blob are corrected, and in the storing step, the reference threshold value and the reference blob are calculated based on the corrected threshold value and the blob, and the reference threshold value and the reference blob are stored. Therefore, when the electronic components are the same electronic components but have different brightness differences such as the body and leads, the corrected threshold value and blob are reflected as the reference threshold value and reference blob, and the same electronic component results in an image processing error. Can be prevented. Therefore, according to the component recognition method in this electronic component mounting apparatus, it is possible to improve the productivity of the electronic component mounting apparatus by preventing image processing errors due to brightness differences. If the image processing result is determined to be abnormal in the image processing result determining step, the threshold value and the blob can be corrected based on the determination by the operator without immediately discarding the electronic component, so that delicate data adjustment is possible. This can be particularly effective when it is necessary.

  In the component recognition method in the electronic component mounting apparatus according to claim 2, in the image processing correction step, the image processing result is determined to be abnormal, the electronic components are within a predetermined number after the supply switching, and the operator When it is determined that the electronic component is normal, the threshold value and the blob are corrected. In the storing step, the reference threshold value and the reference blob are calculated based on the corrected threshold value and the blob, and the reference threshold value and the reference blob are stored. Therefore, within the predetermined number after supply switching, when the electronic parts are the same electronic parts as before the supply switching, but the difference in brightness such as the body and lead is different, the corrected threshold and blob are used as the reference threshold and reference blob. It is reflected and it is possible to prevent the electronic component after the supply switching from being an image processing error. Therefore, according to the component recognition method in this electronic component mounting apparatus, it is possible to improve the productivity of the electronic component mounting apparatus by preventing image processing errors due to brightness differences.

  Embodiments 1 and 2 that embody a component recognition method in an electronic component mounting apparatus according to the present invention will be described below with reference to the drawings. FIG. 1 shows an electronic component mounting apparatus 100 that employs the component recognition method of the first embodiment. The electronic component mounting apparatus 100 includes a component supply device 10, a substrate transfer device 80, a component transfer device 90, and a control device 120.

  The component supply apparatus 10 is configured by arranging a plurality of cassette-type feeders 11 on a base frame 99. The cassette type feeder 11 includes a main body 12 that is detachably attached to the base frame 99, a supply reel 13 that is detachably attached to a rear portion of the main body 12, and a component supply position 14 that is provided at the tip of the main body 12. ing. As shown in FIG. 2, a supply reel 13 is rotatably and detachably attached to the main body 12 of the cassette type feeder 11. A carrier tape 20 that holds a predetermined number of electronic components 25 at a constant pitch is wound around the supply reel 13.

  As shown in FIG. 3, the carrier tape 20 is composed of a resin embossed tape 21 that is formed to be elongated with a predetermined width, and a cover tape 24 that is bonded to the embossed tape 21. In the longitudinal direction of the embossed tape 21, cavities 22 in which the electronic components 25 are enclosed are recessed at a predetermined pitch, and on one end side in the width direction of the embossed tape 21, feed holes 23 have the same pitch as the cavities 22. It is penetrated at intervals.

  As shown in FIG. 2, the carrier tape 20 wound around the supply reel 13 is sent to the main body 12 of the cassette type feeder 11 one pitch at a time, and the electronic components 25 are transferred one by one to the component supply position 14. A device 15 is provided. The transfer device 15 includes a guide portion 16 that guides the carrier tape 20 to the component supply position 14, a sprocket 17 that is rotatably supported by the main body 12 and engages with a feed hole 23 of the carrier tape 20, and the sprocket 17 for one pitch. And a motor (not shown) that rotates each time. The main body 12 is provided with a plurality of rollers 18 for guiding the cover tape 24 to be peeled off before the component supply position 14 and discharged to a predetermined position.

  As shown in FIG. 1, the board | substrate conveyance apparatus 80 is what is called a double conveyor type which arranged the 1st conveyance apparatus 81 and the 2nd conveyance apparatus 82 in parallel, and conveys the printed circuit board 75 to the X-axis direction. The first transport device 81 (second transport device 82) has a pair of guide rails 84a and 84b (85a and 85b) arranged parallel to each other on the base 83 in parallel with each other. A pair of conveyor belts (not shown) that support and convey the printed circuit board 75 guided by 84b (85a, 85b) are arranged in parallel to face each other. Also, the substrate transport device 80 is provided with a clamp device (not shown) that pushes up and clamps the printed circuit board 75 transported to a predetermined position, and the printed circuit board 75 is positioned and fixed at the mounting position by the clamp device. In addition, an imaging device 70 and a disposal box 110 are provided between the component supply device 10 and the substrate transfer device 80. The imaging device 70 recognizes the suction state of the electronic component 25 sucked by a suction nozzle provided in the mounting head 93 described later, and the defective product is discarded in the disposal box 110.

  The component transfer device 90 is of the XY robot type, is mounted on the base frame 99, is disposed above the substrate transfer device 80 and the component supply device 10, and is moved in the Y-axis direction by the Y-axis motor 91. Y-axis slider 92 is provided. A mounting head 93 is attached to the Y-axis slider 92 to attract electronic components and mount them on the printed circuit board 75.

  The control device 120 includes a computer 121 and a display 122 having a touch panel. The computer 121 controls the electronic component mounting apparatus 100 and stores programs and data. The display 122 is a man-machine interface that transmits information between the computer 121 and an operator.

  In the electronic component mounting apparatus 100 configured as described above, an outline of an operation for mounting the electronic component 25 on the printed circuit board 75 will be described with reference to a flowchart of the electronic component mounting program shown in FIG. This electronic component mounting program is loaded in the storage device of the computer 121. When the electronic component mounting program is executed, in step S 1, the mounting head 93 is moved to the component supply position 14, and the electronic component is sucked by the suction nozzle of the mounting head 93. That is, when the sprocket 17 is rotated by one pitch by the motor, the carrier tape 20 is fed by one pitch by the sprocket 17 and the electronic components 25 stored in the cavity 22 are supplied to the component supply position 14 one by one. . The electronic component 25 is sucked by the suction nozzle of the mounting head 93.

  In step S2, the mounting head 93 is moved, and the electronic component 25 sucked by the suction nozzle is moved to the component recognition position. Then, the suction state of the electronic component 25 is imaged by the imaging device 70 at the component recognition position. The image of the electronic component 25 imaged by the imaging device 70 is stored in the storage device of the computer 121 as an 8-bit gray value for every approximately 1000 × 1000 pixels. Here, step S2 is an “image acquisition step”.

  In step S3, an image processing result is obtained based on the gray value. The image processing result includes a threshold value for binarizing the gray value and a blob obtained by binarization. As a method for obtaining the threshold value, for example, a discriminant analysis method for obtaining the threshold value from a histogram of gray values can be employed. Here, step S3 is an “image processing step”.

  In step S4, the threshold value and the blob obtained in step S3 are compared with the reference threshold value and the reference blob to determine whether the image processing result is normal or abnormal. Specifically, it is determined whether or not the threshold value and the size / position of the blob are within an allowable range with respect to the reference threshold value and the size / position of the reference blob. Here, for the electronic component 25 that has already been determined to be non-defective, image processing results such as gray values, threshold values, blobs, reference threshold values, and reference blobs are stored in the storage device of the computer 121. If the image processing result is normal, step S9 is executed, and if the image processing result is abnormal, step S6 is executed. Here, step S4 is an “image processing result determination step”.

  If the image processing result is abnormal, in step S6, the electronic component mounting apparatus 100 is stopped, and a message that prompts the operator to confirm whether the electronic component 25 is good or defective is displayed on the display 122. After confirming whether the electronic component 25 is a non-defective product or a defective product, the worker inputs information (good product or defective product) about the electronic component 25 from the touch panel of the display 122. This information is input by the computer 121.

  In step S <b> 7, it is determined whether or not the electronic component 25 is a non-defective product from the information on the electronic component 25 input from the touch panel of the display 122. If the electronic component 25 is a non-defective product, step S8 is executed. If the electronic component 25 is a defective product, step S11 is executed. In step S11, the electronic component 25 is discarded in the disposal box 110, and the electronic component mounting program is terminated. Here, step S8 is an “image processing correction step”.

  When step S8 is executed, the image processing result (threshold and blob data) of the electronic component 25 is corrected because it is determined that the image processing result is abnormal although the electronic component 25 is a non-defective product. It is necessary to keep it. Thus, by reflecting the image processing result of the electronic component 25 in the reference threshold value and the reference blob, it is possible to determine that the image processing result for the electronic component 25 similar to the electronic component 25 is normal. it can. In step S8, the blog / threshold adjustment program (see FIG. 5) is executed. In step S9, the new reference threshold value and the size / position of the reference blob are calculated, and the image processing results such as the gray value, the threshold value, and the blob, and the new reference threshold value and the size / position of the reference blob are calculated. Are stored in the storage device of the computer 121. The size and position of the reference threshold and the reference blob can be obtained as an average value of the size and position of the threshold and the blob, for example. In step S10, the electronic component 25 is mounted at a predetermined position on the printed circuit board 75, and the electronic component mounting program is terminated.

  In the blog / threshold adjustment program shown in FIG. 5, in step S20, it is determined whether or not there is a difference between the blob obtained in step S3 and the reference blob. Specifically, if the size / position of the blob is within an allowable range with respect to the size / position of the reference blob, it is determined that there is no difference between the two and step S25 is executed. If the size / position of the blob is not within the allowable range with respect to the size / position of the reference blob, it is determined that there is a difference between the two and step S21 is executed.

  In step S <b> 21, a message is displayed on the display 122 that allows the operator to confirm a method (automatic or manual) of inputting blob data. The operator inputs information about a method (automatic or manual) of inputting blob data from the touch panel of the display 122. This information is input by the computer 121.

  In step S <b> 22, it is determined whether or not the blob data input method is automatic from the information on the blob data input method input from the touch panel of the display 122. If the method for inputting blob data is automatic, step S23 is executed. If the method for inputting blob data is manual, step S24 is executed.

  In step S23, the blob data is automatically corrected from the gray value stored in the storage device of the computer 121. In step S24, the blob data is manually corrected by the data editing tool. In steps S23 and S24, as the data of the blob is corrected, the threshold value is changed to a value capable of creating the blob. After execution of steps S23 and S24, step S25 is executed.

  In step S25, it is determined whether or not there is a difference between the threshold (the value after the change if the threshold is changed in steps S23 and 24, the value obtained in step S3 if the threshold is not changed) and the reference threshold. Is done. Specifically, if the threshold value is within an allowable range with respect to the reference threshold value, it is determined that there is no difference between the two, the blob / threshold adjustment program is terminated, and control is returned to the electronic component mounting program. If the threshold value is not within the allowable range with respect to the reference threshold value, it is determined that there is a difference between them, and it is checked in step S26 whether or not the threshold value is automatically set. If the threshold is automatically set, control is returned to the electronic component mounting program. If the threshold value is not within the allowable range with respect to the reference threshold value, it is determined that there is a difference between them, and step S27 is executed.

  In step S <b> 27, a message for causing the worker to change the threshold value is displayed on the display 122. The operator inputs information for changing the threshold value from the touch panel of the display 122. This information is input by the computer 121.

  In step S28, it is checked whether or not to change the threshold value. When the threshold value is not changed, the threshold value is left as it is, and control is returned to the electronic component mounting program. When changing the threshold, it is checked whether or not to change to automatic setting. When the threshold value is changed to automatic setting, control is returned to the electronic component mounting program after the automatic setting is changed in step S30.

  In step S32, the threshold value is manually changed. However, since the optimum threshold value is displayed on the display 122, the operator can refer to this. At this time, the gray value is binarized based on the threshold value input by the operator, and the blob thus obtained is displayed on the display 122. Therefore, the worker can determine the threshold value after confirming the blob displayed on the display 122. Then, after the threshold is changed, control is returned to the electronic component mounting program.

  In the component recognition method in the electronic component mounting apparatus according to the first embodiment, in step S8, when the image processing result is determined to be abnormal in step S4 and the electronic component 25 is determined to be normal by the operator, the threshold value is set. In step S9, the reference threshold value and the reference blob are calculated based on the corrected threshold value and the blob, and the reference threshold value and the reference blob are stored. Therefore, in the case where the electronic components 25 have different brightness differences such as the body and leads even though they are the same electronic component 25, the corrected threshold value and blob are reflected as the reference threshold value and the reference blob, and the same electronic component 25 is subjected to image processing. An error can be prevented. Therefore, according to the component recognition method in the electronic component mounting apparatus of Embodiment 1, it is possible to improve the productivity of the electronic component mounting apparatus 100 by preventing an image processing error due to a brightness difference. If the image processing result is determined to be abnormal in step S4, the electronic component mounting apparatus 100 is always stopped and the operator is allowed to determine whether the electronic component 25 is normal or abnormal (step S6). Therefore, even though the electronic component 25 is a non-defective product, it can be prevented from being discarded as a defective product in the disposal box 110 and can be particularly effective when delicate data adjustment is necessary. .

  Next, a component recognition method in the electronic component mounting apparatus according to the second embodiment will be described. In the second embodiment, as in the first embodiment, the electronic component mounting apparatus 100, the cassette type feeder 11 and the like shown in FIGS. FIG. 6 is a flowchart of an electronic component mounting program showing an outline of an operation of mounting the electronic component 25 on the printed circuit board 75 using the electronic component mounting apparatus 100, and is similar to the flowchart of the electronic component mounting program shown in FIG. The same number is used for the processing of, and the description thereof is omitted.

  FIG. 6 is different only in that step S5 is inserted between step S4 and step S6 in FIG. In step S5, it is checked whether or not the number of electronic components 25 is a predetermined number from the detection of component replacement. When the predetermined number is detected from the component replacement, Steps S6 to S10 are executed as in the first embodiment shown in FIG. 4, and when the predetermined number is not detected from the component replacement, the electronic component 25 is placed in the disposal box 110 in Step S11. After being discarded, the electronic component mounting program is terminated.

  That is, while it is determined that the image processing result is abnormal and the number of electronic components 25 is a predetermined number from the detection of component replacement, the electronic component mounting apparatus 100 is stopped and the image processing results (threshold and Blob data) is corrected, or the electronic component 25 is discarded in the disposal box 110. Further, when it is determined that the image processing result is abnormal and the number of electronic components 25 is not a predetermined number from the detection of component replacement, it is the same as the case where the abnormality of the normal image processing result is detected, and the electronic component mounting apparatus 100 The electronic component 25 is discarded in the disposal box 110 without stopping. Here, “part replacement” refers to replenishment of a new electronic component 25 due to the occurrence of component breakage. When the cassette-type feeder 11 is replaced or wound around the supply reel 13 with fewer electronic components 25. This occurs, for example, when splicing is performed to connect the end portion of the rotated carrier tape 20 and the start end portion of the carrier tape 20 wound around the new supply reel 13. The “predetermined number” may be a case where a certain number of non-defective products are detected continuously.

  In the component recognition method in the electronic component mounting apparatus according to the second embodiment, in step S8, it is determined that the image processing result is abnormal, the electronic components 25 are within the predetermined number after the supply switching, and the operator performs electronic processing. When it is determined that the component 25 is normal, the threshold value and the blob are corrected. In step S9, the reference threshold value and the reference blob are calculated based on the corrected threshold value and the blob, and the reference threshold value and the reference blob are stored. Therefore, in the predetermined number after the supply switching, when the electronic component 25 is the same electronic component 25 as before the supply switching but the brightness difference such as the body and the lead is different, the corrected threshold and blob are the reference threshold and the reference. Reflected as a blob, it is possible to prevent the electronic component 25 after the supply switching from causing an image processing error. Therefore, even by the component recognition method in the electronic component mounting apparatus according to the second embodiment, it is possible to improve the productivity of the electronic component mounting apparatus 100 by preventing image processing errors due to brightness differences. The electronic component mounting apparatus 100 is stopped only while the image processing result is determined to be abnormal and the predetermined number of electronic components 25 have been detected since the replacement of the component, and the operator is informed of whether the electronic component 25 is normal or abnormal. It is judged (step S6). On the other hand, even if it is determined that the image processing result is abnormal, if the electronic component 25 is not a predetermined number from the component replacement detection, the electronic component mounting apparatus 100 is not stopped and the electronic component 25 is discarded. 110 is discarded. Therefore, the effect can be exhibited particularly when delicate data adjustment is not so necessary except when the electronic component 25 is replaced.

  In the above, although the component recognition method in the electronic component mounting apparatus of this invention was demonstrated according to Embodiment 1, 2, this invention is not restrict | limited to these, unless it is contrary to the technical idea of this invention. Needless to say, the present invention can be appropriately changed and applied.

The perspective view of an electronic component mounting apparatus in connection with the component recognition method in the electronic component mounting apparatus of Embodiment 1,2. The front view of a cassette type feeder in connection with the component recognition method in the electronic component mounting apparatus of Embodiment 1,2. The perspective view of the carrier tape wound around the supply reel in connection with the component recognition method in the electronic component mounting apparatus of Embodiment 1,2. The flowchart of the electronic component mounting program in connection with the component recognition method in the electronic component mounting apparatus of Embodiment 1. 7 is a flowchart of a blob / threshold adjustment program according to a component recognition method in the electronic component mounting apparatus according to the first and second embodiments. The flowchart of an electronic component mounting program in connection with the component recognition method in the electronic component mounting apparatus of Embodiment 2.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Component supply apparatus, 25 ... Electronic component, 70 ... Imaging device, 75 ... Printed circuit board, 100 ... Electronic component mounting apparatus, S2 ... Image acquisition process, S3 ... Image processing process, S4 ... Image processing result judgment process, S8 ... Image processing correction step, S9 ... storage step.

Claims (2)

In the component recognition method in the electronic component mounting apparatus in which the electronic component supplied from the component supply device is sucked by the suction nozzle and the electronic component recognized by the imaging device is mounted on the printed board
An image acquisition step of obtaining an image of the electronic component as a gray value by the imaging device;
An image processing step for binarizing the gray value based on a threshold and obtaining a blob;
An image processing result determination step for comparing the threshold value and the blob with a reference threshold value and a reference blob to determine whether the image processing result is normal or abnormal.
An image processing correction step of correcting the threshold and the blob when the image processing result is determined to be abnormal in the image processing result determination step and the electronic component is determined to be normal by an operator;
And a storage step of calculating the reference threshold and the reference blob on the basis of the corrected threshold and the blob and storing the reference threshold and the reference blob. In the component recognition method in the electronic component mounting apparatus in which the electronic component supplied from the component supply device is sucked by the suction nozzle and the electronic component recognized by the imaging device is mounted on the printed board
An image acquisition step of obtaining an image of the electronic component as a gray value by the imaging device;
An image processing step for binarizing the gray value based on a threshold and obtaining a blob;
An image processing result determination step for comparing the threshold value and the blob with a reference threshold value and a reference blob to determine whether the image processing result is normal or abnormal.
When the image processing result is determined to be abnormal in the image processing result determination step, the threshold value and the electronic component within the predetermined number after supply switching and the electronic component is determined to be normal by an operator An image processing correction process for correcting the blob;
And a storage step of calculating the reference threshold and the reference blob on the basis of the corrected threshold and the blob and storing the reference threshold and the reference blob.

Images