JP2018063973A - Component mounting machine and component recognition method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To allow a package type of an appropriate component to be used as a component recognition condition.SOLUTION: A component mounting method includes the steps of: supplying a component including the same type of package; holding the supplied component with a mounting head; acquiring a photographic image of the component by photographing the component held with the mounting head; and comparing the photographic image with component recognition conditions including a condition of having a characteristic of one object package set from different types of plural packages, has the mounting head mount the component on a circuit board if the photographic image satisfies the component recognition conditions, and has the mounting head discard the component if the photographic image does not satisfy the component recognition conditions; and performing condition adjustment processing to adjust the component recognition conditions on the basis of the photographic image. The condition adjustment processing includes processing to adjust a package set as the object package from the plurality of packages on the basis of the photographic image.SELECTED DRAWING: Figure 10

Description

  The present invention relates to a technique for determining whether a captured image obtained by capturing a component satisfies a predetermined component recognition condition in order to permit or prohibit a component held by a mounting head from being mounted on a substrate.

  Conventionally, in a component mounter that mounts a component on a board with a mounting head, mounting of the component is permitted or not based on whether or not a result of recognizing the component held by the mounting head with a camera satisfies a predetermined component recognition condition. It is forbidden. Specifically, in Patent Document 1, mounting of a component is permitted if the amount of deviation from the standard value of the component dimension recognized by the camera is within a predetermined allowable range, and mounting of the component is otherwise performed. It is forbidden. By the way, the allowable range of such component dimensions is not always appropriate, and may be too narrow for an appropriate range, for example. Therefore, in Patent Document 1, control is performed to widen the allowable range of component dimensions based on the obtained dispersion or standard deviation of component dimensions.

Japanese Patent No. 4927457

  However, there are various types of component packages. For this reason, if the package type used for the component recognition condition is inappropriate, there may be a problem of erroneous determination such that it is determined that the mounting of the component that should originally be permitted is prohibited. When such a problem occurs, it is difficult to avoid erroneously determining that mounting is prohibited when the allowable range of component dimensions is expanded. Therefore, it is important to use an appropriate component package type as the component recognition condition.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a technique that makes it possible to use a package type of an appropriate component as a component recognition condition.

  A component mounter according to the present invention includes a component supply unit that supplies components having the same type of package, a substrate transfer unit that transfers a substrate, and a substrate that is supported by the substrate transfer unit. The features of the mounting head to be mounted on, the component imaging unit that acquires the captured image of the component by imaging the component held by the mounting head, and one target package set from a plurality of different types of packages Compare the component recognition condition including the condition of having a captured image with the captured image. If the captured image satisfies the component recognition condition, the component is mounted on the mounting head. If the captured image does not satisfy the component recognition condition, the component is mounted. A control unit that causes the head to discard the component, and the control unit executes a condition adjustment process for adjusting the component recognition condition based on the captured image, and the condition adjustment process includes a plurality of packages. Including processing is adjusted based on the captured image of the package is set as a target package from among.

  The component mounting method according to the present invention includes a step of supplying a component having the same type of package, a step of holding the supplied component by the mounting head, and imaging the component by imaging the component held by the mounting head. A component recognition condition including a step of acquiring an image and a condition of having a feature of one target package set from a plurality of different types of packages is compared with the captured image, and the captured image satisfies the component recognition condition. If it satisfies, the mounting head executes the mounting of the component on the board, and if the captured image does not satisfy the component recognition condition, the mounting head discards the component, and the component recognition condition is adjusted based on the captured image. A process for executing a condition adjustment process. The condition adjustment process is a captured image of a package set as a target package among a plurality of packages. Based comprising a process of adjusting.

  In the present invention (component mounter and component mounting method) configured as described above, a captured image of a component is acquired by capturing an image of the component held by the mounting head. Then, a component recognition condition including a condition that the target package has a feature set from a plurality of different types of packages is compared with the captured image. As a result of this comparison, when the captured image satisfies the component recognition condition, the mounting head executes the mounting of the component on the substrate. On the other hand, when the captured image does not satisfy the component recognition condition, the mounting head discards the component. In addition, the component recognition conditions used here are adjusted based on the captured image by executing the condition adjustment process. In particular, the condition adjustment process includes a process of adjusting a package set as a target package from a plurality of packages based on the captured image. In this way, the target package used for the component recognition condition among a plurality of different types of packages is adjusted based on the captured image obtained by actually capturing the component. Therefore, it is possible to use an appropriate component package type as the component recognition condition.

  In addition, the component recognition conditions include a condition that the reference location of the target package is within a predetermined size range, and the condition adjustment process includes a process for adjusting the size range based on the captured image. It may be configured. Thus, an appropriate dimension range can be used as the component recognition condition.

  The component imaging unit includes illumination that irradiates the component with light, and the condition adjustment process configures the component mounter so as to include a process that adjusts the intensity of light emitted by the illumination based on the captured image. Also good. Thus, a captured image can be acquired while irradiating the component with light of appropriate intensity.

  In addition, a storage unit that stores a plurality of captured images is further provided, and the control unit adjusts the component recognition condition based on the plurality of captured images stored in the storage unit, so as to execute the condition adjustment processing. A machine may be configured. As described above, based on a plurality of captured images, the component recognition conditions can be adjusted more accurately.

  In addition, the component mounter is such that the plurality of captured images stored in the storage unit include a first captured image that is a captured image that does not satisfy the component recognition condition and a second captured image that is a captured image that satisfies the component recognition condition. May be configured. In such a configuration, it is possible to adjust the component recognition conditions more accurately based on both the captured image that does not satisfy the component recognition conditions (first captured image) and the image that satisfies the component recognition conditions (second captured image). It becomes.

  In addition, when a plurality of first captured images are continuously acquired, the control unit stores only the first captured image acquired first in the storage unit, and the plurality of second captured images continuously. When acquired, only the first captured image acquired first is stored in the storage unit, so that the first captured image and the second captured image are alternately stored in the storage unit one by one. A mounting machine may be configured. Such a configuration can acquire the numbers of the first captured image and the second captured image in a well-balanced manner, and contributes to appropriately adjusting the component recognition conditions.

  In addition, in the condition adjustment process, the control unit executes, for each of the plurality of captured images stored in the storage unit, an operation for specifying one package having a characteristic that the captured image satisfies from among the plurality of packages. The component mounter may be configured such that one package having the largest number of captured images satisfying the characteristics is set as the target package. This makes it possible to use an appropriate component package type as the component recognition condition.

  As described above, according to the present invention, an appropriate component package type can be used as a component recognition condition.

The partial top view which shows typically an example of the component mounting machine which concerns on this invention. The block diagram which shows an example of the electrical constitution with which the component mounting machine of FIG. 1 is provided. The figure which shows an example of the type of the package of components in a table format. The figure which shows an example of the structure of component data in a table format. The flowchart which shows an example of the condition adjustment process performed in parallel with board | substrate production. The figure which shows typically an example of the process performed by components recognition. The flowchart which shows an example of the process performed by illumination level estimation. The figure which shows typically the relationship between an illumination level and the luminance distribution in a lead | read | reed. The figure which shows an example of the frequency distribution table which makes a lighting level a class. The flowchart which shows an example of the process performed by components data preparation. The flowchart which shows an example of the process performed by a data update process.

  FIG. 1 is a partial plan view schematically showing an example of a component mounter according to the present invention. FIG. 2 is a block diagram showing an example of an electrical configuration provided in the component mounter of FIG. In FIG. 1, XYZ orthogonal coordinates composed of a Z direction parallel to the vertical direction and an X direction and a Y direction parallel to the horizontal direction are shown as appropriate. As shown in FIG. 2, the component mounter 1 includes a controller 100 that comprehensively controls the entire apparatus. The controller 100 includes an arithmetic processing unit 110 that is a computer configured with a CPU (Central Processing Unit) and a RAM (Random Access Memory), and a storage unit 120 configured with an HDD (Hard Disk Drive). Further, the controller 100 includes a drive control unit 130 that controls the drive system of the component mounting machine 1 and an imaging control unit 140 that controls imaging of the component E (FIG. 1) that is a component mounting target.

  Then, the arithmetic processing unit 110 controls the drive control unit 130 according to the mounting program stored in the storage unit 120, thereby executing component mounting in a sequence defined by the mounting program. At this time, the arithmetic processing unit 110 controls component mounting based on the image of the component E captured by the component imaging unit 5 by the imaging control unit 140. Further, the component mounter 1 is provided with a display / operation unit 150, and the arithmetic processing unit 110 displays the status of the component mounter 1 on the display / operation unit 150, or inputs it to the display / operation unit 150. Or accepting instructions from a designated worker.

  As shown in FIG. 1, the component mounter 1 includes a pair of conveyors 12 and 12 provided on a base 11. And the component mounting machine 1 mounts components on the board | substrate B carried in to the mounting operation position (position of the board | substrate B of FIG. 1) from the upstream of the X direction (board | substrate conveyance direction) with the conveyor 12, and mounts components. The completed board B is carried out from the mounting work position to the downstream side in the X direction by the conveyor 12.

  The component mounter 1 is provided with a pair of Y-axis rails 21, 21 extending in the Y direction, a Y-axis ball screw 22 extending in the Y direction, and a Y-axis motor My that rotationally drives the Y-axis ball screw 22, and a head support member 23 is fixed to the nut of the Y-axis ball screw 22 while being supported by the pair of Y-axis rails 21 and 21 so as to be movable in the Y direction. An X-axis ball screw 24 extending in the X direction and an X-axis motor Mx that rotationally drives the X-axis ball screw 24 are attached to the head support member 23, and the head unit 3 can move to the head support member 23 in the X direction. The nut is fixed to the nut of the X-axis ball screw 24 while being supported by the nut. Therefore, the drive control unit 130 rotates the Y-axis ball screw 22 by the Y-axis motor My to move the head unit 3 in the Y direction, or rotates the X-axis ball screw 24 by the X-axis motor Mx to move the head unit 3 to X. Can be moved in the direction.

  On each side of the pair of conveyors 12 and 12 in the Y direction, two component supply units 28 are arranged in the X direction. A plurality of tape feeders 281 are detachably attached to each component supply unit 28 along the X direction. Each tape feeder 281 is provided with a reel on which a carrier tape containing small pieces of electronic components E such as integrated circuits, transistors, capacitors and the like is wound at predetermined intervals, and the carrier tape drawn out from this reel. Is loaded into the tape feeder 281. Note that a plurality of parts E having the same type of package P (FIG. 3), that is, a plurality of parts E of the same type, are stored in the carrier tape loaded in one tape feeder 281. Then, the tape feeder 281 sequentially feeds the parts E of the same type to the front end portion by intermittently feeding the carrier tape to the head unit 3 side.

  The head unit 3 has a plurality (four) of mounting heads 4 arranged in a straight line in the X direction. Each mounting head 4 can move up and down in the Z direction under the driving force of the Z-axis motor Mz, and the drive control unit 130 can raise and lower each mounting head 4 by the Z-axis motor Mz. Each mounting head 4 sucks and mounts the component E by a nozzle attached to the lower end. Specifically, the mounting head 4 moves directly above the component E supplied to the tip of the tape feeder 281. Then, the mounting head 4 is lowered until the lower end of the nozzle comes into contact with the upper end surface of the component E, and generates a negative pressure in the nozzle. Thereby, the component E is adsorbed by the nozzle (component adsorbing operation). Subsequently, the mounting head 4 rises while maintaining the negative pressure in the nozzle, and takes out the component E from the tape feeder 281. When the component suction operation is completed in this way, the mounting head 4 moves above the substrate B at the mounting work position and mounts the component E on the substrate B. Specifically, the mounting head 4 mounts the component E by generating atmospheric pressure or positive pressure in the nozzle after lowering the nozzle until the component E contacts the substrate B.

  Further, between the component supply units 28 arranged in the X direction, a component imaging unit 5 that images the component E sucked by the mounting head 4 from below is arranged. The component imaging unit 5 includes an imaging camera 51 attached so that its visual field faces upward, and an illumination 52 that illuminates the visual field of the imaging camera 51 by irradiating light upward. The imaging camera 51 images the field of view with a solid-state imaging device such as a CCD (Charge-Coupled Device), and the illumination 52 emits light from a light emitting device such as an LED (Light Emitting Diode). Further, the intensity of the light emitted by the illumination 52, in other words, the illumination level Ll can be variably set in eight stages.

  When the mounting head 4 completes the component suction operation, the component E sucked by the nozzles is stored in the field of view of the imaging camera 51 via the component imaging unit 5 on the way from the tape feeder 281 to the substrate B. . In contrast, the imaging control unit 140 captures an image of the component E with the imaging camera 51 while irradiating the component E with light from the illumination 52. At this time, the arithmetic processing unit 110 controls the intensity of light emitted by the illumination 52 based on the illumination level Ll stored in the storage unit 120. The illumination level Ll is set for each tape feeder 281, and the arithmetic processing unit 110 irradiates the illumination 52 with light of the illumination level Ll corresponding to the tape feeder 281 from which the mounting head 4 has taken out the component E.

  In this way, a captured image I obtained by capturing the component E held by the mounting head 4 is acquired. Then, the arithmetic processing unit 110 recognizes the component E based on the comparison between the component data Dp stored in the storage unit 120 and the captured image I. The component data Dp is created for each tape feeder 281, and the arithmetic processing unit 110 compares the component data Dp corresponding to the tape feeder 281 from which the mounting head 4 has taken out the component E with the captured image I. If the captured image I satisfies the conditions defined in the component data Dp, the arithmetic processing unit 110 determines that the component E has been recognized, and causes the mounting head 4 to mount the component E on the board B. . On the other hand, when the captured image I does not satisfy the conditions defined in the component data Dp, the arithmetic processing unit 110 moves the mounting head 4 above the discarding unit 6 to discard the component E into the discarding unit 6. The mounting head 4 is caused to execute. As will be described later, the arithmetic processing unit 110 alternately accumulates the NG captured image In that has failed in recognition and the OK captured image Io that has failed in recognition in the storage unit 120 one by one.

  In such a component mounter 1, a component E having various types of packages P (FIG. 3) can be mounted on the substrate B. Here, FIG. 3 is a diagram showing an example of the component package type in a table format. As shown in FIG. 3, there are parts E having a plurality of different types of packages P, and each package P has features such as an external dimension S and lead information L. Here, the external dimension S indicates the length, width, and thickness of the package P, and the lead information L indicates the number, width, arrangement pitch, or the like of the leads (that is, electrodes) of the component E. A plurality of tape feeders 281 mounted at different positions can supply parts E having different types of packages P.

  Therefore, in order to appropriately recognize the part E from the captured image I according to the type of the package P of the part E supplied by each tape feeder 281, the part data Dp has a structure as shown in FIG. Here, FIG. 4 is a diagram showing an example of the structure of the component data in a table format. As shown in FIG. 4, in other words, the component data Dp is created for each of the plurality of feeder positions F with respect to the feeder position F to which each of the plurality of tape feeders 281 is mounted. Each component data Dp has a target package Po, an outer dimension S, lead information L, and a recognition parameter R. The target package Po is one package P set with respect to the corresponding feeder position F among a plurality of types of packages P, and the outer dimensions S and the lead information L shown in FIG. 4 are the outer dimensions of the target package Po. Dimension S and lead information L. The recognition parameter R should be satisfied by the luminance threshold Bt (FIG. 6) used to detect the reference location of the part E, specifically, the lead El (FIG. 6) from the captured image I, and the detected lead El. The dimension range Wt (FIG. 6), the dimension range of the outer dimension S, or the like.

  Incidentally, such component data Dp is not always appropriate. For example, the type of the target package Po is inappropriate due to various factors such as an input error by the operator, or the type of the target package Po is appropriate. Also, the set dimension range may be inappropriate. Alternatively, even if the component data Dp is appropriate, the illumination level Ll of the illumination 52 may be inappropriate. As described above, if the conditions such as the component data Dp and the illumination level Ll are inappropriate, it is difficult to accurately recognize the component E. Therefore, the component mounter 1 mounts the component E held from the tape feeder 281 on the substrate B to produce the substrate B on which the component E is mounted, and these conditions are set in the captured image I. The “condition adjustment process” for adjusting based on is executed.

  FIG. 5 is a flowchart showing an example of a condition adjustment process executed in parallel with substrate production. The arithmetic processing unit 110 executes the condition adjustment program stored in the storage unit 120 to individually execute the condition adjustment process of FIG. 5 for each of the plurality of tape feeders 281. In this condition adjustment process, among the captured images I used for component recognition, NG captured images In and OK captured images Io are alternately acquired one by one, for a total of 20 images. Based on these captured images I, conditions Dp, Ll is modified.

  When substrate production is started, the count value N for counting the number of acquired captured images I is reset to zero, and the control for alternately acquiring the NG captured image In and the OK captured image Io is executed. The flag flg is set off (step S101). Then, when the mounting head 4 picks up the component E from the tape feeder 281 and moves it above the component imaging unit 5, component recognition is executed (step S102).

  FIG. 6 is a diagram schematically illustrating an example of processing executed in component recognition. In the drawing, the upper side schematically shows the captured image I of the component E, and the lower side shows the luminance distribution in the captured image I. That is, in the lower graph, the horizontal axis indicates the position in the length direction of the component E, and the vertical axis indicates the luminance. In the component recognition in step S102, the arithmetic processing unit 110 compares the component data Dp corresponding to the feeder position F of the tape feeder 281 from which the component E has been taken out with the captured image I of the component E. Specifically, it is determined whether the captured image I has the characteristics of the target package Po set in the component data Dp. As a feature of the target package Po, for example, the number, width, or arrangement pitch of the leads El of the component E can be cited. Since such a lead El is a metal, the light from the illumination 52 is strongly reflected as compared with other parts of the component E and the background. Therefore, the arithmetic processing unit 110 detects, as the lead El, a range whose luminance is higher than the predetermined luminance threshold Bt in the captured image I, and determines whether the detection result has the characteristics of the target package Po. In this component recognition, it is confirmed whether or not the detected width W of the lead El is within the dimension range Wt defined in the component data Dp. Here, the dimension range Wt indicates the minimum range Wn to the maximum range Wx of the allowable value of the lead width W. Therefore, if the width W of each lead El is equal to or greater than the minimum range Wn and within the maximum range Wx, it is determined that it exists within the dimension range Wt.

  In step S103, if the captured image I does not satisfy the characteristics specified in the component data Dp, it is determined that the recognition of the component E has failed, and the captured image I satisfies the characteristics specified in the component data Dp. It is determined that the recognition of the part E is successful. If it is determined that the component recognition has failed ("NO" in step S103), it is determined whether the component recognition failure is due to a non-adsorption error (step S104). Here, the non-adsorption error indicates an error in which the mounting head 4 fails to pick up the component E from the tape feeder 281 and the component E is not attached to the mounting head 4. The occurrence of the non-adsorption error can be determined by confirming that the lead El cannot be detected from the captured image I or by confirming that no negative pressure exceeding a predetermined value is generated in the nozzle of the mounting head 4.

  If the component recognition failure is due to a non-adsorption error (“YES” in step S104), the process proceeds to step S111. On the other hand, the component recognition failure is not due to a non-adsorption error, and the component E is applied to the nozzle of the mounting head 4. If is attached, the process proceeds to step S105. In step S105, it is determined whether the flag flg is on. If the flag flg is on ("YES" in step S105), the process proceeds to step S111, while if the flag flg is off ("NO" in step S105). In the case), the captured image I acquired in step S102, that is, the NG captured image In is stored in the storage unit 120 (step S106). Then, the count value N is incremented and the flag flg is switched on (step S107), and then the process proceeds to step S111.

  On the other hand, if it is determined in step S103 that the component recognition is successful (in the case of “YES”), it is determined in step S108 whether the flag flg is on. If the flag flg is off (if “NO” in step S108), the process proceeds to step S111. If the flag flg is on (“YES” in step S108), the captured image acquired in step S102 is obtained. I, that is, an OK captured image Io is stored in the storage unit 120 (step S109). Then, the count value N is incremented and the flag flg is switched off before proceeding to step S111.

  In step S111, it is determined whether or not the count value N has reached the predetermined number Nx (= 20). If the count value N is less than the predetermined number Nx (“NO” in step S111), the process returns to step S101. Accordingly, steps S101 to S111 are repeated until the count value N reaches the predetermined number Nx, that is, until the predetermined number Nx of the captured images I are accumulated in the storage unit 120. As a result, the NG captured image In and the OK captured image Io are alternately stored one by one in the storage unit 120, and a total of a predetermined number Nx of the captured images I are accumulated.

  Thus, when the predetermined number Nx of the captured images I are accumulated, the illumination level estimation (step S112) in step S112 is executed. FIG. 7 is a flowchart showing an example of processing executed in the illumination level estimation. In step S201, the count value N is reset to zero. In step S202, it is determined whether the length of the lead El can be measured from the Nth captured image I. Specifically, for the captured image I for which the lead El cannot be detected, it is determined that the length of the lead El cannot be measured (“NO” in step S202), and the process proceeds to step S206. On the other hand, the length of the lead El can be measured for the captured image I that has succeeded in component recognition or the captured image I in which the component El has failed because the width W of the lead El is not the dimension range Wt but the lead El can be detected. ("YES" in step S202), the process proceeds to step S203, and the luminance of the lead El is acquired from the Nth captured image I. In step S204, an appropriate illumination level Ll of the illumination 52 is calculated from the acquired luminance of the lead EL.

  FIG. 8 is a diagram schematically showing the relationship between the illumination level and the luminance distribution in the lead. In the example of FIG. 8, as the illumination level Ll increases from 1/8 to 5/8, the top of the luminance distribution in the lead El increases. Therefore, in step S204, an appropriate illumination level Ll is calculated from the plurality of illumination levels Ll. Specifically, the luminance change amount of the lead El when the illumination level Ll switched in eight steps is changed by one step is experimentally obtained in advance and stored in the storage unit 120. Further, a predetermined average value and a predetermined deviation that should be satisfied by an appropriate luminance distribution are experimentally obtained in advance and stored in the storage unit 120. Therefore, the arithmetic processing unit 110 estimates the luminance distribution of the lead El when the illumination level Ll is increased or decreased from that at the time of capturing the Nth captured image I, and obtains the average value and deviation of the luminance distribution. Thus, the lower limit of the illumination level Ll at which the average value of the luminance distribution is equal to or greater than the predetermined average value and the deviation of the luminance distribution is less than the predetermined deviation is calculated as an appropriate illumination level Ll.

  When the appropriate illumination level Ll is thus calculated in step S204, the arithmetic processing unit 110 increments the count value of the illumination level Ll in the frequency distribution table (FIG. 9) with the illumination level Ll as a class (step S205). Here, FIG. 9 is a diagram showing an example of a frequency distribution table in which the illumination level Ll is a class.

  In the subsequent step S206, the count value N is incremented. In step S207, it is determined whether the count value N has reached the predetermined number Nx. If the count value N is less than the predetermined number Nx (“NO” in step S207), the process returns to step S202. Thus, steps S202 to S206 are repeated until the count value N reaches the predetermined number Nx (“YES” in step S207). As a result, a frequency distribution table as illustrated in FIG. 9 is completed. In step S208, the illumination level Ll stored in the storage unit 120, that is, the illumination level Ll used for component recognition is changed to the illumination level Ll having the largest count value.

  Thus, when the flowchart of FIG. 7, that is, the illumination level estimation in step S112 of FIG. 5 is completed, component data creation (FIG. 10) of step S113 is executed. FIG. 10 is a flowchart showing an example of processing executed in creating part data. This part data creation may be started automatically after the illumination level estimation is completed, or a start command is input from the operator after displaying on the display / operation unit 150 that the part data can be created. You may start when there is.

  In step S301, the count value N is reset to zero. In step S302, an attempt is made to create component data Dp based on the Nth captured image I. The creation of the component data Dp can be executed by appropriately using a well-known existing technique. In an attempt to create the component data Dp, one package P that matches the characteristics of the Nth captured image I is searched for from among a plurality of packages P. If one package P cannot be searched and the creation of the component data Dp has failed (in the case of “NO” in step S303), the process proceeds to step S305. On the other hand, when one package P can be searched and the creation of the component data Dp is successful (in the case of “YES” in step S303), the arithmetic processing unit 110 uses the frequency distribution table with the type of the package P as a class. After incrementing the count value of the one package P (step S304), the process proceeds to step S305.

  In step S305, the count value N is incremented. In step S306, it is determined whether the count value N has reached the predetermined number Nx. If the count value N is less than the predetermined number Nx (“NO” in step S306), the process returns to step S302. Thus, steps S302 to S305 are repeated until the count value N reaches the predetermined number Nx (“YES” in step S306). As a result, a frequency distribution table with the type of the package P as a class is created. In step S307, the type of package P having the largest count value is set as a candidate for the target package Po.

  In step S308, a recognition parameter R is created based on the setting candidate package P. For example, when the dimension range Wt with respect to the width W of the lead El is obtained, the Smilnov-Grubbs test or the Thompson test is used to deviate from the width W of the lead El extracted from each of the predetermined number Nx of the captured images I. The value is excluded, and a range of ± 3σ (σ is a standard deviation) with respect to the average value of the remaining values is set as the dimension range Wt. At this time, the median value may be used instead of the average value.

  Further, when obtaining the dimension range for the external dimension S of the part E, among the predetermined number Nx of the captured images I, the captured image I having no outliers for both the length and width of the part E is targeted. Also good. That is, the captured image I having an outlier with respect to the length of the component E is excluded, and the captured image I having an outlier with respect to the width of the component E is further excluded. Then, a range of ± 3σ (σ is a standard deviation) with respect to the average value of the length of the part E extracted from each of the remaining captured images I is set as the dimension range of the length, and the average of the width of the part E A range of ± 3σ (σ is a standard deviation) with respect to the value is set as the dimension range of the width. At this time, the median value may be used instead of the average value.

  When the creation of the component data in the flowchart of FIG. 10, that is, step S113 in FIG. 5, is completed, the data update process (FIG. 11) in step S114 is executed. FIG. 11 is a flowchart illustrating an example of processing executed in the data update processing. In step S <b> 401, a screen for inquiring whether to update the part data Dp fully automatically is displayed on the display / operation unit 150. Then, when the operator inputs to the display / operation unit 150 that it is fully automatic, the arithmetic processing unit 110 calculates the mounting offset amount. Specifically, the difference between the center position and inclination of the part E indicated by each of the part data Dp currently stored in the storage unit 120 and the newly created part data Dp, that is, the offset amount is obtained. Then, the center position and inclination of the part E indicated by the newly created part data Dp are corrected by the respective offset amounts, and the corrected part data Dp is stored / updated in the storage unit 120 (step S403). As a result, the target package Po set in the component data Dp of the storage unit 120, that is, the package P used for component recognition, is changed to the package P having the largest count value as a candidate in step S307.

  On the other hand, when the operator inputs to the display / operation unit 150 that the automatic operation is not performed, the arithmetic processing unit 110 superimposes the component data Dp on the captured image I of the component E in the display / operation unit 150. indicate. Then, as a result of visually confirming the relationship between the captured image I of the part E and the part data Dp, the worker inputs the quality to the display / operation unit 150. If “good” is input (“YES” in step S405), steps S402 and 403 are executed as described above, and the component data Dp stored in the storage unit 120 is updated. On the other hand, if a defect is input (“NO” in step S405), the component data Dp is not updated.

  When the flowchart of FIG. 11, that is, the data update process of step S114 of FIG. If the production is continued (in the case of “NO” in step S115), the process returns to step S101. On the other hand, if the production is terminated (in the case of “YES” in step S115), the flowchart of FIG. To do.

  In the embodiment configured as described above, the captured image I of the component E is acquired by imaging the component E held by the mounting head 4. Then, the component data Dp (component recognition condition) indicating the condition that the target package Po has a characteristic set from among a plurality of different types of packages P is compared with the captured image I. As a result of this comparison, when the captured image I satisfies the component data Dp, the mounting head 4 executes the mounting of the component E on the board B. On the other hand, when the captured image I does not satisfy the component data Dp, the mounting head 4 Discards the parts. Further, the component data Dp used here is adjusted based on the captured image I by executing the condition adjustment process of FIG. In particular, the condition adjustment process includes a process of adjusting the package P set as the target package Po from the plurality of packages P based on the captured image I. As described above, the target package Po used for the component data Dp among the plurality of different types of packages P is adjusted based on the captured image I obtained by actually capturing the component E. Therefore, it is possible to set an appropriate component package P in the component data Dp. As a result, it is possible to suppress the erroneous disposal of the non-defective part E.

  Further, the component data Dp includes a condition that the lead El (reference location) of the target package Po is within the predetermined dimension range Wt. The condition adjustment process includes a process of adjusting the dimension range Wt based on the captured image I. Thereby, an appropriate dimension range Wt can be set in the component data Dp. As a result, it is possible to suppress the erroneous disposal of the non-defective part E.

  In addition, the component imaging unit 5 includes an illumination 52 that irradiates the component E with light. The condition adjustment process includes a process of adjusting the intensity of light emitted by the illumination 52 based on the captured image I. Thereby, the captured image I can be acquired while irradiating the component E with light of appropriate intensity.

  In addition, a storage unit 120 that stores a plurality of captured images I is provided, and the arithmetic processing unit 110 performs condition adjustment processing by adjusting the component data Dp based on the plurality of captured images I stored in the storage unit 120. Run. As described above, based on the plurality of captured images I, the component data Dp can be adjusted more accurately.

  The plurality of captured images I stored in the storage unit 120 include an NG captured image In that does not satisfy the component data Dp and an OK captured image Io that satisfies the component data Dp. In such a configuration, based on the NG captured image In, the component data Dp is accurately obtained based on the NG captured image In that is determined not to satisfy the component data Dp although it is the captured image I obtained by imaging the non-defective component E. This is advantageous in suppressing the erroneous disposal of the non-defective part E. In addition, by also based on the OK captured image Io, it is possible to reduce the influence of the NG captured image In (in other words, the authentic NG captured image In) obtained by capturing the defective component E on the adjustment of the component data Dp. It has become. Thus, based on both the NG captured image In and the OK captured image Io, the component data Dp can be adjusted more accurately.

  In addition, when a plurality of NG captured images In are continuously acquired, the arithmetic processing unit 110 stores only the first acquired NG captured image In in the storage unit 120, and the plurality of OK captured images Io are stored. When the images are continuously acquired, only the first captured OK image Io is stored in the storage unit 120, whereby the NG captured image In and the OK captured image Io are alternately stored in the storage unit 120 one by one. To do. Such a configuration can acquire the respective numbers of the NG captured image In and the OK captured image Io in a balanced manner, and contributes to appropriately adjusting the component data Dp.

  In addition, in the condition adjustment process, the control unit executes, for each of the plurality of captured images stored in the storage unit, an operation for specifying one package having a characteristic that the captured image satisfies from among the plurality of packages. The component mounter may be configured such that one package having the largest number of captured images satisfying the characteristics is set as the target package. This makes it possible to use an appropriate component package type as the component recognition condition.

  As described above, in the present embodiment, the component mounter 1 corresponds to an example of the “component mounter” of the present invention, and the tape feeder 281 corresponds to an example of the “component supply unit” of the present invention. The conveyors 12 and 12 correspond to an example of the “board transport unit” of the present invention, the mounting head 4 corresponds to an example of the “mounting head” of the present invention, and the component imaging unit 5 corresponds to the “component imaging unit” of the present invention. The processing unit 110 corresponds to an example of the “control unit” of the present invention, the illumination 52 corresponds to an example of the “lighting” of the present invention, and the storage unit 120 corresponds to the “storage unit” of the present invention. The board B corresponds to an example of the “board” of the present invention, the part E corresponds to an example of the “part” of the present invention, and the lead El corresponds to an example of the “reference point” of the present invention. The dimension range Wt corresponds to an example of the “dimension range” of the present invention, and the package P corresponds to the “package” of the present invention. The target package Po corresponds to an example of the “target package” of the present invention, the captured image I corresponds to an example of the “captured image” of the present invention, and the NG captured image In corresponds to the present invention. The “captured image” corresponds to an example of the “first captured image”, the OK captured image Io corresponds to an example of the “second captured image” of the present invention, and the component data Dp corresponds to an example of the “component recognition condition” of the present invention. Steps S103 to S114 correspond to an example of “condition setting processing” of the present invention, and the illumination level Ll corresponds to an example of “light intensity” of the present invention.

  The present invention is not limited to the above-described embodiment, and various modifications can be made to the above-described one without departing from the spirit of the present invention. For example, in the above embodiment, the tape feeder 281 is used as the component supply unit. However, the feeder that can be used as the component supply unit is not limited to the tape feeder 281 and may be, for example, a stick feeder or a tray feeder.

  Further, in the flowchart of FIG. 5, for example, the illumination level estimation in step S112 and the data update process in step S114 may be omitted. In the latter case, the target package Po and the recognition parameter R obtained in steps S307 and S308 in FIG. 10 may be directly overwritten on the component data Dp in the storage unit 120.

  Further, the number Nx of the captured images I stored in the storage unit 120 is not limited to 20. Further, it is not always necessary to store the NG captured image In and the OK captured image Io alternately in the storage unit 120 one by one.

  Moreover, the specific example of the reference | standard location of the components E is not restricted to said lead El.

  Further, the package P of the component E is not limited to the example of FIG.

  DESCRIPTION OF SYMBOLS 1 ... Component mounting machine, 281 ... Tape feeder (component supply part), 12 ... Conveyor (board | substrate conveyance part), 4 ... Mounting head, 5 ... Component imaging part, 110 ... Arithmetic processing part (control part), 52 ... Illumination, 120 ... Storage unit, B ... Board, E ... Part, El ... Lead (reference location), P ... Package, Po ... Target package, I ... Captured image, In ... NG captured image (first captured image), Io ... OK Captured image (second captured image), Dp ... component data (component recognition condition), S103 to S114 ... condition setting processing, Wt ... dimension range, Ll ... illumination level (light intensity)

Claims (8)

A component supply for supplying components having the same type of package;
A substrate transport section for transporting the substrate;
A mounting head for mounting the component supplied by the component supply unit on the substrate supported by the substrate transport unit;
A component imaging unit that captures an image of the component by capturing the component held by the mounting head;
When the captured image is compared with a component recognition condition including a condition that the target package has a feature set from a plurality of different types of packages, and the captured image satisfies the component recognition condition A control unit that causes the mounting head to discard the component when the captured image does not satisfy the component recognition condition while mounting the component on the mounting head;
The control unit executes a condition adjustment process for adjusting the component recognition condition based on the captured image,
The condition adjustment process includes a process of adjusting a package set as the target package from the plurality of packages based on the captured image. The component recognition conditions include a condition that a reference location of the target package is within a predetermined size range,
The component mounting machine according to claim 1, wherein the condition adjustment process includes a process of adjusting the dimension range based on the captured image. The component imaging unit has illumination for irradiating the component with light,
The component mounting machine according to claim 1, wherein the condition adjustment process includes a process of adjusting an intensity of light emitted by the illumination based on the captured image. A storage unit for storing a plurality of the captured images;
The component according to any one of claims 1 to 3, wherein the control unit executes the condition adjustment processing by adjusting the component recognition condition based on the plurality of captured images stored in the storage unit. Mounting machine.   The plurality of captured images stored in the storage unit include a first captured image that is the captured image that does not satisfy the component recognition condition and a second captured image that is the captured image that satisfies the component recognition condition. The component mounting machine according to any one of 1 to 3.   When the plurality of first captured images are continuously acquired, the control unit stores only the first captured image acquired first in the storage unit, and the plurality of second captured images are stored in the storage unit. When the images are continuously acquired, the first captured image and the second captured image are alternately stored one by one by storing only the first captured image acquired first in the storage unit. The component mounting machine according to claim 5, which is stored in a part.   In the condition adjustment process, the control unit executes, for each of the plurality of captured images stored in the storage unit, an operation for identifying one package having the characteristics satisfied by the captured image from the plurality of packages. The component mounter according to any one of claims 4 to 6, wherein among the plurality of packages, one package having the largest number of captured images satisfying the characteristics is set as the target package. Supplying parts having the same type of package;
Holding the supplied component by the mounting head;
Acquiring a captured image of the component by imaging the component held by the mounting head;
When the captured image is compared with a component recognition condition including a condition that the target package has a feature set from a plurality of different types of packages, and the captured image satisfies the component recognition condition A step of causing the mounting head to mount the component on a substrate, while causing the mounting head to discard the component when the captured image does not satisfy the component recognition condition;
A condition adjustment process for adjusting the component recognition conditions based on the captured image,
The condition adjustment process is a component mounting method including a process of adjusting a package set as the target package from the plurality of packages based on the captured image.

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