JPH05251898A - Parts deciding method of electronic parts mounting machine - Google Patents

Parts deciding method of electronic parts mounting machine

Info

Publication number
JPH05251898A
JPH05251898A JP4049116A JP4911692A JPH05251898A JP H05251898 A JPH05251898 A JP H05251898A JP 4049116 A JP4049116 A JP 4049116A JP 4911692 A JP4911692 A JP 4911692A JP H05251898 A JPH05251898 A JP H05251898A
Authority
JP
Japan
Prior art keywords
component
parts
allowable value
data
dimension
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4049116A
Other languages
Japanese (ja)
Other versions
JP3383673B2 (en
Inventor
Hiroki Yamamoto
裕樹 山本
Kazuo Nagae
和男 長江
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP04911692A priority Critical patent/JP3383673B2/en
Publication of JPH05251898A publication Critical patent/JPH05251898A/en
Application granted granted Critical
Publication of JP3383673B2 publication Critical patent/JP3383673B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Abstract

PURPOSE:To improve an accuracy for evaluating a parts and improve a quality of the board of a product, by accumulating the data of the parts which are obtained by recognizing the parts, and by setting the allowable value of the data of the parts on the basis of the accumulated data, and further, by updating it. CONSTITUTION:The external shape of a parts is recognized by a visual recognition, and from the binary picture thereof the dimension of the parts is calculated. Then, whether the dimension of the parts is within the allowable value which is set in the last time or not is decided. When it is within the allowable value, after setting the effect that the mounting operation of the parts is performed, from the outside dimension of the parts, the average value thereof, which is inherent in each parts, is calculated. Then, the dispersion to the catalog dimension of the parts is calculated from the difference between the outside dimension and the catalog dimension of the parts. Further, from the calculated dispersion, the allowable value inherent in each parts, which satisfies an elimination given beforehand, is set, and it is updated in succession. Using the allowable value set in this manner as a deciding reference, whether the external shape of the parts is suitable or not is decided in the next time.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、部品を認識・判定して
実装する電子部品実装機の部品認識処理において、部品
判定を適正に行う方法に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for appropriately determining a component in a component recognition process of an electronic component mounter that recognizes and determines a component and mounts the component.

【0002】[0002]

【従来の技術】近年、電子部品実装の分野では実装密度
の向上のための部品の小型化と多品種化と共に製品基板
の品質の向上が求められており、部品を認識・判定して
実装する電子部品実装機が利用されるようになってきて
いる。
2. Description of the Related Art In recent years, in the field of electronic component mounting, it has been required to reduce the size of components and increase the variety of products as well as to improve the quality of product boards. Electronic component mounters are being used.

【0003】以下、図3を参照しながら従来の電子部品
実装機の認識処理における部品評価処理を説明する。図
3において、まず現在認識中の部品の外形の認識処理を
行い(ステップ#31)、次に予め記憶している部品の
外形と現在認識中の部品の外形を比較して現在認識中の
部品の外形が許容値内かどうかの判定を行い(ステップ
#32、#33)、許容値内であれば実装動作を行う設
定を行い(ステップ#34)、許容値内でない場合には
実装動作を行わない設定を行っている(ステップ#3
5)。
The component evaluation process in the conventional recognition process of the electronic component mounter will be described below with reference to FIG. In FIG. 3, the outer shape of the currently recognized component is first recognized (step # 31), and then the previously stored outer shape of the component is compared with the outer shape of the currently recognized component to identify the currently recognized component. It is determined whether the outer shape is within the allowable value (steps # 32, # 33), and if it is within the allowable value, the mounting operation is set (step # 34). If it is not within the allowable value, the mounting operation is performed. It is set not to be performed (Step # 3)
5).

【0004】具体例について追加説明すると、予め全て
の部品の外形データがその種別により数種類のパターン
に振り分けられて記憶されており、部品外形の認識工程
ではその部品の寸法、面積あるいはリード本数が求めら
れ、比較工程では予め記憶されている上記外形データ値
との比が求められ、この比が予めパターンごとに設定さ
れている許容値内か否かによって実装動作を行うか否か
を判定する。
To further explain a specific example, the outer shape data of all parts are stored in advance by being divided into several types of patterns according to their types, and in the step of recognizing the outer shape of a part, the dimension, area, or number of leads of the part is obtained. Then, in the comparison step, a ratio with the previously stored outer shape data value is obtained, and it is determined whether or not the mounting operation is performed depending on whether or not the ratio is within an allowable value set for each pattern in advance.

【0005】[0005]

【発明が解決しようとする課題】しかしながら、上記の
ような処理では、許容値を部品毎に固定的に設定してい
るので、同じ種類の部品でもメーカー間で部品外形精度
に違いがあり、また照明条件の時間的変化により認識値
が変動するためにこれらを考慮して許容範囲を拡大して
設定しておく必要があり、部品評価の精度を落とすこと
となる。その結果、指定した部品と違っていても実装で
きてしまうというようなことが起こり得るという問題を
有していた。
However, in the above-described processing, since the allowable value is fixedly set for each component, there is a difference in the component outer shape accuracy between manufacturers even for the same type of component. Since the recognition value fluctuates due to the temporal change of the illumination condition, it is necessary to expand the allowable range in consideration of these and set the accuracy, which deteriorates the accuracy of component evaluation. As a result, there is a problem in that it may be possible to mount even if the specified component is different.

【0006】本発明は上記従来の問題点に鑑み、各部品
毎に毎回の認識データに基づいて部品許容値を設定しま
た更新して行くことができる電子部品実装機の部品判定
方法を提供することを目的とする。
In view of the above-mentioned conventional problems, the present invention provides a component determination method for an electronic component mounter capable of setting and updating a component allowable value based on recognition data for each component. The purpose is to

【0007】[0007]

【課題を解決するための手段】本発明の電子部品実装機
の部品判定方法は、部品を認識して得られた部品データ
が許容値内の部品のみ実装するようにした電子部品実装
機において、部品を認識して得られた部品データを蓄え
る処理と、蓄えた部品データに基づいて部品データの許
容値を設定する処理とを備えていることを特徴とする。
According to a method of determining a component of an electronic component mounter of the present invention, in an electronic component mounter in which component data obtained by recognizing a component is mounted within a permissible value, It is characterized by including a process of accumulating the component data obtained by recognizing the component and a process of setting an allowable value of the component data based on the accumulated component data.

【0008】好適には、許容値を設定する処理が、各部
品データと予め設定されている部品データとの差から部
品データのばらつきを求める処理と、部品データのばら
つきから各部品固有の予め与えられた条件を満たす許容
値を設定し更新する処理とを備える。
Preferably, the process of setting the allowable value is a process of obtaining a variation of the component data from a difference between each component data and the preset component data, and a process of giving a variation peculiar to each component in advance from the variation of the component data. And a process of setting and updating a permissible value satisfying the specified condition.

【0009】[0009]

【作用】本発明によれば、部品認識で得られた部品デー
タを蓄えてそれに基づいて部品データの許容値を設定・
更新して行くので、メーカー間に部品外形精度に違いが
あったり、照明条件が時間的に変化するような場合で
も、部品評価の精度を高めて適正な許容範囲の部品だけ
を実装し、そうでない部品は実装しないようにでき、製
品基板の品質を高めることができる。
According to the present invention, the component data obtained by the component recognition is stored, and the allowable value of the component data is set based on the stored data.
Since we will update it, even if there is a difference in the external shape accuracy of the parts between manufacturers or the lighting conditions change with time, we will improve the accuracy of part evaluation and mount only the parts within the appropriate tolerance range. It is possible to avoid mounting non-parts and improve the quality of the product board.

【0010】[0010]

【実施例】以下、本発明の一実施例の電子部品実装機に
おける部品実装動作について図1、図2を参照しながら
説明する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A component mounting operation in an electronic component mounting machine according to an embodiment of the present invention will be described below with reference to FIGS.

【0011】まず、図2により部品実装動作について説
明すると、実装部品に適合した装着ノズルを選択した
後、そのノズルナンバーを確認し、さらに装着ノズルを
回転してその原点位置に戻した状態にする(ステップ#
11〜13)。次に、装着ノズルにて部品を吸着すると
ともに(ステップ#14)、吸着時の装着ノズル位置か
ら部品厚みを測定する(ステップ#15)。次に、視覚
認識によって部品の外形を認識し(ステップ#16)、
適正部品であるか不良部品であるかにより装着を行うか
否かの判定を行う(ステップ#17)。不良部品の場合
はステップ#21に移行し、装着を行わずに不良部品を
排出してステップ#11に戻る。適正部品で装着を行う
場合は、装着ノズルを回転して装着角度の補正を行った
後装着ノズルを基板に向けて下降させて部品を装着し
(ステップ#18、19)、部品装着後装着ノズルを原
点に戻した後(ステップ#20)、ステップ#11に戻
り、以上の動作を繰り返すことにより、順次部品を装着
する。
First, the component mounting operation will be described with reference to FIG. 2. After selecting a mounting nozzle suitable for the mounting component, the nozzle number is confirmed, and the mounting nozzle is further rotated to return to its original position. (Step #
11-13). Next, the component is sucked by the mounting nozzle (step # 14), and the component thickness is measured from the position of the mounting nozzle at the time of suction (step # 15). Next, the outer shape of the component is recognized by visual recognition (step # 16),
It is determined whether or not mounting is to be performed depending on whether it is a proper part or a defective part (step # 17). In the case of a defective part, the process proceeds to step # 21, the defective part is discharged without mounting, and the process returns to step # 11. When mounting with the proper component, the mounting nozzle is rotated to correct the mounting angle, and then the mounting nozzle is lowered toward the substrate to mount the component (steps # 18 and 19), and the mounting nozzle after mounting the component. After returning to the origin (step # 20), the process returns to step # 11 and the above operations are repeated to sequentially mount the components.

【0012】次に、上記部品認識(ステップ#16)の
具体的な処理を図1を参照して説明すると、ステップ#
1で部品の外形を視覚認識によって認識し、その2値画
像から部品寸法を求める。次に、ステップ#2でその部
品寸法が前回設定された許容値内のものであるか否かを
判定する。許容値内の場合はステップ#3に移行して実
装動作を行う設定を行った後ステップ#5に移行し、許
容値内でない場合にはステップ#4に移行して実装動作
を行わない設定を行った後ステップ#5に移行する。ス
テップ#5では、ステップ#1で求められた部品外形寸
法から各部品固有の外形寸法の平均値を求める。この平
均値は参考データとして用いられ、その平均値が予め記
憶されている部品のカタログ寸法に対して著しい差異が
ある場合に部品メーカーや検査工程に対する指令や照明
条件の変更指令を出すために利用される。次にステップ
#6でステップ#1で求められた部品外形寸法と部品の
カタログ寸法との差から部品のカタログ寸法に対するば
らつきを求める。そうして、ステップ#7でステップ#
5、6で求められたばらつきから予め与えられた条件を
満たす各部品固有の許容値を設定し、更新して行く。こ
こで、予め設定された条件とは、ばらつきのデータから
σを求め、カタログ値のプラス・マイナス3σを許容値
とするものである。こうして設定された許容値が次回の
部品外形の適否の判定基準とされる。
Next, the specific processing of the above-mentioned component recognition (step # 16) will be described with reference to FIG.
In step 1, the outer shape of the component is visually recognized, and the component dimension is obtained from the binary image. Next, in step # 2, it is determined whether or not the component size is within the previously set allowable value. If it is within the allowable value, the process proceeds to step # 3 to set the mounting operation and then to step # 5. If it is not within the allowable value, the process proceeds to step # 4 to set the mounting operation not to be performed. After that, the process proceeds to step # 5. In step # 5, the average value of the external dimensions peculiar to each component is determined from the external dimensions of the component determined in step # 1. This average value is used as reference data, and is used to issue a command to the parts manufacturer or inspection process or a command to change the lighting conditions when the average value is significantly different from the catalog size of the parts stored in advance. To be done. Next, in step # 6, the variation with respect to the catalog size of the component is calculated from the difference between the component outer dimension obtained in step # 1 and the component catalog size. Then, in Step # 7, Step #
The permissible value peculiar to each component satisfying a given condition is set from the variations obtained in 5 and 6 and updated. Here, the preset condition is that σ is obtained from the variation data and the plus / minus 3σ of the catalog value is an allowable value. The allowable value set in this way is used as a criterion for determining the suitability of the next component outline.

【0013】以上のように本実施例によれば、ステップ
#6のカタログ外形との差から外形のバラツキを求める
処理、ステップ#7の各部品固有の予め与えられた条件
を満たす許容値を設定し更新する処理を設けることによ
り、部品の外形精度と2値画像の両者のばらつきを加味
した許容値を設定することができる。かくして、部品外
形の製造上の精度や、照明の照度変化など認識装置の環
境変化等の影響をうけない許容値の設定を自動的に行う
ことができ、その結果製品基板の品質を向上することが
できる。
As described above, according to this embodiment, the process of obtaining the variation of the outer shape from the difference with the catalog outer shape in step # 6, and the allowable value satisfying the predetermined condition peculiar to each part in step # 7 are set. By providing the processing for updating, it is possible to set the allowable value in consideration of the variation in both the external shape accuracy of the component and the binary image. In this way, it is possible to automatically set tolerances that are not affected by the manufacturing accuracy of the external shape of the component and the environmental change of the recognition device such as the illuminance change of the illumination, and as a result, improve the quality of the product board. You can

【0014】尚、上記実施例においては部品外形として
部品寸法を用いたが、部品面積としてもよい。
In the above embodiment, the component size is used as the component outer shape, but it may be the component area.

【0015】さらに本発明は、視覚認識による部品外形
に限らず、その他の部品特性に関するデータに関しても
適用することができる。
Further, the present invention can be applied not only to the outer shape of a component by visual recognition but also to data relating to other component characteristics.

【0016】[0016]

【発明の効果】本発明によれば、以上のように部品認識
で得られた部品データを蓄えてそれに基づいて部品デー
タの許容値を設定・更新して行くので、例えば部品外形
について言えばメーカー間に部品外形精度に違いがあっ
たり、照明条件が時間的に変化するような場合において
も、部品評価の精度を高めて適正な許容範囲の部品だけ
を実装し、そうでない部品は実装しないようにでき、製
品基板の品質を高めることができる。
According to the present invention, the component data obtained by the component recognition as described above is stored, and the allowable value of the component data is set / updated based on the stored component data. Even if there is a difference in the external shape accuracy of parts or the lighting conditions change with time, improve the accuracy of part evaluation so that only parts within the appropriate tolerance range are mounted, and parts that are not so are not mounted. Therefore, the quality of the product substrate can be improved.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施例の部品実装動作における部品
認識処理のフローチャートである。
FIG. 1 is a flowchart of component recognition processing in a component mounting operation according to an embodiment of the present invention.

【図2】同実施例の部品実装動作のフローチャートであ
る。
FIG. 2 is a flowchart of a component mounting operation of the same embodiment.

【図3】従来例の部品実装動作における部品認識処理の
フローチャートである。
FIG. 3 is a flowchart of a component recognition process in a component mounting operation of a conventional example.

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 部品を認識して得られた部品データが許
容値内の部品のみ実装するようにした電子部品実装機に
おいて、部品を認識して得られた部品データを蓄える処
理と、蓄えた部品データに基づいて部品データの許容値
を設定する処理とを備えていることを特徴とする電子部
品実装機の部品判定方法。
1. An electronic component mounter configured to mount only a component whose component data obtained by recognizing the component is within an allowable value, and a process of recognizing the component and storing the component data obtained. A component determination method for an electronic component mounter, comprising: a process of setting an allowable value of component data based on component data.
【請求項2】 許容値を設定する処理が、各部品データ
と予め設定されている部品データとの差から部品データ
のばらつきを求める処理と、部品データのばらつきから
各部品固有の予め与えられた条件を満たす許容値を設定
し更新する処理とを備えていることを特徴とする請求項
1記載の電子部品実装機の部品判定方法。
2. A process of setting an allowable value is a process of obtaining a variation of component data based on a difference between each component data and a preset component data, and a process of presetting peculiar to each component based on the variation of the component data. The component determination method for an electronic component mounter according to claim 1, further comprising: a process of setting and updating an allowable value satisfying a condition.
JP04911692A 1992-03-06 1992-03-06 Component judgment method for electronic component mounting machine Expired - Fee Related JP3383673B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP04911692A JP3383673B2 (en) 1992-03-06 1992-03-06 Component judgment method for electronic component mounting machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP04911692A JP3383673B2 (en) 1992-03-06 1992-03-06 Component judgment method for electronic component mounting machine

Publications (2)

Publication Number Publication Date
JPH05251898A true JPH05251898A (en) 1993-09-28
JP3383673B2 JP3383673B2 (en) 2003-03-04

Family

ID=12822097

Family Applications (1)

Application Number Title Priority Date Filing Date
JP04911692A Expired - Fee Related JP3383673B2 (en) 1992-03-06 1992-03-06 Component judgment method for electronic component mounting machine

Country Status (1)

Country Link
JP (1) JP3383673B2 (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003249799A (en) * 2002-02-26 2003-09-05 Hitachi High-Tech Instruments Co Ltd Method and device for component recognition in electronic component mounting apparatus
JP2007294999A (en) * 2007-07-06 2007-11-08 Hitachi High-Tech Instruments Co Ltd Method and device for component recognition in electronic component mounting apparatus
JP2007335609A (en) * 2006-06-14 2007-12-27 Matsushita Electric Ind Co Ltd Quality control method
JP2007335738A (en) * 2006-06-16 2007-12-27 Matsushita Electric Ind Co Ltd Selecting method
JP2008010570A (en) * 2006-06-28 2008-01-17 Matsushita Electric Ind Co Ltd Method for determining mounting condition
JP2008028032A (en) * 2006-07-19 2008-02-07 Matsushita Electric Ind Co Ltd Service supply method
JP2011211088A (en) * 2010-03-30 2011-10-20 Fuji Mach Mfg Co Ltd Method and device for generating image-processing component data
JP2017059557A (en) * 2015-09-14 2017-03-23 パナソニックIpマネジメント株式会社 Component mounting method and component mounting device
JP2018063973A (en) * 2016-10-11 2018-04-19 ヤマハ発動機株式会社 Component mounting machine and component recognition method
CN114503796A (en) * 2019-09-30 2022-05-13 株式会社富士 Data management system

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003249799A (en) * 2002-02-26 2003-09-05 Hitachi High-Tech Instruments Co Ltd Method and device for component recognition in electronic component mounting apparatus
JP4718378B2 (en) * 2006-06-14 2011-07-06 パナソニック株式会社 Quality improvement method
JP2007335609A (en) * 2006-06-14 2007-12-27 Matsushita Electric Ind Co Ltd Quality control method
JP2007335738A (en) * 2006-06-16 2007-12-27 Matsushita Electric Ind Co Ltd Selecting method
JP2008010570A (en) * 2006-06-28 2008-01-17 Matsushita Electric Ind Co Ltd Method for determining mounting condition
JP2008028032A (en) * 2006-07-19 2008-02-07 Matsushita Electric Ind Co Ltd Service supply method
JP4559453B2 (en) * 2007-07-06 2010-10-06 株式会社日立ハイテクインスツルメンツ Component recognition processing method for electronic component mounting apparatus and component recognition processing apparatus
JP2007294999A (en) * 2007-07-06 2007-11-08 Hitachi High-Tech Instruments Co Ltd Method and device for component recognition in electronic component mounting apparatus
JP2011211088A (en) * 2010-03-30 2011-10-20 Fuji Mach Mfg Co Ltd Method and device for generating image-processing component data
US8867846B2 (en) 2010-03-30 2014-10-21 Fuji Machine Mfg. Co. Ltd. Method and device for generating image-processing component data used for image recognition of a component by component measurements
JP2017059557A (en) * 2015-09-14 2017-03-23 パナソニックIpマネジメント株式会社 Component mounting method and component mounting device
JP2018063973A (en) * 2016-10-11 2018-04-19 ヤマハ発動機株式会社 Component mounting machine and component recognition method
CN114503796A (en) * 2019-09-30 2022-05-13 株式会社富士 Data management system
CN114503796B (en) * 2019-09-30 2023-09-01 株式会社富士 data management system

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