KR20150104763A - Method for automatic determination of test model for optical inspection - Google Patents

Method for automatic determination of test model for optical inspection Download PDF

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Publication number
KR20150104763A
KR20150104763A KR1020140026494A KR20140026494A KR20150104763A KR 20150104763 A KR20150104763 A KR 20150104763A KR 1020140026494 A KR1020140026494 A KR 1020140026494A KR 20140026494 A KR20140026494 A KR 20140026494A KR 20150104763 A KR20150104763 A KR 20150104763A
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KR
South Korea
Prior art keywords
inspection
substrate
model
reference mark
inspection model
Prior art date
Application number
KR1020140026494A
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Korean (ko)
Inventor
박찬화
이상준
백영선
Original Assignee
주식회사 미르기술
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Application filed by 주식회사 미르기술 filed Critical 주식회사 미르기술
Priority to KR1020140026494A priority Critical patent/KR20150104763A/en
Publication of KR20150104763A publication Critical patent/KR20150104763A/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like

Abstract

The present invention relates to a substrate optical inspection method capable of inspecting a substrate defect through an image of a camera, and more particularly, to a method of automatically determining an inspection model for optical inspection, Recognizing a reference mark at a predetermined position on the substrate, performing a continuous inspection when the reference mark is recognized at the position, and performing an inspection when the reference mark is not recognized at the position by changing the inspection model Step.
According to the present invention as described above, the optical inspection is immediately performed by activating the specific inspection model among the stored inspection model storage units, and only when the reference mark does not coincide with the inspection target substrate image data in the reference mark recognition step, It is possible to shorten the optical inspection time by activating other inspection models, and it is unnecessary for the operator to individually reset the inspection model as in the prior art, which simplifies the process and has a high inspection efficiency.

Description

METHOD FOR AUTOMATIC DETERMINATION OF TEST MODEL FOR OPTICAL INSPECTION [0002]

The present invention relates to a substrate optical inspection method capable of inspecting a defect of a substrate through an image of a camera, and more particularly, to a substrate optical inspection method for automatically determining an inspection model such as an upper / And more particularly, to a substrate optical inspection system and method capable of quickly inspecting defective substrates.

Printed circuit boards (PCBs) are widely used in semiconductors, multimedia devices, communication devices, various electronic products, automobiles, and related industries, which constitute the final circuit by mounting various electronic components on the surface.

A manufacturing process of a printed circuit board is briefly described by exposing a surface of a photosensitive resin film to a photosensitive pattern using a wiring pattern film using a laminated board made of copper laminated inside and outside and etching the copper into a desired pattern using the characteristics of the photosensitive resin Thereby forming a wiring pattern (plating pattern). Thereafter, the pattern side and the insulating layer are laminated by using a press machine, holes are formed for electrical connection between the pattern layers, and the layers stacked through the holes are electrically connected. Then, it is covered with the wiring part etc. by using a photo-imageable solder resist (PSR part) to prevent copper from being oxidized by contact with the air or to prevent copper from being crushed by external impact or to prevent shorting due to metal.

Thereafter, a step of inspecting the printed circuit board is required. This is a step of inspecting various bonds such as the interval between fine line widths of the circuit pattern, short circuit to the circuit pattern, short circuit, protrusion, denting, foreign matter adhesion, appearance of the solder resist, .

That is, it is necessary to grasp the existence of the defective printed circuit board and filter it.

Conventionally, a method of inspecting the surface appearance of a substrate, such as a circuit, a terminal, a bonding pad, and a gold tab on a printed circuit board, includes a method of inspecting electric current using a probe, There is a way for the inspector to visually inspect the appearance, such as the circuit diagram and terminal, of the printed circuit board.

However, since the method of inspecting the printed circuit board using the probe merely checks the electrical connection state of the circuit, it is impossible to check whether the integrated circuit or the terminal printed on the substrate meets the standard, Since there is no such equipment, equipment is required separately.

When the inspector visually inspects the circuit diagram on the printed circuit board, there is a difference in the reliability of the inspection depending on the skill of the operator, the circuit not visible on the printed circuit board can not be inspected, As the substrate size increases, the accuracy of the inspection becomes lower.

As described above, effective inspection of the printed circuit board is a key to improving the quality and productivity, and accordingly, an optical inspection technique through camera photographing is used.

In the optical inspection technique through camera photographing, the reference image of the substrate photographed without error is compared with the photographed image of the substrate to be inspected, and the defect is judged. The inspection model is activated in the library in which the inspection reference model of the inspection target substrate is stored by checking the model, and the substrate is sequentially matched by judging whether the defect is defective or not.

Here, in order to align the substrate with the substrate, the reference mark written on the substrate is searched to align the substrate with the reference position, and then the optical image and the reference image are aligned with each other.

In addition, in order to inspect the top and bottom surfaces of the substrate, the operator first determines whether the substrate to be inspected is on the top surface in advance and sets the mode to the top surface inspection mode or the bottom inspection mode. .

However, in such a process, before the reference mark is inspected, the operator sets the inspection model in advance and the inspection is performed through the reference mark matching, resulting in a problem that the inspection speed is slow.

Accordingly, there is an increasing demand for a substrate optical inspection system and method that can overcome the unreasonable points of the conventional optical inspection method of the substrate, shorten the optical inspection time, and simplify the work process.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and it is an object of the present invention to provide an inspection model in which an image of a substrate to be inspected is activated in a reference mark sorting process for a substrate optical inspection, The present invention also provides a method for automatically determining an inspection model for an optical inspection, which can determine whether or not the inspection model is matched, and continuously conduct inspection or automatically activate another inspection model.

According to an aspect of the present invention, there is provided a method of automatically determining an inspection model for an optical inspection, comprising: activating a specific inspection model for inspection of a substrate; recognizing a reference mark at a predetermined position on the substrate; Performing a continuous inspection when the reference mark is recognized at the corresponding position, and changing the inspection model when the reference mark is not recognized at the corresponding position, thereby performing inspection.

Here, the inspection model is provided including a top surface inspection model for inspection of the top surface of the substrate and a bottom inspection model for the bottom inspection of the substrate.

In addition, the inspection model includes a plurality of inspection models for inspection of different types of substrates.

Further, when there are three or more inspection models, the inspection model is continuously changed until a reference mark corresponding to the inspection model is recognized.

According to another aspect of the present invention, there is provided a method of automatically determining an inspection model for an optical inspection, comprising: activating a specific inspection model for inspection of a substrate; recognizing a specific identification mark at a predetermined position on the substrate; And performing a reference mark recognition operation corresponding to the changed inspection model after changing the inspection model if the reference mark is not recognized at the corresponding position.

According to the present invention as described above, the optical inspection is immediately performed by activating the specific inspection model among the stored inspection model storage units, and only when the reference mark does not coincide with the inspection target substrate image data in the reference mark recognition step, It is possible to shorten the optical inspection time by activating other inspection models, and it is unnecessary for the operator to individually reset the inspection model as in the prior art, which simplifies the process and has a high inspection efficiency.

1 is a block diagram showing a main configuration of a substrate optical inspection system according to an automatic determination of inspection models according to the present invention.
2 is a flowchart showing a procedure of an automatic determination method for an inspection model for an optical inspection according to the present invention.
3 is a flowchart showing another embodiment of a method for automatically determining an inspection model for an optical inspection according to the present invention.

Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.

1 is a block diagram showing a main configuration of a substrate optical inspection system according to an automatic determination of inspection models according to the present invention.

The substrate optical inspection system according to the present invention includes a CPU 10, a memory 20, a substrate inspection unit 30, a test model storage unit 40, an optical inspection unit 50).

The CPU 10 may be a general purpose processor, a digital signal processor (DSP), a microprocessor, a host processor, a controller, a plurality of processors or controllers, a chip, a microchip, (IC), an application specific integrated circuit (ASIC), or any other suitable multipurpose or special purpose processor or processor. Such CPU 10 may execute instructions for performing, for example, the operation of an operating system (OS) (not shown) or other functional blocks 20, 30, 40, 50 of the optical inspection system.

The memory 20 loads a thread which is a unit of an instruction set to be processed by the CPU 10 and provides it by a call of the CPU 10 (110). The memory 20 may be, for example, a random access memory (RAM), a read only memory (ROM), a dynamic random access memory (DRAM), a synchronous DRAM (SD-RAM), flash memory, volatile memory, A buffer, a short term memory unit, a long term memory unit, or other suitable memory unit or storage unit.

The inspection target substrate photographing section 30 photographs an image of an upper surface or a lower surface of a specific substrate to generate inspection target image data. The substrate to be inspected 30 is composed of a plurality of cameras and a lighting device, and a detailed description of the substrate shooting method will be omitted.

The inspection model storage unit 40 photographs images of upper and lower surfaces of a specific substrate without errors, stores the image data as a reference image, and determines substrate inspection reference data, that is, And an inspection model in which the image data matching order in the position is set is stored.

The inspection model storage unit 40 includes two inspection models: a first inspection model and a second inspection model.

Here, the first inspection model sets the inspection reference based on the top surface reference image of the specific substrate, and the second inspection model sets the inspection reference based on the bottom reference image of the specific substrate.

Alternatively, the inspection model storage unit 40 may include a plurality of inspection models for different types of substrate inspection, and the inspection standards may be separately set.

In particular, when three or more different types of substrate inspection models are used as described above, the inspection model is continuously changed until a reference mark corresponding to the inspection model is recognized.

The optical inspection unit 50 activates a specific inspection model, and matches the reference mark with the image data of the inspection target substrate photographed by the substrate photographing unit 30 and the reference image stored in advance in the inspection model by setting control of the activated inspection model And conducts optical inspection.

Hereinafter, a method for automatically determining an inspection model for an optical inspection according to the present invention will be described in detail.

2 is a flowchart showing a procedure of an automatic determination method for an inspection model for an optical inspection according to the present invention.

Referring to the drawings, a method of automatically determining an inspection model for an optical inspection according to the present invention includes capturing an image of a specific substrate to be inspected through a camera to obtain inspection substrate image data (S210).

In this optical inspection, the specific inspection model among the inspection models stored in the inspection model storage unit 40 is activated in advance (S220), and the optical inspection is immediately performed.

The optical inspection compares the reference image stored in the inspection model storage unit 40 with the image data of the specific substrate to be inspected in accordance with the inspection reference order of the activated inspection model and sets a reference mark at a preset position in the image data of the specific substrate (S230).

If the reference mark is recognized at a predetermined position on the substrate during the matching process, the optical inspection is continuously performed in accordance with the inspection reference order of the activated inspection model (S240) to determine the defective state of the substrate.

However, if the reference mark is not recognized at a predetermined position on the substrate, the activated inspection model is deactivated and another inspection model not activated among the inspection models stored in the inspection model storage unit 40 is activated (S250) The optical inspection is continuously performed as described above.

For example, the inspection model stored in the inspection model storage unit 40 includes a first inspection model in which inspection standards are set based on a top surface reference image of a specific substrate, and a second inspection model in which inspection standards (S220), the first first inspection model is activated (S220), and in the optical inspection step, the specific substrate image data and the second substrate inspection data If the reference mark is matched with the reference mark of the first inspection model (S230), the substrate image is recognized as the top image data and the optical inspection is continuously performed (S240).

 However, if the specific substrate image data and the reference mark of the top surface inspection model storage unit do not match in the optical inspection step, the substrate image data is recognized as image data, the previously activated first inspection model is deactivated, So that the reference mark is matched.

In addition to the top and bottom surface inspection models, if a plurality of inspection models are not matched with the reference marks of any one of the first inspection model and the second inspection model, .

In addition, when there are three or more inspection models, the inspection model may be continuously changed until a reference mark corresponding to the inspection model is recognized.

As described above, the optical inspection time is shortened by automatically activating the second inspection model on the opposite side only when the reference mark is not coincident with the inspection target substrate image data, The worker does not have to reset the upper surface or lower surface inspection model storage unit of the substrate in the conventional manner, thereby simplifying the process.

3 is a flowchart showing another embodiment of a method for automatically determining an inspection model for an optical inspection according to the present invention.

In another embodiment of the present invention, the inspection model is not changed in the reference mark matching step when the upper and lower inspection model reference marks are the same on the surface inspection model of the substrate, In order to make the change.

More specifically, in another exemplary embodiment, after capturing an image of a specific substrate (S310), the inspection model storage unit 40 activates one of the inspection models of the top and bottom inspection models S320).

Then, a specific identification mark is recognized at a predetermined position on the substrate to be inspected (S330). If the identification mark is recognized at the position, the reference mark is inspected on the image of the specific substrate, (S340).

Subsequently, the substrate optical inspection is continuously performed in the inspection order of the activated inspection model (S350).

That is, when the initial top surface inspection model is activated and the identification mark in the top surface inspection model is recognized in the substrate image to be inspected, the substrate to be inspected is determined as the top surface image, and the inspection is performed through matching of the reference marks.

However, if the identification mark of the activated inspection model is not recognized in the inspection target substrate image, the inspection target substrate image is judged as the image of the other surface, the activated inspection model is inactivated and the inspection model of the inactive surface is activated ) Again to recognize the identification mark.

Although the present invention has been described in connection with the above-mentioned preferred embodiments, it is possible to make various modifications and variations without departing from the spirit and scope of the invention. Accordingly, the scope of the appended claims should include all such modifications and changes as fall within the scope of the present invention.

10: CPU 20: Memory
30: Inspection substrate pickup section 40: Inspection model storage section
50: Optical inspection part

Claims (5)

Activating a particular test model for substrate inspection;
Recognizing a reference mark at a predetermined position on the substrate;
Performing a continuous inspection when the reference mark is recognized at a corresponding position, and performing an inspection by changing an inspection model when the reference mark is not recognized at the corresponding position. Automatic determination method.
The method according to claim 1,
Wherein the inspection model includes a top surface inspection model for top surface inspection of the substrate and a bottom inspection model for bottom surface inspection of the substrate.
The method according to claim 1,
Wherein the inspection model includes a plurality of inspection models for inspection of different types of substrates.
The method of claim 3,
Wherein when the inspection model is three or more, the inspection model is continuously changed until a reference mark corresponding to the inspection model is recognized.
Activating a particular test model for substrate inspection;
Recognizing a specific identification mark at a predetermined position on the substrate;
Performing a reference mark recognition operation when the identification mark is recognized at a corresponding position, performing a reference mark recognition operation corresponding to the changed inspection model after changing the inspection model if the reference mark is not recognized at the position, And determining whether or not the inspection model is automatically determined.
KR1020140026494A 2014-03-06 2014-03-06 Method for automatic determination of test model for optical inspection KR20150104763A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102016113522A1 (en) 2015-07-24 2017-01-26 Hyundai Autron Co., Ltd. Method and apparatus for controlling tire pressure using a zero crossing
KR20230027500A (en) 2021-08-19 2023-02-28 주식회사 크레셈 Board inspection method using a learning model

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102016113522A1 (en) 2015-07-24 2017-01-26 Hyundai Autron Co., Ltd. Method and apparatus for controlling tire pressure using a zero crossing
KR20230027500A (en) 2021-08-19 2023-02-28 주식회사 크레셈 Board inspection method using a learning model

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