JP2008010570A - Method for determining mounting condition - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for determining mounting conditions capable of optimally setting the mounting conditions of a part mounting machine. <P>SOLUTION: The method determines the mounting conditions of the part mounting machine producing a part mounting substrate. The method contains a part-quality status data acquisition step (S2) acquiring part-quality status data indicating the quality statuses of parts or materials at every kind of the parts, or the materials regarding the parts or the materials used for producing the part mounting substrate. The method further contains a mounting-condition determining step (S8) determining the mounting conditions of the part mounting machine, so that the operating status of the part mounting machine is kept within a tolerance on the basis of the acquired part-quality status data regarding the parts or the materials. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a mounting condition determination method for a component mounting machine, and more particularly to a mounting condition determination method that dynamically changes a mounting condition when there is a problem in the quality of a component or material.

Conventionally, as a method of improving the quality of component mounting boards produced by component mounters, a history of the number of error occurrences is stored for each suction nozzle or component cassette of the component mounter, and based on the correlation with the component suction rate There has been proposed a method for identifying a suction nozzle or a component cassette that causes a reduction in the operating status or quality status in the production of a component mounting board (see, for example, Patent Document 1).
Japanese Patent No. 3421372

  However, according to the conventional method, when the operation status of the component mounting machine deteriorates, the cause analysis is performed on the assumption that the cause is the component member of the component mounting machine such as a suction nozzle or a component cassette.

  As described above, in the conventional cause analysis method, the cause is identified from the component parts of the component mounter and the setting conditions for the component mounter, and the cause causing the component mounter is removed from the beginning. Was. Therefore, the mounting conditions of the component mounter have been reset so as to remove the identified cause.

  However, when there are factors that can cause a decrease in operating status and quality status in the electronic components supplied by component manufacturers and adhesives provided by material manufacturers, etc., the conventional method can optimize the mounting conditions. There is a problem that it cannot be reset. In addition, as a factor that may cause a decrease in the operating status and quality status of the electronic component, a variation in the dimensions of the component may be considered. Further, as a factor that may cause a decrease in the operating status and quality status due to the adhesive, a decrease in the viscosity of the adhesive may be considered.

  The present invention has been made in order to solve the above-described problems, and even if the component or material has a cause of deterioration in the operating status of the component mounting machine or the quality status of the component mounting board, the component mounting It is an object of the present invention to provide a mounting condition determining method capable of optimally setting a mounting condition of a machine.

  In order to achieve the above object, a mounting condition determining method according to the present invention is a method for determining a mounting condition of a component mounting machine that produces a component mounting board, and is a component or material used for production of a component mounting board. For each part or material type, a component quality status data acquisition step for acquiring component quality status data indicating the quality status of the component or material, and the operation of the component mounting machine based on the acquired component quality status data And a mounting condition determining step for determining a mounting condition of the component mounter so that a situation or a quality condition of the component mounting board falls within an allowable range.

  According to this configuration, the mounting condition of the component mounter is determined in consideration of the quality status of the component or material. For this reason, even if there is a cause of a decrease in the operating status of the component mounting machine or the quality status of the component mounting board in the component or material, the mounting conditions of the component mounting machine can be set optimally.

  Preferably, in the component quality status data acquisition step, a dispersion or standard deviation of component dimensions is acquired for the entire component mounter for each component type, and the mounting condition determination step includes the component dimensions for each component type. Determining whether or not the variance or standard deviation of the component is greater than or equal to a predetermined specified value, and if the variance or standard deviation of the component dimensions is greater than or equal to the predetermined specified value, a suction nozzle that sucks a component of the component type From the mounting conditions for changing the size to a size larger than the current size, the mounting conditions for moving the component to the mounting position on the board slower than the current moving speed, and the standard values of the component dimensions A determination step of determining at least one of the mounting conditions for expanding the allowable range of the deviation amount as the mounting condition of the component mounting machine.

  Further, the mounting condition determination method described above further includes a step of acquiring a recognition error rate, which is a rate at which recognition cannot be normally performed when a component sucked by a suction nozzle is recognized by a component recognition camera for each component type. Including determining, for each component type, whether or not the recognition error rate exceeds a predetermined specified value; and when the recognition error rate exceeds the predetermined specified value And a step of determining a mounting condition for expanding the allowable range of the deviation amount from the standard value of the dimension of the component of the component type as the mounting condition of the component mounting machine.

  By performing the processing as described above, the allowable range of the dimension of the component when the component is recognized by the component recognition camera can be reduced. Therefore, the recognition error rate of parts can be reduced. Therefore, the operating status can be improved.

  Further, the mounting condition determination method described above further includes a step of acquiring a suction rate, which is a rate at which the suction nozzle succeeds in sucking a component from the component supply unit, for each component type, and the determination step includes: A step of determining whether or not the suction rate exceeds a predetermined specified value for each type, and if the suction rate exceeds the predetermined specified value, suction for sucking a component of the part type Determining a mounting condition for changing the nozzle size to a size larger than the current size as a mounting condition for the component mounting machine.

  By using the suction nozzle having a large size, the component mounting machine can stably suck the component, and can improve the operation status such as the suction rate. This also improves the quality of the component mounting board.

  Further, the determining step determines, for each component type, whether or not a ratio of mounting accuracy deviating from a predetermined standard range exceeds a predetermined specified value; and the ratio is set to a predetermined specified value. A step of determining, as the mounting condition of the component mounting machine, a mounting condition that the moving speed when moving the component of the component type to the mounting position on the board is slower than the current moving speed if it exceeds And may be included.

  By slowing down the moving speed of the component, it is possible to stably mount the component on the substrate, such as reducing the possibility of dropping the component on the substrate, and to improve the operation status of the component mounting machine.

  The present invention can be realized not only as a mounting condition determination method including such characteristic steps, but also as a mounting condition determination device using the characteristic steps included in the mounting condition determination method as means. Alternatively, it can be realized as a program that causes a computer to execute the characteristic steps included in the mounting condition determination method. Needless to say, such a program can be distributed via a recording medium such as a CD-ROM (Compact Disc-Read Only Memory) or a communication network such as the Internet.

  Providing a mounting condition determination method that can optimally set the mounting conditions for a component mounter even if there is a cause for the deterioration of the operating status of the component mounter or the quality status of the component mounting board in the component or material. can do.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(Embodiment 1)
FIG. 1 is a diagram showing a component mounting board production system for realizing the first embodiment of the present invention.

  The production system includes a plurality of mounting lines 200 provided in the component mounting board manufacturer 100 and a component quality management device 300.

  The plurality of mounting lines 200 is a system for producing a component mounting board in which components are mounted on a board.

  The component quality management device 300 is connected to all the mounting lines 200, and is a device that manages the quality of the component for each component type. When the component quality management apparatus 300 determines that there is a variation in the quality of the components, the component quality management apparatus 300 determines the production conditions of the component mounting machines that constitute the mounting line 200, and transmits an instruction to change the production conditions to the component mounting machines. .

FIG. 2 is an external view of the mounting line 200 shown in FIG.
The mounting line 200 is a system for transporting a board from an upstream production facility to a downstream production facility to produce a board on which components are mounted. The stocker 14 and 30, the solder printer 16, the conveyor 18, 26, an adhesive application device 21, component mounters 22 and 24, and a reflow furnace 28.

  The stockers 14 and 30 are devices for stocking substrates, and the stocker 14 is located on the uppermost stream of the production line, and the stocker 30 is located on the most downstream side of the production line. That is, the stocker 14 is stocked with a board on which no components are mounted, and the stocker 30 is stocked with a finished product board with components mounted thereon.

  The solder printing device 16 is a device that prints solder on a substrate. The conveyors 18 and 26 are apparatuses for transporting the substrate. The adhesive application device 21 is an apparatus that applies an adhesive on a substrate. The component mounters 22 and 24 are devices for mounting components on a board. The reflow furnace 28 is an apparatus for fixing a component on the substrate after melting the solder or the like by heating the substrate on which the component is mounted.

  FIG. 3 is an external view showing the configuration of the component mounter 22. The component mounter 24 has a similar configuration.

  The component mounter 22 includes two sub-equipment 130a and 130b that perform component mounting in cooperation with each other (or alternately). The sub-equipment 130a includes a component supply unit 124a having an arrangement of parts feeders 123 for storing component tapes, and a plurality of suction nozzles (hereinafter simply referred to as “ Multi-mounting head 121 having a nozzle ”), a beam 122 to which multi-mounting head 121 is attached, and a component for inspecting two-dimensionally or three-dimensionally the suction state of a component sucked by multi-mounted head 121 A recognition camera 126 and the like are provided. The sub-equipment 130b has the same configuration as the sub-equipment 130a.

FIG. 4 is a plan view showing a main configuration inside the component mounter 22.
The component mounter 22 includes two sub-equipment 130a and 130b arranged in the front-rear direction (Y-axis direction) of the component mounter 22 therein. The sub-equipment 130a and 130b arranged facing each other in the front-rear direction (Y-axis direction) perform component mounting work on one board 20 in cooperation with each other.

  Each of the sub-equipment 130 a and 130 b includes a beam 122 and a multi mounting head 121. Moreover, the sub-equipment 130a and 130b are provided with component supply parts 124a and 124b, respectively. In addition, the component mounter 22 is provided with a pair of rails 129 for transporting the substrate 20 between the sub-equipment 130a and 130b.

The component recognition camera 126 is not shown in the figure.
The beam 122 is a rigid body extending in the X-axis direction, and moves on a track (not shown) provided in the Y-axis direction (perpendicular to the conveyance direction of the substrate 20) while being parallel to the X-axis direction. Is something that can be done. Further, the beam 122 can move the multi-mounting head 121 attached to the beam 122 along the beam 122, that is, in the X-axis direction. The multi mounting head 121 can be moved freely in the XY plane by moving the multi mounting head 121 moving in the Y axis direction in the X axis direction. In addition, a plurality of motors such as a motor (not shown) for driving them are provided in the beam 122, and electric power is supplied to these motors and the like via the beam 122.

FIG. 5 is a block diagram showing a functional configuration of the component quality management apparatus 300.
The component quality management apparatus 300 includes an arithmetic control unit 301, a display unit 302, an input unit 303, a memory unit 304, a component quality management program storage unit 305, a communication I / F (interface) unit 306, a database unit 307, and the like. .

  The arithmetic control unit 301 is a CPU (Central Processing Unit), a numerical processor, or the like, and loads and executes a necessary program from the component quality management program storage unit 305 to the memory unit 304 in accordance with an instruction from the operator and the like. Each component 302 to 307 is controlled according to the result.

  The display unit 302 is a CRT (Cathode-Ray Tube), LCD (Liquid Crystal Display), or the like, and the input unit 303 is a keyboard, a mouse, or the like. 300 is used for dialogue between the operator and the operator.

  The communication I / F unit 306 is a LAN (Local Area Network) adapter or the like, and is used for communication between the component quality management apparatus 300 and the component mounter 22 configuring the mounting line 200. The memory unit 304 is a RAM (Random Access Memory) or the like that provides a work area for the arithmetic control unit 301.

  The database unit 307 is a hard disk or the like that stores input data (mounting point data 307a, component library 307b, etc.), a deduction table 307c, a determination table 307d, etc., used for the mounting program creation processing by the component quality management apparatus 300. .

  The component quality management program storage unit 305 is a hard disk or the like that stores various control programs that implement the functions of the component quality management device 300, and is functionally a processing unit that functions when executed by the arithmetic control unit 301. As described above, the operation status calculating unit 305a, the component quality status calculating unit 305b, the mounting board quality status calculating unit 305h, the parameter counting unit 305c, the cause specifying unit 305d, and the mounting condition changing unit 305g are included.

  The operating status calculation unit 305a is a processing unit that calculates various parameters related to the operating status of each component mounter. The component quality status calculation unit 305b is a processing unit that calculates various parameters related to the quality status of components used for the production of a component mounting board by each component mounter.

  The mounting board quality status calculation unit 305h is a processing unit that calculates various parameters related to the quality status of the component mounting board produced by each component mounting machine. As parameters calculated by the mounting board quality status calculation unit 305h, for example, the occurrence rate of component mounting position deviation, the occurrence rate of missing parts on the board, the occurrence rate of poor connection between leads and lands, and the like can be considered. The mounted board quality status calculation unit 305h counts these parameters for each component type.

  The parameter totaling unit 305c totalizes the parameters calculated by the operation status calculation unit 305a, the component quality status calculation unit 305b, and the mounting board quality status calculation unit 305h for each component mounting machine or for the entire component mounting machine, and performs processing for scoring Part. However, the parameter totaling unit 305c may total the parameters calculated by the operation status calculation unit 305a and the part quality status calculation unit 305b. Instead of the parameters calculated by the operation status calculation unit 305a, The parameters calculated by the mounting board quality status calculation unit 305h may be aggregated.

  The cause identifying unit 305d is a processing unit that identifies the cause of the above-described deterioration of the operating status or the quality status. The mounting condition changing unit 305g obtains the mounting conditions of the component mounting machine 22 based on the processing results of the parameter totaling unit 305c and the cause identifying unit 305d, and instructs the component mounting machine 22 to change to the obtained mounting conditions. Is a processing unit that transmits.

FIG. 6 is a diagram illustrating an example of the mounting point data 307a.
The mounting point data 307a is a collection of information indicating mounting points of all components to be mounted. As shown in FIG. 6, one mounting point pi includes a component type ci, an X coordinate xi, a Y coordinate yi, a mounting angle θi, and control data φi. Here, “component type” corresponds to a component name in a component library 307b shown in FIG. 7 described later, and “X coordinate” and “Y coordinate” are coordinates of a mounting point (coordinates indicating a specific position on the board). The “mounting angle” is the rotation angle of the component at the time of component mounting, and the “control data” is the constraint information regarding the mounting of the component (type of usable suction nozzle, maximum movement of the multi mounting head 121) Speed, etc.).

FIG. 7 is a diagram illustrating an example of the component library 307b.
The component library 307b is a library in which unique information about all the component types that can be handled by the component mounter 22 and the like is collected. As shown in FIG. 7, the component size and tact (constant) for each component type are collected. And the other constraint information (a type of suction nozzle that can be used, a recognition method by the component recognition camera 126, a maximum moving speed of the multi mounting head 121, etc.). In the drawing, the external appearance of the components of each component type is also shown for reference.

  First, various parameters relating to the operation status of each component mounter calculated by the operation status calculation unit 305a will be described.

  FIG. 8 is a diagram showing a mounting rate and the number of errors for each suction nozzle, which is a kind of parameter relating to the operation status. FIG. 8 shows the mounting rate and number of errors for each suction nozzle in the multi mounting head 121 of a component mounting machine. Here, the “mounting rate” is a value indicating the rate of successful component mounting on the board. The “number of errors” is the number of parts that have failed to be mounted on the board. According to FIG. 8, the mounting rate of the 12th suction nozzle among the 16 suction nozzles is the smallest, and the number of errors is the largest. That is, FIG. 8 shows that component mounting errors frequently occur in the twelfth suction nozzle.

  FIG. 9 is a diagram illustrating a mounting rate and the number of times of suction for each suction nozzle, which are a kind of parameters related to the operation status. FIG. 9 shows the mounting rate and number of suctions for each suction nozzle in the multi-mounting head 121 of a certain component mounting machine. Here, the “mounting rate” is the same as that described in FIG. The “number of times of suction” indicates the number of times of suction of parts by the suction nozzle. For example, the sixth suction nozzle and the fourteenth suction nozzle indicate that the number of times of suction is smaller than other suction nozzles.

  FIG. 10 is a diagram showing the mounting rate and the number of times of suction for each component cassette, which are a kind of parameters related to the operating status. FIG. 10 shows the mounting rate and the number of suctions for each component cassette in the component supply unit of a certain component mounting machine. Here, “mounting rate” has the same meaning as described in the description of FIG. However, here, the mounting rate for each component cassette, that is, for each component type is shown. Further, “the number of times of suction” indicates the number of times of suction of the component by the suction nozzle. However, here, the number of suctions by component cassette, that is, by component type is shown. For example, the component mounting rate of the 87th component cassette is lower than 99.7%, which indicates that the component mounting rate decreases when the component is sucked from the component cassette and mounted on the board. .

  FIG. 11 is a diagram showing a recognition error rate of a component type, which is a kind of parameter related to the operating status. The “recognition error rate” is a rate at which recognition cannot be normally performed when a component sucked by the suction nozzle is recognized by the component recognition camera 126. As indicated by the broken line in the figure, when the allowable value of the recognition error rate is 0.5%, the recognition error rates of the component types A and D exceed the allowable value.

  FIG. 12 is a diagram showing the suction rate for each component type, which is a kind of parameter related to the operation status. The “suction rate” is a rate at which the suction nozzle succeeds in sucking a component from the component cassette. Whether or not the suction nozzle is picking up a component can be determined by recognizing the component with the component recognition camera 126. As shown by the broken line in the figure, when the allowable value of the suction rate is 99.8%, the suction rate of the part A is lower than the allowable value.

  FIG. 13 is a diagram illustrating the take-out rate of the component type, which is a kind of parameter related to the operating status. The “take-out rate” is a rate at which a component sucked by the suction nozzle fails to be mounted on the substrate and the component is brought back. Whether the component has been brought home is determined by measuring the amount of change in the vacuum pressure in the multi-mounting head 121 after the component mounting operation by the suction nozzle or by the component recognition camera 126. It can be determined by recognizing or not. As indicated by the broken line in the figure, when the allowable value of the takeout rate is 0.6%, the takeout rates of the component types B and C exceed the allowable value.

  Next, various parameters relating to the quality status of the component calculated by the component quality status calculation unit 305b will be described.

  First, a description will be given of a dimensional error, which is a kind of parameter relating to the quality status. “Dimensional error” indicates a variation in the size of a part, and specifically, a dispersion or standard deviation of the dimension of the part is used.

  FIG. 14 is a diagram for explaining the dimensions of a part. The dimension of the part includes a width x, a depth y, and a height t. When the component recognition camera 126 is a two-dimensional camera, the width x and depth y of the component can be obtained from the output of the component recognition camera 126. When the component recognition camera 126 is a three-dimensional camera, the width x, depth y, and height t of the component can be obtained from the output of the component recognition camera 126. Further, from the output of the component recognition camera 126, it is also possible to obtain a suction angle shift amount θ when a component is sucked. Here, for simplification of description, the component recognition camera 126 is a two-dimensional camera, and the width x, depth y, and suction angle deviation amount θ of the component can be obtained from the output of the component recognition camera 126. .

Hereinafter, a result of recognizing 400 parts by the parts recognition camera 126 will be described.
FIG. 15 is a graph showing the amount of deviation dX from the standard value of the width x for each component. The horizontal axis indicates the part number, and the vertical axis indicates the deviation dX [μm] from the standard value of the width x. FIG. 16 is a graph obtained by enlarging the graph shown in FIG. 15 in the vertical axis direction.

  FIG. 17 is a graph showing the amount of deviation dY from the standard value of the depth y for each component. The horizontal axis indicates the part number, and the vertical axis indicates the amount of deviation dY [μm] from the standard value of the depth y.

  FIG. 18 is a histogram showing the distribution of the deviation amount dX, and FIG. 19 is a histogram showing the distribution of the deviation amount dY. FIG. 20 is a histogram showing the distribution of the adsorption angle deviation amount θ [deg].

  FIG. 21 is a graph two-dimensionally showing the distribution of the shift amount dX and the shift amount dY. The horizontal axis indicates the shift amount dX, and the vertical axis indicates the shift amount dY. In the graph, the standard range is indicated by a rectangular frame 600. The “standard range” is a range of an allowable deviation amount for a component having a normal dimension. In the graph, a component whose deviation amount dX is a value between −50 μm and 50 μm and a deviation amount dY is a value between −50 μm and 50 μm falls within the standard range.

  FIG. 22 is a table summarizing the above results. According to the table, the number of measurement points of parts is 400, and the recognition error is 0. In addition, regarding the deviation amount dX of the width x of the component, the upper limit of the standard range is 50 μm and the lower limit is −50 μm. Furthermore, the average value of the shift amount dX is 11.0, the maximum value is 37.8, the minimum value is −18.2, and the range of the shift amount dX (= maximum value−minimum value) is 56. Furthermore, the standard deviation of the deviation amount dX is 9.51, and 3σ is 28.53. In the figure, process capability indexes (Cp, k, Cpk) are also shown. Similar values are shown for the displacement amount dY of the component depth y and the suction angle displacement amount θ. The dimension error here corresponds to the standard deviation of the deviation amount dX, the standard deviation of the deviation amount dY, and the standard deviation of the suction angle deviation amount θ.

  FIG. 23 is a diagram for explaining the bending of the lead, which is a kind of parameter relating to the quality status. In lead parts having leads as shown in FIG. 23 (a), lead bending 604 as shown in FIGS. 23 (a) and 23 (b) often occurs at the time of manufacturing or transporting the parts. The component recognition camera 126 can recognize such a lead bend 604 two-dimensionally or three-dimensionally at the time of component mounting. If a component with a bent lead 604 is mounted on a board, the lead may not be properly connected to a regular land on the board and cannot be conducted, or may contact other lands or leads that are not regular lands. , Short circuit. For this reason, it becomes a factor which deteriorates the quality condition of a component mounting board.

  FIG. 24 is a diagram for explaining the variation in the amount of solder, which is a kind of parameter relating to the quality status. In a part having a BGA (Ball Grid Array) as shown in FIG. 24, ball-shaped solder is applied in advance to electrode portions arranged on the array. However, in the case where the solder has an area or volume different from that of other solder, such as the solder included in the region 605, the electrodes may float from the substrate due to insufficient solder, or the electrodes may be separated due to excessive solder. There arises a problem of conduction. For this reason, it becomes a factor which deteriorates the quality of a component mounting board. Therefore, “variation in the amount of solder” indicates variation in the area or volume of the solder, and specifically, the variance or standard deviation of the area or volume of the solder is used. Note that the area or volume of the solder can be recognized by the component recognition camera 126.

  It should be noted that the “take-out rate”, which is a kind of parameter relating to the operation status described above, is also a kind of parameter relating to the quality situation. That is, in FIG. 25, the position of the part that is picked up by the suction nozzle is shown by hatching. However, if the sticking property of the part shown by hatching is strong, the take-out rate increases. For this reason, there is a correlation between the take-out rate and the sticking property. That is, the take-out rate is also a kind of parameter related to the quality situation. Note that the adhesiveness varies depending on the material of the component. For example, in the case of a material having a high purity of tin, the portion becomes soft, so that it is easily caught by the suction nozzle, and the take-out rate increases.

  Thus, there is a close relationship between the quality status of the component and the operating status of the component mounter. FIG. 26 is a diagram for explaining the above-described relationship, taking “dimension error”, which is a kind of parameter relating to the quality status, as an example. FIG. 26A is a graph similar to the graph shown in FIG. 21, and shows the distribution of the deviation amount dX from the standard value of the component width x and the deviation amount dY from the standard value of the component depth y. It is the graph shown in dimension. In FIG. 26A, the standard range is indicated by a rectangular frame 606. For this reason, the parts corresponding to the points plotted outside the rectangular frame 606 are parts outside the standard range. When the variation in component dimensions increases, recognition errors occur frequently in the component recognition camera 126. For this reason, the operation rate of a component mounting machine falls by the frequent small stop of a component mounting machine. For this reason, there exists a problem that productivity of a component mounting board will fall. In such a case, the operator re-teaches the component dimension standard value to the component mounter in order to prevent a recognition error, but if the dimensional variation is large, what kind of standard value should be re-teached? In both cases, a recognition error occurs.

  Moreover, if there are many dimensional variations, it will also lead to a reduction in the adsorption rate described above. This leads to an increase in the number of parts discarded during production. For this reason, the components of the component type to be discarded are insufficient, and in the worst case, the component mounting board cannot be produced, and the productivity of the component mounting board is lowered. Further, when the adsorption rate is reduced, there is a high possibility that the component is dropped on the substrate, which leads to a deterioration in the quality of the component mounting substrate.

  Furthermore, when there are many dimensional variations, the mounting accuracy is lowered because the positions of the component electrodes and the board lands are difficult to coincide with each other. For this reason, as shown in FIG. 26B, the component is mounted at a position shifted from the true mounting position in the X direction and the Y direction, leading to deterioration of the quality of the component mounting board.

  Next, processing executed by the component quality management apparatus 300 will be described. FIG. 27 is a flowchart of processing executed by the component quality management apparatus 300.

  The component quality status calculation unit 305b calculates a dimensional error for each component type among the parameters regarding the quality status described above (S2). The component quality status calculation unit 305b calculates the dimensional error for each component mounter and also calculates the entire component mounter.

  The parameter totaling unit 305c totalizes the dimensional errors calculated in S2 for each component mounting machine, and scores the component types (S3). Further, the parameter totaling unit 305c totalizes the dimensional errors calculated in S2 as the whole component mounter, and scores the component types (S4). How to assign points will be described later.

  FIG. 28 is a diagram illustrating an example of parameters and points for each component type that are tabulated and scored as the whole component mounter. FIG. 28 shows the parameters and points of the entire component mounters constituting all the mounting lines 200. Based on the display instruction from the operator input unit 303, a screen (component quality) as shown in FIG. Display screen) is displayed on the display unit 302. The part quality display screen of FIG. 28 includes a part name, a manufacturer name, a dimensional error (X), a dimensional error (Y), a score, and a determination. The dimension error (X) indicates the standard deviation of the deviation amount dX, and the dimension error (Y) indicates the standard deviation of the deviation amount dY. For example, the part name “I” has a manufacturer name “XX”, a dimension error (X) “15”, a dimension error (Y) “20”, and a score of “55 points”. And the determination is “red”. The types of determination include “green”, “yellow”, and “red”, and the determination of “green” indicates that there is little dimensional error of the part and is good. The determination of “yellow” indicates that the dimensional error of the parts is a little bad and attention is required. The determination of “red” indicates that the dimensional error of the component is bad and a problem has occurred.

  FIG. 29 is a diagram illustrating an example of parameters and points for each component type that are tabulated and scored in units of component mounters. FIG. 29 shows parameters and points for a certain component mounting machine α, and a screen (component quality display screen) as shown in FIG. 29 is displayed on the display unit 302 based on a display instruction from the input unit 303 of the operator. Is displayed. The part quality display screen in FIG. 29 includes a part name, a manufacturer name, a dimensional error (X), a dimensional error (Y), a score, and a determination. For example, the part name “I” has the manufacturer name “XX”, the dimension error (X) “14”, the dimension error (Y) “22”, and the score “55 points”. And the determination is “red”.

  FIG. 30 is a diagram illustrating an example of component parameters and scores that are tabulated and scored by component manufacturer. FIG. 30 totals the parameters and parts of all parts for each part maker, and a screen (part quality display screen) as shown in FIG. 30 is displayed based on a display instruction from the input unit 303 of the operator. It is displayed on the display unit 302. The part quality display screen of FIG. 30 includes a manufacturer name, a dimensional error (X), a dimensional error (Y), a score, and a determination. For example, the integrated dimension error (X) for all parts of the manufacturer name “ZZ” is “8”, the dimension error (Y) is “6”, the score is “90 points”, and the determination is “ It is shown to be “green”. That is, the column of manufacturer name “ZZ” targets parts manufactured by all manufacturers “ZZ” including the part name “K” and the part name “L” shown in the part quality display screen of FIG. Dimensional errors, points, etc. are shown. As a result, it can be determined whether or not the manufacturer is a good manufacturer. In addition, you may not be every manufacturer but every factory of a manufacturer.

  FIG. 31 is a graph in which the score is displayed for each component type out of the parameters and the scores for each component type totaled and scored as the whole component mounter shown in FIG. The graph is displayed on the display unit 302 based on a display instruction from the input unit 303 of the operator. In the graph shown in FIG. 31, the horizontal axis represents the component name, and the vertical axis represents the score for each component type. Further, a score “70 points” indicating a separation between the determinations “red” and “yellow” and a score “90 points” indicating a separation between the determinations “yellow” and “green” are indicated by broken lines in the drawing. According to this graph, the judgment of the parts with the part names “I” and “J” is “red”, the judgment of the part with the part name “K” is “yellow”, and the judgment of the part with the part name “L” is determined. Is "green".

  FIG. 32 is a graph that displays the dimensional error (X) for each component type among the parameters and points for each component type that are tabulated and scored as the whole component mounter shown in FIG. The graph is displayed on the display unit 302 based on a display instruction from the input unit 303 of the operator. In the graph shown in FIG. 32, the horizontal axis represents the component name, and the vertical axis represents the dimensional error (X) for each component type. For example, it is indicated that the dimension errors (X) of the component types “I”, “J”, “K”, and “L” are “15”, “10”, “9”, and “8”, respectively. .

  FIG. 33 is a graph in which a dimensional error (Y) is displayed for each component type out of the parameters and the scores for each component type totaled and scored as the whole component mounter shown in FIG. The graph is displayed on the display unit 302 based on a display instruction from the input unit 303 of the operator. In the graph shown in FIG. 33, the horizontal axis indicates the component name, and the vertical axis indicates the dimensional error (Y) for each component type. For example, it is shown that the dimensional errors (Y) of the component types “I”, “J”, “K”, and “L” are “20”, “31”, “10”, and “4”, respectively. .

  FIG. 34 shows the amount of deviation dX from the standard value of the component width x for the component type “I” out of the parameters and points for each component type totaled and scored as the whole component mounter shown in FIG. 5 is a graph two-dimensionally showing the distribution of the deviation amount dY from the standard value of the component depth y. The graph is displayed on the display unit 302 based on a display instruction from the input unit 303 of the operator. The horizontal axis of the graph indicates the shift amount dX, and the vertical axis indicates the shift amount dY. In the graph shown in FIG. 34, the standard range is indicated by a rectangular frame 800. For this reason, the parts corresponding to the points plotted outside the rectangular frame 800 are out of the standard range. A similar graph can be displayed for other component types, for example, the component type “J”.

  FIG. 35 is a graph showing the bending rate of the lead in the component having the lead described with reference to FIG. The graph is displayed on the display unit 302 based on a display instruction from the input unit 303 of the operator. In the graph shown in FIG. 35, the horizontal axis indicates the part name, and the vertical axis indicates the lead bending rate. The lead bending rate is a value indicating the proportion of parts bent beyond a predetermined standard range. In the graph, 0.5% is provided as a threshold value for the lead bending rate. If only the lead bending rate of the part is considered, it is shown that the parts where the bending rate of the lead exceeds 0.5%, that is, the component types “I” and “J” are out of the standard range. Has been.

  The processing executed by the component quality management apparatus 300 will be described again with reference to FIG. The cause identifying unit 305d obtains a difference between the score of the entire component mounter and the minimum value of the scores obtained for each component mounter for each component type, and compares the difference with a predetermined threshold value TH ( S6).

  As a result of the comparison, if the above difference is larger than the threshold value TH (YES in S6), the cause identifying unit 305d determines that the cause of the deterioration of the operation status and the quality status is the component mounter, and If the difference is equal to or less than the threshold value TH (NO in S6), it is determined that the cause of the deterioration of the operation status and the quality status is not the component mounter but the component itself.

  The reason for such determination will be described below. When the cause of the deterioration of the operation status and the quality status is in the component mounter, only the score in the specific component mounter having the problem is low, and the score in the other component mounters is high. For this reason, although the score as a whole component mounting machine is high, the minimum value of the score calculated | required for every component mounting machine becomes low. Therefore, when the above difference is calculated, the difference becomes large.

  On the other hand, when the cause of the deterioration of the operation status and the quality status is in the parts, the score is lowered in all the component mounting machines. For this reason, both the score as the whole component mounter and the minimum value of the scores obtained for each component mounter are low. Therefore, when the above difference is calculated, the difference becomes small. Utilizing such a property, the cause identifying unit 305d determines whether the cause of the deterioration of the operation status and the quality status is the component mounter or the component.

  When it is determined that the cause of the deterioration of the operation status and the quality status is in the component (NO in S6), the mounting condition changing unit 305g applies the component to the component mounter using the component type. An instruction to change the mounting conditions when mounting the product type on the board is given (S8). This process will be described later.

  When it is specified that the cause of the deterioration of the operation status and the quality status is in the component mounting machine (YES in S6), the mounting condition changing unit 305g checks the component mounting machine that is the cause. By displaying the instruction on the display unit 302, the operator is instructed to check the component mounter (S9).

  The cause identifying unit 305d and the mounting condition changing unit 305g repeat the processing of S6 to S9 for all component types (loop B).

The process described above is repeated while the production of the component mounting board continues (S10).
Next, the mounting condition changing process (S8 in FIG. 27) will be described in detail. FIG. 36 is a flowchart showing details of the mounting condition changing process (S8 in FIG. 27).

  The mounting condition changing unit 305g determines whether or not the dimensional error (X) or the dimensional error (Y) of the component mounting machine as a whole for the target component type is 20 or more (S82). If any of the dimensional errors is 20 or more (YES in S82), the mounting condition changing unit 305g changes the size of the suction nozzle used when sucking the component of the component type to one larger. The instruction to do so is transmitted to the component mounter using the component of the component type (S84). By using a suction nozzle that is one size larger, it becomes possible to stably suck the parts, and the operating status such as the suction rate can be improved. This also improves the quality of the component mounting board.

  In addition, the mounting condition changing unit 305g gives an instruction to slow down the maximum moving speed of the multi-mounting head 121 when mounting a component of the component type by two steps, and the component using the component of the component type It transmits with respect to a mounting machine (S86). By reducing the maximum moving speed of the multi-mounting head 121, it is possible to stably mount the component on the substrate, such as reducing the possibility of dropping the component on the substrate, and to improve the operating status. Also, the component mounting accuracy shown in FIG. 26B can be improved. Therefore, the quality of the component mounting board is also improved.

  Further, the mounting condition changing unit 305g instructs the component mounter that uses the component of the component type to instruct the component recognition camera 126 to increase the dimensional tolerance (standard range) by 10%. (S88). For example, FIG. 21 shows a standard range with respect to a deviation amount dX and a deviation amount dY from a standard value by a rectangular frame 600. As shown in FIG. 21, the upper limit of the standard range is 50 μm and the lower limit is −50 μm. When this standard range is expanded by 10%, the upper limit of the standard range is 55 μm and the lower limit is −55 μm. Thereby, the recognition error rate can be reduced. Therefore, the operating status can be improved.

  If any dimension error is less than 20 (NO in S82), the mounting condition changing unit 305g determines whether any dimension error is 10 or more (S90). If any one of the dimensional errors is 10 or more (YES in S90), the mounting condition changing unit 305g changes the size of the suction nozzle used when sucking the component of the component type to one larger. The instruction to do so is transmitted to the component mounter using the component of the component type (S92). In addition, the mounting condition changing unit 305g gives an instruction to slow down the maximum moving speed of the multi-mounting head 121 when mounting the component of the component type by one step, and the component using the component of the component type The data is transmitted to the mounting machine (S94). Further, the mounting condition changing unit 305g gives an instruction to increase the dimensional tolerance (standard range) by the component recognition camera 126 by 5% to the component mounter using the component of the component type. (S96). The reason for transmitting these instructions is as described above.

  If any dimensional error is less than 10 (NO in S90), no processing is performed. The various numerical values of the mounting condition changing process described above are merely examples, and other numerical values may be used.

  As described above, according to the present embodiment, even when the quality of a component is poor, the mounting conditions of the component mounter are optimized so as to improve the operation status of the component mounter and the quality status of the component mounting board. Can be set to

(Embodiment 2)
Next, a production system according to Embodiment 2 of the present invention will be described.

  The configuration of the production system according to the second embodiment is the same as that shown in the first embodiment. Therefore, detailed description thereof will not be repeated here. In the second embodiment, the processing executed by the component quality management apparatus 300 is different from that in the first embodiment. In the first embodiment, the mounting conditions of the component mounter are changed based on the quality status. However, in the second embodiment, the mounting conditions of the component mounter are changed based on the quality status and the operating status. Is different from the first embodiment.

  FIG. 37 is a flowchart of processing executed by the component quality management apparatus 300 according to the second embodiment.

  The operating status calculation unit 305a calculates a recognition error rate, a suction rate, and a take-out rate for each component type among the parameters related to the operating status described above (S1). The operating status calculation unit 305a calculates these parameters for each component mounter and also for the entire component mounter. As a result, the recognition error rate, suction rate, and take-out rate for each component type as shown in FIGS. 11 to 13 are calculated for each component mounter or for the entire component mounter.

  Next, the component quality status calculation unit 305b calculates a dimensional error for each component type among the parameters regarding the quality status described above (S2). The component quality status calculation unit 305b calculates the dimensional error for each component mounter and also calculates the entire component mounter.

  The parameter totaling unit 305c totals the four types of parameters calculated in S1 and S2 for each component mounter, and scores the component types (S3). Further, the parameter totaling unit 305c totals the four types of parameters calculated in S1 and S2 as the entire component mounter, and scores the component types (S4). How to assign points will be described later.

  The parameter totaling unit 305c also counts the component mounting accuracy shown in FIG. 26B, and calculates a ratio that is out of a predetermined standard range (S5).

  FIG. 38 is a diagram illustrating an example of parameters and points for each component type that are tabulated and scored for each component mounter. FIG. 38 shows parameters and points for a certain component mounting machine α, and a screen (component quality monitor) as shown in FIG. 38 is displayed on the display unit 302 based on a display instruction from the input unit 303 of the operator. Is done. The part quality monitor of FIG. 38 includes a part name, a recognition error rate, a suction rate, a take-out rate, a dimensional error, a manufacturer name, and a determination. For example, the recognition error rate of the component with the component name “A” is “1.8”%, the suction rate is “96.0%”, the take-out rate is “0.05%”, and the dimension error Is “16”, the manufacturer name is “XX”, the score is “50 points”, and the determination is “red”. Note that the determination is indicated by the difference in color on the display unit 302, and the part name “A” is indicated in red.

  FIG. 39 is a diagram illustrating an example of parameters and points for each component type that are tabulated and scored as the whole component mounter. FIG. 39 shows the parameters and points of the entire component mounter constituting all the mounting lines 200. Based on the display instruction from the input unit 303 of the operator, a screen (component quality) as shown in FIG. Monitor) is displayed on the display unit 302. The part quality monitor in FIG. 39 includes a part name, a recognition error rate, a suction rate, a take-out rate, a dimensional error, a manufacturer name, and a determination. For example, the recognition error rate of the component with the component name “A” is “0.9”%, the suction rate is “96.2%”, the take-out rate is “0.04%”, and the dimension error Is “17”, the manufacturer name is “XX”, the score is “55 points”, and the determination is “red”.

  Here, how to assign the “score” shown on the component quality display screens of FIGS. 28 to 30, FIG. 38, and FIG. 39, that is, the component type scoring process (S3, S4) will be described. The number of parts types is given by a deduction method from a maximum of 100 points. FIG. 40 is a deduction table 307c showing how many points are deducted. The deduction table 307c is stored in the database unit 307 of the component quality management apparatus 300. The deduction points are determined for each of the recognition error rate, suction rate, take-out rate, and dimensional error. For example, paying attention to the deduction of the dimensional error, when the dimensional error is 0 or more and 4 or less, the deduction is “0 point”. If the dimensional error is greater than 4 and less than or equal to 8, the deduction is “5 points”. When the dimensional error is greater than 8 and less than or equal to 10, the deduction point is “10 points”. When the dimensional error is greater than 10 and 15 or less, the deduction point is “15 points”. When the dimensional error is larger than 15, the deduction point is “30 points”.

For example, focusing on the component name “A” shown in FIG. 38, the recognition error rate is “1.8%”. For this reason, the deduction is “10 points” based on the deduction table shown in FIG. Similarly, since the adsorption rate is “96.0%”, the deduction point is “10 points”. Moreover, since the take-out rate is “0.05%”, the deduction point is “0 point”. Furthermore, since the dimensional error is “16”, the deduction point is “30 points”. From the above, the score of the part name “A” is
It is calculated | required that it is "50 points" by the formula of 100 points-10 points-10 points-0 points-30 points = 50 points.

  Next, the “determination” determination process (determination process) shown on the component quality display screens of FIGS. 28 to 30, 38, and 39 will be described. The “determination process” is a process that is performed in the component type scoring process (S3, S4) and obtains a determination result for the component type score. FIG. 41 is a determination table 307d showing the relationship between the number of points used in the determination process and the determination result. The determination table 307d is stored in the database unit 307 of the component quality management apparatus 300. Based on the determination table 307d, the parameter totaling unit 305c determines that both the operating status and the quality status are good when the score is greater than 90, and sets the determination result to “green”. In addition, when the score is greater than 70 and less than or equal to 90, the parameter totaling unit 305c determines that attention is required for the operation status and the quality status, and sets the determination result to “yellow”. Further, when the score is 70 or less, the parameter totaling unit 305c determines that there is a problem in the operation status and the quality status, and sets the determination result to “red”.

  The processing executed by the component quality management apparatus 300 will be described again with reference to FIG. The cause identifying unit 305d determines, for each component type, whether there is a “red” determination among the determination as the whole component mounter or the determination for each component mounter (S22). If there is a component type with a determination of “red” (YES in S22), the mounting condition changing unit 305g displays an instruction to check the component type component and the component mounter that uses the component. By displaying on the unit 302, the operator is instructed to check the component and the component mounter (S24).

  The cause identifying unit 305d obtains a difference between the score of the target component type as a whole component mounter and the minimum value of the scores determined for each component mounter, and determines a predetermined threshold TH. (S26).

  As a result of the comparison, if the above difference is larger than the threshold value TH (YES in S26), the cause identifying unit 305d determines that the cause of the decrease in the operation status and the quality status is the component mounter, and If the difference is equal to or less than the threshold value TH (NO in S26), it is determined that the cause of the deterioration of the operation status and the quality status is not the component mounter but the component itself. The reason for such determination is as described in the first embodiment.

  When it is determined that the cause of the deterioration of the operation status and the quality status is in the component (NO in S26), the mounting condition changing unit 305g determines the dimensional error of the entire component mounting machine for the target component type. It is determined whether (X) or the dimensional error (Y) is equal to or greater than a predetermined specified value (S28).

  If any of the dimensional errors is greater than or equal to a predetermined specified value (YES in S28), the mounting condition changing unit 305g has a recognition error rate of the target component type as a whole component mounting machine of a predetermined specified value. It is judged whether it is larger than (S30). When the recognition error rate is larger than the predetermined specified value (YES in S30), the mounting condition changing unit 305g adds the allowable value (standard range) of the dimension by the component recognition camera 126 by a predetermined ratio. Is transmitted to the component mounter using the component of the component type (S32). Specifically, the same processing as S88 of FIG. 36 is performed. Thereby, the recognition error rate of components can be reduced. Therefore, the operating status can be improved.

  The mounting condition changing unit 305g determines whether or not the suction rate of the target component type as a whole component mounter exceeds a predetermined specified value (S34). When the suction rate is larger than the predetermined specified value (YES in S34), the mounting condition changing unit 305g changes the size of the suction nozzle used when sucking the part of the part type to one larger. An instruction to do so is transmitted to the component mounter using the component of the component type (S36). By using a suction nozzle that is one size larger, it becomes possible to stably suck the parts, and the operating status such as the suction rate can be improved. This also improves the quality of the component mounting board.

  The mounting condition changing unit 305g determines whether or not the rate at which the mounting accuracy of the target component type deviates from a predetermined standard range is greater than a predetermined specified value (S38). When the ratio is larger than the predetermined specified value (YES in S38), the mounting condition changing unit 305g decreases the maximum moving speed of the multi mounting head 121 when mounting the component of the component type by one step. An instruction is sent to the component mounter using the component of the component type (S40). By reducing the maximum moving speed of the multi-mounting head 121, it is possible to stably mount the component on the substrate, such as reducing the possibility of dropping the component on the substrate, and to improve the operating status. Also, the component mounting accuracy shown in FIG. 26B can be improved. Therefore, the quality of the component mounting board is also improved.

  The cause identifying unit 305d and the mounting condition changing unit 305g repeat the processing of S22 to S40 for all component types (loop C).

The process described above is repeated while the production of the component mounting board continues (S42).
As described above, according to the present embodiment, even when the quality of a component is poor, the mounting conditions of the component mounter are optimized so as to improve the operation status of the component mounter and the quality status of the component mounting board. Can be set to

  The production system according to the embodiment of the present invention has been described above, but the present invention is not limited to this embodiment.

  In the above-described embodiment, scoring is performed using the dimensional error of the component. However, it is not always necessary to use the dimensional error of the component, and scoring may be performed using the various parameters introduced above. Good. For example, scoring may be performed using the lead bending rate, or scoring may be performed using variations in the amount of solder of the BGA. For example, when the bending rate of the lead of a component is large, an instruction to slow down the maximum moving speed of the multi mounting head 121 by one step may be transmitted to the component mounting machine.

  Moreover, in the above-mentioned embodiment, although the score was given with respect to the component used for a component mounting machine, the object of scoring does not necessarily need to be a component, the board | substrate or material used with a component mounting machine, It may be a material used in other production facilities. For example, a substrate, cream solder, adhesive, or the like may be used.

  If there is a problem with cream solder, the solder printing conditions such as decreasing the printing speed in the solder printing device 16 may be changed.

  Furthermore, when there is a problem with the adhesive, the adhesive application conditions by the adhesive application device 21 may be changed.

Moreover, the function of the above-mentioned component quality management apparatus 300 may be provided in the component mounter.
The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

  The present invention can be applied to a mounting condition determining apparatus for determining an optimal mounting condition for a component mounting machine in a mounting line including a component mounting machine for mounting electronic components on a substrate.

It is a figure which shows the production system of the component mounting board | substrate for implement | achieving embodiment of this invention. It is an external view of the mounting line shown in FIG. It is an external view which shows the structure of a component mounting machine. It is a top view which shows the main structures inside a component mounting machine. It is a block diagram which shows the functional structure of a component quality management apparatus. It is a figure which shows an example of mounting point data. It is a figure which shows an example of a component library. It is a figure which shows the attachment rate and the number of errors for every adsorption nozzle which are 1 type of parameters regarding an operating condition. It is a figure which shows the mounting rate according to adsorption nozzle and the frequency | count of adsorption | suction which are 1 type of the parameter regarding an operating condition. It is a figure which shows the mounting rate and the frequency | count of adsorption | suction by component cassette which are 1 type of the parameter regarding an operating condition. It is a figure which shows the recognition error rate of a component classification which is a kind of parameter regarding an operating condition. It is a figure which shows the adsorption | suction rate of component classification which is a kind of parameter regarding an operating condition. It is a figure which shows the take-out rate of a component classification which is a kind of parameter regarding an operating condition. It is a figure for demonstrating the dimension of components. It is the graph which showed deviation | shift amount dX from the standard value of the width | variety x about each component. It is the graph which expanded the graph shown in FIG. 15 to the vertical axis | shaft direction. It is the graph which showed deviation | shift amount dY from the standard value of depth y about each component. It is the histogram which showed distribution of deviation | shift amount dX. It is the histogram which showed distribution of deviation | shift amount dY. It is a histogram which showed distribution of adsorption angle shift amount theta [deg]. It is the graph which showed distribution of deviation amount dX and deviation amount dY two-dimensionally. It is the table | surface which put together the experimental result regarding deviation | shift amount. It is a figure for demonstrating the bending of a lead which is a kind of parameter regarding a quality condition. It is a figure for demonstrating the variation in the amount of solder which is a kind of parameter regarding a quality condition. It is a figure for demonstrating adhesiveness. It is a figure for demonstrating the relationship between the quality condition of a component mounting board | substrate and the operating condition of a component mounting machine, taking "dimensional error" which is a kind of parameter regarding a quality condition as an example. It is a flowchart of the process which a components quality management apparatus performs. It is a figure which shows an example of the parameter and score for every component kind totaled and scored as the whole component mounting machine, respectively. It is a figure which shows an example of the parameter and score for every component kind totaled and scored by the component mounting machine unit, respectively. It is a figure which shows an example of the parameter and score of a component totaled and scored according to component manufacturers. It is the graph which displayed the score for every component kind among the parameter and the score for every component kind which were totaled and scored as the whole component mounting machine shown in FIG. It is the graph which displayed dimension error (X) for every component type among the parameters and points for every component type which were totaled and scored as the whole component mounting machine shown in FIG. It is the graph which displayed the dimension error (Y) for every component type among the parameter and the score for every component type which were totaled and scored as the whole component mounting machine shown in FIG. Of the parameters and points for each component type, which are tabulated and scored as the whole component mounting machine shown in FIG. It is the graph which showed two-dimensional distribution with deviation | shift amount dY from the standard value of y. It is the graph which showed the bending rate of the lead in the components which have the lead demonstrated using FIG. It is a flowchart which shows the detail of a mounting condition change process (S8 of FIG. 27). 10 is a flowchart of processing executed by the component quality management apparatus according to the second embodiment. It is a figure which shows an example of the parameter and score for every component kind totaled and scored by the component mounting machine unit, respectively. It is a figure which shows an example of the parameter and score for every component kind totaled and scored as the whole component mounting machine, respectively. It is a deduction table showing how many points are deducted. It is the determination table | surface which showed the relationship between the score used for determination processing, and a determination result.

Explanation of symbols

14, 30 Stocker 16 Solder printing device 18, 26 Conveyor 20 Substrate 21 Adhesive application device 22, 24 Component mounting machine 28 Reflow furnace 100 Component mounting substrate manufacturer 121 Multi mounting head 122 Beam 123 Parts feeder 124a, 124b Component supply unit 126 Components Recognition camera 129 Rails 130a, 130b Sub-equipment 200 Mounting line 300 Component quality management device 301 Operation control unit 302 Display unit 303 Input unit 304 Memory unit 305 Component quality management program storage unit 305a Operation status calculation unit 305b Component quality status calculation unit 305c Parameters Aggregation unit 305d Cause identification unit 305g Mounting condition change unit 305h Mounting board quality status calculation unit 306 Communication I / F unit 307 Database unit 307a Mounting point data 307b Component library 307c Deduction table 307 Decision table

Claims (11)

A method for determining mounting conditions of a component mounter that produces a component mounting board,
A component quality status data acquisition step for acquiring component quality status data indicating the quality status of a component or material for each type of component or material for a component or material used for production of a component mounting board;
A mounting condition determining step for determining a mounting condition for the component mounter based on the acquired component quality status data so that the operating status of the component mounter or the quality status of the component mounting board falls within an allowable range. A mounting condition determination method characterized by: Furthermore, based on at least one of the component mounting board quality status data indicating the quality status of the component mounting board and the operating status data indicating the operating status of the component mounting machine, the operating status of the component mounting machine or the component mounting board Determining whether the quality status does not meet a predetermined standard is caused by a component or material used for production of the component mounting board,
In the mounting condition determination step, it is determined that the operating status of the component mounting machine or the quality status of the component mounting board does not satisfy a predetermined standard due to the component or material used for the production of the component mounting board. In this case, the mounting conditions of the component mounter are determined based on the acquired component quality status data so that the operation status of the component mounter falls within an allowable range. Mounting condition determination method. In the component quality status data acquisition step, for each component type, the component mounting machine as a whole acquires the dispersion or standard deviation of the component dimensions,
The mounting condition determining step includes:
Determining for each component type whether the variance or standard deviation of the component dimensions is greater than or equal to a predetermined value;
When the dispersion or standard deviation of the component dimensions is equal to or greater than the predetermined specified value, the mounting condition for changing the suction nozzle for sucking the component of the component type to a size larger than the current size, and placing the component on the board At least one of a mounting condition for lowering a moving speed at the time of moving to the mounting position than the current moving speed and a mounting condition for expanding an allowable range of a deviation amount from a standard value of the component dimensions The determination method of determining as mounting conditions of a component mounting machine, The mounting condition determination method of Claim 1 or 2 characterized by the above-mentioned. Furthermore, for each component type, when the component sucked by the suction nozzle is recognized by the component recognition camera, a step of obtaining a recognition error rate, which is a rate at which recognition cannot be performed normally,
The determining step includes
Determining whether the recognition error rate exceeds a predetermined specified value for each component type; and
When the recognition error rate exceeds the predetermined specified value, the mounting condition for expanding the allowable range of the deviation amount from the standard value of the component dimension of the component type is the mounting condition of the component mounting machine. The method for determining the mounting condition according to claim 3, further comprising the step of: Further, for each type of component, the determination step includes a step of acquiring a suction rate that is a rate at which the suction nozzle succeeds in sucking the component from the component supply unit.
Determining for each component type whether the suction rate exceeds a predetermined value; and
When the suction rate exceeds the predetermined specified value, the mounting condition for changing the size of the suction nozzle that sucks the component of the component type to a size larger than the current size is the same as that of the component mounting machine. The method for determining a mounting condition according to claim 3, further comprising a step of determining the mounting condition. The determining step includes
Determining, for each component type, whether or not the ratio of mounting accuracy deviating from a predetermined standard range exceeds a predetermined specified value;
If the ratio exceeds a predetermined specified value, the mounting condition that the moving speed when moving the component of the component type to the mounting position on the board is slower than the current moving speed is the component mounting The mounting condition determining method according to claim 3, further comprising a step of determining as a mounting condition for the machine. The mounting condition determining method according to any one of claims 1 to 6, wherein, in the mounting condition determining step, the component mounter determines the mounting condition. An apparatus for determining mounting conditions of a component mounting machine that produces a component mounting board,
Component quality status data acquisition means for acquiring component quality status data indicating the quality status of a component or material for each type of component or material for a component or material used for production of a component mounting board;
Mounting condition determining means for determining a mounting condition of the component mounting machine based on the acquired component quality status data so that the operating status of the component mounting machine or the quality status of the component mounting board falls within an allowable range; A mounting condition determining apparatus characterized by that. A component mounting method for mounting a component on a board,
A component quality status data acquisition step for acquiring component quality status data indicating the quality status of a component or material for each type of component or material for a component or material used for production of a component mounting board;
Based on the acquired component quality status data, a mounting condition determining step for determining a mounting condition of the component mounter so that the operating status of the component mounter or the quality status of the component mounting board falls within an allowable range;
A component mounting method comprising: a mounting step of mounting a component on the board based on the determined mounting condition. A component mounter for mounting components on a board,
Component quality status data acquisition means for acquiring component quality status data indicating the quality status of a component or material for each type of component or material for a component or material used for production of a component mounting board;
Based on the acquired component quality status data, mounting condition determining means for determining the mounting condition of the component mounter so that the operating status of the component mounter or the quality status of the component mounting board falls within an allowable range;
A component mounting machine comprising: mounting means for mounting a component on the board based on the determined mounting condition. A program for determining mounting conditions of a component mounting machine that produces a component mounting board,
A component quality status data acquisition step for acquiring component quality status data indicating the quality status of a component or material for each type of component or material for a component or material used for production of a component mounting board;
A mounting condition determining step for determining a mounting condition of the component mounter based on the acquired component quality status data so that the operating status of the component mounter or the quality status of the component mounting board falls within an allowable range; A program characterized by having the program executed.

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