JPH09293966A - Inner layer substrate its designing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide the inner layer substrate avoiding the running out of resin bonding agent and the production of air void as well as the designing device for arranging the dams on said inner layer substrate. SOLUTION: Within an inner layer substrate 1 used for a multilayer printed wiring board, this inner layer substrate 1 is provided with a plurality of circuit forming parts 11 and the dams for preventing running out of a resin bonding agent are scatter-formed in the outer periphery between the circuit forming parts 11 and a substrate edge 12. Besides, respectively a plurality of larger sized dams 21 and smaller sized dams 22 are mixed with one another. On the other hand, the gap dams 25 smaller than the larger dams 21 provided in the outer periphery 13 but larger than the smaller dams 22 are formed in the product gaps 24 between a plurality of the circuit forming parts 11.

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to an inner layer substrate used for a multilayer printed wiring board and a designing device for disposing a dam therein.

[0002]

2. Description of the Related Art A multilayer printed wiring board is one in which a plurality of laminated substrates are fixed to each other by a resin adhesive, and a conductor pattern is formed inside thereof. When laminating three or more substrates, one or more inner layer substrates are arranged between the upper and lower substrates. A conductor pattern is formed on the inner layer substrate. That is, as shown in FIG.
Has two circuit forming portions 91 each having a conductor pattern 910 formed therein. An outer peripheral portion 93 is formed between the circuit forming portion 91 and the substrate peripheral edge 92 of the inner layer substrate, and a large number of dams 95 are provided on the outer peripheral portion 93.
Further, there is a product gap 95 between both circuit forming portions 91, and a dam 95 is also provided in this portion.

The dam 95 has a thickness of about 35 μm. As described above, the dam 95 causes the resin adhesive to flow out between the two when the inner layer substrate 9 is bonded to the upper and lower substrates through the resin adhesive as described above, and an air void is formed between the two. It is provided in order to prevent the occurrence (Japanese Patent Laid-Open No. 6-177538). After laminating and adhering as described above, the laminated board is cut along the cutting line 911 of the inner layer board to obtain an individual board. The cutting line 911 is located on the outer periphery of the circuit forming portion 91.

[0004]

However, in the conventional inner layer substrate 9, since the dams 95 have the same size, the gap between the dams 95 is relatively simple, and the resin adhesive easily flows out. There was a risk of resin adhesive flowing out and air voids. In addition, in recent years, along with high-performance wiring,
As shown in FIG. 20, the size of the circuit forming portion 91 in which the conductor pattern 910 is provided is increased.
The product gap 96 therebetween is small. Therefore, as shown in FIG. 20, it is impossible to arrange a dam having the same size as the dam 95 arranged in the outer peripheral portion 93 in the product gap 96.

In view of the above conventional problems, the present invention aims to provide an inner layer substrate which does not cause outflow of a resin adhesive and air voids, and a design device for disposing a dam on the inner layer substrate.

[0006]

According to a first aspect of the present invention, in an inner layer substrate used for a multilayer printed wiring board, the inner layer substrate has a plurality of circuit forming portions, and the circuit forming portion and a board peripheral edge are provided. Dams for preventing the outflow of the resin adhesive are formed on the outer peripheral portion between the dams, and the dam has a large dam with a large shape and a plurality of small dams with a small shape. On the other hand, in the product gap between the plurality of circuit forming portions, a gap dam having a size smaller than the large dam provided on the outer peripheral portion and larger than the small dam is formed. The inner layer substrate is characterized in that

What is most noticeable in the present invention is that the large dam and the small dam are formed in a mixed manner on the outer peripheral portion of the inner layer substrate, and that the product gap is smaller than the large dam and smaller than the small dam. That is, a gap dam having a size is provided. The size of the above large dam is 5.0-1 in diameter
0.0mm, small dam size is 2.0-4.0mm
It is preferable that If the size is smaller than these, it is difficult to completely prevent the resin adhesive from flowing out from the outer peripheral portion and the generation of air voids. On the other hand, if the size is larger than these, it may be difficult to arrange the large dam and the small dam on the outer peripheral portion. Further, the large dam, the small dam, and the gap dam are arranged on both front and back surfaces of the inner layer substrate, for example.

Next, the function and effect of the present invention will be described.
In the inner layer substrate of the present invention, since the large dam and the small dam are mixedly arranged in the outer peripheral portion, the passage between them is complicatedly bent. Therefore, the air existing between the substrates is easily released from these passages. On the other hand, the resin adhesive does not flow out.

Therefore, the outflow of the resin adhesive and the generation of air voids can be prevented. In addition, since the gap dam of the above size is provided between the product gaps, even if the product gap is narrow, a gap dam of any size can be arranged according to the width of the product gap, and the outflow and the outflow of the resin adhesive can be prevented. Generation of air voids can be prevented.

Next, as in the invention of claim 2, it is preferable that the gap dam has the same size as the small dam and is arranged in a plurality of rows. In this case, since the gap dam is the same as the small dam, both can be easily designed. Further, as in the invention of claim 3, it is preferable that the large dams in the outer peripheral portion are arranged in two or more rows, and the small dams are arranged between the large dams (FIGS. 5 to 7). In this case, the passage formed between them becomes complicated, and the resin adhesive flows out,
The generation of air voids can be further prevented.

Next, as in the invention of claim 4, it is preferable that a small dam is interposed between the center lines of the arrangement of the large dams (FIG. 7). In this case also, as above,
Outflow of resin adhesive and generation of air voids can be further prevented.

Next, according to the invention of claim 5, in the inner layer substrate for the multilayer printed wiring board, a large portion for preventing the resin adhesive from flowing out to the outer peripheral portion between the circuit forming portion and the peripheral edge of the substrate. An apparatus for designing an inner layer substrate for arranging a large number of dams and small dams in a mixed manner, including dam information reading means for reading information on large dams and small dams to be arranged on the outer peripheral portion of the inner layer substrate, and the outer peripheral portion. And a large dam arranging means for arranging a plurality of large dams obtained by the dam information reading means on the outer peripheral part recognized by the outer peripheral part recognizing means. A plurality of small dams obtained by the dam information reading means are provided in the residual recognition means for recognizing the size of the residual portion in the outer peripheral portion after the dam is arranged, and the residual portion recognized by the residual recognition means. Distribution There are design apparatus of the inner layer substrate, wherein more becomes possible small dam arrangement means.

The operation of the designing device will be described. In the design apparatus, first, the dam information reading means reads the information on the large dam and the small dam. On the other hand, the size of the outer peripheral portion of the inner layer substrate is recognized by the outer peripheral portion recognition means.
Then, a plurality of large dams obtained from the dam information reading means are arranged on the outer peripheral portion recognized as described above. And, the arrangement of the large dam on the outer peripheral portion is, for example,
Repeat until the large dam cannot be placed on the outer circumference, that is, until the space for placing the large dam is exhausted.

Next, after the arrangement of the large dam is completed, the residual recognizing means recognizes the remaining portion on the outer peripheral portion where the large dam is not arranged. Then, the small dam is arranged on the remaining portion by the small dam arrangement means. These arrangements are, for example, CAD (Computer Ai).
ded Design) device.

With the above design apparatus, the large dam and the small dam can be easily arranged on the outer peripheral portion, and the excellent inner layer substrate as described above can be obtained. Moreover, since the large dam and the small dam are arranged in a mixed manner, the amount of CAD data can be reduced as compared with the case where only the small dam is arranged.

Next, when the inner layer substrate has a plurality of circuit forming portions and there is a product gap between the circuit forming portions as in the sixth aspect of the invention, It is preferable to have product gap recognizing means for recognizing the size of the product gap and gap dam arranging means for arranging a gap dam smaller than the large dam and larger than the small dam in the product gap. . As a result, the gap dam can be easily arranged in the product gap even for the inner layer substrate having a plurality of circuit forming portions, and the excellent inner layer substrate as described above can be obtained.

Next, as in the seventh aspect of the invention, the large dam arranging means, the small dam arranging means and the gap dam arranging means are arranged repeatedly until the large dam, the small dam and the gap dam cannot be arranged, respectively. It is preferable to have a repeating means. Thereby, the large dam, the small dam, and the gap dam can be arranged as much as possible with respect to the outer peripheral portion and the product gap.

Next, as in the invention of claim 8, the outer peripheral portion recognizing means includes an inner layer board size reading means for reading the size of the inner layer board, and a circuit forming portion size reading means for reading the size of the circuit forming portion. It is preferable to have a circuit forming portion arrangement information reading means for reading arrangement information for arranging the circuit forming portion on the inner layer substrate. As a result, information on the sizes of the inner layer substrate, the circuit forming portions provided on the inner layer substrate, and the positions of the circuit forming portions arranged on the inner layer substrate can be obtained, and the sizes of the outer peripheral portion and the product gap can be easily recognized. .

Next, between the meshes formed by a vertical center line passing through the center of the large dam and a horizontal center line orthogonal to the center line passing through the center of the large dam, as in the ninth aspect of the invention. It is preferable to have a mesh dividing and arranging means for arranging the center of the small dam on each of the dividing lines dividing the above into two or more in the vertical direction and the horizontal direction. Thereby, the small dam can be further arranged between the meshes formed by the vertical and horizontal center lines passing through the center of the large dam, and the small dam can be easily arranged.

[0020]

BEST MODE FOR CARRYING OUT THE INVENTION

Embodiment 1 An inner layer substrate according to an embodiment of the present invention will be described with reference to FIGS. As shown in FIG. 1, the inner layer board 1 of this example is the same as the inner layer board 1 used for a multilayer printed wiring board, and the inner layer board 1 has a plurality of circuit forming portions 11 and Dams for preventing the outflow of the resin adhesive are formed on the outer peripheral portion 13 between the substrate and the peripheral edge 12 of the substrate.

Further, the dam is provided with a plurality of large dams 21 each having a large shape and a plurality of small dams 22 each having a small shape in a mixed manner, while a product between the plurality of circuit forming portions 11 is provided. In the gap 24, two rows of gap dams 25, which are smaller than the large dam 21 provided on the outer peripheral portion 13 and have a size larger than that of the small dam 22, are formed.

The large dam 21, the small dam 22 and the gap dam 25 are perfect circles, and they are provided on both the front and back surfaces of the inner layer substrate 1, as shown in FIGS. Also,
The large dams 21 are arranged in two rows in the vertical direction, and the small dams 22 are arranged on the right or left side of the large dam 21 in the horizontal center line passing through the center of the large dam 21. In this example, the diameter of each dam is 6.0 mm for the large dam 21 and 3.
0 mm, the gap dam 25 is 3.0 mm, and their thickness is 35 μm.

Further, as shown in FIG. 4, a conductor pattern 115 is formed in the circuit forming portion 11. A cutting line 111 for cutting after stacking is formed on the outer periphery of the circuit forming portion 11. In addition, each of these dams is provided, for example, in the conductor pattern 11 in the circuit forming portion 11 of the inner layer substrate 1.
5 is formed at the same time. That is, when the conductor pattern 115 is formed on a copper clad laminate, the large dam 21, the small dam 22, and the gap dam 25 are etched by etching or the like.
To form Further, the arrangement of each of these dams is performed by using a design device using CAD as described later.

Next, the function and effect of this example will be described. In the inner layer substrate 1 of this example, the large dam 21 is formed on the outer peripheral portion 13.
Since the small dam 22 and the small dam 22 are mixed, the passage between them is complicatedly bent and formed. Therefore, the outflow of the resin adhesive and the generation of air voids can be prevented. Further, since the product gap 24 is provided with the gap dam 25 of the above size, even if the product gap 24 is narrow, a gap dam of any size can be arranged according to its size. It is possible to prevent outflow of resin adhesive and generation of air voids.

Embodiment 2 In this embodiment, as shown in FIG. 5, two rows of large dams 21 are arranged in the outer peripheral portion 13 between the circuit forming portion 11 and the substrate peripheral edge 12, and surrounded by four large dams. This is an example in which the small dam 22 is arranged at the center position of the portion to be covered. The small dam 22 has two vertical and horizontal lines between each vertical center line 31 and each horizontal center line 32 passing through the center of the large dam 21.
It is formed on the mesh of the divided dividing lines 35 and 36.

Further, since the circuit forming portion 11 is formed to be large, the product gap 24 having a small gap is
Row gap dams have been formed. Others are Embodiment 1
Is the same as In this example, the same effect as that of the first embodiment can be obtained.

Embodiment 3 As shown in FIG. 6, this embodiment shows an example in which the outer peripheral portion 13 in the vertical direction is narrowed in Embodiment 2.
In this example, one row of large dams 21 is formed on the outer peripheral portion 13 in the vertical direction. The small dam 22 divides the horizontal centerlines 32 of the large dam 21 into two, and the vertical centerline 31 of the large dam 21 in the upper and lower outer peripheral portions 13.
It is provided on the mesh formed by the dividing lines 35 (virtual lines) that have been divided. Others are the same as the second embodiment. In this example, the same effect as that of the second embodiment can be obtained.

Embodiment 4 In this embodiment, as shown in FIG. 7, in the outer peripheral portion 13, the small dam 2 is provided between the vertical and horizontal center lines 31 and 32 of the large dam 21.
An example in which 2 is arranged is shown. In this example, the distance between the center lines 31 and 32 is set larger than that in the third embodiment, and the small dams 22 are arranged in a checkered pattern between the large dams 21. . Further, in the outer peripheral portion 13, a small dam 21 is arranged in a portion facing the circuit forming portion 11. Others are the same as the second embodiment. Also in this example, the same effect as that of the second embodiment can be obtained.

Fifth Embodiment As shown in FIGS. 8 and 9, this embodiment shows an apparatus for designing an inner layer substrate and its flow chart. The design device of this example is shown in FIG.
As shown in FIGS. 1 and 5, a large dam for preventing resin adhesive from flowing out to the outer peripheral portion 13 between the circuit forming portion 11 and the board peripheral edge 12 in the inner layer substrate 1 for a multilayer printed wiring board. This is a device for designing the inner layer substrate 1 for arranging a large number of 21 and small dams 22 mixedly.

The designing apparatus is such that the outer peripheral portion 1 of the inner layer substrate 1 is
It is recognized by the dam information reading means 41 for reading the information of the large dam 21 and the small dam 22 to be arranged in 3, the outer peripheral part recognizing means 42 for recognizing the size of the outer peripheral part 13, and the outer peripheral part recognizing means 42. A large dam arranging means 431 for arranging a plurality of large dams 21 obtained by the dam information reading means 41 on the outer peripheral portion 13, and a size of a remaining portion in the outer peripheral portion 13 after the large dam 21 is arranged. And a small dam arranging means 432 for arranging a plurality of small dams 22 obtained by the dam information reading means 41 in the residual portion recognized by the residual recognizing means 44.

A product gap recognition means 46 for recognizing the size of the product gap 24 and a gap dam 25 having a size smaller than the large dam 21 and larger than the small dam 22 are provided in the product gap 24. Gap dam placement means 43 to be placed
3

The large dam arranging means 431, the small dam arranging means 432 and the gap dam arranging means 433 repeat the arrangement until the large dam 21, the small dam 22 and the gap dam 24 cannot be arranged, respectively. (Not shown).

The outer peripheral portion recognizing means 42 reads the size of the inner layer board 1 and reads the inner layer board size reading means 4
21, a circuit formation portion size reading means 422 for reading the size of the circuit formation portion 11, and a circuit formation portion arrangement information reading means 423 for reading arrangement information for arranging the circuit formation portion on the inner layer substrate 1.

Further, between a mesh formed by a vertical centerline 31 passing through the center of the large dam 21 and a lateral centerline 31 orthogonal to the centerline 31 passing through the center of the large dam 21,
Dividing line 3 that divides vertically and horizontally into two or more
There is a mesh dividing and arranging means 45 for arranging the center of the small dam 22 with respect to 5, and 36.

Next, a method of arranging a large dam, a small dam, and a gap dam on the inner layer substrate using the above design apparatus will be described by taking the inner layer substrate 1 shown in FIG. 5 (Embodiment 2) as an example. . First, in S (step) 101, the size of the inner layer substrate 1 is read by the inner layer substrate size reading means 421. Next, in step S102, the size of the circuit forming portion 11 is read by the circuit forming portion size reading means 422, and in step S103, the circuit forming portion placement information reading means 423 provides information on the position of the circuit forming portion on the inner layer substrate. Read.

Then, in S104, based on the size of the inner layer substrate 1, the circuit forming portion 11 and the position of the circuit forming portion 11 in the inner layer substrate 1, the substrate peripheral edge 1 of the inner layer substrate 1 is determined.
The outer peripheral portion 13 formed between the circuit 2 and the circuit forming portion 11 is recognized.

Next, in S105, the dam information reading means 41 reads dam information such as the shape and diameter of the dam. Then, in S106, the large dam 21 is arranged on the outer peripheral portion 13 by the large dam arrangement means 431. The large dams 21 are arranged in two rows on the outer peripheral portion as described in FIG. 5 (second embodiment).

Next, after the arrangement of the large dam 21 is completed, S
At 107, the residual recognizing means 44 recognizes the residual portion in the outer peripheral portion 13 where the large dam 21 is not arranged. Then, in step S108, the mesh dividing and arranging means 45 and the small dam arranging means 432 cause the above-mentioned FIG.
A small dam 22 is arranged around the large dam 21 as shown in FIG. The arrangement of the small dam 22 is repeated while recognizing the above-mentioned remaining portion until there is no remaining portion where the small dam 22 can be arranged.

Next, after the completion of the arrangement of the small dam 22, S1
At 09, the product gap recognizing means 46 determines the size of the product gap 24 between the circuit forming portions 11 and 11 from the information such as the size of the inner layer substrate 1, the circuit forming portion 11 and the arrangement position of the circuit forming portion 11. recognize. Then, in S110, the product gap 24 is generated by the gap dam placement means 433.
The gap dam 25 is placed in the. When the placement of the gap dam 25 is completed, the dam placement program ends.

Next, the data of the inner layer substrate after the above-mentioned dam arrangement is
The data is output by the inner layer substrate data output means 47 and printed out by the plotter device 49. These series of operations can be performed using a CAD device.

Embodiment 6 As shown in FIGS. 10 to 16, this embodiment will explain the arrangement of the large dam 21 on the outer peripheral portion 13 and the arrangement method of the small dam 22 by the mesh division arrangement means 45. First, as shown in FIG. 10, two rows of large dams 21 are arranged on the outer peripheral portion. Next, when arranging the small dam 22, a vertical dividing line 35 that divides each vertical center line 31 of the large dam 21 into two is formed by the mesh dividing and arranging means 45, while each horizontal center of the large dam 21 is formed. A horizontal division line 36 that divides the space between the lines 32 into two is formed. Next, the small dam 22 is arranged at the intersection of the meshes formed by the dividing lines 35 and 36.

Next, in FIG. 11, the center line 32 and the dividing line 36 are further divided into two, that is, the respective center lines 31 are divided into four, and another small dam 221 is formed at that position. An example is shown. FIG. 12 shows an example in which the small dam 223 is formed by dividing the space between the center line 32 and the dividing line 36 into three.

FIG. 13 shows the large dam 21 in the same manner as above.
The large dam 21 and small dam 22 are divided into multiple spaces between the centerlines of
It shows an example in which a smaller dam 224 is arranged on the diagonal between and. In this way, the center lines of the large dam 21 can be arbitrarily divided, and small dams and smaller small dams can be arranged at the intersections of the dividing lines.

Embodiment 7 In this embodiment, as shown in FIG. 14, the large dam 21 is connected to the outer peripheral portion 13
The example shows the case of arranging in. That is, first, the outer peripheral portion 1
The first large dam 21 is arranged at an arbitrary position in FIG.
A). Next, with the first large dam 21 as a reference, downward y ₂
The second large dam 21 is arranged at the moved position (B in the figure).

Further, as shown in FIG. 6C, the second large dam 21 is arranged at a position moved x ₂ to the right with reference to the first large dam 21. In addition, as shown in FIG.
As a reference a large dam 21, x ₃ to the right, y downward
₃ Place the second large dam 21 at the moved position. Less than,
According to the arrangement method described above, large dams are arranged as shown in the first to fifth embodiments.

Embodiment 8 In this embodiment, as shown in FIGS. 15 to 18, when the large dam 21, the small dam 22 and the gap dam 25 are arranged (FIG. 15A), the outer peripheral portion is vertically moved as shown in FIG. 15B. In the example, the large dam 21, the small dam 22 and the gap dam 25 are arranged in the F region and the left and right H regions, and the product gap 24 is divided into the G region.

That is, for the F region, as shown in FIG. 16A, the large dam 21 is arranged at the position of x ₁ , y ₁ from the reference point F ₁ at the upper left end, and as shown in FIG. Large dams are arranged in sequence. Then, in the F region, it is checked whether or not the large dams can be arranged above and below the large dams 21. In this case, as shown by the dotted circle in the figure, this dam cannot be placed because the large dam protrudes. Therefore, as shown in FIG. 6C, as shown in the seventh embodiment, a mesh with dividing lines is temporarily formed, and the small dam 22 is formed at the intersection of the meshes.

Next, regarding the G region of the product gap, FIG.
As shown in FIG. 7A, since the product gap is small, a dam (dotted line circle) 219 having the same size as the large dam 21 arranged in the F region 219
If you try to place it, it will stick out. Therefore, as shown in FIG. 17B, a gap dam 25 having the same size as the small dam 22 smaller than the large dam is arranged. Further, as shown in FIG. 7C, it is judged whether or not a gap dam can be formed between the gap dams 25 and above and below the gap dams 25. However,
In this case, the gap dam extends out of the G area as shown by the dotted circle. Therefore, the gap dam 25 has only one row.

Next, regarding the H region, as shown in FIG. 18A, x ₁ , y ₁ ,
The large dam 21 is arranged at the position of, and the large dam 21 is arranged downward as shown in FIG. In addition, it is checked whether or not large dams can be arranged on the left and right between the large dams 21. However, as shown in Figure B, the large dam, as shown by the dotted circle, protrudes to the left and right and cannot be placed. Therefore,
As shown in Fig. C, small dams 2 are provided on the left and right between the large dams 21.
2 is arranged. The arrangement of the small dam 22 is performed by using the dividing line shown in the seventh embodiment.

In any of the fifth to eighth embodiments described above, the same excellent inner layer substrate as shown in the first embodiment can be obtained, and the dam can be easily arranged on the inner substrate. be able to.

[0051]

As described above, according to the present invention, it is possible to provide an inner layer substrate free from the outflow of a resin adhesive and generation of air voids, and a designing device for disposing a dam on the inner layer substrate.

[Brief description of drawings]

FIG. 1 is an explanatory diagram showing an arrangement state of a large dam, a small dam, and a gap dam of an inner layer substrate in a first embodiment.

FIG. 2 is a sectional view taken along the line AA of FIG. 1 in the first embodiment.

FIG. 3 is a cross-sectional view taken along the line BB of FIG. 1 in the first embodiment.

FIG. 4 is an explanatory diagram of a circuit forming unit according to the first embodiment.

FIG. 5 is an explanatory diagram showing the arrangement of large dams, small dams, and gap dams on the inner layer substrate in the second embodiment.

FIG. 6 is an explanatory diagram showing the arrangement of large dams, small dams, and gap dams on the inner layer substrate in the third embodiment.

FIG. 7 is an explanatory diagram showing an arrangement state of large dams, small dams, and gap dams of the inner layer substrate in the fourth embodiment.

FIG. 8 is a block diagram of an inner layer board designing apparatus according to a fifth embodiment.

FIG. 9 is a flow chart of dam arrangement in the fifth embodiment.

FIG. 10 is an explanation of a method of arranging a large dam and a small dam in the sixth embodiment.

FIG. 11 is an explanation of the arrangement of small dams and the like between large dams in the sixth embodiment.

FIG. 12 is an explanation of the arrangement of small dams and the like between large dams in the sixth embodiment.

FIG. 13 is an explanation of arrangement of small dams and the like between large dams in the sixth embodiment.

FIG. 14 is an explanatory diagram of the arrangement of large dams in the seventh embodiment.

FIG. 15 (A) of the inner layer substrate in the eighth embodiment.
Large dam layout diagram, (B) area explanatory diagram.

FIG. 16 is a layout diagram of (A) large dam in area F, (B) wiring diagram of large dam, and (C) large dam in embodiment 8;
Small dam layout diagram.

FIG. 17 (A) to the G region in the eighth embodiment.
Gap dam layout study, (B) Gap dam layout, (C) Gap dam layout study up and down.

FIG. 18 (A) to the H region in the eighth embodiment
Large dam layout study, (B) Large dam layout study on left and right,
(C) Layout of large dam and small dam.

FIG. 19 is an explanatory diagram of dam arrangement on the inner layer substrate in the conventional example.

FIG. 20 is an explanatory diagram of dam placement on an inner layer substrate having a narrow product gap in a conventional example.

[Explanation of symbols]

 1. . . Inner layer substrate, 11. . . Circuit forming part, 115. . . Conductor pattern, 12. . . Substrate edge, 13. . . Outer periphery, 21. . . Great Dam, 22. . . Small dam, 24. . . Product gap, 25. . . Gap Dam, 31, 32. . . Centerline, 35, 36. . . Dividing line,

Claims (9)

[Claims] 1. An inner layer substrate used for a multilayer printed wiring board, wherein the inner layer substrate has a plurality of circuit forming portions, and a resin adhesive is applied to an outer peripheral portion between the circuit forming portions and the peripheral edge of the substrate. Dams for preventing the outflow of the agent are formed in a scattered manner, and the dam is provided with a plurality of large dams having a large shape and a plurality of small dams having a small shape in a mixed manner. An inner layer substrate is characterized in that a gap dam having a size smaller than the large dam provided in the outer peripheral portion and larger than the small dam is formed in the product gap between the plurality of circuit forming portions. . 2. The inner layer substrate according to claim 1, wherein the gap dam has the same size as the small dam and is arranged in a plurality of rows. 3. The inner layer substrate according to claim 1, wherein the large dams in the outer peripheral portion are arranged in two or more rows, and the small dams are arranged between them. 4. The method according to claim 1, wherein
An inner layer substrate, characterized in that a small dam is interposed between the center lines of the arrangement rows of the large dams. 5. A large number of large dams and small dams for preventing resin adhesive from flowing out are mixedly arranged in an outer peripheral portion between a circuit forming portion and a peripheral edge of the substrate in an inner layer substrate for a multilayer printed wiring board. And a dam information reading means for reading information on a large dam and a small dam to be arranged on the outer peripheral portion of the inner layer board, and an outer peripheral portion recognizing means for recognizing the size of the outer peripheral portion. A large dam arranging means for arranging a plurality of large dams obtained by the dam information reading means on the outer peripheral part recognized by the outer peripheral part recognizing means, and the outer peripheral part after the large dam is arranged. It comprises a residual recognizing means for recognizing the size of the residual portion, and a small dam arranging means for arranging a plurality of small dams obtained by the dam information reading means in the residual portion recognized by the residual recognizing means. An inner layer substrate designing device characterized by the above. 6. The inner layer substrate according to claim 5, wherein the inner layer substrate has a plurality of circuit forming portions and a product gap is provided between the circuit forming portions, and the size of the product gap is recognized. And a gap dam arranging means for arranging a gap dam having a size smaller than the large dam and larger than the small dam in the product gap. . 7. The large dam arranging means, the small dam arranging means and the gap dam arranging means according to claim 5 or 6, wherein the large dam arranging means, the small dam arranging means and the gap dam arranging means are arranged repeatedly until the large dam, the small dam and the gap dam cannot be arranged. An apparatus for designing an inner layer substrate having. 8. The method according to claim 5, wherein
The outer peripheral part recognizing means reads an inner layer board size reading means for reading the size of the inner layer board, a circuit forming part size reading means for reading the size of the circuit forming part, and an arrangement information for arranging the circuit forming part on the inner layer board. An apparatus for designing an inner layer substrate, comprising: a circuit formation portion placement information reading means. 9. The method according to claim 5, wherein
A division that divides the mesh between a vertical centerline passing through the center of a large dam and a horizontal centerline orthogonal to it and passing through the center of the large dam into two or more vertical and horizontal directions. A device for designing an inner layer substrate, characterized by having a mesh dividing and arranging means for arranging a center of a small dam on a line.