JPH09260417A - Connecting method for conductive ball and connecting equipment therefor - Google Patents

Connecting method for conductive ball and connecting equipment therefor

Info

Publication number
JPH09260417A
JPH09260417A JP8062350A JP6235096A JPH09260417A JP H09260417 A JPH09260417 A JP H09260417A JP 8062350 A JP8062350 A JP 8062350A JP 6235096 A JP6235096 A JP 6235096A JP H09260417 A JPH09260417 A JP H09260417A
Authority
JP
Japan
Prior art keywords
ball
tool
circuit pattern
joining
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8062350A
Other languages
Japanese (ja)
Inventor
Hiroshi Haji
宏 土師
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP8062350A priority Critical patent/JPH09260417A/en
Publication of JPH09260417A publication Critical patent/JPH09260417A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/742—Apparatus for manufacturing bump connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
    • H01L2224/1133—Manufacturing methods by local deposition of the material of the bump connector in solid form
    • H01L2224/11334—Manufacturing methods by local deposition of the material of the bump connector in solid form using preformed bumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
    • H01L2224/1133—Manufacturing methods by local deposition of the material of the bump connector in solid form
    • H01L2224/1134—Stud bumping, i.e. using a wire-bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/118—Post-treatment of the bump connector
    • H01L2224/1183—Reworking, e.g. shaping
    • H01L2224/1184—Reworking, e.g. shaping involving a mechanical process, e.g. planarising the bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/1301—Shape
    • H01L2224/13016—Shape in side view
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/4554—Coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85009—Pre-treatment of the connector or the bonding area
    • H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a connecting method for a conductive ball capable shifting a conductive ball at a high speed, by moving a tool in a direction separating it from the circuit pattern and by separating this tool from a ball jointed to a circuit pattern. SOLUTION: A tool 13 is lowered to a ball 6 and the lower portion of tool 13 is caught in the upper portion of the tool, and the ball 6 is retained in the lower portion of this tool 13. Next, the tool 13 is lowered to a circuit pattern 2, and connecting the ball retained to the lower portion of this tool 13 to the circuit pattern with a jointing force larger than the force for retaining the ball to the tool 13 by a force retaining to the tool 13, next, the tool 13 is moved in a direction for separating the tool 13 from the circuit pattern 2, thereby separating it from ball 6 jointed to the circuit pattern 2.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【発明の属する技術分野】本発明は、導電性ボールを用
いた導電性ボールの接合方法及び導電性ボールの接合装
置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conductive ball bonding method and a conductive ball bonding apparatus using conductive balls.

【０００２】[0002]

【従来の技術】基板の回路パターンにバンプ（突出電
極）を比較的に安価に形成できる工法として、ワイヤバ
ンプ法が知られている。この工法は、金属細線からなる
ワイヤの先端部にスパークを飛ばしてボールを形成し、
このボールを回路パターンに押し付けて接合させ、その
後ワイヤをクランパで保持して上昇させて回路パターン
に接合したボールからワイヤを引きちぎってボールのみ
を回路パターンに残し、残ったボールをバンプとして使
用するというものである。2. Description of the Related Art A wire bump method is known as a method of forming bumps (protruding electrodes) on a circuit pattern of a substrate at a relatively low cost. This method creates a ball by flying a spark at the tip of a wire made of thin metal wire.
This ball is pressed against the circuit pattern to bond it, and then the wire is held by a clamper and raised to tear off the wire from the ball bonded to the circuit pattern, leaving only the ball in the circuit pattern and using the remaining ball as a bump. It is a thing.

【０００３】[0003]

【発明が解決しようとする課題】しかしながら、この工
法では、ボールを回路パターンへ接合する一連の工程の
中でボール形成やワイヤを引きちぎる際に行うクランパ
の開閉動作を行うのでタクトタイムが長くなりがちであ
るという問題点があった。However, in this method, the tact time tends to be long because the clamper opening / closing operation is performed when forming the ball or tearing the wire in the series of steps for joining the ball to the circuit pattern. There was a problem that was.

【０００４】そこで本発明は、高速に導電性ボールを接
合できる導電性ボールの接合方法を提供することを目的
とする。Therefore, it is an object of the present invention to provide a method of joining conductive balls which can join the conductive balls at high speed.

【０００５】[0005]

【課題を解決するための手段】本発明の導電性ボールの
接合方法は、ツールをボール供給部のボールへ下降させ
てボールの上部にツールの下部を食い込ませてこのツー
ルの下部にボールを保持、次にツールを回路パターンへ
下降させてボールが食い込みによってツールに保持され
る力よりも大きな接合力でボールを回路パターンに接合
させ、次にツールを前記回路パターンから離反する方向
へ移動させて回路パターンに接合されたボールからこの
ツールを分離するものである。According to the method of joining conductive balls of the present invention, the tool is lowered to the ball of the ball supply part so that the lower part of the tool is bitten into the upper part of the ball and the lower part of the tool holds the ball. Then, lower the tool to the circuit pattern and bond the ball to the circuit pattern with a bonding force greater than the force that the ball holds in the tool by biting, and then move the tool away from the circuit pattern. It separates the tool from the balls that are bonded to the circuit pattern.

【０００６】[0006]

【発明の実施の形態】請求項１記載の導電性ボールの接
合方法は、ツールでボールをピックアップする際、ボー
ルの上部にツールの下部を食い込ませ、ボールを回路パ
ターン上へ接合する際、ボールが食い込みによってツー
ルに保持される力よりも大きな接合力でボールを回路パ
ターンに接合させ、次にツールを前記回路パターンから
離反する方向へ移動させて回路パターンに接合されたボ
ールからこのツールを分離するものであり、ボールのピ
ックアップは単にボールをツールに食い込ませるだけで
完了し、またボールの接合は単にツールに食い込んだボ
ールを回路パターンに圧着させた後ツールを回路パター
ンから離反させるだけで完了する。即ち、ボール形成や
ワイヤ引きちぎりの際のクランパ開閉動作等時間のかか
る動作が含まれていないので、高速な接合を行うことが
できる。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The method of joining conductive balls according to claim 1 is such that when picking up a ball with a tool, the lower part of the tool is bitten into the upper part of the ball and the ball is joined onto a circuit pattern. The ball is bonded to the circuit pattern with a bonding force larger than that held by the tool and then the tool is moved away from the circuit pattern to separate the tool from the ball bonded to the circuit pattern. Picking up the ball is completed by simply biting the ball into the tool, and joining the balls is simply done by pressing the ball that has bitten into the tool to the circuit pattern and then separating the tool from the circuit pattern. To do. That is, since a time-consuming operation such as a clamper opening / closing operation at the time of ball formation or wire tearing is not included, high-speed joining can be performed.

【０００７】次に、図面を参照しながら本発明の実施の
形態について説明する。図１は、本発明の一実施の形態
における導電性ボールの接合装置の斜視図である。Next, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view of a conductive ball joining apparatus according to an embodiment of the present invention.

【０００８】図１において、１はその表面に複数の回路
パターン２が形成された基板、３は回路パターン２上に
形成されたバンプ、４は基板１を位置決めする位置決め
テーブルである。In FIG. 1, 1 is a substrate having a plurality of circuit patterns 2 formed on its surface, 3 is a bump formed on the circuit pattern 2, and 4 is a positioning table for positioning the substrate 1.

【０００９】５は位置決めテーブル４に隣接して配置さ
れたボール供給部であり、６はボール供給部５が供給す
る導電性のボールである。このボール６としては、金ボ
ール、半田ボールなど種々のものを使用できる。Reference numeral 5 denotes a ball supply section which is arranged adjacent to the positioning table 4, and 6 denotes a conductive ball which the ball supply section 5 supplies. Various balls such as gold balls and solder balls can be used as the balls 6.

【００１０】７はＸモータＭＸ，ＹモータＭＹによって
ＸＹ方向に移動できる移動手段としての移動テーブル、
８は移動テーブル７上に設けられ略Ｕ字状をなすフレー
ム、９はフレーム８の上部に揺動自在に軸支されたブロ
ックであり、１０はブロック９を揺動させるモータであ
る。このモータ１０は、後述するツールの上下動手段を
構成している。Reference numeral 7 is a moving table as moving means that can be moved in the XY directions by the X motor MX and the Y motor MY,
Reference numeral 8 is a frame provided on the moving table 7 and having a substantially U-shape, 9 is a block pivotally supported on the upper portion of the frame 8, and 10 is a motor for rocking the block 9. The motor 10 constitutes an up-and-down moving means of a tool described later.

【００１１】そして、ブロック９にはアーム１１の後部
が装着されており、１２はアーム１１の後端部に装着さ
れた超音波振動子、１３はアーム１１の先端部に保持さ
れたツールである。The block 9 has a rear portion of the arm 11 mounted thereon, 12 is an ultrasonic transducer mounted on the rear end portion of the arm 11, and 13 is a tool held on the front end portion of the arm 11. .

【００１２】次に図２、図３を参照しながら、第１の実
施の形態について説明する。本形態では、ツール１３の
下部に円錐状の凹部１３ａを形成し、この凹部１３ａと
同軸的に針１３ｂを配置すると共に、針１３ｂの先端部
を凹部１３ａから下方へ突出させている。Next, a first embodiment will be described with reference to FIGS. In this embodiment, a conical recess 13a is formed in the lower part of the tool 13, the needle 13b is arranged coaxially with this recess 13a, and the tip of the needle 13b is projected downward from the recess 13a.

【００１３】次に動作を説明する。まず、ＸモータＭ
Ｘ，ＹモータＭＹを駆動してツール１３をボール供給部
５上のボール６の真上に移動する。そして、図２（ａ）
に示すように、モータ１０を駆動してアーム１１を下向
きに揺動させることにより、針１３ｂをボール６へ向け
て下降させる。Next, the operation will be described. First, the X motor M
The X and Y motors MY are driven to move the tool 13 directly above the balls 6 on the ball supply unit 5. Then, FIG.
As shown in FIG. 3, the motor 13 is driven to swing the arm 11 downward so that the needle 13b is lowered toward the ball 6.

【００１４】そして図２（ｂ）に示すように、ボール６
の上部へ針１３ｂを突き刺しツール１３にボール６を食
い込ませる。次に、図２（ｃ）で示すように、ツール１
３を上昇（矢印Ｎ２）させてボール６をピックアップす
る。このように、ボール６をピックアップする際には、
単にツール１３を上下に往復動させるだけでよい。Then, as shown in FIG. 2B, the ball 6
Needle 13b is pierced to the upper part of the tool and the ball 6 is bited into the tool 13. Next, as shown in FIG.
3 is raised (arrow N2) to pick up the ball 6. Thus, when picking up the ball 6,
All that is required is to reciprocate the tool 13 up and down.

【００１５】次に、ＸモータＭＸ，ＹモータＭＹを駆動
して、ツール１３を回路パターン２上へ移動させる。そ
して、図２（ｄ）で示すように、モータ１０を駆動して
ツール１３を下降（矢印Ｎ３）させ、図２（ｅ）で示す
ように、ボール６の下部を回路パターン２へ圧着する。
この圧着時には、超音波振動子１２を駆動して、ボール
６が食い込みによってツール１３に保持される力よりも
十分大きな接合力で、ボール６と回路パターン２とが接
合するようにする。因みに、超音波振動子１２を用いれ
ば、このように大きな接合力を簡単に得ることができ
る。Next, the X motor MX and the Y motor MY are driven to move the tool 13 onto the circuit pattern 2. Then, as shown in FIG. 2D, the motor 10 is driven to lower the tool 13 (arrow N3), and the lower portion of the ball 6 is pressed onto the circuit pattern 2 as shown in FIG. 2E.
At the time of this pressure bonding, the ultrasonic vibrator 12 is driven so that the ball 6 and the circuit pattern 2 are bonded with a bonding force sufficiently larger than the force that the ball 6 is held by the tool 13 by being bitten. Incidentally, if the ultrasonic transducer 12 is used, such a large joining force can be easily obtained.

【００１６】そして圧着が終了したら、図２（ｆ）で示
すようにツール１３を回路パターン２から離反する方向
へ上昇（矢印Ｎ４）させボール６を回路パターン２上へ
残しバンプ３とする。なおこのとき接合力はボール６が
食い込みによってツール１３に保持される力に対して十
分大きいので、ボール６がツール１３と一緒に上昇して
回路パターン２から外れてしまうことはない。このよう
に、ボール６を接合させる際にも、従来のようにクラン
パの開閉といった時間のかかる動作は不要であるから、
それだけボール６の接合におけるタクトタイムを短縮す
ることができる。When the pressure bonding is completed, the tool 13 is raised in the direction away from the circuit pattern 2 (arrow N4) to leave the ball 6 on the circuit pattern 2 and form the bump 3 as shown in FIG. 2 (f). At this time, the joining force is sufficiently large with respect to the force held by the tool 13 by the bite 6 so that the ball 6 does not rise together with the tool 13 and come off from the circuit pattern 2. In this way, even when the balls 6 are joined together, there is no need for a time-consuming operation such as opening and closing the clamper as in the conventional case.
The tact time in joining the balls 6 can be shortened accordingly.

【００１７】ところで、上述したようにボール６として
は、金ボールや半田ボールなど種々の導電性を有するボ
ールを用いることができる。そして、本形態によると、
バンプ３の上部に針１３ｂで突き刺した跡（即ち穴）が
残る。しかしながら、この穴が残っても次に述べるよう
に別段支障を生じない。By the way, as described above, as the balls 6, balls having various conductivity such as gold balls and solder balls can be used. And according to this embodiment,
A trace (that is, a hole) left by the needle 13b is left on the bump 3. However, even if this hole remains, it does not cause any trouble as described below.

【００１８】まず金ボールを用いた場合には、バンプ３
が形成された後に、バンプ３や基板１が実装されるモジ
ュール２０の電極２１等には、導電性熱硬化接着剤２２
（例えば銀ペーストなど）が塗布される（図３
（ａ））。First, when a gold ball is used, the bump 3
After the bumps are formed, the conductive thermosetting adhesive 22 is applied to the electrodes 21 of the module 20 on which the bumps 3 and the substrate 1 are mounted.
(Eg silver paste etc.) is applied (Fig. 3
(A)).

【００１９】そして図３（ｂ）に示すように、導電性熱
硬化接着剤２２を硬化させることにより、基板１をモジ
ュール２０に固着する。このとき、バンプ３に穴が開い
ていても、この穴に上記接着剤２２が入り込み支障なく
固着できる。むしろ、穴がある方が、多い量の上記接着
剤２２がバンプ３と電極２１との間に存在するので好都
合なのである。Then, as shown in FIG. 3B, the conductive thermosetting adhesive 22 is cured to fix the substrate 1 to the module 20. At this time, even if a hole is formed in the bump 3, the adhesive 22 can enter the hole and be fixed without any trouble. Rather, it is more convenient to have a hole because a large amount of the adhesive 22 is present between the bump 3 and the electrode 21.

【００２０】また、ボール６に半田ボールを用いる場合
（図３（ｃ））、半田ボールによる固着は、半田を溶融
させた後固化させることにより行われるので、一旦半田
が溶融する際に、溶けた半田がその表面張力で丸くなり
自然と穴がなくなってしまう（図３（ｄ））ので、この
場合も何ら支障なく後工程を行えるのである。When solder balls are used as the balls 6 (FIG. 3 (c)), the fixing by the solder balls is performed by melting the solder and then solidifying it. Therefore, when the solder is once melted, it is melted. Since the solder becomes round due to its surface tension and the holes disappear naturally (FIG. 3 (d)), the post-process can be performed without any trouble in this case as well.

【００２１】次に、本発明の第２の実施の形態につい
て、図４を参照しながら説明する。第２の実施の形態で
は、ツール１３の下部に、ボール６よりもやや小径の凹
部１３ｃを形成し、この凹部１３ｃに無理やりボール６
を押込むことで、ツール１３にボール６を食い込ませる
ものである。Next, a second embodiment of the present invention will be described with reference to FIG. In the second embodiment, a recess 13c having a diameter slightly smaller than that of the ball 6 is formed in the lower portion of the tool 13, and the ball 6 is forced into the recess 13c.
By pushing in, the ball 6 is bitten into the tool 13.

【００２２】即ち、ピックアップ時には、ツール１３を
下降して（図４（ａ））、凹部１３ｃにボール６を食い
込ませ（図４（ｂ））、ツール１３を上昇させる（図４
（ｃ））。That is, at the time of pickup, the tool 13 is lowered (FIG. 4 (a)), the ball 6 is bitten into the recess 13c (FIG. 4 (b)), and the tool 13 is raised (FIG. 4).
(C)).

【００２３】また接合時には、ツール１３を下降して
（図４（ｄ））、超音波振動子１２による振動を与えて
ボール６の下部を回路パターン２に接合し（図４
（ｅ））、ボール６を残してツール１３を上昇させ（図
４（ｆ））、バンプ３を形成する。At the time of joining, the tool 13 is lowered (FIG. 4 (d)), and vibration is applied by the ultrasonic vibrator 12 to join the lower portion of the ball 6 to the circuit pattern 2 (FIG.
(E)), the tool 13 is raised while leaving the ball 6 (FIG. 4 (f)), and the bump 3 is formed.

【００２４】第２の実施の形態においても、接合力を食
い込みによってツールに保持される力より十分大きくす
ることは容易であり、ピックアップ時及び接合時のいず
れにおいても、従来のクランパ開閉というような時間の
かかる動作が不要であって、タクトタイムを短縮でき
る。In the second embodiment as well, it is easy to make the joining force sufficiently larger than the force held by the tool by biting, and it is the same as the conventional clamper opening / closing at both the pickup and the joining. The time-consuming operation is unnecessary and the tact time can be shortened.

【００２５】[0025]

【発明の効果】本発明の導電性ボールの接合方法は、ツ
ールでボールをピックアップする際、ボールの上部にツ
ールの下部を食い込ませ、ボールを回路パターン上へ接
合する際ボールがツールに食い込むよりも大きな接合力
でボールを回路パターンに接合させるものであるので、
タクトタイムを短縮して高速な接合を行うことができ
る。According to the method of joining conductive balls of the present invention, when the ball is picked up by the tool, the lower part of the tool is bited into the upper part of the ball, and the ball is not bited into the tool when the ball is bonded to the circuit pattern. Also uses a large bonding force to bond the ball to the circuit pattern,
The tact time can be shortened and high-speed joining can be performed.

【図面の簡単な説明】[Brief description of drawings]

【図１】本発明の一実施の形態における導電性ボールの
接合装置の斜視図FIG. 1 is a perspective view of a conductive ball joining device according to an embodiment of the present invention.

【図２】（ａ）本発明の第１の実施の形態における導電
性ボールの接合方法の工程説明図 （ｂ）本発明の第１の実施の形態における導電性ボール
の接合方法の工程説明図 （ｃ）本発明の第１の実施の形態における導電性ボール
の接合方法の工程説明図 （ｄ）本発明の第１の実施の形態における導電性ボール
の接合方法の工程説明図 （ｅ）本発明の第１の実施の形態における導電性ボール
の接合方法の工程説明図 （ｆ）本発明の第１の実施の形態における導電性ボール
の接合方法の工程説明図2A is a process explanatory view of a conductive ball bonding method according to the first embodiment of the present invention. FIG. 2B is a process explanatory view of a conductive ball bonding method according to the first embodiment of the present invention. (C) Process explanatory drawing of the conductive ball joining method in the first embodiment of the present invention (d) Process explanatory drawing of the conductive ball joining method in the first embodiment of the present invention (e) Book Process explanatory drawing of the conductive ball joining method in the first embodiment of the invention (f) Process explanatory drawing of the conductive ball joining method in the first embodiment of the present invention

【図３】（ａ）本発明の第１の実施の形態における導電
性ボールの接合方法の工程説明図 （ｂ）本発明の第１の実施の形態における導電性ボール
の接合方法の工程説明図 （ｃ）本発明の第１の実施の形態における導電性ボール
の接合方法の工程説明図 （ｄ）本発明の第１の実施の形態における導電性ボール
の接合方法の工程説明図3A is a process explanatory view of a conductive ball bonding method according to the first embodiment of the present invention. FIG. 3B is a process explanatory view of a conductive ball bonding method according to the first embodiment of the present invention. (C) Process explanatory drawing of the conductive ball joining method in the first embodiment of the present invention (d) Process explanatory drawing of the conductive ball joining method in the first embodiment of the present invention

【図４】（ａ）本発明の第２の実施の形態における導電
性ボールの接合方法の工程説明図 （ｂ）本発明の第２の実施の形態における導電性ボール
の接合方法の工程説明図 （ｃ）本発明の第２の実施の形態における導電性ボール
の接合方法の工程説明図 （ｄ）本発明の第２の実施の形態における導電性ボール
の接合方法の工程説明図 （ｅ）本発明の第２の実施の形態における導電性ボール
の接合方法の工程説明図 （ｆ）本発明の第２の実施の形態における導電性ボール
の接合方法の工程説明図4A is a process explanatory view of a conductive ball bonding method according to a second embodiment of the present invention. FIG. 4B is a process explanatory view of a conductive ball bonding method according to a second embodiment of the present invention. (C) Process explanatory drawing of the conductive ball joining method in the 2nd Embodiment of this invention (d) Process explanatory drawing of the conductive ball joining method in the 2nd Embodiment of this invention (e) Book Process explanatory drawing of the conductive ball joining method in the 2nd Embodiment of this invention (f) Process explanatory drawing of the conductive ball joining method in the 2nd Embodiment of this invention

【符号の説明】[Explanation of symbols]

２ 回路パターン ６ ボール １３ ツール １３ｂ 針 2 circuit pattern 6 ball 13 tool 13b needle

Claims (4)

【特許請求の範囲】[Claims] 【請求項１】ボール供給部からツールでボールをピック
アップし、ピックアップしたボールを回路パターン上へ
接合する導電性ボールの接合方法であって、ツールをボ
ール供給部のボールへ下降させてボールの上部に前記ツ
ールの下部を食い込ませてこのツールの下部にボールを
保持し、次に前記ツールを回路パターンへ下降させてボ
ールが食い込みによってツールに保持される力よりも大
きな接合力でこのツールの下部に保持されたボールを回
路パターンに接合させ、次に前記ツールを前記回路パタ
ーンから離反する方向へ移動させて回路パターンに接合
されたボールからこのツールを分離することを特徴とす
る導電性ボールの接合方法。1. A method of joining conductive balls, wherein a ball is picked up by a tool from a ball supply unit and the picked-up ball is joined onto a circuit pattern. Lower the tool to hold the ball in the lower part of the tool, then lower the tool into the circuit pattern to lower the tool with a joining force greater than the force that the ball holds in the tool. Of the conductive ball, characterized in that the ball held on the circuit pattern is bonded to the circuit pattern, and then the tool is moved in a direction away from the circuit pattern to separate the tool from the ball bonded to the circuit pattern. Joining method. 【請求項２】ボールを供給するボール供給部と、回路パ
ターンを有する基板を位置決めする位置決めテーブル
と、下部がボールの上部に食い込ませ得るように形成さ
れたツールと、前記ツールに食い込んだボールを回路パ
ターン上に押し付けてボールが食い込みによってツール
に保持される力よりも大きな接合力で回路パターンに接
合するように、前記ツールに上下動作を行わせる上下動
手段とを備えたことを特徴とする導電性ボールの接合装
置。2. A ball supply unit for supplying a ball, a positioning table for positioning a substrate having a circuit pattern, a tool formed so that a lower part thereof can bite into an upper part of the ball, and the ball biting into the tool. And a vertical movement means for causing the tool to move up and down so that the ball is pressed onto the circuit pattern and bonded to the circuit pattern with a bonding force larger than the force of the ball being held by the tool by biting. Device for joining conductive balls. 【請求項３】前記ツールは、ボールに突き刺さる針を有
することを特徴とする請求項２記載の導電性ボールの接
合装置。3. The conductive ball joining apparatus according to claim 2, wherein the tool has a needle that pierces the ball. 【請求項４】前記ツールは、ボールの上部に噛み込む凹
部を有することを特徴とする請求項２記載の導電性ボー
ルの接合装置。4. The conductive ball joining apparatus according to claim 2, wherein the tool has a recessed portion that engages with an upper portion of the ball.
JP8062350A 1996-03-19 1996-03-19 Connecting method for conductive ball and connecting equipment therefor Pending JPH09260417A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8062350A JPH09260417A (en) 1996-03-19 1996-03-19 Connecting method for conductive ball and connecting equipment therefor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8062350A JPH09260417A (en) 1996-03-19 1996-03-19 Connecting method for conductive ball and connecting equipment therefor

Publications (1)

Publication Number Publication Date
JPH09260417A true JPH09260417A (en) 1997-10-03

Family

ID=13197594

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8062350A Pending JPH09260417A (en) 1996-03-19 1996-03-19 Connecting method for conductive ball and connecting equipment therefor

Country Status (1)

Country Link
JP (1) JPH09260417A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6555764B1 (en) 1998-03-12 2003-04-29 Fujitsu Limited Integrated circuit contactor, and method and apparatus for production of integrated circuit contactor

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6555764B1 (en) 1998-03-12 2003-04-29 Fujitsu Limited Integrated circuit contactor, and method and apparatus for production of integrated circuit contactor
US7174629B2 (en) 1998-03-12 2007-02-13 Fujitsu Limited Integrated circuit contactor, and method and apparatus for production of integrated circuit contactor

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