JPH09237477A - Magnetic head suspension - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce the influence of a stress load due to thermal deformation by providing a wiring layer consisting of an insulated layer and a conductive layer on a gimbal suspension with a prescribed pattern and forming the insulated layer constituting this wiring layer only under the conductive layer on the gimbal suspension. SOLUTION: The wiring layer of the gimbal suspension 12 is provided with two layers structure forming the conductive layer 22 through the insulated layer 23, and the insulated layer 23 is formed only under this conductive layer 22. The pattern of the insulated layer 23 coincides with the pattern of the wiring layer 21, and the insulated layer 23 does not exist on the area of the gimbal suspension 12, where the wiring layer 21 is not formed. Consequently, the area where the surface of the magnetic head suspension 12 is covered with the insulated layer 23, is remarkably reduced, then the influence of the stress load due to the thermal deformation to the gimbal suspension 12 from the insulated layer 23 is extremely reduced, even though coefficients of thermal expansion of the gimbal suspension 12 and insulated layer 23 are different.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a magnetic head suspension used in a magnetic disk device.

[0002]

2. Description of the Related Art In a magnetic disk device, writing and reading are carried out using a magnetic head suspension equipped with a slider carrying a magnetic head.

A conventional magnetic head suspension is composed of a load beam, a mount plate, and a gimbal suspension, and a slider having a magnetic head can be mounted on the tip of the gimbal suspension. The load beam is for applying a predetermined load to the slider on which the magnetic head is mounted, and has an appropriate rigidity. The gimbal suspension is for making a slider having a magnetic head follow the undulations of the magnetic disk surface, and has a proper flexibility.

In such a conventional magnetic head suspension, the magnetic head mounted on the slider and the electric circuit in the magnetic disk device are connected mainly by using a lead wire having a conductive wire inserted in an insulating coating tube. It was being appreciated. In this case, the lead wire guided from the electric circuit to the magnetic head suspension and arranged therein is arranged while being fixed to the load beam and the mount plate in the magnetic head suspension and connected to the magnetic head.

On the other hand, miniaturization of magnetic disk devices in recent years,
Along with the demand for thinner magnetic head suspensions, the magnetic head suspensions have also been made smaller and thinner, and each member constituting the magnetic head suspensions has been made smaller and thinner.

However, it is difficult to make the lead wire for connecting the magnetic head mounted on the slider and the electric circuit in the magnetic disk device to a large amount due to its structure. The lead wire is relatively large with respect to each of the constituent members. Therefore, an extra load is applied from the lead wire to the load beam and the gimbal suspension, and there is a problem in that the followability of the slider to the waviness of the magnetic disk surface is deteriorated. In addition, there is a high risk of the lead wire coming into contact with the magnetic disk surface, and there is a problem that the lead wire is broken.

Here, the magnetic head used in the magnetic disk device has changed from a monolithic structure in which a coil is manually wound by integral machining to a composite in which a coil is manually wound by split machining, and is currently a thin film method. Therefore, the inductive type which forms the writing / reading coil is mainly used. Further, in response to the recent demand for increase in storage capacity of magnetic disk devices, the use of MR (Magneto Resistive) heads, which are high-sensitivity magnetic heads, is advancing.
However, since this MR head is read-only, it is necessary to mount a thin film head for writing on the slider in addition to the MR head. For this reason, the magnetic head mounted on the slider and the electric circuit in the magnetic disk device are mounted. The lead wires for connecting to and are required from the conventional two to four. As a result, the problems that may occur in the magnetic head suspension due to the above-described lead wires tend to become more serious.

[0008]

In order to solve the above problems, a flexible film in which a conductor is coated with an insulating resin is used instead of the lead wire in which the conductor is inserted in an insulating coating tube. There is disclosed a magnetic head suspension which connects a magnetic head mounted on a slider of the magnetic head suspension and an electric circuit in a magnetic disk device, and which can obtain a desired damping action by the flexible film (special feature). Kaihei 1-162212
issue).

Further, instead of using a lead wire in which a conductive wire is inserted in an insulating coating tube, an insulating layer is formed on at least one surface of a load beam or a gimbal suspension, and an electric conductive path is formed on this insulating layer. The magnetic head mounted on the slider of the magnetic head suspension is connected to an electric circuit in the magnetic disk device, and as a result, an extra load is not applied to the slider and excellent follow-up to the waviness of the magnetic disk surface is achieved. A magnetic head suspension having the property is disclosed (Japanese Patent Laid-Open No. 6-
No. 124558).

However, in the magnetic head suspensions disclosed in JP-A-1-162212 and JP-A-6-124558, an insulating resin is formed on almost the entire surface of one side of the load beam or gimbal suspension made of a thin metal plate such as SUS304. Since the insulating layer consisting of is fixedly formed, due to the difference in the coefficient of thermal expansion between the thin metal plate and the insulating resin, when thermal deformation occurs, a stress load is applied from the insulating layer to the gimbal suspension, and the slider follows the waviness of the magnetic disk surface. The problem of adversely affecting sex arises.

The present invention has been made in view of the above circumstances, and is excellent in the followability of the slider to the waviness of the magnetic disk surface, and the magnetic head capable of stable operation in response to downsizing and thinning. Intended to provide suspension.

[0012]

To achieve the above object, the present invention provides a magnetic head suspension including a load beam and a gimbal suspension for mounting a slider having a magnetic head mounted thereon. Has a wiring layer of a predetermined pattern having a conductive layer on the insulating layer, and the insulating layer is formed only on the gimbal suspension below the conductive layer.

In the magnetic head suspension of the present invention, the insulating layer is made of an electrodepositable insulating adhesive material, or the insulating layer is made of at least an electrodepositable insulating adhesive material and an insulating resin. The configuration is as follows.

Further, the magnetic head suspension of the present invention is constructed such that at least one of the conductive layer and the insulating layer is formed on the gimbal suspension by transfer.

In the present invention as described above, the thermal expansion coefficient of the insulating layer forming the wiring layer having the predetermined pattern on the gimbal suspension and existing only below the conductive layer is the same as that of the gimbal suspension. Even if it is different, the gimbal suspension is extremely rarely subjected to a stress load due to thermal deformation.

[0016]

DETAILED DESCRIPTION OF THE INVENTION The present invention will be described below with reference to the drawings.

FIG. 1 is a plan view showing an example of the magnetic head suspension of the present invention, FIG. 2 is a side view of the magnetic head suspension shown in FIG. 1, and FIG. 3 is a magnetic head shown in FIG. It is a perspective view for explaining the constituent members of the suspension. 1 to 3,
The magnetic head suspension 1 of the present invention includes a load beam 11, a gimbal suspension 12 fixed to a predetermined position on the load beam 11, and a mount plate 13 fixed to the base side of the load beam 11. A hole 11 for mounting the magnetic head suspension on the magnetic disk device is provided on the base side of the load beam 11.
a is formed, and the mount plate 13 has a similar hole 1
3a are formed. Further, the tip portion 12a of the gimbal suspension 12 projects from the tip portion of the load beam 11, and the slider S having a magnetic head mounted thereon is mounted on the tip portion 12a.

The load beam 11 is for applying a predetermined load to the slider on which the magnetic head is mounted, and can be formed of, for example, a thin metal plate of SUS304TA or the like, and the thickness thereof can be about 60 to 80 μm. . Further, the shape and dimensions of the load beam 11 can be set as appropriate, and in the illustrated example, in order to impart appropriate rigidity to the load beam 11, flanges 11a projecting downward are formed at both end portions of the load beam 11. It is provided.

The gimbal suspension 12 is for making the slider S having a magnetic head follow the undulations of the magnetic disk surface, and is more flexible than the load beam 11, and is formed of a thin metal plate such as SUS304TA. The thickness can be about 18 to 30 μm.

The gimbal suspension 12 has a lead portion 12c extending from one side end of the rear end portion 12b toward the base portion. Then, the wiring layer 21 is formed on the gimbal suspension 12 in the illustrated pattern from the tip portion 12a of the gimbal suspension 12 to the lead portion 12c. This wiring layer 21 is the gimbal suspension 1
The four terminals T ₁ , T ₂ , T at the tip 12a of
₃ , T ₄ and the four terminals t ₁ and t on the lead 12c.
₂ , t ₃ , t ₄ and wirings L ₁ , L ₂ , L ₃ , L ₄ connecting the corresponding terminals of the tip portion 12a and the lead portion 12c. In addition, the four terminals T ₁ and T on the tip portion 12a of the gimbal suspension 12 are
₂ , T ₃ and T ₄ are connected to corresponding terminals of a read-only MR (Magneto Resistive) head mounted on the slider S and a thin film head for writing by lead wires (not shown).

The shape of the gimbal suspension 12
The dimensions can be set appropriately. In addition, the wiring layer 21
The pattern can be appropriately set according to the shape of the gimbal suspension 12, the magnetic head mounted on the slider S, and the like.

The mount plate 13 is for mounting the magnetic head suspension 1 on the magnetic disk device, and is required to have sufficient rigidity.
It can be formed of a thin metal plate such as SUS304, and the thickness thereof can be about 200 to 300 μm. When the load beam 11 has sufficient rigidity, the mount plate 13 may be omitted.

Next, the above magnetic head suspension 1
The configuration of the wiring layer 21 formed in the gimbal suspension 12 will be described.

FIG. 4 is a partially enlarged vertical sectional view taken along the line AA of the gimbal suspension 12 shown in FIG.
In FIG. 4, the wiring layer 21 on the gimbal suspension 12 (the wiring L ₁ , L ₂ , L ₃ , L ₄ portions in the illustrated example)
Has a two-layer structure in which the conductive layer 22 is formed via the insulating layer 23. Since the insulating layer 23 is formed only below the conductive layer 22 in the present invention, the pattern of the wiring layer 21 shown in FIG. 1 (the pattern including the terminal portion T, the terminal portion t, and the lead portion L) is formed. ) And the pattern of the insulating layer 23 are the same, and the insulating layer 23 does not exist in the region of the gimbal suspension 12 where the wiring layer 21 (conductive layer 22) is not formed. That is, the area where the surface of the gimbal suspension 12 is covered with the insulating layer 23 is only the area where the conductive layer 22 needs to be formed. Therefore, as compared with the magnetic head suspension in which a conductive layer is conventionally formed in a predetermined pattern via an insulating layer,
In the magnetic head suspension 1 of the present invention, the area where the surface of the gimbal suspension 12 is covered with the insulating layer 23 is greatly reduced. As a result, even if the coefficient of thermal expansion of the gimbal suspension 12 and the coefficient of thermal expansion of the insulating layer 23 differ, the stress load due to thermal deformation is extremely small on the gimbal suspension 12 from the insulating layer 23, and the waviness of the magnetic disk surface The followability of the slider S with respect to is excellent. At the same time, the insulating layer 23 effectively prevents vibration of the magnetic head suspension 1.

The conductive layer 22 constituting the wiring layer 21 is a layer formed by a plating method or the like, and is, for example, copper, silver, gold,
It can be formed using nickel, chromium, zinc, tin, platinum or the like, and the film thickness is about 3 to 15 μm, preferably 7 μm in order to suppress the electric resistance to a low level and achieve a thin film.
It is about 10 μm.

Further, the insulating layer 23 constituting the wiring layer 21.
Has a thickness of about 1 to 15 μm, preferably 7 to 10 μm
The thickness can be adjusted to a certain level, and it can be formed of an insulating material capable of forming a film by a known means such as an electrodeposition method, a coating and filling method using a squeegee, a dispense coating method, and a screen printing method. As the insulating material, for example, an electrodeposition adhesive material that exhibits tackiness at room temperature or heating can be used, and as the polymer to be used, anionic or cationic synthetic polymer resin having tackiness is used. Can be mentioned.

Specifically, as the anionic synthetic polymer resin, acrylic resin, polyester resin, maleated oil resin, polybutadiene resin, epoxy resin, polyamide resin, polyimide resin or the like alone or any of these resins can be used. Can be used as a mixture. Further, the above-mentioned anionic synthetic polymer resin may be used in combination with a crosslinkable resin such as melamine resin, phenol resin and urethane resin.

As the cationic synthetic polymer resin,
Acrylic resin, epoxy resin, urethane resin, polybutadiene resin, polyamide resin, polyimide resin and the like can be used alone or as a mixture of any combination thereof. Further, the above-mentioned cationic synthetic polymer resin may be used in combination with a crosslinkable resin such as polyester resin and urethane resin.

If desired, a tackifying resin such as a rosin-based resin, a terpene-based resin, or a petroleum resin-based resin may be added to impart tackiness to the polymer resin.

The above-mentioned polymer resin is subjected to the electrodeposition method in a state of being solubilized in water by neutralizing with an alkaline or acidic substance in a method of forming a wiring layer described later or in a state of being dispersed in water. That is, the anionic synthetic polymer resin is neutralized with amines such as trimethylamine, diethylamine, dimethylethanolamine and diisopropanolamine, and inorganic alkali such as ammonia and caustic potash. Also,
The cationic synthetic polymer resin is neutralized with an acid such as acetic acid, formic acid, propionic acid and lactic acid. Then, the polymer resin neutralized and solubilized in water is used in a state of being diluted with water as an aqueous dispersion type or a solution type.

In addition, the insulating property of the insulating material having adhesiveness,
For the purpose of enhancing reliability such as heat resistance, a known thermosetting resin having a thermopolymerizable unsaturated bond such as blocked isocyanate may be added to the above polymer resin and cured by heat treatment after formation. Of course, in addition to the thermosetting resin, if a resin having a polymerizable unsaturated bond (for example, an acrylic group, a vinyl group, an allyl group, etc.) is added to the adhesive material, the insulating resin can be irradiated by electron beam irradiation after formation. The layer can be cured.

As the material of the insulating layer 23, in addition to the above,
Not only a thermoplastic resin but also an adhesive resin that loses its adhesiveness after being cured by a thermosetting resin may be used as long as it exhibits adhesiveness at room temperature or by heating. Further, it may contain an organic or inorganic filler in order to impart strength to the coating film.

The material of the insulating layer 23 may be an electrodepositable adhesive which exhibits fluidity at room temperature or when heated.

Next, the above magnetic head suspension 1
Another configuration example of the wiring layer formed in the gimbal suspension 12 will be described.

FIG. 5 is a partially enlarged vertical sectional view taken along the line AA of the gimbal suspension 12 shown in FIG.
5, the wiring layers 21 'on the gimbal suspension 12 (wiring in the illustrated example _{L 1, L 2, L 3} , L 4 parts)
Has a three-layer structure in which a conductive layer 22 'is formed via an insulating layer 23' composed of a first insulating layer 23'a and a second insulating layer 23'b. In this wiring layer 21 ', the insulating layer 23
′ Has the electrical insulation function and the adhesive function of the first insulation layer 23′a.
And the second insulating layer 23'b. That is,
The first insulating layer 23'a has an electrical insulating function, and the second insulating layer 23'b has an adhesive function with the conductive layer 22 '. Thereby, the reliability of the wiring layer can be further improved. Also in this wiring layer 21 ′, similarly to the above-mentioned wiring layer 21, since the insulating layer 23 ′ is formed only below the conductive layer 22 ′, the coefficient of thermal expansion of the gimbal suspension 12 and the insulating layer 23 ′. Even if the coefficient of thermal expansion is different from that of ‘′, the stress load due to thermal deformation is hardly applied to the gimbal suspension 12 from the insulating layer 23 ′, and the followability of the slider S to the waviness of the magnetic disk surface becomes excellent. . At the same time, the insulating layer 23 'effectively prevents vibration of the magnetic head suspension 1.

Conductive layer 22 'constituting the wiring layer 21'
Can be the same as the conductive layer 22 constituting the wiring layer 21 described above, and description thereof will be omitted here.

First insulating layer 23 'constituting the wiring layer 21'
a can be formed using an insulating resin such as a photosensitive resin having an insulating property or a thermosetting resin, and the thickness thereof is 3 to 1
The thickness can be about 5 μm, preferably about 7 to 10 μm.

Examples of the photosensitive resin include a novolac resin, a polyimide resin, and the like, to which a quinonediazide-based, nitrobenzylsulfonic acid-based, or dihydropyridine-based substance is added as a substance that promotes dissolution by light irradiation. it can. Further, as the photosensitive resin, a novolac resin, a polyimide resin or the like having a substituent in the resin that promotes dissolution by light irradiation can also be used. Further, a known thermosetting resin having a heat-polymerizable unsaturated bond such as blocked isocyanate may be added to the above-mentioned photosensitive resin and cured by heat treatment. Of course, in addition to the thermosetting resin, if a resin having a polymerizable unsaturated bond (eg, acrylic group, vinyl group, allyl group) is added to the photosensitive resin, it can be cured by electron beam irradiation. it can.

The thermosetting resin is a high-viscosity liquid or powder composed of a mixture of a polyfunctional low molecular weight compound or an initial condensation reaction intermediate and a catalyst, such as phenol resin, melamine resin, unsaturated polyester resin, epoxy resin. A known thermosetting resin such as resin, silicon resin, polyurethane resin, diallyl phthalate resin, or polyimide resin can be used. The second insulating layer 23'b constituting the wiring layer 21 'is made of the above-mentioned insulating material. The insulating material for forming the layer 23 can be appropriately selected and formed, and description thereof is omitted here.

Now, a method of forming a wiring layer on the gimbal suspension which constitutes the magnetic head suspension of the present invention will be described.

First, an example of forming a wiring layer having a two-layer structure of a conductive layer and an insulating layer by a transfer method as shown in FIG. 4 will be described with reference to FIG.

First, a transfer original plate for transferring a wiring layer onto the gimbal suspension 12 is prepared. A photoresist is applied on the conductive substrate 31 as a transfer substrate to form a photoresist layer, and the photoresist layer is exposed by contact and developed using a predetermined photomask to form an insulating layer 32. Of these, the wiring pattern portion 31a is exposed (FIG. 6A). This wiring pattern portion 31a
As shown in FIG. 1, the gimbal suspension 1
2 is a pattern extending from the terminal portion T of the tip end portion 12a of the second portion to the terminal portion t of the lead portion 12c through the wiring L. In the illustrated example, the wiring L (L ₁ , L ₂ , L ₃ , L ₄ ) portion is shown. ing.

The above-mentioned conductive substrate 31 may be any one as long as at least the surface thereof has conductivity, and it is a conductive metal plate such as aluminum, copper, nickel, iron, stainless steel, titanium, or a glass plate, polyester, or the like. An insulating substrate such as a resin film of polycarbonate, polyimide, polyethylene, acrylic, or the like, on which a conductive thin film is formed, can be used. The thickness of such a conductive substrate 31 is preferably about 0.05 to 1.0 mm. Further, in order to improve printing durability as a transfer original plate, chromium (Cr), ceramic Kanigen (K) is formed on the surface of the conductive substrate.
You may form a thin film, such as Ni + P + SiC by anigen company. The thickness of this thin film is preferably about 0.1 to 1.0 μm.

Next, a conductive layer 33 is formed on the wiring pattern portion 31a by a plating method (FIG. 6 (B)). After that, an electrodeposition insulating adhesive material having adhesiveness is electrodeposited on the conductive layer 33 by the electrodeposition method to form the insulating layer 34 (FIG. 6C). As a result, the transfer original plate 30 provided with the transfer pattern layer 36, which is a laminate of the conductive layer 33 and the insulating layer 34, is obtained.

Next, the transfer original plate 30 is pressure-bonded so that the adhesive insulating layer 34 comes into contact with a predetermined position of a thin metal plate such as SUS304 which is a material of the gimbal suspension 12 (FIG. 6D). . This pressure bonding may be performed by any method such as roller pressure bonding, plate pressure bonding, and vacuum pressure bonding. In addition, when the insulating layer 34 is made of an adhesive material that exhibits tackiness or adhesiveness by heating, thermocompression bonding can be performed. Then, the conductive substrate 31 is peeled off, the transfer pattern layer 36 is transferred onto the metal thin plate, and the insulating layer 34 is cured. This allows the gimbal suspension 12
A wiring layer 21 having a two-layer structure of a conductive layer 22 and an insulating layer 23 is formed in a predetermined pattern on a thin metal plate such as SUS304, which is the material of FIG. 6 (E).

Next, an example of forming a wiring layer having a three-layer structure of a conductive layer, a first insulating layer and a second insulating layer by a transfer method as shown in FIG. 5 will be described with reference to FIG.

First, the wiring pattern portion 31a is formed on the conductive substrate 31 in the same manner as described with reference to FIG. 6, and the conductive layer 33 'and the second insulating layer 34 are formed on the wiring pattern portion 31a by plating. ′ Is formed to prepare a transfer original plate 30 ′ having a transfer pattern layer 36 ′ (FIG. 7 (A)).

On the other hand, a photosensitive resin is applied on a thin metal plate such as SUS304, which is a material of the gimbal suspension 12, to form a photosensitive resin layer 41. The photosensitive resin can be applied by curtain coating, roll coating, screen coating, etc. in the case of in-line processing using a continuous thin metal plate, and spin coating, curtain coating, screen coating when the thin metal plate is a sheet. Then, the transfer original plate 30 'is pressure-bonded so that the second insulating layer 34' comes into contact with a predetermined position on the photosensitive resin layer 41. This pressure bonding may be performed by any method such as roller pressure bonding, plate pressure bonding, and vacuum pressure bonding. Further, when the second insulating layer 34 'is made of an adhesive material that exhibits tackiness or adhesiveness by heating, thermocompression bonding can be performed. Then, the conductive substrate 31 is peeled off and the transfer pattern layer 36 'is transferred onto the photosensitive resin layer 41 (see FIG. 7).
(B)).

After that, the photosensitive resin layer 41 is exposed and developed using the transfer pattern layer 36 'as a mask to form a first insulating layer 41' only under the transfer pattern layer 36 '(FIG. 7).
(C)). Then, by curing the first insulating layer 41 ′ and the second insulating layer 34 ′, the conductive layer 22 ′ and the first insulating layer 23 ′ a are formed on a thin metal plate such as SUS304 which is a material of the gimbal suspension 12. , The second insulating layer 23 '
A wiring layer 21 'having a three-layer structure of b is formed in a predetermined pattern (FIG. 7 (D)).

In the formation of the above-mentioned three-layer wiring layer, the first
Although the insulating layer is made of a photosensitive resin, a thermosetting resin may be used instead of the photosensitive resin to form a wiring layer having a three-layer structure in the same manner. However, in the step corresponding to FIG. 7B, the transfer pattern layer 36 ′ is transferred onto the thermosetting resin layer after pre-baking the formed thermosetting resin layer. Then, the thermosetting resin layer is etched using the transfer pattern layer 36 'as a mask to form a first insulating layer made of the thermosetting resin only below the transfer pattern layer 36' (FIG. 7C). Equivalent to). Then, by curing the first insulating layer and the second insulating layer, a three-layer structure of the conductive layer, the first insulating layer, and the second insulating layer is formed on the metal thin plate such as SUS304 that is the material of the gimbal suspension 12. The wiring layer can be provided in a predetermined pattern.

By forming the wiring layer by the transfer method as described above, the photo-etching step becomes unnecessary,
Moreover, since the transfer original plate can be repeatedly used, the manufacturing process can be simplified and the manufacturing cost can be reduced.

Although the above-mentioned wiring layer forming methods all use transfer, in the magnetic head suspension of the present invention, an insulating layer and a conductive layer are directly formed on the gimbal suspension by a photolithography process. A wiring layer can be formed by stacking layers.

[0053]

As described above in detail, according to the present invention, among the load beam and the gimbal suspension which form the magnetic head suspension, the gimbal suspension is provided with a wiring layer having an insulating layer and a conductive layer in a predetermined pattern. Since the insulating layer forming this wiring layer is formed only below the conductive layer on the gimbal suspension, even if the coefficient of thermal expansion of the gimbal suspension and the coefficient of thermal expansion of the insulating layer differ, stress load due to thermal deformation Is very rarely applied to the gimbal suspension from the insulating layer, which allows the slider to follow the undulations of the magnetic disk surface, and the insulating layer can effectively prevent the vibration of the magnetic head suspension. High reliability with stable operation in response to downsizing and thinning The magnetic head suspension is possible. Further, by forming the insulating layer from at least an electrodeposition insulating adhesive material and an insulating resin, it is possible to further improve the electrical insulating function and the adhesive function of the insulating layer and further improve the reliability of the magnetic head suspension. Also, by forming at least one of the conductive layer and the insulating layer on the gimbal suspension by transfer, it is possible to easily form a fine wiring layer and reduce the manufacturing cost of the magnetic head suspension.

[Brief description of drawings]

FIG. 1 is a plan view showing an example of a magnetic head suspension of the present invention.

FIG. 2 is a side view of the magnetic head suspension shown in FIG.

3 is a perspective view for explaining constituent members of the magnetic head suspension shown in FIG. 1. FIG.

4 is an A- of the gimbal suspension shown in FIG.
It is a partial expanded longitudinal cross-sectional view in the A line.

5 is an A- of the gimbal suspension shown in FIG.
It is a partial expanded longitudinal cross-sectional view in the A line.

FIG. 6 is a drawing for explaining an example of forming a wiring layer as shown in FIG.

FIG. 7 is a drawing for explaining an example of forming a wiring layer as shown in FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Magnetic head suspension 11 ... Load beam 12 ... Gimbal suspension 13 ... Mount plate 21,21 '... Wiring layer 22, 22' ... Conductive layer 23, 23 '... Insulating layer 23'a ... 1st insulating layer 23'b … Second insulating layer S… Slider

Claims (4)

[Claims] 1. A magnetic head suspension including a load beam and a gimbal suspension for mounting a slider on which a magnetic head is mounted, wherein the gimbal suspension includes a wiring layer having a predetermined pattern and a conductive layer on an insulating layer. The magnetic head suspension, wherein the insulating layer is formed only above the conductive layer on the gimbal suspension. 2. The magnetic head suspension according to claim 1, wherein the insulating layer is formed of an electrodeposition insulating adhesive material. 3. The magnetic head suspension according to claim 1, wherein the insulating layer is formed of at least an electrodeposition insulating adhesive material and an insulating resin. 4. The magnetic according to claim 1, wherein at least one of the conductive layer and the insulating layer is formed on the gimbal suspension by transfer. Head suspension.