JP2002335070A - Printed circuit board and its manufacturing method as well as method for connecting electronic component using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a printed circuit board having a connecting means, which enables flip-chip mounting on a printed circuit board wiring terminal of a narrow pitch to be executed with high connecting reliability, and to provide a method for manufacturing the same and a method for connecting the electronic component using the same. SOLUTION: The method for connecting the electronic component comprises the steps of forming an electrodeposition resin film 6 on a wiring terminal 3 of the printed circuit board, and adhering conductive particles 7 to the surface of the film 6.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board for connecting and mounting various electronic components, and more particularly, to a printed wiring board incorporated in an electronic device such as a portable information terminal or a liquid crystal display.
The present invention relates to a printed wiring board used for flip-chip mounting in which a semiconductor chip such as an SI, a memory, a DSP, and a driver IC is directly mounted on a flexible printed wiring board, a method of manufacturing the same, and a method of connecting electronic components using the same.

[0002]

2. Description of the Related Art Heretofore, flip chip mounting in which a semiconductor chip, which is a surface mount type electronic component, is directly mounted on a printed wiring board has been used as one means of surface mounting. The flip-chip mounting is a method of directly mounting a semiconductor chip, and is an optimal mounting method for a product that requires a reduction in size, weight, and thickness. Also, since there is no intermediate material called lead frame or interposer,
It is possible to shorten the wiring length from the terminal of the semiconductor chip, and it is an extremely excellent electrical mounting method such as reduction of electrical loss and reduction of noise in a high frequency region.

[0003] In recent years, the trend of flip-chip mounting having such characteristics to be applied to flexible printed wiring boards has been active in liquid crystal display applications. This form of flip-chip mounting on a flexible printed wiring board is particularly called a chip-on-film (hereinafter abbreviated as COF), and is expected to rapidly spread mainly in liquid crystal display applications of mobile phones. The implementation of this COF includes:
Anisotropic conductive films (hereinafter abbreviated as ACF) are widely used.

Here, ACF generally means φ3 to 5 μm
Is mixed into an insulating thermosetting resin and molded into a film. As a method of use, the ACF is attached to the surface of the wiring terminal of the printed wiring board, the positions of the wiring terminals of the printed wiring board and the bumps on the semiconductor chip electrodes are aligned in advance, and then the semiconductor chip is crimped from the upper side. Heat curing for about 10 seconds to complete the mounting in a short time. At this time, the conductive particles are trapped between the wiring terminal portion of the printed wiring board and the bump on the semiconductor chip, so that stable conduction between the wiring terminal and the bump can be obtained. Further, since the joint is protected by the cured thermosetting resin, very high connection reliability can be obtained.

As described above, the ACF is characterized by the simplicity of the mounting process and the high connection reliability. However, there is a problem that the connection reliability is reduced due to the narrow pitch of the wiring terminals of the printed wiring board. This means that as the line width of the wiring terminal becomes narrower, the number of conductive particles caught in the wiring terminal portion of the printed wiring board and the bump on the semiconductor chip also decreases, and the connection resistance between the wiring terminal and the bump is reduced. There was a possibility that stable connection between the printed wiring board and the semiconductor chip could not be obtained due to an increase in the value or poor conduction. Furthermore, due to the structure of the ACF, conductive particles also exist between adjacent wiring terminals to be insulated and usually exist in isolation, but as the space between the wiring terminals becomes narrower, these conductive particles become There is also a possibility that a short circuit occurs, and insulation between the wiring terminals is not maintained, resulting in an electrical short circuit failure. As described above, in the ACF, it has been extremely difficult to secure both the electrical connection with the semiconductor and the insulation between the printed wiring board wiring terminals with the narrowing of the pitch of the printed wiring board wiring terminals.

[0006]

As described above, in the conventional flip-chip mounting of a printed wiring board, AC flip-chip mounting is advantageous due to the advantages of simple mounting process and high connection reliability.
F is widely used, but as the pitch of the printed circuit board wiring terminals becomes narrower, the ACF has a problem that a stable connection between the printed circuit board and the semiconductor chip cannot be obtained and the insulation between the wiring terminals is maintained. There were two issues that could not be achieved.

Therefore, in flip-chip mounting of a printed wiring board, the electrical connection with the semiconductor and the printed wiring board wiring terminals in the printed wiring board wiring terminals of a narrow pitch are performed while following the simplicity of the mounting process which is an advantage of the ACF. There has been a demand for a mounting method with high connection reliability that enables compatibility with inter-insulation properties.

In view of the above-mentioned problems, the present invention provides a printed circuit having connection means that enables flip-chip mounting to a narrow-pitch printed wiring board wiring terminal with high connection reliability without impairing the simplicity of the mounting process. An object of the present invention is to provide a wiring board, a method of manufacturing the same, and a method of connecting electronic components using the same.

[0009]

In order to solve the above problems, a printed wiring board according to the present invention has an electrodeposited resin film formed on a wiring terminal and conductive particles adhered to the surface of the electrodeposited resin film. Consists of a configuration.

According to this structure, the conductive particles are adhered only to the wiring terminals of the printed wiring board using the electrodeposition resin film as an adhesive layer, and no conductive particles exist between the adjacent wiring terminals. In addition, electrical connection with a semiconductor is possible, and insulation between the wiring terminals is maintained, so that high connection reliability is possible in flip-chip mounting on narrow-pitch printed wiring board terminals.

According to another aspect of the present invention, there is provided a method of manufacturing a printed wiring board, comprising: forming an electrodeposited resin film directly on a wiring terminal by an electrodeposition method; Is attached.

With this configuration, the advantage that the electrodeposited resin film can be selectively formed only in the energized portion in the electrodeposition method is applied, and the electrodeposited resin film can be formed on the wiring terminals with extremely high positional accuracy. This is a manufacturing method that can be applied to wiring terminals of a printed wiring board having a narrow pitch.

According to another aspect of the present invention, there is provided a method of manufacturing a printed wiring board, comprising forming an electrodeposited resin film of a predetermined shape on an electrodeposited substrate, and transferring the electrodeposited resin film onto a wiring terminal. Then, the conductive particles are attached to the surface of the electrodeposited resin film.

With this configuration, the advantage of selectively forming an electrodeposited resin film on the upper surface of the wiring terminal that is the most convex in the structure of the printed wiring board in the transfer method is applied, and only rough positioning of the electrodeposited substrate is required. The electrodeposition resin film can be formed on the upper surface of the wiring terminal with extremely high positional accuracy. Furthermore, even if the wiring terminals cannot be directly energized due to the restrictions of the wiring terminal pattern and the method of construction, and the electrodeposition method as described above cannot be used, the electrodeposition resin film is transferred by the transfer method to the upper surface of the wiring terminals. Can be formed. From the above, it is a manufacturing method that can be formed even on a wide variety of wiring terminals of a printed wiring board having a narrow pitch.

In order to solve the above-mentioned problems, a method for connecting an electronic component using a printed wiring board according to the present invention comprises forming an electrodeposited resin film on a wiring terminal and attaching conductive particles to the surface of the electrodeposited resin film. Using the printed wiring board, after covering the conductive particles with an insulating resin, in a state where the bumps formed on the electronic components and the wiring terminals of the printed wiring board are conducted through the conductive particles. The electronic component is fixedly joined with the insulating resin.

According to this configuration, a printed wiring board having a highly reliable connection structure in which conductive particles are attached to wiring terminals via an electrodeposition resin film in advance is prepared, and an insulating resin is applied. This is a connection method capable of simplifying the mounting process because the mounting is completed in a simple process of mounting the electronic components, and having high connection reliability in the wiring terminals of the narrow pitch printed wiring board. .

[0017]

A printed wiring board according to a first aspect of the present invention includes an electrodeposition resin film formed on a wiring terminal, and conductive particles adhered to the surface of the electrodeposition resin film. It consists of a configuration. According to this configuration, since the conductive particles are attached only to the wiring terminals of the printed wiring board using the electrodeposition resin film as an adhesive layer, the electrical connection with the semiconductor can be reliably performed at the time of mounting. Further, according to this configuration, since there is no conductive particle between the adjacent wiring terminals, there is an effect that insulation between the wiring terminals can be maintained.

According to a second aspect of the present invention, there is provided a method of manufacturing a printed wiring board, comprising: forming an electrodeposited resin film directly on a wiring terminal by an electrodeposition method; and attaching conductive particles to the surface of the electrodeposited resin film. , Is provided. With this configuration, the advantage that the electrodeposited resin film can be selectively formed only in the energized portion in the electrodeposition method is applied, and the electrodeposited resin film can be formed on the wiring terminals with extremely high positional accuracy.

According to a third aspect of the present invention, there is provided a method for manufacturing a printed wiring board, comprising: forming an electrodeposited resin film having a predetermined shape on an electrodeposited substrate; transferring the electrodeposited resin film onto a wiring terminal; Attaching conductive particles to the surface of the resin film. With this configuration, by using a transfer mechanism of bringing the electrodeposited substrate on which the electrodeposited resin film is formed into contact with the wiring terminal portion, the electrodeposited substrate is selectively electrodeposited on the wiring terminal upper surface portion which is the most convex in the structure of the printed wiring board. The resin film can be formed, and the electrodeposited resin film can be formed on the upper surface of the wiring terminal with very high positional accuracy only by rough alignment of the electrodeposited substrate. In addition, due to restrictions on wiring terminal patterns and construction methods,
Even when the electric current cannot be directly supplied to the wiring terminal, the electrodeposition resin film can be formed on the upper surface of the wiring terminal by the transfer method.

According to a fourth aspect of the present invention, there is provided a method of manufacturing a printed wiring board according to the second or third aspect of the invention, wherein the conductive particles are adhered on the original plate by pattern plating in a predetermined shape. And transferring the conductive particles to the surface of the electrodeposited resin film. With this configuration, the conductive particles can be selectively formed only on the upper surface of the wiring terminal by transferring and forming the conductive particles on the surface of the electrodeposited resin film. This has the effect that the electrodeposition resin film can be formed on the upper surface of the wiring terminal with high positional accuracy.

According to a fifth aspect of the present invention, there is provided a method for manufacturing a printed wiring board according to the second or third aspect, wherein the conductive foil is adhered by pattern etching a metal foil to a predetermined shape. Forming conductive particles and transferring the conductive particles to the surface of the electrodeposited resin film. With this configuration, the conductive particles can be selectively formed only on the upper surface of the wiring terminal by transferring and forming the conductive particles on the surface of the electrodeposited resin film. The electrodeposition resin film can be formed on the upper surface of the wiring terminal with high positional accuracy.

According to a sixth aspect of the present invention, there is provided a method of mounting a semiconductor device, comprising: forming an electrodeposited resin film on a wiring terminal; and using a printed wiring board having conductive particles adhered to the surface of the electrodeposited resin film.
After covering the conductive particles with the insulating resin, the electronic component is fixedly joined with the insulating resin in a state where the bumps formed on the electronic component and the wiring terminals of the printed wiring board are conducted through the conductive particles. , Is provided. According to this configuration, a printed wiring board having a high connection reliability structure in which conductive particles are previously attached to the wiring terminals via an electrodeposition resin film is prepared, and an insulating resin is applied. In addition, since mounting is completed in a simple process of mounting electronic components, the tact of the mounting process can be shortened.

According to a seventh aspect of the present invention, there is provided a method for connecting an electronic component using a printed wiring board having an electrodeposited resin film formed on a wiring terminal and conductive particles adhered to the surface of the electrodeposited resin film. After covering the conductive particles with the insulating resin, the electronic component is fixedly joined with the insulating resin in a state where the wiring terminals formed on the electronic component and the wiring terminals of the printed wiring board are conducted through the conductive particles. To do. According to this configuration, a printed wiring board having a high connection reliability structure in which conductive particles are previously attached to the wiring terminals via an electrodeposition resin film is prepared, and an insulating resin is applied. In addition, since mounting is completed in a simple process of mounting electronic components, the tact of the mounting process can be shortened.

An embodiment of the present invention will be described below with reference to FIGS. In these drawings, the same members are denoted by the same reference numerals, and redundant description is omitted. Further, the numerical values shown in the embodiments are examples of various types that can be selected, and the present invention is not limited to these.

(Embodiment) A printed wiring board according to an embodiment of the present invention will be described below.

First, the printed wiring board of the present invention will be described with reference to FIG. FIG. 1A is a perspective sectional view of a printed wiring board according to an embodiment of the present invention, and FIG. 1B is a sectional view of a main part of the printed wiring board according to the embodiment of the present invention.

1 (a) and 1 (b), reference numeral 1 denotes a polyimide base film, 2 denotes an adhesive layer for attaching a copper wiring 5 to the surface of the base film 1, and 3 denotes a copper wiring 5.
This is a wiring terminal having a structure in which conductive particles 7 are attached on the surface via an electrodeposition resin film 6, and the conductive particles 7 are attached only to the upper surface of the wiring terminal 3. Further, reference numeral 4 denotes a cover film made of a polyimide material for protecting the wiring terminals 3, and electronic parts such as semiconductors are mounted in the openings.

As shown in FIG. 1B, the conductive particles 7 are adhered only to the upper surface of the wiring terminal 3 using the electrodeposition resin film 6 as an adhesive layer, so that it is ensured in flip chip mounting of a semiconductor described later. Electrical connection with the semiconductor is possible, and an increase in the connection resistance value between the wiring terminal and the bump and poor conduction can be avoided. Furthermore, since the structure is such that the conductive particles 7 do not exist between adjacent wiring terminals, insulation between the wiring terminals is maintained, and an electrical short failure between the wiring terminals in flip-chip mounting of a semiconductor can be avoided. Therefore, high connection reliability can be achieved even in flip-chip mounting on a narrow-pitch printed wiring board terminal.

Next, a method of manufacturing such a printed wiring board will be described in more detail with reference to FIGS. 2, 3 and 4. The same reference numerals as those in FIG. 1 are basically the same in FIG. 2, FIG. 3, and FIG.

First, a step of forming an electrodeposited resin film on a wiring terminal will be described with reference to FIG. FIG. 2A is a cross-sectional view of a main part of a printed wiring board before an electrodeposition resin film according to an embodiment of the present invention is formed, and FIG. 2B is a sectional view of the electrodeposition resin film according to the embodiment of the present invention. Sectional view of main part to be formed, FIG. 2
FIG. 3C is a cross-sectional view of a principal part of the printed wiring board on which the electrodeposition resin film according to the embodiment of the present invention is formed.

In FIG. 2, reference numeral 8 denotes an electrodeposition solution, and in this embodiment, an acrylic anion-type electrodeposition resin solution deposited on an anode is exemplified. In addition, suitably, a cationic electrodeposition resin liquid may be used in addition to the anion electrodeposition resin liquid, and the main component of the electrodeposition resin liquid is an acrylic resin, an epoxy resin, or a polyimide resin. Etc. In addition, a pigment, ceramic powder, metal powder, or the like is mixed into the electrodeposition resin liquid to adjust various characteristics of the formed electrodeposition resin film, such as transmittance, thermal expansion coefficient, dielectric constant, and dielectric strength. It is also possible.

First, as shown in FIG. 2A, a printed wiring board having a cover film 4 and a copper wiring 5 formed on the surface of a base film 1 with an adhesive layer 2 interposed therebetween is prepared. The printed wiring board may be a non-adhesive type printed wiring board having no adhesive layer 2 and excellent flexibility. Further, in order to prevent the surface of the copper wiring 5 from being oxidized, there is no problem even if the surface of the copper wiring 5 is subjected to a metal plating treatment or a rust preventive agent application, and it is applicable to printed wiring boards having various structures. .

Next, as shown in FIG.
An uncured electrodeposited resin film 6 is formed directly on the surface of the copper wiring 5 in the inside. The electrodeposition resin film 6 made of the electrodeposition resin is obtained by electrodeposition of an acrylic anion-type electrodeposition resin.
Its thickness is 1 μm. Here, since the electrodeposited resin 6 is in an uncured state, it can be used as an adhesive layer when conductive particles described later are adhered by heating.

Finally, by washing the excess electrodeposition solution with water,
As shown in FIG. 2C, an electrodeposition resin film 6
Is obtained.

As described above, by applying the advantage that the electrodeposited resin film can be selectively formed only in the energized portion in the electrodeposition method, it is possible to form the electrodeposited resin film on the wiring terminals with extremely high positional accuracy. it can. Usually, there are screen printing, offset printing, and the like as a method for selectively forming such a resin film, but the positional accuracy of the formed resin film is limited to about 50 μm. That is, it is very difficult to selectively apply a resin film to the surface of a wiring terminal portion of a wiring terminal of a printed wiring board having a pitch interval smaller than this, which may not be applicable. The photolithography method used in the manufacture of semiconductors is also a method that can form a photosensitive resin film with high positional accuracy. However, since the resin film itself has photosensitivity, there are restrictions on the material of the resin film. It is difficult to adapt to the present invention because it is severe and does not have tackiness. Further, the equipment itself is expensive and the process is complicated. From the above, the present invention uses an electrodeposition method in which an electrodeposited resin film is selectively formed only on an energized portion, with simple steps and equipment,
This is a method in which an electrodeposited resin film can be formed on wiring terminals with extremely high positional accuracy, thereby providing a manufacturing method that can be formed even on wiring terminals of a printed wiring board having a narrow pitch.

Similarly, another method of forming an electrodeposited resin film on a wiring terminal will be described with reference to FIG. FIG. 3 (a)
FIG. 3B is a cross-sectional view of an electrodeposited substrate according to an embodiment of the present invention, and FIG. 3B is a cross-sectional view of a main part of forming an electrodeposited resin film on the electrodeposited substrate according to an embodiment of the present invention. FIG. 3C is a cross-sectional view of a principal part of transferring an electrodeposited resin film on an electrodeposited substrate according to an embodiment of the present invention, and FIG. 3D is a diagram illustrating an electrodeposited resin film formed according to an embodiment of the present invention. It is principal part sectional drawing of a printed wiring board.

In FIG. 3, reference numeral 9 denotes an electrodeposited substrate in which a release layer 11 is formed on the surface of a metal plate 10 and is used as a transfer master of the electrodeposited resin film 6. Here, the peeling layer 11 is for easily peeling the electrodeposited resin film 6 from the surface of the metal plate 10, and is an essential element in transferring the electrodeposited film.

First, as shown in FIG. 3 (a), a release liquid is thinly applied to the surface of the metal plate 10 by an application roller and dried to prepare an electrodeposited substrate 9 on which a release layer 11 is formed.
As shown in (b), an uncured electrodeposition resin film 6 is formed on the surface of the electrodeposition substrate 9 in the electrodeposition liquid 8.

Next, as shown in FIG. 3C, the electrodeposited substrate 9 on which the electrodeposited resin film 6 is formed is positioned on the copper wiring 5, and heated under pressure. Here, the electrodeposited resin film 6 is in an uncured state, and exhibits adhesiveness when heat is applied, and adheres to the upper surface of the copper wiring 5 when further pressed.

Finally, after cooling, the electrodeposited substrate 9 is removed to obtain a printed wiring board having the electrodeposited resin film 6 formed on the upper surface of the copper wiring 5, as shown in FIG. The electrodeposited substrate 9 used here is used again as a transfer master after cleaning the electrodeposited resin film 6 with an alkaline solution and returning to FIG. 3A again.

As described above, the transfer method in which the electrodeposited resin film is selectively formed on the upper surface of the wiring terminal which is the most convex in the structure of the printed wiring board is used. The electrodeposition resin film can be formed on the upper surface of the wiring terminal with high positional accuracy. Further, even when the wiring terminals cannot be directly energized due to the restriction of the wiring terminal pattern and the method of construction, and the electrodeposition method as described above cannot be used, the electrodeposition resin film is transferred by the transfer method to the upper surface of the wiring terminal. Can be formed. From the above, it is a manufacturing method that can be formed even on a wide variety of wiring terminals of a printed wiring board having a narrow pitch.

Finally, the step of attaching conductive particles to the surface of the electrodeposited resin film will be described with reference to FIG. FIG. 4 (a)
Is a cross-sectional view of a plating master in one embodiment of the present invention,
FIG. 4B is a cross-sectional view of a principal part for pattern-plating a plating master according to one embodiment of the present invention, and FIG. 4C is a cross-sectional view of a main part for transferring conductive particles on the plating master according to one embodiment of the present invention. FIG. 4D is a sectional view of a main part of the printed wiring board after the formation of the conductive particles according to the embodiment of the present invention.

In FIG. 4, reference numeral 12 denotes a plating original plate having an insulating pattern film 14 formed on the surface of a metal plate 13 and is used as an original plate for transferring the conductive particles 7. In addition, 1
5 is a plating solution for forming the conductive particles 7. still,
The types of the plating solution 15 used are Ni, Cu, A
Various metal plating solutions such as u, Ag, and Sn can be selected, and these plating solutions may be used a plurality of times to form the conductive particles 7 in a laminated structure of a metal plating film.

First, as shown in FIG. 4A, an insulating pattern film 14 having an opening of a predetermined shape is formed on the surface of a metal plate 13 by a photolithography method.
As shown in FIG. 4B, the plating master 12 is energized in the plating solution 15 to form conductive particles 7 in the openings of the plating master 12.

Next, as shown in FIG. 4C, the plating original plate 12 on which the conductive particles 7 are formed is positioned on the copper wiring 5 on which the electrodeposited resin film 6 is formed, Let it.
Here, the electrodeposited resin film 6 on the surface of the copper wiring 5 is in an uncured state, and when heat is applied, tackiness is developed, and when the conductive particles 7 are further pressed, the electrodeposited resin film 6 is pressed. 6 Adhere to the surface.

Finally, by removing the plating master 12, as shown in FIG. 4D, a printed wiring board having conductive particles 7 formed on the upper surface of the copper wiring 5 via the electrodeposition resin film 6. Is obtained. At this time, if the plating transfer process is repeated a desired number of times to increase the coverage of the conductive particles 7 with respect to the area of the upper surface of the wiring terminal 3, electrical connection with the semiconductor can be reliably performed at the time of mounting, which will be described later. Still better.
Also, the plating original plate 12 used here is shown in FIG.
And used repeatedly as a transfer master.

As described above, the advantage of the transfer method of selectively forming conductive particles on the upper surface of the wiring terminal, which is the most convex in the structure of the printed wiring board, is successfully applied, and only the rough positioning of the original plate is required. The conductive particles can be formed on the upper surface of the wiring terminal with extremely high positional accuracy, and the manufacturing method can be formed even on a wiring terminal of a printed wiring board having a narrow pitch.

Further, by using the transfer method, conductive particles can be formed only on the upper surface of the wiring terminal. As a result, electrical connection with the semiconductor can be reliably performed in flip-chip mounting of the semiconductor, which will be described later, and an increase in the connection resistance value between the wiring terminal and the bump and poor conduction can be avoided. Further, since the structure has no conductive particles between adjacent wiring terminals, insulation between the wiring terminals is maintained, and an electrical short failure between the wiring terminals in flip-chip mounting of a semiconductor can be avoided. Therefore, high connection reliability can be achieved even in flip-chip mounting on a narrow-pitch printed wiring board terminal.

Similarly, another method for forming conductive particles on wiring terminals will be described below. As another method of attaching the conductive particles, a method of pattern-etching a metal foil to form conductive particles having a predetermined shape and transferring the conductive particles to the surface of the electrodeposited resin film may be used. Since this method also uses a transfer method, the conductive particles can be formed on the upper surface of the wiring terminal with extremely high positional accuracy, and is a manufacturing method that can be formed even on a wiring terminal of a printed wiring board having a narrow pitch. .

As another method of attaching the conductive particles, a method of spraying the conductive particles on the surface of the electrodeposited resin film may be used. In this method, the conductive particles can be formed on the upper surface of the wiring terminal with very high positional accuracy by a simple process and equipment compared with the above-described conductive particle transfer method, and the printed wiring board has a narrow pitch. It is a simpler manufacturing method that can be formed in the wiring terminal.

Next, a method of mounting a semiconductor using such a printed wiring board will be described with reference to FIG. 1, 2, 3, and 4 are basically the same as those in FIG. 5, and a description thereof will be omitted.

First, a semiconductor mounting process using the printed wiring board of the present invention will be described with reference to FIG. FIG.
5A is a cross-sectional view of a main part of a printed wiring board according to one embodiment of the present invention, FIG. 5B is a cross-sectional view of a main part forming an insulating resin according to one embodiment of the present invention, and FIG. 5) is a cross-sectional view of a main part for mounting a semiconductor according to an embodiment of the present invention, and FIG. 5D is a cross-sectional view of a main part after mounting the semiconductor according to the embodiment of the present invention.

In FIG. 5, reference numeral 16 denotes an insulating resin having adhesiveness, and reference numeral 17 denotes a semiconductor in which bumps 19 are formed on terminals on a semiconductor bare chip 18. Here, a semiconductor is exemplified as a mounting component, but various surface mounting components such as a chip resistor and a chip capacitor may be mounted, and the semiconductor device may be connected to various substrates such as an ITO substrate and a flexible printed wiring board. May be.

First, as shown in FIG. 5A, conductive particles 7 are adhered via an electrodeposition resin film 6 on the surface of a copper wiring 5 manufactured in one embodiment of the present invention. Wiring terminal 3
Is prepared, and an insulating resin 16 is applied using a dispenser to cover the wiring terminals 3 as shown in FIG. 5B.

Next, as shown in FIG.
The semiconductor 17 on which the semiconductor substrate 9 is formed is aligned with the wiring terminal 3, and is pressurized and adhered. At this time, the bumps 19 on the semiconductor 17 press the conductive particles 7 to break the electrodeposited resin film 6 and bring the copper particles 5 into complete contact. As a result, a state is obtained in which the bumps 19 formed on the semiconductor 17 and the wiring terminals 3 of the printed wiring board are completely conducted through the conductive particles 7. Further, no conductive particles 7 exist between the wiring terminals 3. From the above, the electrical connection with the semiconductor can be reliably performed at the time of mounting, the insulation between the wiring terminals is maintained, and high connection reliability is obtained.

Finally, as shown in FIG. 5D, the insulating resin 16 is cured by heating to completely fix and bond the semiconductor 17. As a result, the bonding portion is protected by the cured insulating resin 16, so that high reliability can be obtained.

In view of the above, a printed wiring board having a highly reliable connection structure in which conductive particles are attached to wiring terminals via an electrodeposition resin film in advance is prepared, and an insulating resin is applied. However, since the mounting is completed in a simple process of mounting the semiconductor chip, the mounting process can be simplified, and a mounting method capable of connecting with high connection reliability at the wiring terminals of the narrow pitch printed wiring board. is there.

[0058]

According to the printed wiring board of the first aspect of the present invention, the electrical connection with the semiconductor can be reliably performed at the time of mounting, the insulation between the wiring terminals is maintained, and the printed wiring board having a narrow pitch is provided. In flip-chip mounting on a wiring board terminal, there is an effect that a printed wiring board having high connection reliability can be obtained.

The method for manufacturing a printed wiring board according to claims 2 to 5 of the present invention utilizes an electrodeposition method and a transfer method to deposit an electrodeposited resin film and conductive particles on wiring terminals with extremely high positional accuracy. Therefore, there is an effect that a printed wiring board having a connection means having high connection reliability on a wiring terminal of the printed wiring board having a narrow pitch can be manufactured.

According to the method for connecting electronic components using the printed wiring board according to claims 6 and 7 of the present invention, mounting is completed in a simple process, so that the mounting process can be simplified and a narrow pitch printed wiring is provided. There is an effect that a mounting method capable of connecting with high connection reliability at the wiring terminals of the board is obtained.

The present invention also relates to a printed wiring board having connection means for enabling flip-chip mounting on a printed wiring board wiring terminal of a narrow pitch with high connection reliability without impairing the simplicity of the mounting process, and a printed circuit board having the same. It is possible to provide a manufacturing method and a method for connecting electronic components using the same.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view of a printed wiring board according to an embodiment of the present invention.

FIG. 2 is an essential part cross-sectional view of a step of directly forming an electrodeposition resin film on a printed wiring board in one embodiment of the present invention.

FIG. 3 is an essential part cross-sectional view of a step of transferring an electrodeposited resin film on an electrodeposited substrate to a printed wiring board in one embodiment of the present invention.

FIG. 4 is an essential part cross-sectional view of a step of transferring conductive particles on a plating original plate to a printed wiring board in one embodiment of the present invention.

FIG. 5 is an essential part cross-sectional view of a step of mounting a semiconductor on a printed wiring board according to one embodiment of the present invention;

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 base film 2 adhesive layer 3 wiring terminal 4 cover film 5 copper wiring 6 electrodeposition resin film 7 conductive particles 8 electrodeposition liquid 9 electrodeposition substrate 10 metal plate 11 release layer 12 plating original plate 13 metal plate 14 insulating pattern film 15 Plating solution 16 Insulating resin 17 Semiconductor 18 Bare chip 19 Bump

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 5E319 AA03 AB01 AC01 AC16 BB11 CC61 CD04 CD25 GG01 GG09 5F044 KK03 KK18 KK19 LL09 RR19

Claims (7)

[Claims] 1. A printed wiring board comprising: an electrodeposited resin film formed on a wiring terminal; and conductive particles adhered to the surface of the electrodeposited resin film. 2. A method for manufacturing a printed wiring board, comprising: forming an electrodeposited resin film directly on a wiring terminal by an electrodeposition method; and attaching conductive particles to the surface of the electrodeposited resin film. 3. An electrodeposited resin film having a predetermined shape is formed on an electrodeposited substrate, the electrodeposited resin film is transferred onto a wiring terminal, and conductive particles are attached to the surface of the electrodeposited resin film. Manufacturing method of a printed wiring board. 4. A method for adhering the conductive particles,
4. The printed wiring board according to claim 2, wherein conductive particles having a predetermined shape are formed on the plating original plate by pattern plating, and the conductive particles are transferred to the surface of the electrodeposited resin film. Manufacturing method. 5. A method for adhering the conductive particles,
4. The printed wiring board according to claim 2, wherein the metal foil is pattern-etched to form conductive particles having a predetermined shape, and the conductive particles are transferred to the surface of the electrodeposited resin film. Production method. 6. An electro-deposited resin film is formed on a wiring terminal, and the conductive particles are coated with an insulating resin using a printed wiring board having conductive particles adhered to the surface of the electrodeposited resin film. ,
A method of connecting electronic components, wherein the bumps formed on the electronic components and the wiring terminals of the printed wiring board are fixedly joined with the insulating resin in a state where the bumps are made conductive through the conductive particles. 7. A method in which an electrodeposited resin film is formed on a wiring terminal, and the conductive particles are coated with an insulating resin using a printed wiring board having conductive particles adhered to the surface of the electrodeposited resin film. ,
A method of connecting an electronic component, wherein a wiring terminal formed on the electronic component and a wiring terminal of the printed wiring board are fixedly joined to each other with the insulating resin in a state where the wiring terminal is electrically connected through the conductive particles.