JPH09205009A5 - - Google Patents

Info

Publication number
JPH09205009A5
JPH09205009A5 JP1996326135A JP32613596A JPH09205009A5 JP H09205009 A5 JPH09205009 A5 JP H09205009A5 JP 1996326135 A JP1996326135 A JP 1996326135A JP 32613596 A JP32613596 A JP 32613596A JP H09205009 A5 JPH09205009 A5 JP H09205009A5
Authority
JP
Japan
Prior art keywords
layer
semiconductor material
semiconductor
base
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1996326135A
Other languages
English (en)
Japanese (ja)
Other versions
JP3778640B2 (ja
JPH09205009A (ja
Filing date
Publication date
Priority claimed from US08/565,735 external-priority patent/US6023091A/en
Application filed filed Critical
Publication of JPH09205009A publication Critical patent/JPH09205009A/ja
Publication of JPH09205009A5 publication Critical patent/JPH09205009A5/ja
Application granted granted Critical
Publication of JP3778640B2 publication Critical patent/JP3778640B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP32613596A 1995-11-30 1996-11-21 半導体ヒータおよびその製造方法 Expired - Fee Related JP3778640B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/565,735 US6023091A (en) 1995-11-30 1995-11-30 Semiconductor heater and method for making
US565735 1995-11-30

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2005196440A Division JP2006024937A (ja) 1995-11-30 2005-07-05 半導体ヒータおよびその製造方法

Publications (3)

Publication Number Publication Date
JPH09205009A JPH09205009A (ja) 1997-08-05
JPH09205009A5 true JPH09205009A5 (cg-RX-API-DMAC10.html) 2004-11-04
JP3778640B2 JP3778640B2 (ja) 2006-05-24

Family

ID=24259895

Family Applications (2)

Application Number Title Priority Date Filing Date
JP32613596A Expired - Fee Related JP3778640B2 (ja) 1995-11-30 1996-11-21 半導体ヒータおよびその製造方法
JP2005196440A Pending JP2006024937A (ja) 1995-11-30 2005-07-05 半導体ヒータおよびその製造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2005196440A Pending JP2006024937A (ja) 1995-11-30 2005-07-05 半導体ヒータおよびその製造方法

Country Status (2)

Country Link
US (1) US6023091A (cg-RX-API-DMAC10.html)
JP (2) JP3778640B2 (cg-RX-API-DMAC10.html)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6023091A (en) * 1995-11-30 2000-02-08 Motorola, Inc. Semiconductor heater and method for making
JP2001168651A (ja) * 1999-12-14 2001-06-22 Mitsumi Electric Co Ltd 半導体装置
US6986566B2 (en) 1999-12-22 2006-01-17 Eastman Kodak Company Liquid emission device
US6457815B1 (en) * 2001-01-29 2002-10-01 Hewlett-Packard Company Fluid-jet printhead and method of fabricating a fluid-jet printhead
JP3868755B2 (ja) * 2001-04-05 2007-01-17 アルプス電気株式会社 サーマルヘッド及びその製造方法
KR100449069B1 (ko) * 2001-09-12 2004-09-18 한국전자통신연구원 미소전극, 미소전극 어레이 및 미소전극 제조 방법
EP1602124B1 (en) * 2003-02-25 2013-09-04 IC Mechanics, Inc. Micromachined assembly with a multi-layer cap defining cavity
US7492019B2 (en) * 2003-03-07 2009-02-17 Ic Mechanics, Inc. Micromachined assembly with a multi-layer cap defining a cavity
JP3729353B2 (ja) * 2003-06-18 2005-12-21 松下電器産業株式会社 固体撮像装置およびその製造方法
US7480006B1 (en) * 2004-04-13 2009-01-20 Pixim, Inc. Optical package for image sensor with integrated heater
US7714694B2 (en) 2004-09-21 2010-05-11 Microbridge Technologies Canada, Inc. Compensating for linear and non-linear trimming-induced shift of temperature coefficient of resistance
JP2010096655A (ja) * 2008-10-17 2010-04-30 Kurabo Ind Ltd 流体制御方法
US8767448B2 (en) 2012-11-05 2014-07-01 International Business Machines Corporation Magnetoresistive random access memory
US9324937B1 (en) 2015-03-24 2016-04-26 International Business Machines Corporation Thermally assisted MRAM including magnetic tunnel junction and vacuum cavity
JP1551075S (cg-RX-API-DMAC10.html) * 2015-09-29 2016-06-06
JP1551076S (cg-RX-API-DMAC10.html) * 2015-09-29 2016-06-06
JP1551077S (cg-RX-API-DMAC10.html) * 2015-09-29 2016-06-06
CN112938937B (zh) * 2021-03-25 2022-05-31 安徽晟捷新能源科技股份有限公司 一种基于碳纳米管生产的气体加热流量控制设备
CN114089598A (zh) * 2022-01-24 2022-02-25 浙江光特科技有限公司 半导体器件的制造方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58167A (ja) * 1981-06-25 1983-01-05 Fujitsu Ltd 半導体装置
US4601777A (en) * 1985-04-03 1986-07-22 Xerox Corporation Thermal ink jet printhead and process therefor
US4638337A (en) * 1985-08-02 1987-01-20 Xerox Corporation Thermal ink jet printhead
US4639748A (en) * 1985-09-30 1987-01-27 Xerox Corporation Ink jet printhead with integral ink filter
JPH01109250A (ja) * 1987-10-22 1989-04-26 Toshiba Corp ガスセンサ
US4967589A (en) * 1987-12-23 1990-11-06 Ricoh Company, Ltd. Gas detecting device
JP2703773B2 (ja) * 1988-04-14 1998-01-26 シャープ株式会社 半導体装置の製造方法
JP2847970B2 (ja) * 1989-12-28 1999-01-20 富士電機株式会社 ガスセンサおよびその製造方法
JP3033143B2 (ja) * 1989-12-28 2000-04-17 富士電機株式会社 ガスセンサの製造方法
US5169806A (en) * 1990-09-26 1992-12-08 Xerox Corporation Method of making amorphous deposited polycrystalline silicon thermal ink jet transducers
US5285131A (en) * 1990-12-03 1994-02-08 University Of California - Berkeley Vacuum-sealed silicon incandescent light
US5464966A (en) * 1992-10-26 1995-11-07 The United States Of America As Represented By The Secretary Of Commerce Micro-hotplate devices and methods for their fabrication
US5345213A (en) * 1992-10-26 1994-09-06 The United States Of America, As Represented By The Secretary Of Commerce Temperature-controlled, micromachined arrays for chemical sensor fabrication and operation
US5450109A (en) * 1993-03-24 1995-09-12 Hewlett-Packard Company Barrier alignment and process monitor for TIJ printheads
US5324683A (en) * 1993-06-02 1994-06-28 Motorola, Inc. Method of forming a semiconductor structure having an air region
US5466484A (en) * 1993-09-29 1995-11-14 Motorola, Inc. Resistor structure and method of setting a resistance value
FR2736205B1 (fr) * 1995-06-30 1997-09-19 Motorola Semiconducteurs Dispositif detecteur a semiconducteur et son procede de formation
US6023091A (en) * 1995-11-30 2000-02-08 Motorola, Inc. Semiconductor heater and method for making

Similar Documents

Publication Publication Date Title
JPH09205009A5 (cg-RX-API-DMAC10.html)
JPH11251550A5 (cg-RX-API-DMAC10.html)
EP1018697A3 (en) Apparatus and method for contacting a conductive layer
JPH10154801A5 (cg-RX-API-DMAC10.html)
EP1356871A4 (en) METHOD OF FORMING A THIN LAYER ON A SURFACE OF CYLINDRICAL BASE MATERIAL AND MACHINE FOR FORMING A COVER LAYER
JPH11166866A5 (cg-RX-API-DMAC10.html)
JP2003518238A5 (cg-RX-API-DMAC10.html)
JP2001325879A5 (cg-RX-API-DMAC10.html)
EP1297967A3 (en) Thermal recording material and production method thereof
JP2000118555A5 (cg-RX-API-DMAC10.html)
JPH05145220A (ja) 導体膜および導体膜の製造方法
JPH0256443U (cg-RX-API-DMAC10.html)
JPH0235158U (cg-RX-API-DMAC10.html)
JPH1126773A5 (cg-RX-API-DMAC10.html)
KR960033447U (ko) 축열 보온층 구성 공기청정 전기압력보온밥솥
JPH0348621U (cg-RX-API-DMAC10.html)
RU1777964C (ru) Циклон
JPH1151573A (ja) 加熱炉の吸引成型方法
JPS58138242U (ja) 消弧装置
RU97111887A (ru) Способ изготовления толстопленочного резистивного нагревателя
JP2001305899A5 (cg-RX-API-DMAC10.html)
JPH0315418U (cg-RX-API-DMAC10.html)
JPH0272530U (cg-RX-API-DMAC10.html)
JPH03128668U (cg-RX-API-DMAC10.html)
JPS63131558U (cg-RX-API-DMAC10.html)