JPH09199892A - Electronic component mounting device and mounting method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To be able to shorten a tact time which a nozzle of a mounting and transfer head needs for picking up electronic components provided on a tray. SOLUTION: Trays 31, 33 and 35 are vertically arranged in steps. Input and output means are individually provided for each tray, and the means independently transfer the trays 31, 33 and 35 at different levels between a pick-up stage A while picking up is done at least and a waiting stage B while picking up is not done. When one of nozzles 14a of a mounting and transfer head 13 descends to pick up an electronic component on the lowest tray 31, other nozzles 14b and 14c which have already picked up electronic components 34 and 36 also descend following the nozzle 14a.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus and an electronic component mounting apparatus for picking up electronic components provided on a plurality of upper and lower trays by a plurality of nozzles provided on a transfer head and transferring and mounting them on a substrate. The present invention relates to a component mounting method.

[0002]

2. Description of the Related Art As an electronic component mounting apparatus, there has been conventionally used an electronic component mounting apparatus in which various kinds of electronic components provided in an electronic component supply apparatus are vacuum-sucked and picked up by a nozzle of a transfer head and transferred and mounted on a substrate. It is more widely implemented. Further, there are various types of electronic component supply devices that supply electronic components to the nozzles of the transfer head, and among them, there is a type that uses a tray.

Next, a conventional electronic component supply apparatus of this type will be described. FIG. 11 is a side view of a conventional electronic component supply device. In FIG. 11, reference numeral 1 is a magazine for storing trays 2 for storing a plurality of electronic components in a matrix in a vertically stacked manner. Then, in the conventional electronic component supply apparatus, a certain level 3 of loading / unloading is set and the magazine 1
Is lifted by the lifting means 4, and then the pickup stage 6
The tray 2 to be moved to is placed at this access level 3. Numeral 5 is an entrance / exit means for ejecting the tray 2 at the entrance / exit level 3 from the magazine 1 to the pickup stage 6 and for returning the tray 2 at the pickup stage 6 to the magazine 1.

Then, when the tray 2 required for the pickup stage 6 is taken out (see the tray 2 indicated by the broken line),
The nozzle 8 of the transfer head 7 descends toward the tray 2, and the electronic component P is vacuum-sucked and picked up from the tray 2 by the lower end portion of the nozzle 8, and the electronic component P is transferred to the substrate 9 as indicated by the broken line. It is supposed to be transferred.

[0005]

However, this has a problem that the time required for replacing the tray 2 located on the pickup stage 6 is long and the supply tact time is slow. The reason is as follows. That is, the tray 2 shown by the broken line in FIG.
If the tray 2x is to be replaced, the tray 2 is first returned from the pickup stage 6 to the magazine 1 by the loading / unloading means 5, and secondly, the magazine is lifted by the elevating means 4 so that the tray 2x reaches the loading / unloading level 3. This is because a series of operations is indispensable, in which the tray 2x which is raised to 1 and thirdly reaches the loading / unloading level 3 is loaded onto the pickup stage 6 by the loading / unloading means 5.

Therefore, an object of the present invention is to provide an electronic component mounting apparatus and an electronic component mounting method which can shorten the supply tact time and can transfer and mount electronic components on a substrate at high speed.

[0007]

An electronic component mounting apparatus according to the present invention has trays arranged in a plurality of upper and lower stages, and is provided with a loading / unloading means for individually loading / unloading each tray to / from a pickup stage. A plurality of nozzles for vacuum-sucking electronic components and a vertical movement mechanism for vertically moving each nozzle independently of each other according to the level of each tray in the pickup stage are provided.

The electronic component mounting method of the present invention picks up electronic components housed in trays arranged in a plurality of upper and lower stages on a pickup stage by vacuum suction using a plurality of nozzles provided in a transfer head. An electronic component mounting method for transferring and mounting on a substrate positioned by a positioning unit, wherein the transfer head is positioned above a tray arranged in a plurality of upper and lower stages, and the plurality of nozzles are sequentially moved up and down there. To pick up electronic components in order from the upper tray to the lower tray, and at that time,
Following the nozzles that perform the descending operation for picking up the electronic components, the other nozzles that do not pick up the electronic components also perform the descending operation.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS In the invention of claim 1, the trays can be independently moved in and out of the pickup stage at different levels, and the transfer heads can be independently moved up and down. Since it has multiple nozzles, multiple trays are positioned on the pickup stage at a time, and each nozzle is individually moved up and down to vacuum-pick up electronic components and pick them up and transfer them to the board. can do. Further, when the tray needs to be replaced, it can be dealt with only by removing the unnecessary tray from the pickup stage. That is, it is possible to save time for the magazine elevating / lowering operation, which is inevitable in the conventional electronic component supply device, and the tray loading / unloading operation performed after the elevating / lowering operation is completed, and the tact time is shortened accordingly. be able to.

According to a second aspect of the present invention, the transfer head is positioned above the trays arranged in a plurality of upper and lower stages, and the plurality of nozzles are sequentially moved up and down there to move the upper tray to the lower tray. The electronic parts are picked up in order to the tray, and at that time, the nozzles that perform the descending operation for picking up the electronic parts are followed, and the other nozzles that do not pick up the electronic parts also perform the descending operation. Therefore, the takt time required for the nozzle to move up and down to pick up the electronic component on the tray, and the nozzle to move to the upper side of the substrate, and to move up and down again to mount the electronic component on the substrate The tact time can be shortened, so that the electronic components provided on the tray can be mounted on the substrate at high speed and with good workability.

Next, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view of an electronic component mounting apparatus incorporating an electronic component supply apparatus according to an embodiment of the present invention, FIG. 2 is a perspective view of essential parts of the electronic component supply apparatus, and FIG. 3 is the electronic component supply apparatus. And FIG. 4 is a perspective view of a transfer head of the electronic component mounting apparatus. In FIG. 1, 11 is
The conveyor is provided on the upper surface of the base 10 so as to be long in the X direction, and serves as a board positioning unit that conveys the board 12 and positions the board 12 at a predetermined position. Reference numeral 13 denotes a transfer head having a plurality of nozzles for sucking electronic components at the bottom thereof, which is configured to be horizontally movable in the XY directions on the base 10 by an X table 19A and a Y table 19B. Reference numeral 40 denotes an electronic component observation device, which is installed on the side of the conveyor 11. The direction in which the substrate 12 is conveyed by the conveyor 11 is the X direction.

Reference numeral 16 is an electronic component supply device for supplying electronic components by a tray. 17 is the frame,
It is fixed on the base 10. Electronic component supply device 16
Is provided on the side facing the conveyor 11 and the like, and the transfer head 1
Nozzle 3 picks up electronic components by vacuum suction and pick-up stage A, and standby stage B in the center
And a replenishment stage C located on the opposite side of the pickup stage A for replacing an empty tray with another tray and replenishing electronic parts. The standby stage B is covered with a cover 18 from above. Has been. Reference numeral 15 is a parts feeder that supplies electronic components by a supply form other than a tray (for example, a tape feeder or a tube feeder).

Next, the outline of the internal structure of the electronic component supply apparatus will be described with reference to FIG. As shown in FIG. 2, the electronic component supply apparatus according to the present embodiment has a first table 19, a second table 20, and a third table 2 in order from the bottom.
The first table 1 has a three-tiered table
9 for the first conveyor 22, the second table 20 for the second conveyor 23, the third table 21 for the third conveyor 24,
Each is connected. The first conveyor 22 is driven by the first motor 25, and the second conveyor 23 is driven by the second motor 2.
6, the third conveyor 24 is driven by the third motor 27.
Each is driven independently. Therefore, the first
Table 21, second table 22 and third table 23
Can be independently put in and out, as shown by arrows N1, N2, and N3. Here, the 1st conveyor 22, the 2nd conveyor 23, and the 3rd conveyor 24 are equivalent to an in-and-out means.

Next, with reference to FIG. 3, a detailed structure of the electronic component supplying apparatus of the present embodiment will be described. FIG.
As shown in FIG. 1, in the upper part of the frame 17, the first step 17a, the second step 17a
A step 17b and a third step 17c are formed. And
A slider S fixed to the lower surface of the first table 19 is slidably engaged with the first guide 28 fixed to the first step 17a. Similarly, the second table 20 and the third table 20
The table 21 is also slidably supported by a second guide 29 fixed to the second step 17b and a third guide 30 fixed to the third step 17c, respectively. Also, 3
Reference numeral 1 denotes a first tray that houses the first electronic component 32 and is placed on the first table 19, 33 is a second tray that houses the second electronic component 34 and is placed on the second table 20, and 35 is It is a third tray that houses the third electronic component 36 and is placed on the third table 21. Here, in the state of being placed on each table, the first tray 31 is located at the lowermost first level L1, and the second tray 33 is located at the middle second level L2.
And the third tray 35 is located at the uppermost third level L3.
Located in. Note that L0 is an observation level (described later) of the electronic component.

The side portion of the second table 20 has the first
Bend vertically downward just outside table 19,
Just below the table 19, it is bent inside the frame 17 again at a right angle to reach the slider S.
Thus, the side portion of the second table 20 has the first table 1
Since it is bent to the center side of the frame 17 while bypassing the outside of 9, the width of the second table 20 can be made as small as possible and the electronic component supply device can be made compact. Further, for the same reason, the side portion of the third table 21 is formed so as to bypass the outside of the second table 20 and bend toward the center side of the frame 17 to reach the slider S.

Next, the structures of the transfer head 13 and the observation device 40 will be described with reference to FIG. The transfer head 13 has a first nozzle 14a, a second nozzle 14b, and a third nozzle 14c that move up and down independently of each other. As described later, the first electronic component 32 and the second electronic component 32 respectively. Part 3
4. The third electronic component 36 is vacuum-sucked and transferred and mounted on the substrate 12.

The vertical movement mechanism of the first nozzle 14a, the second nozzle 14b, and the third nozzle 14c has the same structure, and the frame 51 and the feed screw 5 vertically held by the frame 51.
2. A Z-axis motor 53 mounted on the upper part of the frame 51 to rotate the feed screw 52 and screwed to the feed screw 52,
When the feed screw 52 rotates, it is provided with a nut 54 that moves up and down along the feed screw, a nozzle shaft 55 vertically installed on the nut 54, and a disk-shaped back plate 56 attached to the nozzle shaft 55. The nozzle shaft 55 is rotated by a motor 57 and a belt 58 about the axis of the shaft by θ. Therefore, when the Z-axis motor 53 rotates forward and backward, the nut 54 moves up and down along the feed screw 52, and the first nozzle 14a, the second nozzle 14b, and the third nozzle 14c move up and down. When the motor 57 rotates, the nozzle shaft 5
5 rotates θ, the first nozzle 14a, the second nozzle 14b,
The rotation angle in the horizontal direction of the electronic component vacuum-adsorbed on the lower end of the third nozzle 14c is corrected.

The observing device 40 is constructed by housing a line sensor 42 inside a box 41. The line sensor 42 is arranged with its longitudinal direction oriented in the Y direction, and a slit 43 corresponding to the line sensor 42 is opened on the upper surface of the box 41. The transfer head 13 is
The direction above the slit 43 is the direction in which the line sensor 42 is arranged (Y
(Direction X). The first nozzle 14a, the second nozzle 14b, and the third nozzle 14c are X
Are arranged in a line in the horizontal direction, and therefore the transfer head 13
By linearly moving in the X direction, the first electronic component 32, the second electronic component 34, and the third electronic component 36, which are vacuum-adsorbed at the respective lower ends, are made to traverse above the line sensor 42 and are continuously connected. By observing at a high speed, the positional deviations in the X, Y, and θ directions are detected.

This electronic component mounting apparatus is constructed as described above, and the overall operation will be described below. 5 and 6,
7, FIG. 8, FIG. 9, and FIG. 10 are process explanatory diagrams of an electronic component supply method according to an embodiment of the present invention, and are shown in order of operation. Hereinafter, each step will be described with reference to FIGS. First, as shown in FIG. 5, the first tray 3
1st, 2nd tray 33, 3rd tray 35 to standby stage B
From the pickup stage A. Here, the first level L1 of the lowermost first tray 31 is the observation device 40.
The observation level L0 of the electronic component and the level of the upper surface of the substrate 12 (mounting level of the electronic component) are completely or substantially matched, and the reason will be described later.

Now, as shown in FIG. 5, the transfer head 13 is moved above the pickup stage A. at first,
First nozzle 14a, second nozzle 14b, third nozzle 14
Although c has retreated to the highest level, first, as shown in the figure, only the third nozzle 14c is caused to move down and up, and the third electronic component 36 provided on the uppermost third tray 35 is vacuum sucked. And pick it up.

Next, as shown in FIG. 6, the third tray 35 is moved back to the standby stage B to expose the second tray 33. Then, as shown in FIG.
The raising operation is performed and the second electronic component 34 is picked up. At this time, the first that does not pick up electronic parts
The nozzle 14a and the third nozzle 14c are also the second nozzle 1
The stroke H1 is lowered following the lowering movement of 4b.

Next, as shown in FIG. 8, the second tray 33 is retracted to the standby stage B to expose the first tray 31. In addition, there, the first nozzle 14a is caused to move down and up, and the first electronic component 32 is picked up. At this time, the second nozzle 14 that does not pick up the electronic component
b, the third nozzle 14c also follows the lowering operation of the first nozzle 14a and further lowers the stroke H2.

As described above, the third nozzle 14c, the second nozzle 14b, and the first nozzle 14a are sequentially arranged in the electronic component 3.
After picking up 6, 34, 32, the transfer head 13 is moved above the observation device 40 as shown in FIG. 9, and the positions of the third electronic component 36, the second electronic component 34, and the first electronic component 32 are changed. The shift is observed (see also FIG. 4). In this case, all the electronic components 36, 34, 32 are attached to the observation device 40.
Of the Z-axis motor 53 in order to position it at the observation level L0 of
Drive the first nozzle 14a, the second nozzle 14b, the third nozzle
Although the nozzle 14c is lowered, at the time of the final pickup shown in FIG. 8, not only the first nozzle 14a for picking up the electronic component 32 but also the electronic components 34 and 36 have already been picked up. In the process shown in FIG. The second nozzle 14b and the third nozzle 14c, which were not picked up, were also lowered together with the first nozzle 14a, so the lowering stroke H3 for lowering the electronic components 36, 34, 32 from the first level L1 to the observation level L0. Will be small, and therefore three electronic components 3
6, 34, 32 are continuously observed at a high speed with good setup,
The positional deviation in the X direction, the Y direction, and the θ direction can be detected. Of course, the descending stroke H3 can be set to 0 by installing the observing device 40 slightly higher.

Next, as shown in FIG. 10, the transfer head 13
Moves above the substrate 12, where the third nozzle 14c,
The second nozzle 14b and the first nozzle 14a are individually caused to perform descending / ascending operations, and the three electronic components 36, 34, 32 are sequentially mounted at predetermined coordinate positions on the substrate 12. In this case as well, Since the nozzle 14a, the second nozzle 14b, and the third nozzle 14c have already been lowered to the low level observation level L0 shown in FIG. 9, the lowering stroke H4 for mounting the electronic components 36, 34, 32 on the substrate 12 is performed. Is short and can be installed at high speed. The observation device 4
The positional deviation between the X direction and the Y direction detected at 0 is corrected by adjusting the movement stroke of the transfer head 13 with respect to the substrate 12 in the X direction and the Y direction, and the positional deviation in the θ direction is corrected by the motor 57 ( 4) is driven to rotate the nozzle shaft 55 to make the correction.

[0025]

The electronic component mounting apparatus of the present invention is provided with a plurality of upper and lower trays, and each tray can be independently moved in and out of the pickup stage at different levels. Since it has multiple nozzles that can individually move up and down independently, multiple trays can be placed on the pickup stage at a time, and each nozzle can be moved up and down individually to vacuum the electronic components. It can be adsorbed, picked up, and transferred and mounted on a substrate. When the tray needs to be replaced,
It can be dealt with simply by removing unnecessary trays from the pickup stage. That is, it is possible to save time for the magazine elevating / lowering operation, which is inevitable in the conventional electronic component supply device, and the tray loading / unloading operation performed after the elevating / lowering operation is completed, and the tact time is shortened accordingly. be able to.

Further, in the electronic component mounting apparatus of the present invention, the transfer head is positioned above the trays arranged in the upper and lower stages, and the plurality of nozzles are sequentially moved up and down there to move from the upper tray. Electronic components are picked up in sequence to the lower tray, and at that time, following the nozzle that moves down to pick up the electronic components,
Since the other nozzles that do not pick up the electronic components are also made to move down, the tact time required for the nozzles to move up and down to pick up the electronic components on the tray, and the nozzle moves above the substrate. Therefore, the tact time required to carry out the vertical movement again to mount the electronic component on the substrate can be greatly shortened, so that the electronic component provided on the tray can be mounted on the substrate at high speed and with good workability.

[Brief description of drawings]

FIG. 1 is a perspective view of an electronic component mounting apparatus incorporating an electronic component supply device according to an embodiment of the present invention.

FIG. 2 is a perspective view of a main part of an electronic component supply device according to an embodiment of the present invention.

FIG. 3 is a sectional view of an electronic component supply device according to an embodiment of the present invention.

FIG. 4 is a perspective view of a transfer head of the electronic component mounting apparatus according to the embodiment of the present invention.

FIG. 5 is a process explanatory diagram of an electronic component supply method according to an embodiment of the present invention.

FIG. 6 is a process explanatory diagram of an electronic component supply method according to an embodiment of the present invention.

FIG. 7 is a process explanatory diagram of an electronic component supply method according to an embodiment of the present invention.

FIG. 8 is a process explanatory diagram of an electronic component supply method according to an embodiment of the present invention.

FIG. 9 is a process explanatory diagram of an electronic component supply method according to another embodiment of the present invention.

FIG. 10 is a process explanatory diagram of an electronic component supply method according to another embodiment of the present invention.

FIG. 11 is a side view of a conventional electronic component supply device.

[Explanation of symbols]

 11 Conveyor 12 Substrate 13 Transfer Head 14a First Nozzle 14b Second Nozzle 14c Third Nozzle 17 Frame 22 First Conveyor 23 Second Conveyor 24 Third Conveyor 31 First Tray 32 First Electronic Component 33 Second Tray 34 Second Electronic parts 35 Third tray 36 Third electronic parts 40 Observation device 52 Feed screw 53 Z-axis motor 54 Nut A Pickup stage B Standby stage L0 Observation level L1 First level L2 Second level L3 Third level

Claims (2)

[Claims] 1. A positioning part for positioning a board, an electronic part supply device for supplying electronic parts, and a board for moving the electronic parts supply device and the positioning part to position the supplied electronic parts. An electronic component mounting apparatus comprising: a transfer head for transferring and mounting the electronic component to the electronic component supply device, wherein the electronic component supply device includes a plurality of upper and lower trays for storing electronic components, and a loading / unloading tray for individually loading and unloading each tray. The transfer head includes a plurality of nozzles for vacuum-suctioning electronic components, and a vertical movement unit for vertically moving each nozzle independently of each other according to the level of each tray in the pickup stage. An electronic component mounting apparatus comprising a moving mechanism. 2. A substrate positioned on a positioning unit by vacuum suction of electronic components housed in trays arranged in a plurality of upper and lower stages on a pickup stage by a plurality of nozzles provided on a transfer head for pickup. In the electronic component mounting method, the transfer head is positioned above the trays arranged in a plurality of upper and lower stages, and the plurality of nozzles are sequentially moved upward and downward from the upper tray. The electronic parts are picked up in order to the lower tray, and at that time, the nozzles that perform the descending operation to pick up the electronic parts are followed, and the other nozzles that do not pick up the electronic parts also perform the descending operation. An electronic component mounting method characterized by the above.