JPH09180976A - 不良分析のフィードバックによる半導体製造工程の制御方法 - Google Patents

不良分析のフィードバックによる半導体製造工程の制御方法

Info

Publication number
JPH09180976A
JPH09180976A JP8228950A JP22895096A JPH09180976A JP H09180976 A JPH09180976 A JP H09180976A JP 8228950 A JP8228950 A JP 8228950A JP 22895096 A JP22895096 A JP 22895096A JP H09180976 A JPH09180976 A JP H09180976A
Authority
JP
Japan
Prior art keywords
equipment
yield
database
abnormal
real time
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8228950A
Other languages
English (en)
Japanese (ja)
Inventor
Mingo Ri
民豪 李
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of JPH09180976A publication Critical patent/JPH09180976A/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41875—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by quality surveillance of production
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/31—From computer integrated manufacturing till monitoring
    • G05B2219/31426—Real time database management for production control
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/32—Operator till task planning
    • G05B2219/32209—Stop production line
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/32—Operator till task planning
    • G05B2219/32221—Correlation between defect and measured parameters to find origin of defect
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Automation & Control Theory (AREA)
  • General Engineering & Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • General Factory Administration (AREA)
  • Testing And Monitoring For Control Systems (AREA)
  • Control By Computers (AREA)
JP8228950A 1995-12-21 1996-08-29 不良分析のフィードバックによる半導体製造工程の制御方法 Pending JPH09180976A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1019950053372A KR100200480B1 (ko) 1995-12-21 1995-12-21 불량 분석 피드백에 의한 반도체 제조공정 제어방법
KR199553372 1995-12-21

Publications (1)

Publication Number Publication Date
JPH09180976A true JPH09180976A (ja) 1997-07-11

Family

ID=19442322

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8228950A Pending JPH09180976A (ja) 1995-12-21 1996-08-29 不良分析のフィードバックによる半導体製造工程の制御方法

Country Status (4)

Country Link
US (1) US5923553A (enExample)
JP (1) JPH09180976A (enExample)
KR (1) KR100200480B1 (enExample)
TW (1) TW314646B (enExample)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11260879A (ja) * 1998-03-06 1999-09-24 Fujitsu Ltd 半導体チップの相関解析方法及び装置、半導体チップ歩留まり調整方法並びに記憶媒体
US6728588B2 (en) 1999-05-20 2004-04-27 Hyundai Electronics Industries Co., Ltd. Apparatus and method for automatically controlling semiconductor manufacturing process in semiconductor factory automation system
WO2005045907A1 (ja) * 2003-11-10 2005-05-19 Renesas Technology Corp. 半導体集積回路装置の製造方法
US7138283B2 (en) 2003-06-18 2006-11-21 Kabushiki Kaisha Toshiba Method for analyzing fail bit maps of wafers
JP2007116182A (ja) * 2006-11-13 2007-05-10 Toshiba Corp 不良検出方法
KR20180123954A (ko) * 2017-05-10 2018-11-20 주식회사 유비덤 품질개선을 위한 스마트 바스켓 시스템 및 방법

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US6594598B1 (en) * 1997-10-08 2003-07-15 Matsushita Electronics Corporation Method for controlling production line
KR100272256B1 (ko) * 1997-10-31 2001-03-02 윤종용 반도체장비와호스트컴퓨터의동시제어방법
US6154714A (en) * 1997-11-17 2000-11-28 Heuristic Physics Laboratories Method for using wafer navigation to reduce testing times of integrated circuit wafers
KR100319208B1 (ko) * 1998-01-14 2002-03-21 윤종용 반도체제조설비관리시스템의설비사전예방유지의주기관리방법
KR100278600B1 (ko) * 1998-01-14 2001-01-15 윤종용 반도체 제조설비 관리시스템의 설비유닛의 상태 관리방법
KR100269941B1 (ko) * 1998-01-14 2001-01-15 윤종용 반도체 제조설비 관리시스템에서 설비의 비상상태관리방법
KR100269942B1 (ko) * 1998-02-03 2000-10-16 윤종용 반도체제조설비관리방법
US6123983A (en) * 1998-04-23 2000-09-26 Sandia Corporation Method and apparatus for monitoring plasma processing operations
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KR100439841B1 (ko) * 2001-10-05 2004-07-12 삼성전자주식회사 반도체 제조설비의 공정불량 방지방법
US6792386B2 (en) * 2001-12-28 2004-09-14 Texas Instruments Incorporated Method and system for statistical comparison of a plurality of testers
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US20030199112A1 (en) 2002-03-22 2003-10-23 Applied Materials, Inc. Copper wiring module control
US8321048B1 (en) * 2002-06-28 2012-11-27 Advanced Micro Devices, Inc. Associating data with workpieces and correlating the data with yield data
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US6778873B1 (en) * 2002-07-31 2004-08-17 Advanced Micro Devices, Inc. Identifying a cause of a fault based on a process controller output
CN100351725C (zh) 2002-08-01 2007-11-28 应用材料有限公司 用于在先进工艺控制系统中处理歪曲的度量数据的方法、系统和介质
US7117057B1 (en) 2002-09-10 2006-10-03 Taiwan Semiconductor Manufacturing Co. Ltd. Yield patrolling system
US7272459B2 (en) 2002-11-15 2007-09-18 Applied Materials, Inc. Method, system and medium for controlling manufacture process having multivariate input parameters
US7333871B2 (en) 2003-01-21 2008-02-19 Applied Materials, Inc. Automated design and execution of experiments with integrated model creation for semiconductor manufacturing tools
US20040215605A1 (en) * 2003-04-25 2004-10-28 Detroit Diesel Corporation System and method for managing a distributed equipment unit service reporting function over a network
US7205228B2 (en) 2003-06-03 2007-04-17 Applied Materials, Inc. Selective metal encapsulation schemes
US7354332B2 (en) 2003-08-04 2008-04-08 Applied Materials, Inc. Technique for process-qualifying a semiconductor manufacturing tool using metrology data
US7035770B2 (en) * 2003-12-18 2006-04-25 Taiwan Semiconductor Manufacturing Company, Ltd. Fuzzy reasoning model for semiconductor process fault detection using wafer acceptance test data
US7356377B2 (en) 2004-01-29 2008-04-08 Applied Materials, Inc. System, method, and medium for monitoring performance of an advanced process control system
US7096085B2 (en) 2004-05-28 2006-08-22 Applied Materials Process control by distinguishing a white noise component of a process variance
US6961626B1 (en) 2004-05-28 2005-11-01 Applied Materials, Inc Dynamic offset and feedback threshold
US7089514B2 (en) 2004-08-10 2006-08-08 International Business Machines Corporation Defect diagnosis for semiconductor integrated circuits
US8055370B1 (en) 2006-06-23 2011-11-08 Novellus Systems, Inc. Apparatus and methods for monitoring health of semiconductor process systems
KR100773350B1 (ko) 2006-08-29 2007-11-05 삼성전자주식회사 설비의 이상패턴 규명을 위한 기준정보형성방법 및 이를이용한 반도체 제조설비의 모니터링 방법
US8279072B2 (en) * 2008-03-17 2012-10-02 Mrl Industries Inc. System to monitor a consumable part and method to monitor performance life and predict maintenance thereof
WO2010092588A2 (en) * 2008-05-23 2010-08-19 Nitin Gupta Method and system for measuring and analyzing the production data directly from machine
JP2010087459A (ja) * 2008-09-08 2010-04-15 Toshiba Corp 故障原因特定装置および方法
US9058034B2 (en) 2012-08-09 2015-06-16 International Business Machines Corporation Integrated circuit product yield optimization using the results of performance path testing
USD814488S1 (en) 2014-10-10 2018-04-03 Lam Research Corporation Display screen with graphical user interface for supporting service maintenance and tracking activities in semiconductor tool
WO2016057551A1 (en) * 2014-10-10 2016-04-14 Lam Research Corporation Mobile connectivity and control of semiconductor manufacturing equipment
US10430719B2 (en) 2014-11-25 2019-10-01 Stream Mosaic, Inc. Process control techniques for semiconductor manufacturing processes
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JP6860406B2 (ja) * 2017-04-05 2021-04-14 株式会社荏原製作所 半導体製造装置、半導体製造装置の故障予知方法、および半導体製造装置の故障予知プログラム
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US11022642B2 (en) 2017-08-25 2021-06-01 Pdf Solutions, Inc. Semiconductor yield prediction
US10318700B2 (en) 2017-09-05 2019-06-11 International Business Machines Corporation Modifying a manufacturing process of integrated circuits based on large scale quality performance prediction and optimization
KR102489762B1 (ko) * 2017-12-29 2023-01-18 비컴솔루션 주식회사 패턴인식에 의한 공정 이상 감지 시스템 및 그 방법
US11029359B2 (en) 2018-03-09 2021-06-08 Pdf Solutions, Inc. Failure detection and classsification using sensor data and/or measurement data
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US10777470B2 (en) 2018-03-27 2020-09-15 Pdf Solutions, Inc. Selective inclusion/exclusion of semiconductor chips in accelerated failure tests
US11669079B2 (en) * 2021-07-12 2023-06-06 Tokyo Electron Limited Tool health monitoring and classifications with virtual metrology and incoming wafer monitoring enhancements
KR102777239B1 (ko) * 2022-06-03 2025-03-05 한국핵융합에너지연구원 반도체 장비를 통합 관리하기 위한 지능형 시스템
CN119903430B (zh) * 2024-12-31 2025-12-12 民航成都物流技术有限公司 故障运维知识图谱结合故障树的复杂产线可靠性分析方法

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Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11260879A (ja) * 1998-03-06 1999-09-24 Fujitsu Ltd 半導体チップの相関解析方法及び装置、半導体チップ歩留まり調整方法並びに記憶媒体
US6728588B2 (en) 1999-05-20 2004-04-27 Hyundai Electronics Industries Co., Ltd. Apparatus and method for automatically controlling semiconductor manufacturing process in semiconductor factory automation system
US7138283B2 (en) 2003-06-18 2006-11-21 Kabushiki Kaisha Toshiba Method for analyzing fail bit maps of wafers
WO2005045907A1 (ja) * 2003-11-10 2005-05-19 Renesas Technology Corp. 半導体集積回路装置の製造方法
JPWO2005045907A1 (ja) * 2003-11-10 2007-05-24 株式会社ルネサステクノロジ 半導体集積回路装置の製造方法
US7346412B2 (en) 2003-11-10 2008-03-18 Renesas Technology Corp. Manufacturing method of semiconductor integrated circuit device
JP4611894B2 (ja) * 2003-11-10 2011-01-12 ルネサスエレクトロニクス株式会社 半導体集積回路装置の製造方法
JP2007116182A (ja) * 2006-11-13 2007-05-10 Toshiba Corp 不良検出方法
KR20180123954A (ko) * 2017-05-10 2018-11-20 주식회사 유비덤 품질개선을 위한 스마트 바스켓 시스템 및 방법

Also Published As

Publication number Publication date
KR970053238A (ko) 1997-07-31
TW314646B (enExample) 1997-09-01
US5923553A (en) 1999-07-13
KR100200480B1 (ko) 1999-10-01

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