|
US6594598B1
(en)
*
|
1997-10-08 |
2003-07-15 |
Matsushita Electronics Corporation |
Method for controlling production line
|
|
KR100272256B1
(ko)
*
|
1997-10-31 |
2001-03-02 |
윤종용 |
반도체장비와호스트컴퓨터의동시제어방법
|
|
US6154714A
(en)
*
|
1997-11-17 |
2000-11-28 |
Heuristic Physics Laboratories |
Method for using wafer navigation to reduce testing times of integrated circuit wafers
|
|
KR100319208B1
(ko)
*
|
1998-01-14 |
2002-03-21 |
윤종용 |
반도체제조설비관리시스템의설비사전예방유지의주기관리방법
|
|
KR100278600B1
(ko)
*
|
1998-01-14 |
2001-01-15 |
윤종용 |
반도체 제조설비 관리시스템의 설비유닛의 상태 관리방법
|
|
KR100269941B1
(ko)
*
|
1998-01-14 |
2001-01-15 |
윤종용 |
반도체 제조설비 관리시스템에서 설비의 비상상태관리방법
|
|
KR100269942B1
(ko)
*
|
1998-02-03 |
2000-10-16 |
윤종용 |
반도체제조설비관리방법
|
|
JP3739201B2
(ja)
*
|
1998-03-06 |
2006-01-25 |
富士通株式会社 |
半導体チップの相関解析方法及び装置、半導体チップ歩留まり調整方法並びに記憶媒体
|
|
US6123983A
(en)
*
|
1998-04-23 |
2000-09-26 |
Sandia Corporation |
Method and apparatus for monitoring plasma processing operations
|
|
US6261470B1
(en)
|
1998-04-23 |
2001-07-17 |
Sandia Corporation |
Method and apparatus for monitoring plasma processing operations
|
|
US6405094B1
(en)
*
|
1998-07-10 |
2002-06-11 |
Tokyo Electron Limited |
Apparatus and method of collecting substrates abnormally processed or processed previous to ordinary processing
|
|
US6240329B1
(en)
*
|
1998-11-09 |
2001-05-29 |
Chin-Yang Sun |
Method and apparatus for a semiconductor wafer inspection system using a knowledge-based system
|
|
KR100303321B1
(ko)
*
|
1999-05-20 |
2001-09-26 |
박종섭 |
반도체 라인 자동화 시스템에서의 오류발생 로트 제어 장치 및그 방법
|
|
US7069101B1
(en)
|
1999-07-29 |
2006-06-27 |
Applied Materials, Inc. |
Computer integrated manufacturing techniques
|
|
US6427093B1
(en)
*
|
1999-10-07 |
2002-07-30 |
Advanced Micro Devices, Inc. |
Method and apparatus for optimal wafer-by-wafer processing
|
|
US6640151B1
(en)
|
1999-12-22 |
2003-10-28 |
Applied Materials, Inc. |
Multi-tool control system, method and medium
|
|
AU1942701A
(en)
*
|
1999-12-30 |
2001-07-16 |
General Electric Company |
Method and system for monitoring production data
|
|
US6405144B1
(en)
*
|
2000-01-18 |
2002-06-11 |
Advanced Micro Devices, Inc. |
Method and apparatus for programmed latency for improving wafer-to-wafer uniformity
|
|
JP3555859B2
(ja)
*
|
2000-03-27 |
2004-08-18 |
広島日本電気株式会社 |
半導体生産システム及び半導体装置の生産方法
|
|
US6434725B1
(en)
*
|
2000-06-26 |
2002-08-13 |
Infineon Technologies Richmond, Lp |
Method and system for semiconductor testing using yield correlation between global and class parameters
|
|
US6708074B1
(en)
|
2000-08-11 |
2004-03-16 |
Applied Materials, Inc. |
Generic interface builder
|
|
US6615101B1
(en)
*
|
2000-10-17 |
2003-09-02 |
Promos Technologies, Inc. |
Method for identifying the best tool in a semiconductor manufacturing process
|
|
US7188142B2
(en)
|
2000-11-30 |
2007-03-06 |
Applied Materials, Inc. |
Dynamic subject information generation in message services of distributed object systems in a semiconductor assembly line facility
|
|
DE10060631C1
(de)
*
|
2000-12-06 |
2002-07-11 |
Infineon Technologies Ag |
Verfahren zum automatischen Überwachen der Herstellung von integrierten Schaltkreisen abhängig von der Anzahl ausgeführter Bearbeitungszyklen
|
|
DE10108920A1
(de)
*
|
2001-02-23 |
2002-09-12 |
Infineon Technologies Ag |
Verfahren zum Überwachen einer Fertigung unter Verwendung von justierten Werten sowie zugehörige Komponenten
|
|
US7127409B2
(en)
*
|
2001-03-01 |
2006-10-24 |
General Electric Company |
Methods and systems for aviation nonconformance component management
|
|
US7101799B2
(en)
|
2001-06-19 |
2006-09-05 |
Applied Materials, Inc. |
Feedforward and feedback control for conditioning of chemical mechanical polishing pad
|
|
US7160739B2
(en)
|
2001-06-19 |
2007-01-09 |
Applied Materials, Inc. |
Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles
|
|
US6910947B2
(en)
|
2001-06-19 |
2005-06-28 |
Applied Materials, Inc. |
Control of chemical mechanical polishing pad conditioner directional velocity to improve pad life
|
|
US7047099B2
(en)
|
2001-06-19 |
2006-05-16 |
Applied Materials Inc. |
Integrating tool, module, and fab level control
|
|
US7082345B2
(en)
|
2001-06-19 |
2006-07-25 |
Applied Materials, Inc. |
Method, system and medium for process control for the matching of tools, chambers and/or other semiconductor-related entities
|
|
US7698012B2
(en)
*
|
2001-06-19 |
2010-04-13 |
Applied Materials, Inc. |
Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing
|
|
US6913938B2
(en)
|
2001-06-19 |
2005-07-05 |
Applied Materials, Inc. |
Feedback control of plasma-enhanced chemical vapor deposition processes
|
|
US7201936B2
(en)
|
2001-06-19 |
2007-04-10 |
Applied Materials, Inc. |
Method of feedback control of sub-atmospheric chemical vapor deposition processes
|
|
US7337019B2
(en)
|
2001-07-16 |
2008-02-26 |
Applied Materials, Inc. |
Integration of fault detection with run-to-run control
|
|
US6950716B2
(en)
|
2001-08-13 |
2005-09-27 |
Applied Materials, Inc. |
Dynamic control of wafer processing paths in semiconductor manufacturing processes
|
|
US6984198B2
(en)
|
2001-08-14 |
2006-01-10 |
Applied Materials, Inc. |
Experiment management system, method and medium
|
|
KR100439841B1
(ko)
*
|
2001-10-05 |
2004-07-12 |
삼성전자주식회사 |
반도체 제조설비의 공정불량 방지방법
|
|
US6792386B2
(en)
*
|
2001-12-28 |
2004-09-14 |
Texas Instruments Incorporated |
Method and system for statistical comparison of a plurality of testers
|
|
US7225047B2
(en)
|
2002-03-19 |
2007-05-29 |
Applied Materials, Inc. |
Method, system and medium for controlling semiconductor wafer processes using critical dimension measurements
|
|
US20030199112A1
(en)
|
2002-03-22 |
2003-10-23 |
Applied Materials, Inc. |
Copper wiring module control
|
|
US8321048B1
(en)
*
|
2002-06-28 |
2012-11-27 |
Advanced Micro Devices, Inc. |
Associating data with workpieces and correlating the data with yield data
|
|
US7069103B1
(en)
*
|
2002-06-28 |
2006-06-27 |
Advanced Micro Devices, Inc. |
Controlling cumulative wafer effects
|
|
US6778873B1
(en)
*
|
2002-07-31 |
2004-08-17 |
Advanced Micro Devices, Inc. |
Identifying a cause of a fault based on a process controller output
|
|
CN100351725C
(zh)
|
2002-08-01 |
2007-11-28 |
应用材料有限公司 |
用于在先进工艺控制系统中处理歪曲的度量数据的方法、系统和介质
|
|
US7117057B1
(en)
|
2002-09-10 |
2006-10-03 |
Taiwan Semiconductor Manufacturing Co. Ltd. |
Yield patrolling system
|
|
US7272459B2
(en)
|
2002-11-15 |
2007-09-18 |
Applied Materials, Inc. |
Method, system and medium for controlling manufacture process having multivariate input parameters
|
|
US7333871B2
(en)
|
2003-01-21 |
2008-02-19 |
Applied Materials, Inc. |
Automated design and execution of experiments with integrated model creation for semiconductor manufacturing tools
|
|
US20040215605A1
(en)
*
|
2003-04-25 |
2004-10-28 |
Detroit Diesel Corporation |
System and method for managing a distributed equipment unit service reporting function over a network
|
|
US7205228B2
(en)
|
2003-06-03 |
2007-04-17 |
Applied Materials, Inc. |
Selective metal encapsulation schemes
|
|
JP3913715B2
(ja)
|
2003-06-18 |
2007-05-09 |
株式会社東芝 |
不良検出方法
|
|
US7354332B2
(en)
|
2003-08-04 |
2008-04-08 |
Applied Materials, Inc. |
Technique for process-qualifying a semiconductor manufacturing tool using metrology data
|
|
TW200516686A
(en)
*
|
2003-11-10 |
2005-05-16 |
Renesas Tech Corp |
Manufacturing method for semiconductor integrated circuit device
|
|
US7035770B2
(en)
*
|
2003-12-18 |
2006-04-25 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
Fuzzy reasoning model for semiconductor process fault detection using wafer acceptance test data
|
|
US7356377B2
(en)
|
2004-01-29 |
2008-04-08 |
Applied Materials, Inc. |
System, method, and medium for monitoring performance of an advanced process control system
|
|
US7096085B2
(en)
|
2004-05-28 |
2006-08-22 |
Applied Materials |
Process control by distinguishing a white noise component of a process variance
|
|
US6961626B1
(en)
|
2004-05-28 |
2005-11-01 |
Applied Materials, Inc |
Dynamic offset and feedback threshold
|
|
US7089514B2
(en)
|
2004-08-10 |
2006-08-08 |
International Business Machines Corporation |
Defect diagnosis for semiconductor integrated circuits
|
|
US8055370B1
(en)
|
2006-06-23 |
2011-11-08 |
Novellus Systems, Inc. |
Apparatus and methods for monitoring health of semiconductor process systems
|
|
KR100773350B1
(ko)
|
2006-08-29 |
2007-11-05 |
삼성전자주식회사 |
설비의 이상패턴 규명을 위한 기준정보형성방법 및 이를이용한 반도체 제조설비의 모니터링 방법
|
|
JP4786505B2
(ja)
*
|
2006-11-13 |
2011-10-05 |
株式会社東芝 |
不良検出方法
|
|
US8279072B2
(en)
*
|
2008-03-17 |
2012-10-02 |
Mrl Industries Inc. |
System to monitor a consumable part and method to monitor performance life and predict maintenance thereof
|
|
WO2010092588A2
(en)
*
|
2008-05-23 |
2010-08-19 |
Nitin Gupta |
Method and system for measuring and analyzing the production data directly from machine
|
|
JP2010087459A
(ja)
*
|
2008-09-08 |
2010-04-15 |
Toshiba Corp |
故障原因特定装置および方法
|
|
US9058034B2
(en)
|
2012-08-09 |
2015-06-16 |
International Business Machines Corporation |
Integrated circuit product yield optimization using the results of performance path testing
|
|
USD814488S1
(en)
|
2014-10-10 |
2018-04-03 |
Lam Research Corporation |
Display screen with graphical user interface for supporting service maintenance and tracking activities in semiconductor tool
|
|
WO2016057551A1
(en)
*
|
2014-10-10 |
2016-04-14 |
Lam Research Corporation |
Mobile connectivity and control of semiconductor manufacturing equipment
|
|
US10430719B2
(en)
|
2014-11-25 |
2019-10-01 |
Stream Mosaic, Inc. |
Process control techniques for semiconductor manufacturing processes
|
|
CN107004060B
(zh)
|
2014-11-25 |
2022-02-18 |
Pdf决策公司 |
用于半导体制造工艺的经改进工艺控制技术
|
|
JP6860406B2
(ja)
*
|
2017-04-05 |
2021-04-14 |
株式会社荏原製作所 |
半導体製造装置、半導体製造装置の故障予知方法、および半導体製造装置の故障予知プログラム
|
|
KR102006357B1
(ko)
*
|
2017-05-10 |
2019-10-08 |
주식회사 유비덤 |
품질개선을 위한 스마트 바스켓 시스템 및 방법
|
|
US11029673B2
(en)
|
2017-06-13 |
2021-06-08 |
Pdf Solutions, Inc. |
Generating robust machine learning predictions for semiconductor manufacturing processes
|
|
US11022642B2
(en)
|
2017-08-25 |
2021-06-01 |
Pdf Solutions, Inc. |
Semiconductor yield prediction
|
|
US10318700B2
(en)
|
2017-09-05 |
2019-06-11 |
International Business Machines Corporation |
Modifying a manufacturing process of integrated circuits based on large scale quality performance prediction and optimization
|
|
KR102489762B1
(ko)
*
|
2017-12-29 |
2023-01-18 |
비컴솔루션 주식회사 |
패턴인식에 의한 공정 이상 감지 시스템 및 그 방법
|
|
US11029359B2
(en)
|
2018-03-09 |
2021-06-08 |
Pdf Solutions, Inc. |
Failure detection and classsification using sensor data and/or measurement data
|
|
US11775714B2
(en)
|
2018-03-09 |
2023-10-03 |
Pdf Solutions, Inc. |
Rational decision-making tool for semiconductor processes
|
|
US10777470B2
(en)
|
2018-03-27 |
2020-09-15 |
Pdf Solutions, Inc. |
Selective inclusion/exclusion of semiconductor chips in accelerated failure tests
|
|
US11669079B2
(en)
*
|
2021-07-12 |
2023-06-06 |
Tokyo Electron Limited |
Tool health monitoring and classifications with virtual metrology and incoming wafer monitoring enhancements
|
|
KR102777239B1
(ko)
*
|
2022-06-03 |
2025-03-05 |
한국핵융합에너지연구원 |
반도체 장비를 통합 관리하기 위한 지능형 시스템
|
|
CN119903430B
(zh)
*
|
2024-12-31 |
2025-12-12 |
民航成都物流技术有限公司 |
故障运维知识图谱结合故障树的复杂产线可靠性分析方法
|