JPH0917937A - Mounting structure of bga type integrated circuit - Google Patents
Mounting structure of bga type integrated circuitInfo
- Publication number
- JPH0917937A JPH0917937A JP16024395A JP16024395A JPH0917937A JP H0917937 A JPH0917937 A JP H0917937A JP 16024395 A JP16024395 A JP 16024395A JP 16024395 A JP16024395 A JP 16024395A JP H0917937 A JPH0917937 A JP H0917937A
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- type integrated
- bga type
- pad
- mounting structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明は、ＢＧＡ（ボールグリ
ッドアレイ）型集積回路の実装構造に関するものであ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a BGA (ball grid array) type integrated circuit mounting structure.
【０００２】[0002]
【従来の技術】図３、図４に示すのは、従来の技術によ
り、ＢＧＡ型集積回路１の電極３を電気回路基板２のパ
ッド４に半田付けしたものである。パッド４と電極３の
間には、ピンを介さずに半田バンプ５を介在させただけ
の接合形態を採っていた。なお、６は、回路を形成する
導体部で、パッド４とつながっている。2. Description of the Related Art FIGS. 3 and 4 show a method in which an electrode 3 of a BGA type integrated circuit 1 is soldered to a pad 4 of an electric circuit board 2 by a conventional technique. Between the pad 4 and the electrode 3, a solder bump 5 is merely interposed without a pin. Reference numeral 6 denotes a conductor portion forming a circuit, which is connected to the pad 4.
【０００３】[0003]
【発明が解決しようとする課題】上記のものにあって
は、パッド４と半田バンプ５、半田バンプ５と電極３と
の接合面積が小さいという欠点があった。The above problems have the drawback that the bonding area between the pad 4 and the solder bump 5 and between the solder bump 5 and the electrode 3 is small.
【０００４】このため、半田バンプ５が熱疲労破壊する
おそれがあった。即ち、電源のオン、オフの際に生ずる
ＢＧＡ型集積回路１と電気回路基板２との熱膨張率の差
のために、パッド４と電極３を接合する半田バンプ５に
過大な応力が繰り返し発生し、半田バンプ５が熱的に疲
労し、最終的には、半田クラックが生じ、導通不良を起
こすといった問題がある。Therefore, the solder bumps 5 may be destroyed by thermal fatigue. That is, due to the difference in the coefficient of thermal expansion between the BGA type integrated circuit 1 and the electric circuit board 2 which occurs when the power is turned on and off, excessive stress is repeatedly generated on the solder bumps 5 that join the pads 4 and the electrodes 3. However, there is a problem that the solder bumps 5 are thermally fatigued, and finally, solder cracks occur and conduction failure occurs.
【０００５】本発明は、上記のような点に鑑みてなされ
たものであり、半田付けの信頼性に優れたＢＧＡ型集積
回路の実装構造及びその製法を提供せんとするものであ
る。The present invention has been made in view of the above points, and an object thereof is to provide a mounting structure of a BGA type integrated circuit excellent in reliability of soldering and a manufacturing method thereof.
【０００６】[0006]
【課題を解決するための手段】この発明の第１は、ＢＧ
Ａ型集積回路１の電極３を電気回路基板２のパッド４に
半田付けしてなるＢＧＡ型集積回路の実装構造におい
て、電気回路基板２に凹部７を設け、この凹部７の表面
にこの表面に沿ったパッド４を形成し、このパッド４と
電極３を半田バンプ５で接合して成ることを特徴とする
ＢＧＡ型集積回路の実装構造である。The first aspect of the present invention is BG.
In the mounting structure of the BGA type integrated circuit in which the electrode 3 of the A type integrated circuit 1 is soldered to the pad 4 of the electric circuit board 2, the electric circuit board 2 is provided with the concave portion 7, and the concave portion 7 is provided on the surface thereof. This is a mounting structure of a BGA type integrated circuit characterized in that a pad 4 is formed along the pad 4, and the pad 4 and the electrode 3 are joined by a solder bump 5.
【０００７】この発明の第２は、上記の発明において、
ＢＧＡ型集積回路１の下面の四隅に脚７を形成して成る
ことを特徴とするものである。A second aspect of the present invention is the above invention,
This is characterized in that legs 7 are formed at the four corners of the lower surface of the BGA type integrated circuit 1.
【０００８】[0008]
【作用】第１の発明によれば、半田バンプ５の略球状の
底部が恰も凹部７に嵌合するがごとくしてパッド４に接
合するので、半田バンプ５のパッド４への接合面積が大
きくなり、かつ、埋め込まれる如く接合されることによ
り、ＢＧＡ型集積回路１と電気回路基板２との接合が強
固である。According to the first aspect of the invention, since the substantially spherical bottom portion of the solder bump 5 is joined to the pad 4 just as if it were fitted into the recess 7, the solder bump 5 has a large joining area to the pad 4. And the bonding is performed so as to be embedded, the bonding between the BGA type integrated circuit 1 and the electric circuit board 2 is strong.
【０００９】第２の発明によれば、周囲の脚８がＢＧＡ
型集積回路１を支持するので、ＢＧＡ型集積回路１の電
気回路基板２上への設置が安定しておこなわれ、接合中
に半田バンプ５が変形を起こすこと等が生じにくく、か
つ、半田バンプ５の凹部７への嵌合量が適切となり、両
者があいまって、ＢＧＡ型集積回路１と電気回路基板２
との接合が極めて強固となる。According to the second invention, the surrounding legs 8 are BGA.
Since the BGA type integrated circuit 1 is supported, the BGA type integrated circuit 1 can be installed on the electric circuit board 2 in a stable manner, and the solder bumps 5 are unlikely to be deformed during the bonding. The amount of fitting of 5 into the concave portion 7 becomes appropriate, and the two fit together, so that the BGA type integrated circuit 1 and the electric circuit board 2
The bond with and becomes extremely strong.
【００１０】[0010]
【実施例】以下、この発明の実施例について説明する。Embodiments of the present invention will be described below.
【００１１】図１は本発明に係るＢＧＡ型集積回路の実
装構造の一実施例を示す。ＢＧＡ型集積回路１は、裏面
に電極３を形成している。FIG. 1 shows an embodiment of a mounting structure of a BGA type integrated circuit according to the present invention. The BGA type integrated circuit 1 has an electrode 3 formed on its back surface.
【００１２】電気回路基板２には、凹部７を設け、この
凹部７の表面にこの表面に沿ったパッド４を形成してい
る。６は、回路を形成する導体部で、パッド４とつなが
っている。A recess 7 is provided in the electric circuit board 2, and a pad 4 is formed on the surface of the recess 7 along the surface. Reference numeral 6 denotes a conductor portion forming a circuit, which is connected to the pad 4.
【００１３】この凹部７は、表面にパッド４を形成した
状態で、略球状の半田バンプ５の底部が恰も嵌合するよ
うな凹球面に形成されている。The concave portion 7 is formed into a concave spherical surface with which the bottom portion of the substantially spherical solder bump 5 fits with the pad 4 formed on the surface.
【００１４】ＢＧＡ型集積回路１は、電気回路基板２
に、パッド４と電極３を半田バンプ５で接合して実装さ
れている。半田バンプ５は、電極３に平面状に接合する
と共に凹部７に嵌合するが如くパッド４に接合してい
る。The BGA type integrated circuit 1 includes an electric circuit board 2
Then, the pad 4 and the electrode 3 are joined by the solder bump 5 and mounted. The solder bumps 5 are joined to the electrodes 3 in a plane and are joined to the pads 4 so as to fit into the recesses 7.
【００１５】図２は本発明に係るＢＧＡ型集積回路の実
装構造の異なる実施例を示す。ＢＧＡ型集積回路１は、
長方形のもので、裏面に電極３を形成し、裏面の四隅に
等しい長さの突起からなる脚８を垂下形成している。FIG. 2 shows another embodiment of the mounting structure of the BGA type integrated circuit according to the present invention. The BGA type integrated circuit 1 is
It is rectangular and has electrodes 3 formed on the back surface thereof, and legs 8 having protrusions of equal length are formed at the four corners of the back surface.
【００１６】電気回路基板２には、凹部７を設け、この
凹部７の表面にこの表面に沿ったパッド４を形成してい
る。６は、回路を形成する導体部で、パッド４とつなが
っている。A recess 7 is provided in the electric circuit board 2, and a pad 4 is formed on the surface of the recess 7 along the surface. Reference numeral 6 denotes a conductor portion forming a circuit, which is connected to the pad 4.
【００１７】ＢＧＡ型集積回路１は、電気回路基板２
に、パッド４と電極３を半田バンプ５で接合して実装さ
れている。半田バンプ５は、電極３に平面状に接合する
と共に凹部７に嵌合するが如くパッド４に接合してい
る。The BGA type integrated circuit 1 includes an electric circuit board 2
Then, the pad 4 and the electrode 3 are joined by the solder bump 5 and mounted. The solder bumps 5 are joined to the electrodes 3 in a plane and are joined to the pads 4 so as to fit into the recesses 7.
【００１８】脚８が、ＢＧＡ型集積回路１を支持してい
るので、各半田バンプ５の大きさ、形状等は安定したも
のとなり、電極３及びパッド４への接合も良好なものと
なっている。Since the leg 8 supports the BGA type integrated circuit 1, the size and shape of each solder bump 5 is stable, and the bonding to the electrode 3 and the pad 4 is also good. There is.
【００１９】[0019]
【発明の効果】第１の発明によれば、半田バンプ５の略
球状の底部が恰も凹部７に嵌合するがごとくしてパッド
４に接合するので、ＢＧＡ型集積回路１と電気回路基板
２との接合が強固である。According to the first aspect of the invention, since the substantially spherical bottom portion of the solder bump 5 is fitted into the recess 7 as if it were fitted to the pad 4, the BGA type integrated circuit 1 and the electric circuit board 2 are joined together. The joint with is strong.
【００２０】第２の発明によれば、周囲の脚８がＢＧＡ
型集積回路１を支持するので、ＢＧＡ型集積回路１の電
気回路基板２上への設置が安定しておこなわれ、かつ、
半田バンプ５の凹部７への嵌合量が適切となり、両者が
あいまって、ＢＧＡ型集積回路１と電気回路基板２との
接合が極めて強固となる。According to the second invention, the surrounding legs 8 are BGA.
Since the type integrated circuit 1 is supported, the BGA type integrated circuit 1 can be stably installed on the electric circuit board 2, and
The amount of fitting of the solder bumps 5 into the recesses 7 becomes appropriate, and when the two are combined, the bonding between the BGA type integrated circuit 1 and the electric circuit board 2 becomes extremely strong.
【図１】本発明の一実施例を示す断面図。FIG. 1 is a sectional view showing an embodiment of the present invention.
【図２】本発明の異なる実施例を示す斜視図。FIG. 2 is a perspective view showing another embodiment of the present invention.
【図３】従来例を示す斜視図。FIG. 3 is a perspective view showing a conventional example.
【図４】同上の断面図。FIG. 4 is a sectional view of the above.
１ ＢＧＡ型集積回路 ２ 電気回路基板 ３ 電極 ４ パッド ５ 半田バンプ ６ 導体部 ７ 凹部 1 BGA Type Integrated Circuit 2 Electric Circuit Board 3 Electrode 4 Pad 5 Solder Bump 6 Conductor 7 Recess
Claims (2)
基板２のパッド４に半田付けしてなるＢＧＡ型集積回路
の実装構造において、電気回路基板２に凹部７を設け、
この凹部７の表面にこの表面に沿ったパッド４を形成
し、このパッド４と電極３を半田バンプ５で接合して成
ることを特徴とするＢＧＡ型集積回路の実装構造。1. A mounting structure of a BGA type integrated circuit in which an electrode 3 of the BGA type integrated circuit 1 is soldered to a pad 4 of an electric circuit substrate 2, a recess 7 is provided in the electric circuit substrate 2,
A mounting structure of a BGA type integrated circuit, characterized in that a pad 4 is formed along the surface of the recess 7 and the pad 4 and the electrode 3 are joined by a solder bump 5.
を形成して成ることを特徴とするＢＧＡ型集積回路の実
装構造。2. Legs 7 are provided at the four corners of the lower surface of the BGA type integrated circuit 1.
A mounting structure for a BGA type integrated circuit, characterized in that
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16024395A JPH0917937A (en) | 1995-06-27 | 1995-06-27 | Mounting structure of bga type integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16024395A JPH0917937A (en) | 1995-06-27 | 1995-06-27 | Mounting structure of bga type integrated circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0917937A true JPH0917937A (en) | 1997-01-17 |
Family
ID=15710803
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16024395A Withdrawn JPH0917937A (en) | 1995-06-27 | 1995-06-27 | Mounting structure of bga type integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0917937A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101006619B1 (en) * | 2008-10-20 | 2011-01-07 | 삼성전기주식회사 | A printed circuit board comprising a round solder bump and a method of manufacturing the same |
| CN111970824A (en) * | 2020-08-21 | 2020-11-20 | 苏州浪潮智能科技有限公司 | PCB and pad structure suitable for BGA chip thereof |
-
1995
- 1995-06-27 JP JP16024395A patent/JPH0917937A/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101006619B1 (en) * | 2008-10-20 | 2011-01-07 | 삼성전기주식회사 | A printed circuit board comprising a round solder bump and a method of manufacturing the same |
| CN111970824A (en) * | 2020-08-21 | 2020-11-20 | 苏州浪潮智能科技有限公司 | PCB and pad structure suitable for BGA chip thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 20020903 |