JPH09174796A - Method and apparatus for sticking film, substrate with film - Google Patents

Abstract

PROBLEM TO BE SOLVED: To stick a film on a substrate continuously at a high speed and to prevent the waste of the film at the beginning of the sticking by a method in which after the film being fixed temporarily to the end of the front substrate transferred continuously, the continuous film is sent to a lamination roll with the substrate. SOLUTION: A lamination roll 32 is driven from a continuous line position to a two-dot chain line position to the end of a film 12 which is fixed temporarily, and the end of the film 12 is pushed to a substrate 26. In this state, an air cylinder 44B for a substrate holding roller is released. The lamination roll 32, which is synchronized with the driving roller 40 of a transfer apparatus for the substrate 26, is rotated to drive the substrate 26 from the left to the right and press-bonds the film 12 on the upper surface of the substrate 26 while rotating. After that, the film 12 from which a cover film 12C is peeled off is press-bonded in sequence at an equal speed on the substrate 26 which is transferred intermittently by the lamination roll 32.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a film sticking method and device for sticking a film on the surface of a substrate for printed wiring and the like, and a substrate with a film.

[0002]

2. Description of the Related Art A photosensitive resin layer is formed on a translucent support film (base film; usually a resin film typified by polyester) in the process of manufacturing a printed wiring board used in electronic devices such as computers. In addition, there is a step of peeling the cover film, which is covered with the cover film, onto the conductive layer on the surface of the printed wiring board. Then, in the subsequent step, the wiring pattern film is overlaid, and the photosensitive resin layer is exposed for a predetermined time through the wiring pattern film and the translucent support film. Next, after peeling the light-transmitting support film, the exposed photosensitive resin layer is developed to form an etching mask pattern, and thereafter, unnecessary portions of the conductive layer are removed by etching, whereby a predetermined portion is formed. A printed wiring board having the wiring pattern is formed.

[0003] The same pattern formation is used for forming a barrier of a liquid crystal cell in a liquid crystal display device and a barrier of a discharge cell in a plasma display panel.

The film sticking device for sticking the laminated film as described above, the continuous film (raw film) loaded in the film supply roll, to the front end of the substrate conveyed by the conveying means, The photosensitive resin layer is guided so as to be on the side of the substrate, and is temporarily attached to the front end of the substrate by a temporary attaching means that can move toward and away from the substrate, and then a lamination roll is used to press the film onto the substrate, It is designed to convey a substrate.

The pressure bonding of the film to the substrate is carried out so that the bonding length becomes a length substantially corresponding to the length of the substrate, and the supply film is provided so that the length of the supply film is the film temporary attaching means itself or a member in the vicinity thereof. It is cut by the film cutting means provided in. The cover film is peeled off before or after the tacking means.

As another film sticking device, the photosensitive resin layer side of the film, in which the cover film has been peeled off in advance, is continuously carried and stuck to the film sticking surface of the substrate which is intermittently carried. After cutting, the film may be cut between adjacent substrates.

[0007]

When the film is cut to a length substantially corresponding to the length of the substrate and is attached to the substrate by the temporary attaching means as described above, the temporary attaching member reciprocates for each substrate. However, there is a problem in that the sticking speed is reduced and the temporary attachment means is frequently reciprocated to cause a failure.

Further, the film is continuously attached to the substrate,
In the case of so-called continuous tensioning, the operation is started with the film peeled off the cover film in advance between the lamination roll and the rolls further downstream from it, and the film is pressure-bonded to the substrate. The film up to the first board of wasted,
There is a problem that it is costly (usually the film tip portion that is discarded is a monetary amount of about 20,000 yen).

The present invention has been made in view of the above-mentioned problems of the prior art. It is possible to continuously apply a film to a substrate at a high speed and to prevent the useless portion of the film at the beginning of the application. Therefore, it is an object of the present invention to provide a film sticking method and device which can reduce the cost.

[0010]

According to the present invention, there is provided a method comprising:
As described above, a continuous film in which a photosensitive resin layer and a cover film are laminated on a support film is pulled out from a film supply roll, the cover film is peeled off, and a substrate is continuously conveyed at a constant interval by a conveying means. The photosensitive resin layer side is located on the film sticking surface side, and is fed in the same direction at the same speed as the substrate, while the film is pressure-bonded to the substrate by the lamination roll, the substrate is conveyed, and the position between the substrates after pressure bonding In the film sticking method, in which the film is cut and separated in the width direction, the tip of the continuous film unwound from the film supply roll is adsorbed to the tip of the temporary attachment member with the cover film peeled off. After temporarily attaching to the leading end of the first substrate of the substrates that are continuously conveyed by the temporary attaching member,
The above-mentioned object is achieved by feeding a continuous film together with a substrate into the lamination roll.

According to a second aspect of the present invention, in the first aspect of the invention, before the continuous film is attached to the substrate, the continuous film is in the vicinity of at least one edge in the conveying direction of the substrate in the attached state. At the position, along the edge, at least a part in the thickness direction of the photosensitive resin layer is removed to form a break line.

According to the invention of claim 3, in the invention of claim 2, before the cover film is peeled off, the film is linearly pressed from the cover film side to flow the photosensitive resin layer to the outside of the line. In this way, the break line is formed.

According to the invention of claim 4, in the invention of claim 3, before the cover film is peeled off, the photosensitive resin layer is cut together with the cover film to form the break line, and then the break line is formed. The cover film is connected by an adhesive tape across the line, and then the cover film is continuously peeled from the photosensitive resin layer.

According to a fifth aspect of the present invention, a continuous film formed by laminating a photosensitive resin layer and a cover film on a support film is pulled out from a film supply roll, the cover film is peeled off, and a conveying means is provided. With the photosensitive resin layer side located on the film sticking surface side of the substrate that is continuously conveyed at a constant interval, the film is fed in the same direction at the same speed as the substrate, and the film is pressure-bonded to the substrate with a lamination roll. While carrying the board and crimping,
In a film sticking device that is configured to cut the film in the width direction at the position between the substrates by a separating cutter, the film is pulled out from the film supply roll, and the leading end portion of the continuous film having the leading end cut and aligned is adsorbed, and At the tip of the substrate conveyed by the conveying means, a tacking member for pressing and temporarily attaching the leading end of the continuous film is provided on the upstream side of the lamination roll, and the conveying means conveys the substrate. The above-mentioned object is achieved by arranging that the first board among them stops at the temporary attachment position by the temporary attachment member.

According to a sixth aspect of the present invention, in the fifth aspect of the invention, the cover film is arranged at a position before being peeled off, and the continuous film is stuck to the substrate in at least one of the conveyance directions of the substrate. The portion that is in the vicinity of the edge of the support film from the cover film side is pressed along a line in the film width direction, and the photosensitive resin layer is caused to flow to the outside of the line in the film width direction. A linear pressing device for removing at least a part in the thickness direction is provided.

According to a seventh aspect of the present invention, in the sixth aspect of the invention, the cover film is arranged at a position before being peeled off, and the continuous film is attached to the substrate in at least one of the conveyance directions of the substrate. A part which is near the edge of the cover film is cut from the cover film side along with the photosensitive resin layer along a line in the film width direction, and the cover film cut by the half cut device. Is provided with a connecting device that is connected by an adhesive tape across the cutting line, and the cover film connected by the adhesive tape is continuously peeled off.

Furthermore, the invention of a substrate with a film is defined in claim 8.
As described above, the substrate, and a photosensitive resin layer is laminated on a support film, the photosensitive resin layer side has a film attached to one surface of the substrate, the film, It has a length protruding from at least one edge of the substrate, and has a break line substantially parallel to the edge at a position near the end, and the break line is in the thickness direction of the photosensitive resin layer. The substrate with a film formed by removing at least a part thereof achieves the above object.

[0018]

Embodiments of the present invention will be described below with reference to the drawings.

First, a schematic structure of the film sticking apparatus 10 according to the present invention will be described with reference to FIG.

The film 12 cut and stuck by the film sticking device 10 is, as shown in FIG. 2, a photosensitive resin layer 12B on a translucent support film 12A.
And a cover film 12C are laminated to form a three-layer structure, which is continuously wound around the supply roll 14.

The film 12 unwound from the supply roll 14 is covered with the film separating member 16 to cover the film 1.
2C is peeled off so that the adhesive surface of the photosensitive resin layer 12B is exposed, and the main vacuum plate 2 forming a part of the temporary attaching member 20 via the tension roll 18 is removed.
2 is supplied. The peeled cover film 12C is configured to be wound by a winding roll 24.

The supply roll 14 and the film separating member 1
6, the tension roll 18, the tacking member 20, the winding roll 24, and the like are provided on the upper side of the substrate transport surface I-I in FIG. 1, and the film 12 is attached to the upper surface of the substrate 26. There is.

As shown in FIG. 3, the main vacuum plate 22 has a large number of suction grooves 2 to which a negative pressure is applied.
2A and a suction hole 22B are provided on the surface so that the cover film 12C can adsorb the peeled film 12 (hereinafter referred to as the film 12 unless otherwise specified), and in the vertical guide rail 28 in the drawing. It is slidably supported and is driven by a driving device 30 such as an air cylinder or a servomotor along the guide rail 28 so as to be close to and away from the film sticking position, that is, the substrate transfer surface I.
It is designed to be able to approach and separate from -I.

Further, a film suction groove (not shown) is formed at the front end of the main vacuum plate 22 on the substrate transfer surface II side, which is continuously curved from the surface of the main vacuum plate 22. The film temporary attachment member main body 21 is connected. A heater (not shown) is embedded in the vicinity of the front end portion 21A of the film tacking member main body 21 in the film feeding direction to heat the front end portion 21A.

The tacking member 20 is used to transfer the substrate I-
Although it is possible to move from the position where its tip comes into contact with the upper surface of the substrate 26 on I to the standby position shown by the solid line in FIG. 1, this standby position and the substrate transfer surface I
-I, a film holding member 34 for leading end winding and a rotary cutter 36 are arranged in this order from the side of the tacking member 20 along the feeding surface of the film 12.

The rotary cutter 36 is unwound from the supply roll 14 and covers the cover film 12C.
The front end of the film 12 peeled off is cut and aligned so that the front end is parallel to the front edge of the substrate 26.

Further, the film winding member 34 for winding the leading end is also provided.
A suction groove and a suction hole (both not shown) to which a negative pressure is applied are provided on the end surface on the film passing surface side of the device, so that the end of the film 12 can be adsorbed to the end surface. The tip end portion of the film 12 cut and aligned by the cutter 36 is adsorbed and pulled rightward in FIG. 1 to be wound around the temporary attachment member main body 21 of the provisional attachment member 20 and the film adsorption at the end portion 21A thereof. The groove allows the tip of the film to be adsorbed to the temporary attachment member main body 21.

The rotary cutter 36 has a substantially straight fixed blade 36A arranged in the width direction of the film 12 in parallel with the film passing surface, and a fixed blade 3 having a rotation center axis.
6A and a rotary blade 36B in which a cutting blade is spirally wound around the outer periphery of a cylindrical member arranged substantially parallel to the fixed blade 36A, and the rotary blade 36B comes into contact with the fixed blade 36A on the film passing surface. By rotating while rotating, the film 12 on the film passing surface is cut in the width direction at that position.

Here, the fixed blade 36A is the rotary blade 36.
It can be moved back and forth in a direction orthogonal to the film passing surface with respect to B, and is wound up from the supply roll 14 and comes into contact with the rotary blade 36B only when the front end of the peeled film 12 of the cover film 12C is aligned. It moves forward, and then comes to a retracted position away from the rotary blade 36B (drive mechanism not shown). In the figure, reference numeral 40 is a driving roller in the substrate transport mechanism, 42 is a driven roller, 44 is a substrate pressing member, and 46 is a substrate front end position detection optical sensor.

The substrate pressing member 44 comprises a substrate pressing roller 44A and a substrate pressing roller air cylinder 44B for moving the substrate pressing roller 44A up and down.

The mutual relationship among the lamination roll 32, the driving roller 40, the substrate pressing member 44 and the substrate front end position detecting optical sensor 46 is as follows.

The substrate leading edge position detecting optical sensor 46 provided in the vicinity of the substrate transporting surface II detects the leading edge of the leading substrate 26 transported from left to right in FIG. The same substrate 2 to the film temporary attachment position
When 6 is conveyed, the rotation of the driving roller 40 is stopped. At the same time, the substrate 26 is
Press the air cylinder 44B for the substrate holding roller.
Thereby, the substrate pressing roller 44A is driven.

The substrate 2 is pressed by the substrate pressing roller 44A.
6 is reliably stopped, and even if the film tacking member main body 21, which is the distal end of the tacking member 20, comes into contact with the substrate 26, the substrate 26 does not move, and the tacking to the film 12 is reliably performed. .

The substrate 26 by the substrate pressing roller 44A
Is carried out until the lamination roll 32 comes into contact with the substrate 26, and in synchronization with the contact timing of the lamination roll 32, the air cylinder 44 for the substrate holding roller 44 is pressed.
B is released.

Reference numeral 48 in FIGS. 1 and 4 indicates a separating cutter. The separating cutter 48 is a rotary cutter, and includes a rotary blade 48A and a fixed blade 48B, and the fixed blade 48B is swingable, and swings downward so as not to interfere with the passage of the substrate 26. Then, when the film is cut, the film 12 is oscillated upward and comes into contact with the rotary blade 48A on the film feeding surface, so that the film 12 is cut between the substrates.

Next, the operation of the film sticking device 10 will be described.

First, the lamination roll 32 is at the retracted position shown by the solid line in FIG. 1, the leading end winding film holding member 34 is at a position where the leading end surface is separated from the film passing surface,
The fixed blade 36A of the rotary cutter 36 is a rotary blade 36B.
The film 12 is pulled out from the supply roller 14, the cover film 12 </ b> C is peeled from the leading end, and the film 12 is wound around the take-up roll 24, and the film 12 is wound around the temporary attaching member 20 and the leading end. Of the rotary film 36 is drawn down along the film passing surface on the left side in the figure, and passes between the fixed blade 36A and the rotary blade 36B of the rotary cutter 36.

Next, a negative pressure is applied to the tacking member 20 to attract the film 12, and the film holding member 34 for winding the leading end is also advanced to the film passing surface position to apply a negative pressure to the film. Adsorb 12

In this state, the fixed blade 36A is moved forward and the rotary blade 36B is rotated to cut the film 12 on the film passing surface, and the leading ends thereof are cut and aligned. The cut film 12 on the tip side of the rotary cutter 36 is discarded. Next, the fixed blade 36A is separated from the rotary blade 36B, and the leading-end wrapping film holding member 34 is moved rightward in FIG. 1 while the leading end of the film 12 is attracted to the leading end surface.

At this time, the tip portion 2 of the temporary attachment member main body 21
A negative pressure is applied to the film suction groove in 1A in advance, and in this state, when the leading end winding film holding member 34 moves to the right in the drawing, the leading end portion of the sucked film 12 is temporarily attached. Tip 2 of member body 21
The film is wound along 1A, sucked by the negative pressure of the film suction groove, and separated from the film-winding holding member 34 for tip winding.

Next, the tip portion 21A of the temporary attachment member main body 21
While the front end of the film 12 is adsorbed on the front end of the film 12, the drive device 30 causes the temporary mounting member 20 to stop along the guide rail 28 and the front end 21A at the temporary mounting position via the front end of the film 12. It is lowered until it comes into contact with the upper surface of the leading end position of the leading substrate 26.

As a result, the leading end of the film 12 is temporarily attached to the upper surface of the leading end of the substrate 26, and then the temporary attaching member 20 including the temporary attaching member main body 21 releases the negative pressure, and the solid line in FIG. It rises to and waits until the next tacking.

The substrate pressing roller 44A is stopped when the leading substrate 26 is stopped and stopped at this temporary mounting position.
The restraint by is as described above.

The lamination roll 32 is driven from the position indicated by the solid line in FIG. 1 to the position indicated by the alternate long and two short dashes line with respect to the front end of the film 12 in the temporarily attached state, and the front end of the film 12 is pressed against the substrate 26. In this state, the substrate holding roller air cylinder 44B is released. Next, the lamination roll 32 is rotated so as to drive the substrate 26 from the left side to the right side in FIG. 1 in synchronization with the driving roller 40 of the transport device for the substrate 26, and the film 12 is rotated on the upper surface of the substrate 26 while rotating. Thermocompression bonding to.

After this, the film 1 with the cover film 12C peeled off from the substrate 26 which is intermittently conveyed.
2 are thermocompression-bonded one after another at a constant speed by the lamination roll 32. The exposed photosensitive resin layer 12
In order to prevent B from adhering to the lamination roll 32, the lamination roll 32 causes the lamination roll 32 to move to the film 1 every time the thermocompression bonding of the film 12 to one substrate 26 is completed.
When the two substrates are separated, the thermocompression bonding operation between the substrates is released, and the next substrate 12 is sent to the position of the lamination roll 32, the thermocompression bonding operation is performed again.

When all of the film 12 on the supply roll 14 is unwound and replaced with a new supply roll 14, the unwinding tip of the film 12 is cut and aligned by the rotary cutter 36 as described above, and then the temporary attachment member. Two
It is temporarily attached to the front end of the first substrate 26 of the next lot by 0.

A plurality of substrates 2 which are intermittently conveyed
6 is a thermocompression-bonded film 1 as shown in FIG.
2 is continuous in the transport direction via 2, but is cut by the separating cutter 48 at a position between the trailing edge of the preceding substrate and the leading edge of the following substrate after the thermocompression bonding process. 26 is separated. The separation cutter 48 is not limited to a rotary cutter, and may be a disc cutter or the like.

The stuck film 12 is in a state of protruding from the end portion in the transport direction of each substrate 26 separated by the separating cutter 48.

In this state, for example, when the substrate 26 is a printed wiring board, a wiring pattern film (not shown) is overlaid on the film 12, and the photosensitive resin layer 12B is passed through the wiring pattern film and the transparent support film 12A.
Is exposed for a predetermined time, and then the translucent support film 12A is peeled off.

At this time, since the film 12 is in a state of protruding from the end portion of the substrate 26, the translucent support film 1
2A can be easily peeled off by grasping the protruding end and pulling.

In the film sticking device 10, the film 12 pulled out from the supply roll 14 is
It is arranged to be cut and aligned by the rotary cutter 36, and then wound around the tip end portion 21A of the temporary attachment member main body 21 by the tip end winding film holding member 34, but the present invention is not limited to this. For example, if the leading edge of the film 12 is preliminarily trimmed at the manufacturing stage, the rotary cutter 36 or the like is unnecessary, and the trimmed leading edge of the film 12 may be manually wound around the temporary attachment member body 21. You may

Further, the cutter for trimming the tips is not limited to the rotary cutter 36, but may be a disc cutter, a guillotine cutter, or the like.

Further, since the supply roll 14 is newly replaced every time the entire film 12 is unwound, the device must be stopped each time, but if the film is supplied by the continuous film supply device, it is not always necessary. It is not necessary to stop the apparatus each time the supply roll is replaced and to temporarily attach the leading end of the film 12 by the temporary attachment member 20.

Further, the film sticking apparatus 10 comprises the substrate 2
Although the film 12 is attached only to the upper surface of 6,
The present invention is not limited to this, and can be naturally applied to the case where the film is attached to the lower surface or the upper and lower surfaces of the substrate 26.

In the film sticking apparatus, after exposing the separated photosensitive resin layer 12B on each substrate 26, the photosensitive resin layer 12B is removed from the substrate 26 when the transparent support film 12A is peeled off. When the adhesive strength is weak, or when the photosensitive resin layer 12B in the portion protruding from the end portion of the substrate 26 is pulled, depending on the pulling angle or speed when peeling the transparent support film 12A, the substrate 2
The photosensitive resin layer 12B thermocompression bonded to 6 may also be continuously peeled off.

FIG. 5 is for preventing the photosensitive resin layer 12B thermocompression-bonded to the substrate 26 from being peeled off when the part of the film 12 thermocompression-bonded to the substrate 26 protruding from the end of the substrate 26 is peeled off. 1 shows the film-coated substrate 50 in which the disconnection line 52 is formed on the photosensitive resin layer 12B.

The substrate with film 50 is formed as follows before the cover film 12C is peeled off based on the method / apparatus shown in FIG. 7 or the method / apparatus shown in FIG.

The method / apparatus shown in FIG. 7 corresponds to the film separating member 16 in the film sticking apparatus 10 shown in FIG.
The film 12 before peeling the cover film 12C is pressed toward the support film 12A from the cover film 12C side while rotating the tip of the disk 54 along a line in the film width direction at an upstream side position of Resin layer 12
B is the cover film 12 and the translucent support film 12A
In between, by flowing to the outside of the line in the film width direction,
A linear pressing device 56 for forming the disconnection line 52 is provided by thinning or removing the photosensitive resin layer 12B along the line in the film width direction.

Reference numeral 56A in FIG. 7 is a pedestal that faces the disk 54 and supports the film 12, and 57 is the disk 54.
1 shows a disk drive device for rolling the film 12 in the width direction of the film 12 while pressing the film 12 by, for example, a rodless cylinder. At least one of the disk 54 and the pedestal 56A may be heated and / or ultrasonic vibration may be applied.

As described above, when the disk 54 is pressed from the cover film 12C side while being driven in the film width direction against the film 12 before peeling the cover film 12C, the photosensitive resin layer 12B inside the cover film 12C is pressed.
Is made of a viscous and soft resin, the cover film 12C is formed by the disc 54,
When it is pushed toward the pedestal 56A on the opposite side and locally deformed, it is pushed to both sides thereof and even after the disc 54 is separated, the photosensitive resin pushed away to the surroundings does not return, A break line 52 as shown in FIG.
Will be left.

From this state, even if the cover film 12C is peeled off by the film separating member 16 and sent between the lamination rolls 32, 32 and thermocompression bonded to the substrate 26, the part of the break line 52 remains.

If the disconnection line 52 is set in advance so as to be located near the edge 26A of the film 12 when the film 12 is attached to the substrate 26, the disconnection line 52 is thermocompression-bonded to the substrate 26 and separated by the cutter 48. When cut, the state shown in FIG. 6 is obtained.

When the film 12 is rolled up in FIG. 6 by holding the portion protruding from the substrate 26, the photosensitive resin layer 12B is broken at the break line 52, so that the photosensitive resin layer 12B is entirely covered by the substrate 26. It won't come off.

Further, the method / apparatus of FIG. 7 only presses the film 12 with the disk 54, so that there is an advantage that chips and the like are not generated.

Next, the method and apparatus shown in FIG. 8 will be described.

In this method, the film 12 is provided at a position upstream of the film separating member 16 in the film sticking device 10 shown in FIG. 1 from the side of the cover film 12C together with the photosensitive resin layer 12B in the film width direction. Half-cutting device 58 for cutting along the line, and the cover film 12C cut by the half-cutting device 58
And a connecting device 62 for connecting with the adhesive tape 60 across the cutting line, and the cover film 12C connected by the adhesive tape 60 is connected to the film separating member 1
6 is used to continuously peel off.

Reference numeral 58A in the drawing is a disc cutter in the half-cutting device 58, 64 is the cutting line position, which is arranged in the film width direction on the transparent support film 12A side, and is covered by the disc cutter 58A.
The cutter stand which supports a film when cutting 2C is shown, respectively.

The cutter table 64 has a large number of suction grooves and suction holes (both not shown) formed on its surface.
Negative pressure causes the film 12 to move to the translucent support film 1
It can be adsorbed and held from the 2A side.

The connecting device 62 is provided between the half-cutting device 58 and the film separating member 16, and a plurality of rows of the adhesive tape 60 are arranged at appropriate intervals in the film width direction according to the width direction size of the film 12. The film 12 is made to adhere in the film feeding direction as the film 12 moves.

The disk cutter 58A of the half-cutting device 58 is arranged at a position where the film 12 can be cut at a position near the edge 26A when the film 12 is thermocompression bonded to the substrate 26.

Therefore, according to the half-cutting device 58, the photosensitive resin layer 12B of the film 12 is completely cut linearly in the film width direction at the position of the disk cutter 58A to form the break line 52. It will be.

Thereafter, the adhesive tape 60 is crossed over the disconnection line 52 by the connecting device 62 and the cover film 12C is formed.
Are connected in the film feeding direction, the separation of the cover film 12C by the film separating member 16 can be performed without any trouble.

According to the method and apparatus of FIG. 8, the photosensitive resin layer 12B is completely removed along the disconnection line 52. Therefore, from the state shown in FIG. It is possible to completely prevent peeling off even the photosensitive resin layer 12B in a state of being stuck to the substrate 26 when peeling off the conductive support film 12A.

The disconnection line 52 may be provided in the vicinity of at least one edge of the substrate 26 in the carrying direction, and as shown in FIG. 6, the disconnection line 52 may be located inward from the edge 26A. It is not limited.

Further, the break line 52 may be provided only on the protruding side when the film protrudes from the substrate 26 only in one of the substrate conveying directions.

In the film 12 protruding from the substrate 26, the photosensitive resin layer 12B having adhesiveness is exposed and adheres to the conveying roller to stain or cut it.
When the photosensitive resin layer 12B is UV curable, it sticks to the nip portion at the time of the nip after separation and is inconvenient to handle. Therefore, when the photosensitive resin layer 12B is UV curable, the protruding portion is pre-cured by the curing device 70 shown in FIG. You may do it.

The curing device 70 includes a UV light source 72 therein and a pair of substantially semi-cylindrical covers 74A and 74B arranged in the film width direction. The pair of covers 74A and 74B allows the film to be formed. The portion corresponding to the protruding portion of 12 is sandwiched from the front and back, and is irradiated with ultraviolet rays before lamination to UV-cure the photosensitive resin layer 12B made of a UV-curable resin so as to reduce the adhesiveness. There is.

The curing device 70 is adapted to obtain an exposure time required for curing while moving in synchronization with the film 12 by a moving means (not shown). Also, the cover 7
4A and 74B are made of a material such as a metal that does not transmit ultraviolet rays, and are made to move between an exposure state in which the tip is in close contact with the film 12 and UV light does not leak and a waiting state in which the UV light is separated. ing.

Also, the film 12 of the covers 74A and 74B
The inner circumference of the side end face in the film feeding direction is made to coincide with the position where the break line 52 is to be formed.

The UV curing timing is particularly convenient before the peeling of the cover film 12C because the tip of the cover 74B does not adhere to the photosensitive resin layer 12B.
It may be after peeling off the cover film 12C.

The substrate 26 is rectangular or square, the front and rear edges in the feed direction are orthogonal to the feed direction, and the break line 52 is parallel to the edge. It is not limited, and may be inclined along the edge of the substrate 26 and outside the pattern formation region of the substrate 26. For example, when the disconnection line 52 is formed while the film 12 is running, a certain degree of inclination occurs depending on the speed of the disk 54 or the disk cutter 58A.

The present invention is naturally applied to the case where the substrate 26 is not rectangular or square. For example, the edge in the feed direction may be an inclined line or an arc line.

[0083]

Since the present invention is constructed as described above, when a film is continuously attached to a substrate which is intermittently conveyed, it must be discarded until the leading end of the film is attached to the leading substrate. It is possible to significantly reduce the amount of film that is not used, and to reduce costs.In addition, the film cut according to the substrate length is stretched compared to the case where it is temporarily attached to each substrate with a temporary attachment member. It has an excellent effect that the application speed can be improved and the load of the device failure, maintenance, etc. can be significantly reduced.

Further, the film-attached substrate according to the present invention is excellent in that even when the translucent support film is peeled off while holding the portion protruding from the substrate, the photosensitive resin layer attached to the substrate is not peeled off. Have the effect.

[Brief description of the drawings]

FIG. 1 is a schematic side view showing a film sticking apparatus according to an embodiment of the present invention.

FIG. 2 is an enlarged sectional view showing a film attached by the film attaching apparatus.

FIG. 3 is an enlarged perspective view showing a temporary attaching member in the film attaching apparatus.

FIG. 4 is a schematic side view showing a film and a cutter for separation, which are continuously thermocompression bonded to a plurality of substrates.

FIG. 5 is an enlarged cross-sectional view showing a part of a substrate with a film attached by the film attaching apparatus and separated by a separating cutter.

FIG. 6 is an enlarged cross-sectional view showing a part of a substrate with a film according to an example of an embodiment of the present invention.

FIG. 7 is a schematic side view showing an apparatus for forming a break line of the film-coated substrate.

FIG. 8 is a schematic side view showing another device for forming a break line.

FIG. 9 is a schematic cross-sectional view showing a device added to the above device to reduce the tackiness of a photosensitive resin layer.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 ... Film sticking apparatus 12 ... Film 12A ... Translucent support film 12B ... Photosensitive resin layer 12C ... Cover film 13 ... Film passing surface 14 ... Supply roll 16 ... Film separating member 20 ... Temporary attaching member 21 ... Temporary attaching member Main body 26 ... Substrate 32 ... Lamination roll 36 ... Rotary cutter 48 ... Separation cutter 50 ... Film substrate 52 ... Break line 56 ... Linear pressing device 58 ... Half cut device 60 ... Adhesive tape 62 ... Connection device II ... Substrate Transport surface

─────────────────────────────────────────────────── ───

[Procedure amendment]

[Submission date] January 8, 1996

[Procedure amendment 1]

[Document name to be amended] Drawing

[Correction target item name] Figure 9

[Correction method] Change

[Correction contents]

FIG. 9

Claims (8)

[Claims] 1. A continuous film obtained by laminating a photosensitive resin layer and a cover film on a support film is pulled out from a film supply roll, and the cover film is peeled off.
The photosensitive resin layer side is positioned on the film sticking surface side of the substrate which is continuously conveyed at a constant interval by the conveying means, and is fed in the same direction at the same speed as the substrate, and the film is applied to the substrate by the lamination roll. While crimping, the substrate is transported, and after crimping, the film is cut in the width direction at the position between the substrates.
In the film sticking method so as to be separated, the tip of the continuous film unwound from the film supply roll is adsorbed to the tip of the tacking member with the cover film peeled off, and the tacking member is used to continuously The film sticking method is characterized in that the continuous film is sent together with the substrate to the lamination roll after being temporarily attached to the front end of the leading substrate of the substrates that are conveyed. 2. The continuous film according to claim 1,
Before being attached to the substrate, at least a part of the photosensitive resin layer in the thickness direction of the photosensitive resin layer is provided along the edge at a position in the vicinity of at least one edge in the conveying direction of the substrate in the state of being attached to the substrate. A film sticking method, characterized in that the film is removed to form a break line. 3. The peeling line according to claim 2, wherein before the cover film is peeled off, the film is linearly pressed from the cover film side to flow the photosensitive resin layer to the outside of the line. A method for attaching a film, which comprises: 4. The adhesive tape according to claim 2, wherein the photosensitive resin layer is cut together with the cover film to form the break line before the cover film is peeled off, and then the break line is crossed. The method of attaching a film, wherein the cover film is connected by the above method, and then the cover film is continuously peeled from the photosensitive resin layer. 5. A continuous film obtained by laminating a photosensitive resin layer and a cover film on a support film is pulled out from a film supply roll, and the cover film is peeled off.
The photosensitive resin layer side is positioned on the film sticking surface side of the substrate which is continuously conveyed at a constant interval by the conveying means, and is fed in the same direction at the same speed as the substrate, and the film is applied to the substrate by the lamination roll. While crimping, convey the substrate, after crimping, in a film sticking device that is configured to cut the film in the width direction at the position between the substrates by a cutter for separation, pulled out from the film supply roll,
While adsorbing the leading end of the continuous film whose ends are cut and aligned, the leading end of the continuous film is pressed and temporarily attached to the leading end of the substrate conveyed by the conveying means on the upstream side of the lamination roll. A film sticking apparatus, wherein a tacking member is provided, and the transporting means is configured to stop a leading substrate of the substrates to be transported at a tacking position by the tacking member. 6. The part according to claim 5, which is arranged at a position before the cover film is peeled off, and which is in the vicinity of at least one edge of the substrate in the carrying direction of the continuous film when the continuous film is attached to the substrate. Is pressed from the cover film side toward the support film along a line in the film width direction, causing the photosensitive resin layer to flow to the outside of the line in the film width direction, and at least one in the thickness direction thereof. A film sticking device comprising a linear pressing device for removing a portion. 7. The part according to claim 5, which is arranged at a position before the cover film is peeled off and which is in the vicinity of at least one edge of the substrate in the carrying direction of the continuous film when the continuous film is attached to the substrate. From the cover film side, a half-cut device that cuts it along the line in the film width direction together with the photosensitive resin layer, and the cover film cut by the half-cut device, across the cutting line. A film sticking device, comprising: a connecting device connected by an adhesive tape; and a cover film connected by the adhesive tape being continuously peeled off. 8. A substrate, and a film in which a photosensitive resin layer is laminated on a support film, and the photosensitive resin layer side is attached to one surface of the substrate, the film comprising: , A length extending from at least one edge of the substrate, and having a break line substantially parallel to the edge at a position near the end, and the break line is the thickness of the photosensitive resin layer. A substrate with a film formed by removing at least a part in the vertical direction.