JPH09129526A - Substrate processor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To save the installation space of this device by arranging a substrate surface processor unit, a bake unit and a down flow feeder in the vertical direction. SOLUTION: In this substrate processor, a spin coater 2, a bake unit 3 and a down flow feeder 5 are arranged in the vertical direction. The down flow feeder 5 is composed of an outside air leading part 51 self-containing a blower 54 on the upper part of the bake unit 3, an air buffer 52 and an air filter 6 on the ceiling part of the spin coater 2 as well as a piping part 53 communicating the outside air leading part 51 with the buffer 52. The piping part 53 made of duct only is arranged so as to creep in the gap between adjacent bake unit 3. In such a constitution, the gap dimension may be decided if only the width shape of the duct is taken into consideration sufficing the small gap dimension thereby enabling the dimension in the width direction to be minimized.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate processing apparatus adapted to supply clean air (local downflow) to a plurality of processing units applied to a manufacturing process of liquid crystal display substrates, semiconductor substrates and the like. Is.

[0002]

2. Description of the Related Art As a substrate processing apparatus applied to a manufacturing process of a liquid crystal display substrate or a semiconductor substrate, for example, each substrate surface processing unit such as a substrate cleaning section, a resist coating section and a developing section, and a step subsequent to the surface processing Bake unit (hot plate or cool plate) is used.
These processing units are arranged in consideration of basic processing steps, and a substrate transfer robot having two hands travels between them to sequentially feed and discharge the substrates one by one. Required processing is executed.

Further, in the above-described substrate processing apparatus, it is premised that the environment for processing a substrate is to operate in a clean room free from dust and the like. In general, a clean room is required to have a high level of cleanliness, and therefore the equipment cost and the maintenance cost increase in proportion to the volume.
Therefore, the volume of the clean room is designed to be the minimum necessary, and the substrate processing apparatus installed in the clean room has been devised in various ways to minimize the equipment space (Japanese Patent Laid-Open No. 6-338555). Issue).
FIG. 8 is a side view showing the configuration of a conventional substrate processing apparatus. Clean air (downflow RF) is supplied from above the building into the clean room, and further floating particles and the like are prevented from adhering to the substrate again. The substrate processing apparatus itself is also configured to positively utilize the downflow.

In FIG. 8, a substrate processing apparatus 200 is provided with a spin coater (resist coating section) 210 and a bake unit 220 having a hot plate and a cool plate stacked on top of the spin coater 210. It has a basic configuration in which a pair of transfer robots 230 for transferring substrates to and from the coater 210 and the bake unit 220 are arranged. The bake unit 220 is an upper part of the spin coater 210 and is arranged as close to the front side as possible, and a space is secured at the rear part thereof, and a downflow supply part 240 having a fan (not shown) and the like built therein is provided at this position. Is provided. The downflow supply unit 240 takes in the downflow RF and positively supplies a local clean air flow (downflow F) to the inside of the apparatus. The downflow RF is supplied from the ceiling of the substrate surface processing apparatus 210 by an internal fan. Of the spin coater 210 through a pipe (not shown) and the air filter 250.
I am trying to supply from above.

Further, in the conventional substrate processing apparatus 300 shown in the side view of FIG. 9, a plurality of substrate surface processing units 310 such as spin coaters are arranged side by side in the depth direction of the drawing (horizontal direction of the apparatus), and the upper portion thereof. In addition, a predetermined number of bake units 320 each including a hot plate and a cool plate are arranged side by side, and a substrate transfer robot 330 is arranged on the front side of them. And the bake unit 32
In 0, each plate is constructed so that it can be pulled out rearward (shown by an imaginary line) so that maintenance processing can be performed. In the configuration shown in FIG. 9, adjacent bake units 320 are arranged next to each other at a predetermined interval, and the downflow supply unit is introduced into the gap to guide the substrate surface processing unit 310 upward. In other words, the bake unit and the downflow supply unit are arranged alternately in the width direction.

[0006]

In the substrate processing apparatus shown in FIG. 8, since the downflow supply section 240 is provided in parallel on the rear side of the bake unit 220, even if the substrate surface processing unit can be downsized, The total length of the bake unit 220 and the downflow supply unit 240 in the front-rear direction is increased, and the floor area is increased.

Further, in the substrate processing apparatus shown in FIG. 9, since the downflow supply section and the bake unit 320 are alternately arranged in the width direction, the length in the left-right direction becomes large, and the floor area also becomes large. Will increase.

In view of such circumstances, it is an object of the present invention to provide a substrate processing apparatus which reduces the installation space of the apparatus by devising the arrangement of the downflow supply section.

[0009]

The present invention comprises a substrate surface treatment unit, and one or more bake units mounted in parallel on the upper portion of the substrate surface treatment unit,
In a substrate processing apparatus having a moving space for substrate transfer means for transferring a substrate to and from each unit on the front side of both units, a downflow supply unit for blowing clean air from above to the substrate surface processing unit. The downflow supply unit is provided on the upper surface side of an external air introduction unit provided at the upper portion of the bake unit and a planar air filter arranged so as to face downward from the ceiling of the substrate surface treatment unit. An air buffer having a space dimension having a height dimension of at least one side surface side of the bake unit, and a pipe section communicating the outside air introduction section and the air buffer, and the outside air It is composed of a blower forcibly blowing air toward the air buffer.

According to this structure, the substrate surface treatment unit, the bake unit, and the outside air introduction section are arranged in the vertical direction, and two or more bake units are arranged in parallel on one side surface or both side surfaces of the bake unit. In the case where it is installed, at least by separating the bake units by a dimension that allows the piping to crawl,
It is possible to obtain an apparatus having a floor area excluding the space for disposing the downflow supply unit containing the blower in the conventional apparatus. Further, only the piping portion for supplying the downflow is made to crawl on the side surface portion of the bake unit, and the blower cross section of the piping portion has a required small size in relation to the blowing ability of the blower. Furthermore, since the rear surface side of the bake unit is in an open state, it can be pulled out and the maintenance process is easy.

Further, since the air buffer and the air filter are provided so that the air is uniformly diffused and discharged to the lower surface side, uniform air is supplied over the entire substrate surface processing unit below the air filter. . Particularly, when the substrate surface treatment unit is a spin coater or the like, an effective uniform air flow can be obtained.

Further, according to the second aspect of the present invention, since the blower is provided inside the outside air introducing portion, no other unit or the like is mounted on the upper portion of the outside air introducing portion. A blower with the required size and blowing capacity is built in, and the downflow in the building is effectively sucked.

According to the third aspect of the invention, since the outside air introducing section is provided with a temperature changing means for changing the temperature of the sucked outside air, the temperature can be reduced to a temperature suitable for the substrate surface treatment. The flow is supplied to the substrate surface processing unit.

According to a fourth aspect of the present invention, in the substrate processing apparatus according to the third aspect, a temperature sensor is provided inside the substrate surface processing unit, and the temperature varying means sets the detected temperature to a set value. Since the feedback control is performed so that the temperature of the downflow supplied to the substrate surface processing unit is always maintained at a predetermined temperature.

According to a fifth aspect of the present invention, the substrate surface treatment unit is mounted on the substrate surface treatment unit such that the front surface is behind the front surface of the substrate surface treatment unit by a predetermined dimension. Further, one or two or more bake units arranged side by side, and a downflow supply unit for blowing clean air from above to the substrate surface treatment unit are provided, and the front side of both units is provided with a substrate between them. In the substrate processing apparatus having a moving space for the substrate transfer means for delivering and receiving, the downflow supply unit includes:
An outside air introduction portion provided on the upper portion of the bake unit,
An air buffer formed in a space with a predetermined height dimension on the upper surface side of a planar air filter arranged so as to face downward from the ceiling of the substrate surface processing unit, and the predetermined surface on the front surface of the bake unit. A piping portion that has a thickness of a dimension and is provided via a position that does not interfere with the substrate transfer space and that communicates the outside air introducing portion with the upper surface of the air buffer, and forces the outside air toward the air buffer. An air blower that blows air is provided, and the piping section has a duct provided on at least one of the left and right sides of the substrate transfer space of the bake unit.

According to this structure, the substrate surface treatment unit, the bake unit, and the outside air introduction section are arranged in the vertical direction, and the bake unit is moved as rearward as possible to form a space on the front side. One side surface or both side surfaces of the bake unit is crawled through a position where it does not interfere with the substrate transfer space in the part, and when two or more bake units are arranged side by side, By arranging the pipe part between the above-mentioned substrate transfer spaces, in particular, in the case of two or more bake units, the bake units are arranged side by side in contact with each other. An apparatus having a floor area excluding the installation space of the downflow supply unit can be obtained. Further, only the piping portion for supplying the downflow is made to crawl on the side surface portion of the bake unit, and the blower cross section of the piping portion has a required small size in relation to the blowing ability of the blower. Further, since the rear surface side of the bake unit is in an open state, it can be pulled out and the ease of maintenance processing is ensured.

According to a sixth aspect of the present invention, three bake units are arranged in the left-right direction, and a pair of the ducts is provided on both sides of the central bake unit. Since all the piping parts are crawled in the space, the amount of downflow air can be increased as much as possible.

[0018]

1 is a side view illustrating a first embodiment of a substrate processing apparatus according to the present invention, and FIG. 2 is a perspective view thereof.

The substrate processing apparatus is for manufacturing a liquid crystal display substrate or a semiconductor substrate, and is associated with a plurality of processing steps, for example, substrate surface processing units such as a spin scrubber, a spin coater and a spin developer, and such surface processing. A bake unit (hot plate or cool plate) that is applied after that is used, and each of these units is systematically arranged in consideration of basic processing steps. Then, a transfer robot having two hands travels between them and sequentially supplies and discharges the substrates one by one, thereby performing the substrate processing according to the required procedure.

FIG. 1 shows a part of a substrate processing apparatus as a system. In FIG. 1, 2 is a spin coater (substrate surface treatment unit), and a bake unit 3 is arranged above the spin coater 2. The substrates B are provided on the front side thereof between the conveyance of the substrates B and each processing unit.
A substrate transfer robot 4 that supplies and discharges the substrate is disposed. Further, another unit such as a spin scrubber (rotary substrate cleaning unit) is disposed in the depth direction of the paper surface of FIG. 1 (hereinafter, referred to as a left-right direction).

The substrate processing apparatus 1 further comprises a downflow supply section 5, and an outside air introduction section 51 for taking downflow RF in the building into the apparatus is provided above the bake unit 3. In addition, an air buffer 52 is formed on the ceiling of the spin coater 2 below the bake unit 3. Thus, the substrate processing apparatus 1 has a basic structure in which the spin coater 2, the bake unit 3, and the downflow supply unit 5 are arranged in the vertical direction.

The spin coater 2 is open at the top and the front, and each member is provided in the lower half. That is, the lower half is surrounded by an annular hood 21,
A turntable 2 on which a substrate B is placed so that it can be raised and lowered.
2 and an adsorption means having an adsorption port 23 for adsorbing the substrate B on the turntable 22. A lower portion of a chemical liquid drop of resist liquid or the like (not shown) can be evacuated on the rotation center when the substrate is fed and ejected. It has a basic configuration arranged as described above. By rotating the rotary table 22 at a predetermined speed and utilizing the centrifugal force, the substrate B adsorbed and mounted on the rotary table 22 is made to have a uniform thin film on the surface of the substrate B by the resist solution dropped from the lower portion of the drug droplet. To form. The substrate B processed by the bake unit 3 is loaded into the spin coater 2 by the substrate transport robot 4.

The bake unit 3 has a structure in which boxes each having an open upper surface are mounted in two stages. A hot plate portion 31 utilizing electric heat or the like is provided in the upper stage, and heat of the substrate is transferred to the lower stage. A cool plate portion 32 that absorbs heat is provided. The bake unit 3 is for heating and drying the substrate B cleaned by a spin scrubber (not shown) which is a previous step, and for cooling it to room temperature.
In addition, as shown in FIG.
Supply / discharge windows 31a and 32a, respectively.
Is formed, and the box body suppresses the heat generated inside from being dissipated to the outside as much as possible. In addition, as shown in FIG. 2, a plurality of bake units 3 are arranged side by side in the left-right direction, and each bake unit 3 is arranged at a required interval, as will be described later.

A required space is prepared in front of the spin coater 2 and the bake unit 3, and a substrate transfer robot 4 is installed therein. Substrate transfer robot 4
Is a support wall 4 which is upright on the mount 1a and extends in the left-right direction.
0 is provided on the upper end of the guide rail 40a and three board transfer mechanism parts 41, 42, 43 movable along the guide rail 40a. The board transfer mechanism parts 41, 42, 43 are arranged in the left-right direction. It is designed to move synchronously.

The structure of each substrate transfer mechanism part will be briefly described. All of them have the same structure and are composed of a SCARA robot type arm part 44 and a hollow housing 45 at the tip thereof. The arm portion 44 has two bending and extending type connecting arms, and can be vertically moved by driving a motor (not shown) while keeping the hollow housing 45 at the tip in a horizontal posture. In addition, as shown in FIG. 2 in the inside of the hollow housing 45, a substrate advancing / retreating mechanism section having two arms 451 and 452 of a SCARA robot that are flexibly connected and a hand 453 at the tip thereof. Are stored so that they can appear and disappear. Two substrate advancing / retreating mechanisms are provided in the hollow housing 45 side by side in the vertical direction, and one of them functions alternately for carrying out a substrate and the other for carrying in a substrate. Further, the hand 453 at the tip of the substrate advancing / retreating mechanism portion has a pair of supporting arms branched into two forks, and the substrate B is placed on the supporting arms. Then, the hand 453 on which the substrate B is supported while being supported by its both edges is driven by a motor (not shown) to
By bending and stretching the arms 451 and 452 of the book, the hand 453 can be moved in or out of the supply / discharge window 32a of the cool plate portion 32 as shown in FIG. 2 while maintaining the posture in which the hand 453 is directed. There is.

It should be noted that the three substrate transfer mechanism parts share the supply and discharge of the substrates with respect to the respective processing units not shown in the figure. For example, the substrate transfer mechanism part 42. The bake unit 3, the substrate transfer mechanism unit 43 are in charge of the spin coater 2, and the substrate transfer mechanism unit 41 is in charge of another processing unit (not shown). These points are not particularly important and will not be described in detail.

Next, the structure of the downflow supply unit 5 will be described. The downflow supply unit 5 includes an upper outside air introduction unit 51, an air buffer unit 52, and a piping unit 53 that connects them, and the outside air introduction unit 51 has a blower 54 built therein. The outside air introduction part 51 is a rectangular parallelepiped hollow housing having a surface shape over the entire upper surface of the bake unit 3 and having a required height, and an opening 511 is formed in approximately the rear half of the upper surface. The downflow RF from is effectively guided inside. An opening 51 is provided in the housing of the outside air introducing portion 51.
Two blowers 54 are provided on the front side of the front edge of No. 1 and are arranged side by side toward the front. The blower 54 has a horizontal cylindrical frame body 541 having a required thickness, a blower opening 542 opened tangentially to the cylinder of the frame body 541, and a large number of suction holes 543 for sucking air on both side surfaces of the cylinder. In addition to the above configuration, a large number of blades (not shown) radially provided around the central axis are rotated at high speed by a motor (not shown). Then, due to the rotation of the blades, the air sucked from the suction holes 543 on both sides is vigorously blown out from the blower port 542, so that the local downflow F1 of the required flow rate can be obtained from the downflow RF of the building. There is.

The air buffer 52 is formed in the lower portion of the bake unit 3, that is, in the ceiling portion of the spin coater 2 with a space having a required height, and the planar air filter 6 is provided in the lower portion of this space. It is stretched horizontally across the entire area. The air buffer 52 is configured so that the air is spread over the entire upper surface of the air filter 6 as much as possible. The air filter 6 has a required thickness, for example, a thickness of several tens of millimeters, and is made of a non-woven fabric, a laminate of mesh-like bodies,
Alternatively, a porous material can be used. By having such a composition structure, it is possible to exert both functions of cleaning and diffusion of air.

The piping portion 53 connects the outside air introducing portion 51 and the air buffer 52 (that is, the upper surface of the air filter 6), and has a quadrangular shape downward from a proper position on the front side of the bottom surface portion of the housing of the outside air introducing portion 51. Two ducts are extended. The duct of the pipe portion 53 is arranged in a gap between the plurality of bake units 3 arranged in parallel, and has a cross-sectional shape having a gap dimension and a required thickness in the front-rear direction. The blower 54 has a blowing capacity that opposes such a cross-sectional shape to obtain a suitable air volume. The lower end of the pipe portion 53 faces the inner space of the air buffer 52.
In this way, since each bake unit 3 is arranged with a gap between the adjacent bake units 3 and only the duct of the pipe portion 53 is made to crawl into this gap, a blower is provided in the gap as in the conventional case (FIG. 9). The width dimension in the left-right direction can be suppressed as much as possible, and the floor area can be correspondingly reduced, as compared with the case where the downflow supply units that are provided are individually arranged. This can reduce equipment costs and maintenance costs for downflow.

The operation of the downflow supply section 53 will be described. When the blower 54 is operated and the blades start to rotate, the suction holes 543 on both sides generate a suction force from the outside to the inside. Therefore, the opening 511 of the outside air introduction portion 51
To forcibly start sucking downflow RF (indicated by an outlined arrow), a part of this downflow RF is sucked inward from the suction hole 543, and is blown out vigorously from the air outlet 542 (indicated by an arrow). ), And is supplied to the piping part 53. The air guided to the pipe portion 53 is sent downward in the duct, and then spreads over the whole area in the horizontal direction in the air buffer 52, passes through the air filter 6, and is directed downward from above the spin coater 2. Form a stream. As a result, a local downflow F1 having a required flow rate can be obtained from the downflow RF of the building. Since the air filter 6 has a diffusion mechanism, the air flow passing through the air filter 6 becomes a uniform air flow over the front surface. As a result,
Since the turbulence of the air flow can be suppressed as much as possible, the spin coater 2
The resist solution coating process can be suitably performed.

An air filter 6a is also provided on the ceiling above the substrate transfer robot 4 to supply the downflow F2 to the substrate transfer robot 4 when the substrate transfer robot 4 is operated. The dust generated in the air is forcibly blown downward so as not to be blown into the spin coater 2 or the bake unit 3 side.

FIG. 3 shows a second substrate processing apparatus according to the present invention.
It is a side view explaining an embodiment. In the second embodiment, temperature changing means 7 is added to the first embodiment shown in FIG.

The temperature varying means 7 comprises a radiator 71, a temperature adjusting means 72 for changing the temperature of the radiator 71, and a temperature sensor 73 for measuring the temperature of the downflow F1 above the spin coater 2. The reason for providing the temperature varying means 7 is that although there is a preferable temperature condition for the coating process of the resist solution, this preferable temperature does not always match the air temperature of the downflow RF supplied from the building. The temperature of downflow RF changes due to seasonal factors such as the season, and downflow F1
Is supplied via the immediate vicinity of the bake unit 3, which is a heating element, so that the temperature on the spin coater 2 is slightly increased.

The radiator 71 is constructed by laying one pipe in a meandering shape immediately inside the opening 511 of the outside air introducing portion 51,
Both ends of the chiller 75 for circulation of waste heat are circulated through the pump 74 provided outside the building to circulate the water inside.

The temperature sensor 73 is attached to an appropriate place of the spin coater 2, for example, the lower surface of the air filter 6, measures the temperature of the air flow supplied at this position, and inputs the temperature measurement result to the temperature adjusting means 72. The temperature adjusting means 72 compares the input temperature information with a preset temperature, and outputs a temperature increase instruction signal when the measured temperature is lower, and outputs a temperature decrease instruction signal when the measured temperature is lower. . When the temperature increase instruction signal or the temperature decrease instruction signal is output,
The driving force of the pump 74 is changed, and the circulation speed of water and the rotation speed of the fan of the waste heat chiller 75 are changed. For example, when the temperature of the downflow F1 exceeds the set temperature, the circulation speed of water is increased, and the rotation speed of the fan of the waste heat chiller 75 is increased to increase the heat absorption efficiency from the downflow F1. Thus, the temperature of the airflow can be lowered.

When the downflow RF is basically lower than the optimum temperature of the spin coater 2, the radiator 7
Instead of the heat absorption by No. 1, the temperature can be similarly adjusted by disposing a heater. If such a configuration is adopted, there is an advantage that the pump 74 and the waste heat chiller 75 are not required and the configuration can be simplified.

FIG. 4 shows a third substrate processing apparatus according to the present invention.
It is a side view explaining an embodiment. The third embodiment is provided with the blowing unit 8 separately installed, and is particularly effective when the downflow RF is not generated in the building.

The blower means 8 has a blower 81 and a temperature adjusting means 82 inside, and communicates the blower opening of the blower 81 and the outside air introduction part 51, for example, a bellows-shaped duct 8
3 and 3. An opening (not shown) is formed at an appropriate place in the housing of the blower means 8, preferably at the top,
Air is sucked from here and supplied to the outside air introduction part 51 through the duct 83 by the blower 81. The temperature measurement result from the temperature sensor 84 attached to the lower surface of the air filter 6 is utilized inside so that the air adjusted to an appropriate temperature by the radiator (or heater) 85 can be supplied to the duct.

In the present embodiment, even when the downflow RF of the building exists, for example, the temperature of the downflow RF and the suitable temperature required for the substrate surface treatment in the present apparatus 1 are too different. It can be used.

FIG. 5 shows a fourth substrate processing apparatus according to the present invention.
It is a side view explaining an embodiment. The fourth embodiment has the same configuration as the second embodiment shown in FIG.
The position of the blower 54 is different.

That is, the blower 54 is the bake unit 3
Is provided inside the air buffer 52 on the lower part of the spin coater 2, that is, on the other hand, only the radiator 71 is laid in the outside air introduction part 51, and the height dimension is reduced by the amount of the blower 54 removed. ing. Even with this configuration, the blower 54 can forcibly suck the downflow RF of the building through the opening 511, and the spin coater 2
It is possible to supply an appropriate temperature and an appropriate amount of air.

The substrate transfer robot 4 has the first to first
The difference from the third embodiment is that the spin coater 2
This is because the height dimension of the air buffer 52 is increased due to the fact that the blower 54 is interposed between the bake unit 3 and the bake unit 3, and in terms of the substrate transfer function, the substrate transfer robot 4 and the substrate transfer robot 4 in the above embodiment are functionally functional. There is no difference. The substrate transfer robot 14 has parallel guide rails 140a laid in the left-right direction on the pedestal 1a, so that the two substrate transfer mechanism parts 141, 142 perform the horizontal movement and the substrate transfer operation. Has become.

FIG. 6 shows a fifth example of the substrate processing apparatus according to the present invention.
FIG. 7 is a perspective view showing a side view for explaining the embodiment.

In the fourth embodiment, the bake unit 13 is used.
Is mounted at a position behind the front surface of the spin coater 2 by a predetermined dimension, and the pipe portion 153 is connected to the bake unit 13.
It is arranged in an open space in front of the.

The bake unit 13 can be formed to be shorter than the spin coater 2 in the front-rear direction and the width direction. That is, the bake unit 13 only needs to have a structure for mounting the substrate B on the plate, and does not require the peripheral structure such as the substrate rotation / elevation mechanism, the peripheral annular hood, and the resist solution coating section like the spin coater 2. The size can be reduced, and when the substrate B has a rectangular shape, the size can be further reduced by the difference between the length of one side and the length of the diagonal line.

As shown in FIG. 7, in this embodiment, three bake units 13 are arranged in parallel on top of the two spin coaters 2 arranged in parallel, so that the dimension in the width direction is one set of spins. It is substantially the same as the width dimension of the coater 2. on the other hand,
In the front-back direction, the bake unit 13 is short by a predetermined dimension,
Therefore, a space is provided on the front side of the bake unit 13.

The downflow supply unit 15 is the outside air introduction unit 1
51, an air buffer 152, and an air filter 16, which have the same structure as the outside air introducing portion 51, the air buffer 52, and the air filter 6 of the first embodiment. On the other hand, the piping part 153 has the following structure. The pipe portion 153 is composed of two ducts each having a rectangular cross section, and is arranged in front of the bake unit 13. In addition, the thickness of the duct constituting the pipe portion 153 is made equal to the dimension shortened in the front-rear direction described above, and the pipe portion 153 is
By making the front surface of the substrate and the front surface of the spin coater 2 flush with each other, the movement space of the substrate transfer robot 4 is suitably secured. Further, the arrangement position is a position excluding the front of the supply / discharge windows 131a and 132a of the bake unit 13, that is, a position where the hand 453 of the substrate transfer robot 4 does not interfere with the space when the substrate B is transferred. The outside air introducing portion 151 and the air filter 152, that is, the upper surface of the air filter 16 are communicated with each other via.

By thus disposing the piping portion 153 on the front surface portion of the bake unit 13, the adjacent bake units 13 can be arranged in close contact with each other.
As a result, the dimension in the width direction can be shortened and the floor area can be reduced as much as possible.

The present invention can adopt the following modified embodiments. (1) In the description of the first to fourth embodiments, the pipe portion 5
Although the dimension in the front-back direction of 3 is not particularly described, the dimension may be substantially equal to the front half of the bake unit 3, and
The size may be the same as the size of the bake unit 3 in the front-rear direction. In the latter case, there is an advantage that a high blowing capacity can be obtained. (2) The cross-sectional shape of the pipe portion 53 (153) is not limited to a quadrangle, but may be a circle, but a quadrangle has the advantage of the highest efficiency in terms of securing the flow rate. (3) In the fifth embodiment, the bake unit 1 at the center
Although the pipe portion 153 is provided only on both sides of the bake unit 3, it may be provided outside the supply / discharge windows 131a (132a) of the bake units 13 on both sides. Even in this case, the widthwise dimension of the device can be made smaller (1/2 of the widthwise dimension of the piping portion 153) as compared with the case where it is provided on the outer side surface of the bake unit 13 itself. (4) Although the spin coater 2 is described as an example of the lower unit in the above-described embodiment, the lower unit is a spin scrubber or a spinner as long as it is a processing unit that performs processing on the substrate surface that requires local downflow. It may be a developer or the like.

[0050]

According to the present invention, the downflow supply unit for blowing clean air from above to the substrate surface processing unit,
A space having a predetermined height dimension is formed on the upper surface side of the outside air introduction portion provided on the upper portion of the bake unit and the planar air filter arranged so as to face downward from the ceiling of the substrate surface treatment unit. And an air buffer, a pipe portion provided via at least one side surface side of the bake unit, for communicating the outside air introduction portion and the upper surface of the air buffer, and a blower for forcedly blowing the outside air toward the air buffer. Since the substrate surface treatment unit, the bake unit, and the outside air introduction section can be arranged in the vertical direction, and two or more bake units are arranged in parallel on one side surface or both side surfaces of the bake unit. In addition, it is sufficient to separate at least the dimension for allowing the piping portion to crawl between the bake units. As a result, in the conventional device, a fan with a built-in blower is incorporated. Min excluding space for the Nfuro supply portion, it is possible to obtain a device of smaller floor space.
Also, since the rear side of the bake unit is configured to be open, the bake unit can be pulled out backwards,
Easy maintenance process can be secured. Further, since the air buffer and the air filter are provided, the air can be uniformly diffused and discharged to the lower surface side over the entire substrate surface treatment unit, and a uniform downflow can be supplied. Particularly, when the substrate surface treatment unit is a spin coater or the like, an effective uniform air flow can be obtained.

According to the second aspect of the invention, since the blower is provided inside the outside air introducing portion, a blower having a required size and a blowing capacity can be built in, and downflow in the building can be prevented. Can be used effectively.

According to the third aspect of the invention, since the outside air introducing section is provided with a temperature varying means for changing the temperature of the sucked outside air, the temperature suitable for the substrate surface treatment is obtained. Can be supplied to the substrate surface processing unit.

According to the fourth aspect of the invention, a temperature sensor is provided inside the substrate surface processing unit, and the temperature varying means is feedback-controlled so that the detected temperature becomes a set value. With this configuration, the temperature of the downflow supplied to the substrate surface processing unit can always be stably maintained at a predetermined temperature.

According to a fifth aspect of the present invention, one or two units mounted on the upper surface of the substrate surface processing unit so that the front surface is behind the front surface of the substrate surface processing unit by a predetermined dimension. In contrast to the above-described preparatory configuration including the bake units, the downflow supply unit has the thickness of the predetermined dimension on the front surface of the bake unit, and the outside air passes through a position that does not interfere with the substrate transfer space. Since a piping portion that connects the introduction portion and the upper surface of the air buffer is provided, and this piping portion is a duct provided on at least one of the left and right sides of the substrate transfer space of the bake unit, the substrate surface treatment unit, the bake unit The unit and the outside air introduction part can be arranged vertically, and the bake unit can be moved as rearward as possible to create a space on the front side.
Substrates that are adjacent to each other when one side surface or both side surfaces of the bake unit are crawled through a position that does not interfere with the substrate transfer space in this space portion, and when two or more bake units are juxtaposed. By arranging the piping part between the delivery spaces, especially in the case of two or more bake units, the bake units can be arranged side by side, and the downflow supply part of the conventional device that has a blower built-in can be installed. It is possible to obtain a device having a smaller floor area, which eliminates the installation space. Further, since the rear surface side of the bake unit is configured to be open, the bake unit can be pulled out backward, and easy maintenance processing can be secured.

According to the sixth aspect of the invention, three bake units are arranged in the left-right direction, and a pair of the ducts is provided on both sides of the central bake unit.
Since the pipe portion is made to crawl all over the space between the substrate transfer spaces that are adjacent to each other, the substrate transfer can be ensured and the amount of downflow air can be increased as much as possible.

[Brief description of the drawings]

FIG. 1 is a side view illustrating a first embodiment of a substrate processing apparatus according to the present invention.

FIG. 2 is a perspective view showing a main part of the device shown in FIG.

FIG. 3 is a side view illustrating a second embodiment of the substrate processing apparatus according to the present invention.

FIG. 4 is a side view illustrating a third embodiment of the substrate processing apparatus according to the present invention.

FIG. 5 is a side view illustrating a fourth embodiment of the substrate processing apparatus according to the present invention.

FIG. 6 is a side view illustrating a fifth embodiment of the substrate processing apparatus according to the present invention.

7 is a perspective view showing a main part of the device shown in FIG. 7. FIG.

FIG. 8 is a side view showing a configuration of a conventional substrate processing apparatus.

FIG. 9 is a side view showing another configuration of the conventional substrate processing apparatus.

[Explanation of symbols]

1 Substrate processing device 2 Spin coater 3,13 Bake unit 31,131 Hot plate 32,132 Cool plate 31a, 32a, 131a, 132a Feeding / discharging window 4,14 Transfer robot 453 Hand 5,15 Downflow supply part 51,151 Outside air Introducing section 511, 1511 Opening 52, 152 Spin coater (substrate surface processing unit) 53, 153 Piping section 54, 154, 81 Blower 6,16 Air filter 7 Temperature varying means 71,85 Radiator 72,82 Temperature adjusting means 73,84 Temperature sensor 8 Blower means 83 Duct RF Downflow F1, F2 Local downflow B Substrate

Claims (6)

[Claims] 1. A substrate surface treatment unit, and one or more bake units mounted side by side above the substrate surface treatment unit. The bake unit is mounted on the front side of both units. In a substrate processing apparatus having a moving space for a substrate transfer means for transferring substrates, a downflow supply unit for blowing clean air from above is provided in the substrate surface processing unit, and the downflow supply unit is the bake unit. And an air formed in a space having a predetermined height dimension on the upper surface side of the outside air introduction portion provided on the upper part of the substrate surface treatment unit and the planar air filter arranged so as to face downward from the ceiling of the substrate surface treatment unit. A buffer, a pipe portion provided via at least one side surface side of the bake unit, which communicates the outside air introduction portion with the air buffer, and the outside air The substrate processing apparatus characterized by comprising a blower for forced air toward the buffer. 2. The substrate processing apparatus according to claim 1, wherein the blower is provided inside the outside air introduction unit. 3. The substrate processing apparatus according to claim 1, wherein the outside air introduction unit includes therein a temperature varying unit that changes the temperature of the sucked outside air. 4. The substrate processing apparatus according to claim 3,
A substrate processing apparatus, wherein a temperature sensor is provided inside the substrate surface processing unit, and the temperature varying means is feedback-controlled so that the detected temperature becomes a set value. 5. A substrate surface treatment unit and one or more units mounted side by side on the upper surface of the substrate surface treatment unit so that the front surface is behind the front surface of the substrate surface treatment unit by a predetermined dimension. And a downflow supply unit that blows clean air from above to the substrate surface treatment unit, and for the substrate transfer means that transfers the substrate to and from the front side of both units. In the substrate processing apparatus having a moving space of, the downflow supply unit is an external air introduction unit provided at an upper portion of the bake unit, and a planar surface arranged so as to face downward from a ceiling of the substrate surface processing unit. An air buffer having a predetermined height dimension on the upper surface side of the air filter and a space having a predetermined height dimension on the front surface of the bake unit; It is provided via a position that does not interfere with the substrate transfer space, and is provided with a piping section that communicates the outside air introduction section and the upper surface of the air buffer, and a blower that forcedly blows the outside air toward the air buffer. The substrate processing apparatus, wherein the pipe section has a duct provided on at least one of the left and right sides of the substrate transfer space of the bake unit. 6. The substrate processing apparatus according to claim 5, wherein three bake units are arranged in the left-right direction, and a pair of the ducts is provided on both sides of the central bake unit.