JP2010182744A - Substrate buffer unit - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate buffer unit where a substrate conveyed in one direction along a substrate conveyance path is temporarily evacuated, air in buffer space is efficiently cleaned and the cost can be reduced. <P>SOLUTION: The substrate buffer unit includes a box-shaped shelf portion 2 provided halfway in the substrate conveyance path, having a mount portion 6 for mounting the substrate and provided to move to a predetermined position off the substrate conveyance path, a clean air supply means 4 provided to an upper surface or side surface of the box-shaped shelf portion and supplying clean air having been cleaned, and a ventilation path 5 connecting the clean air supply means to the one side surface of the shelf portion. The clean air supplied from the clean air supply means is supplied from an air intake 7 formed on the one side surface of the box-shaped shelf portion to the mounting portion and discharged from an air outlet 8 formed on the side surface of the box-shaped shelf portion on the opposite side to the air intake. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a substrate buffer unit for temporarily retracting a glass substrate transported through a substrate transport path, for example, used in a flat panel display (FPD), from the substrate transport path, and in particular, for cleaning the air inside the buffer device. The present invention relates to a substrate buffer unit that can be efficiently performed.

  In manufacturing an FPD, a photolithography technique is used to form a circuit pattern on a glass substrate for FPD. A circuit pattern is formed by photolithography by applying a resist solution on a glass substrate to form a resist film, exposing the resist film to correspond to the circuit pattern, and developing the resist film. . For the formation of the circuit pattern, a production line is used in which each processing unit that performs processing such as application of a resist solution and development processing is installed along a transport line (substrate transport path). The glass substrate is subjected to predetermined processing in each processing unit while being transported along the transport line.

By the way, in order to adjust the timing of receiving and delivering the substrate between the processing units, the manufacturing line is usually provided with a buffer device for temporarily retracting and storing the glass substrate from the transfer line.
As such a buffer device, the present applicant has patented an elevator-type buffer device (hereinafter referred to as an elevator buffer device) that carries in and out a substrate by moving up and down a shelf on which glass substrates can be placed in multiple stages. It is disclosed in Document 1.

The substrate retracting operation of the elevator buffer device disclosed in Patent Document 1 will be briefly described with reference to FIG. The elevator buffer device 200 shown in FIGS. 9A to 9C is provided in the middle of the transport line, and a shelf 205 having substrate mounting portions 202a to 202f provided in multiple stages, and the shelf And an elevating mechanism 206 that supports the unit 205 so as to be movable up and down.
When the elevator buffer device 200 needs to retract the substrate, the driving of the auxiliary conveyor mechanism 210 on the downstream side in the X direction is stopped. Furthermore, as shown in FIG. 9A, when the first substrate G1 conveyed from the upstream side in the X direction passes through the carry-in port 201a of the housing 201 and the entire substrate is placed on the placement unit 202a, the conveyor mechanism 250a is stopped. As a result, the substrate G1 is placed on the placement unit 202a.

Next, when the next substrate G2 is transported from the upstream side in the X direction, the connection between the conveyor mechanism 250a and its drive source is released.
Then, as shown in FIG. 9B, for example, as shown in FIG. 9B, the shelf 205 is moved up by the elevating mechanism 206 so that the placement unit 202b matches the height of the transport line. The conveyor mechanism 250b of the part 202b is connected to the drive part and driven. Here, the board | substrate G1 will be in the state evacuated from the conveyance line with the mounting part 202a. And if the whole board | substrate G2 is mounted on the mounting part 202b, the drive of the conveyor mechanism 250b will be stopped.
By repeating such a process, the subsequent substrates G3, G4,... That have been transported on the transport line until the standby state of the substrate transport is canceled are respectively placed on the placement units 202c, 202d,. It is placed on top and stored (see FIG. 9C).

By the way, the elevator buffer device 200 is installed in a clean room together with other units. A clean air supply device called FFU (fan filter unit) is installed on the ceiling of the clean room, thereby forming a vertical laminar flow (down flow) through which air flows downward.
Conventionally, the cleanliness of the room, and thus the cleanliness of the shelf 205 in which the substrate is accommodated, is ensured by this downflow.

A configuration for cleaning the inside of a conventional elevator buffer device will be specifically described with reference to a sectional view of the buffer device in FIG. In FIG. 10, components having the same functions in FIG. 9 will be described using the same reference numerals.
In FIG. 10, in a casing 201 that is an exterior panel, a shelf 205 that can accommodate a plurality of substrates in multiple stages, and an elevating mechanism 206 that supports the shelf 205 so that it can be moved up and down from below are provided. Yes. In addition, in the shelf part 205, a board | substrate is carried in from the near side toward the back in the figure toward the paper surface.

The top plate 201a of the housing 201 is formed with a slit (not shown) for taking clean air flowing downward from above into the housing 201, and a slit for exhaust (on the lower side surface of the housing 201). (Not shown) is formed. For this reason, as indicated by an arrow in the housing 201, the clean air that hits the upper surface of the shelf 205 from above flows around the shelf 205 and flows downward to be exhausted.
Here, in the shelf 205 which is a substrate housing portion, the clean air that has entered the periphery of the shelf 205 is introduced from one side surface (air introduction surface 205a) and exhausted through the opposite side surface side. The inside of the shelf 205 is cleaned.

JP 2007-250671 A

However, in order to efficiently use the downflow coming down from the ceiling of the clean room, the FFU needs to be positioned immediately above the buffer device 200, and there is a possibility that the installation of the production line in the clean room may be restricted. was there.
Even if the FFU is installed immediately above the buffer device 200, the amount of downflow is greatly reduced until it reaches the elevator buffer device, and clean air is sufficiently supplied into the shelf 205 in the housing 201. I couldn't get as much airflow as possible.
For this reason, conventionally, as shown in FIG. 10, a large amount of clean air is drawn into the shelf 205 and an exhaust device 220 for exhausting the buffer device 200 is provided.
However, when the exhaust device 220 is provided, it is necessary to provide a piping facility for exhausting the exhaust device 220 to the outside of the clean room, which causes a problem that the equipment cost increases.

Further, the shelf 205 is moved up and down in the housing 207 by the lifting mechanism 206, and the volume of the space below the shelf 205 changes accordingly. For this reason, every time the shelf 205 moves up and down, the space around the lifting mechanism 206 is compressed and expanded, and dust is rolled up from the lifting mechanism 206, and dust may flow into the shelf 205.
Conventionally, as shown in the figure, the lifting mechanism 206 is enclosed by a casing 212, and the air in the casing 212 is sucked by the exhaust device 220 and exhausted.
However, also in this case, it is necessary to provide piping equipment on the clean room side, and there is a problem that costs increase.

Further, in the structure of the conventional shelf portion 205, the clean air introduced from the air introduction surface 205a passes through the transport driving mechanism 213 that is a substrate transport driving portion and is discharged from the exhaust device 220.
However, when the exhaust operation of the exhaust device 220 is stopped, there is a problem that the inside of the shelf 205 is in a negative pressure state, the air flows backward, and the dust generated from the transport drive mechanism 213 flows into the placement unit.

  The present invention has been made under the circumstances as described above, and in the substrate buffer unit that temporarily retracts the substrate transported in one direction on the substrate transport path, the buffer space is efficiently cleaned with air. And it aims at providing the substrate buffer unit which can reduce cost.

  In order to solve the above-described problems, a substrate buffer unit according to the present invention is a substrate buffer unit that temporarily stores a substrate transported through a substrate transport path and retreats from the substrate transport path. A box-shaped shelf that is provided in the middle and has a placement unit for placing a substrate and is movable to a predetermined position off the substrate transport path, and an upper surface or a side surface of the box-like shelf The clean air supplied from the clean air supply means is provided with a clean air supply means for supplying purified clean air, and an air passage connecting the clean air supply means and one side of the shelf. Air is supplied from the air inlet provided on one side of the box-shaped shelf to the mounting portion, and the air provided on the side opposite to the air inlet in the box-shaped shelf. Exhaust from the outlet To have the feature.

By configuring in this way, it is possible to form a flow of clean air with a sufficient flow rate on the mounting portion of each stage without providing an exhaust device on the downstream side of the shelf, and to ensure the cleanliness in the shelf. Can do.
Therefore, it is not necessary to consider the arrangement of the FFU in the clean room as in the prior art, and the production line can be installed without being restricted by the clean room.
In addition, since there is no need to provide an exhaust device, an increase in equipment costs can be suppressed, and the inside of the shelf that is downstream of the clean air supply means can be in a positive pressure state. (Such as backflow when operation is stopped) can be eliminated.

Further, the box-shaped shelf has a box-shaped casing in which a plurality of the shelves are provided in multiple stages, and on one side of the casing, the air inlet is provided in multiple stages. It is desirable that a plurality of distribution rectification members that are provided corresponding to the mounting portions and distribute clean air to the plurality of air introduction ports are provided in the ventilation path.
By providing such a distribution rectifying member, it is possible to equalize the flow rate to the air inlets of each stage.

Moreover, it is desirable to provide an expansion rectifying member that is provided at the air inlet and expands the clean air supplied from the air inlet onto the mounting portion in a fan shape.
By providing this extended rectifying member, the clean air introduced into each placement portion can be expanded in a fan shape so that no airflow stays in the placement portion.
Further, the fan-shaped flow not only suppresses the inflow of air from the substrate carry-in / out port, but also enables exhaust from the substrate carry-in / out port.

A plurality of the air outlets are formed on the side surface of the box-shaped shelf opposite to the air inlet, and the cross-section has a hollow structure, and the box-shaped shelf is A substrate transfer means for carrying the substrate in and out of the placement section; a transport drive means provided on the downstream side of the clean air supplied onto the placement section; and driving the substrate transport means; and the hollow structure It is desirable to provide drive system exhaust means that exhausts only clean air that is separated from the air outlet and is supplied to the transport drive means.
By adopting such a hollow structure for the air outlet, the inside of the pipe is in a more positive pressure state than the downstream side of the exhaust, and the backflow of the exhausted air and the inflow of air from outside the shelf can be prevented. .
Further, by separating and rectifying the exhaust path, it is possible to prevent the dust generated from the transport driving means from flowing into the placement portion.

Preferably, each of the plurality of air outlets is provided with a flow restriction means for restricting the flow rate of air flowing through the air outlet.
By adjusting the flow rate restricting means at each air outlet, the exhaust amount from all the air outlets can be equalized.

A housing that covers at least the casing of the shelf, wherein the air inlet and the air outlet are respectively formed in a gap space between the housing and the casing of the shelf. It is desirable that a partition member for independently forming a gap space between one side surface and the inner side surface of the casing facing the one side surface is provided on the inner wall of the casing or the outer wall of the casing.
By providing this partition member, the exhaust from the air outlet port does not flow around to the other side surface of the casing, and the exhaust can be prevented from flowing into the mounting portion from the substrate carry-in / out port.

  According to the present invention, in the substrate buffer unit that temporarily retracts the substrate transported in one direction on the substrate transport path, the substrate buffer can efficiently perform air cleaning of the buffer space and reduce the cost. You can get a unit.

FIG. 1 is a side sectional view of a substrate buffer unit according to the present invention. FIG. 2 is a cross-sectional view taken along the line AA in FIG. 3 is a cross-sectional view taken along line BB in FIG. 4 is a cross-sectional view taken along the line CC in FIG. 5 is a cross-sectional view taken along the line DD in FIG. FIG. 6 is a cross-sectional view of the distribution rectifying member. FIG. 7 is a perspective view of the expanded rectifying member. FIG. 8 is a cross-sectional view of the flow restrictor. FIG. 9 is a diagram for explaining the substrate retracting operation of the elevator buffer device. FIG. 10 is a cross-sectional view for explaining a configuration for cleaning the inside of a conventional elevator buffer device.

DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments of a substrate buffer unit of the present invention will be described in detail with reference to the drawings. The substrate buffer unit of the present invention is provided in the middle of a production line for forming a circuit pattern by, for example, a photolithography process, and temporarily accommodates and retracts a glass substrate for FPD that is a substrate to be processed.
Further, the substrate buffer unit according to the present invention can be suitably used in the elevator type buffer device described with reference to FIG. In the following embodiments, an example applied to an elevator buffer device will be described.

1 is a side sectional view of a substrate buffer unit according to the present invention, FIG. 2 is a sectional view taken along line AA in FIG. 1 (plan view inside the unit housing), and FIG. 3 is a sectional view taken along line BB in FIG. 4 is a cross-sectional view taken along the line CC in FIG. 2, and FIG. 5 is a cross-sectional view taken along the line DD in FIG.
The substrate buffer unit 100 shown in the figure supports a box-shaped shelf 2 on which glass substrates G as substrates to be processed can be placed in multiple stages (six stages in the figure) in a unit housing 1 and supports the shelf 2 from below. And a lifting mechanism 3 that moves up and down.

For example, the glass substrate G is carried into the substrate buffer unit 100 from the carry-in port 1a of the unit housing 1 shown in FIGS. 3 and 4, and after being accommodated in the shelf 2, is suitably carried out from the carry-out port 1b on the opposite side. .
The carry-in port 1 a and the carry-out port 1 b in the housing 1 are provided according to the height position of a so-called flat-flow type substrate transfer line (substrate transfer path) provided upstream and downstream of the buffer unit 100.
As shown in FIG. 1, the shelf 2 has a box-shaped casing 20, and the placement portions 6 (6 a to 6 f) for the substrate G are provided in, for example, six stages. As shown in FIGS. 3 and 4, on the side surface of the casing 20 facing the loading / unloading ports 1a and 1b of the casing 1, a plurality of substrate loading ports 2a and loading / unloading ports 2b corresponding to the mounting portions 6 of each stage are provided. Is provided.

Since the shelf 2 (casing 20) can be moved up and down by the lifting mechanism 3 in the housing 1, when the glass substrate G is carried into and out of the mounting unit 6 at a predetermined stage, the predetermined The shelf portion 2 is moved up and down by the elevating mechanism 3 so that the stage mounting portion 6 is at the height of the carry-in port 1a and the carry-out port 1b.
In addition, after placing the substrate G on the predetermined placement unit 6, the lifting and lowering mechanism 3 moves the shelf 2 up and down to a predetermined position off the substrate transport line, thereby retracting the substrate G from the substrate transport line. Can be made.
As shown in FIGS. 1 and 5, each placement unit 6 is provided with a plurality of roller transport shafts 13 (substrate transport means) for transporting the substrate in parallel, and one end of each shaft 13 is provided. The part is provided with a shaft rotation drive mechanism 14 (conveyance drive means) composed of a motor or the like for rotationally driving each shaft 13.

  In the buffer unit 100, a plurality (four in the figure) of FFU (fan filter units) 4a to 4d (collectively referred to as FFU 4) are installed on the upper surface of the casing 20 of the shelf 2 as shown in FIG. . Each of these FFUs 4 is a unit that has a fan that is driven to rotate in a predetermined direction, takes air from above by rotation of the fan, generates purified air (clean air) through a filter, and blows it downward. . That is, the FFU 4 functions as a clean air supply unit.

Below each FFU 4, there is provided a ventilation path 5 (5a, 5b, 5c, 5d) that serves as a flow path for the clean air blown downward, and this ventilation path 5 is connected to the substrate loading / unloading port 1a, It communicates with one side surface orthogonal to the side surface provided with 1b.
More specifically, the introduction of clean air into the shelf 2 shown in FIG. 3 is performed by a plurality of air introduction ports 7 (air introduction ports) formed on one side surface of the shelf 2 through which the ventilation path 5 communicates. ) These air introduction ports 7 are provided in a total of 36, for example, six in the vertical direction, which is the same as the number of stages of the mounting portion, and six in the horizontal direction. That is, six air inlets 7 are provided on the side of each stage 6.

In the case of this embodiment, all 36 air inlets 7 are divided into four groups according to the number of FFUs 4 provided in the upper part of the shelf 2. That is, as shown in FIG. 3, the air introduction ports 7 corresponding to the upper three stages of mounting parts 6a, 6b, 6c are divided into left and right groups 7A, 7B, and the lower three stages of mounting parts 6d, The air inlets 7 corresponding to 6e and 6f are divided into two groups on the left and right of the groups 7C and 7D.
Of these, the clean air supplied by the FFU 4a is supplied from the nine air inlets 7 of the group 7A, and the clean air supplied by the FFU 4b is supplied from the nine air inlets 7 of the group 7B. The clean air supplied by the FFU 4c is supplied from the nine air inlets 7 of the group 7C, and the clean air supplied by the FFU 4d is supplied from the nine air inlets 7 of the group 7D.
Here, clean air is supplied from the respective FFUs 4 to the air inlets 7 in the three vertical stages. In order to make the flow rate more equal, as shown in FIG. A distribution rectifying member 10 that distributes the airflow in accordance with the three-stage inlets 7 is provided.
As shown in FIG. 6, the distribution walls 10a and 10b of the distribution rectifying member 10 are provided such that their positions are movable in the direction indicated by the arrows in the figure. The flow rate of the clean air introduced into 7 is adjusted so that it is more equalized.

Further, when the flow of clean air supplied from the FFU 4 is introduced from the air introduction port 7 to the mounting portion, as shown by an arrow in FIG. It is desirable to have a state where
For this reason, for each mounting portion 6, an extended rectifying member 12 for expanding the direction of the airflow in the left-right direction as shown in the perspective view of FIG. By providing the expansion rectifying member 12, the clean air introduced onto each placement unit 6 spreads in a fan shape as shown in FIG. 5, and no airflow stays in the placement unit 6.
Further, the flow of air spreading like a fan not only suppresses the flow of air from the substrate loading / unloading ports 2a and 2b, but also allows exhausting from the substrate loading / unloading ports 2a and 2b.

On the other hand, the air outlet port 8 for exhausting the air supplied to each mounting unit 6 is provided on the side surface of the casing 20 opposite to the side surface on which the plurality of air introduction ports 7 are formed. Provided for each. That is, as shown in FIG. 4, there are six air outlets 8 (six air outlets 8 for each mounting part 6) in the vertical direction and the same six stages as the stage number of the mounting parts 6 in the horizontal direction. Is provided.
Among these, in FIG. 4, the air outlets 8 a in the left and right end rows are formed by making flat holes in the side wall of the housing 2.
Further, the four air outlets 8b provided between the air outlets 8a in the left and right end rows extend a predetermined length in the exhaust direction as shown in FIG. 1 and FIG. (For example, a flat pipe structure).

The air outlet 8b having such a hollow structure is provided in the vicinity of a shaft rotation drive mechanism 14 that rotationally drives a plurality of shafts 13 in each mounting portion 6 as shown in FIG.
More specifically, the plurality of shaft rotation drive mechanisms 14 are covered with a cover member 15 (drive system exhaust means), and the hollow air outlet 8b penetrates through the cover member 15 as shown in FIG. It is inserted as follows. As shown in FIGS. 1 and 4, an exhaust pipe 16 (drive system exhaust means) extending downward is provided at the lower part of the cover member 15, and the tip thereof is opened in the vicinity of the elevating mechanism 3.

  That is, the clean air that has passed through the mounting portion 6 mainly flows through the air outlet 8 b having a hollow structure and is exhausted without passing through the shaft rotation drive mechanism 14. The clean air flowing through the shaft rotation drive mechanism 14 is exhausted from the exhaust pipe 16. By separating the exhaust path and rectifying in this manner, it is possible to prevent the dust generated from the shaft rotation drive mechanism 14 from flowing into the placement portion 6.

Further, as described above, the air outlet 8b is flat and has a hollow structure with a predetermined length. Further, as shown in the sectional view of FIG. A plate-like flow rate restricting member 11 is provided as a restricting means for limiting the pressure.
Thereby, the inside of the hollow structure becomes a positive pressure state from the downstream side of the exhaust, and the backflow of the exhausted air and the inflow of air from the outside of the shelf 2 are prevented.
Further, the exhaust amount from all the air outlets 8 can be made more uniform by adjusting the inclination angle of the flow restrictor 11 at each outlet 8b.

When such a buffer unit 100 is installed in a clean room and clean air is supplied from the ceiling by downflow, a slit 1c for introducing air is formed on the upper surface of the housing 1 as shown in FIG. Since it is formed, clean air is supplied into the housing 1 from above the housing 1. Further, since an exhaust slit 1d is formed in the lower part of the casing 1, the supplied clean air circulates around the shelf 2 and is exhausted from the exhaust slit 1d at the lower part of the casing 1.
Here, as shown in FIG. 2, the inner wall surface (or the outer wall surface of the casing 20) in the vicinity of the four corners in the housing 1 may face each side surface of the shelf 2 and the inner surface of the housing 1. A partition plate 12 (partition member) that partitions the space is provided.
By providing the partition member 12, the exhaust from the air outlet 8 does not flow around to the other side of the casing 20, thereby preventing the exhaust from flowing into the placement unit 6 from the substrate loading / unloading ports 2 a and 2 b. be able to.

The clean air introduced into the shelf 2 from the air inlet 7 is also exhausted from the substrate loading / unloading ports 2 a and 2 b provided in the casing 20. The exhaust flow flows through a gap space between the casing 1 and the casing 20 and is exhausted from the exhaust slit 1d at the lower portion of the casing 1. For this reason, the inside of the housing | casing 1 can be air-cleaned more efficiently than only the clean air supplied from a clean room.
Further, when the substrate G is carried into and out of each placement unit 6, if the shelf 2 is moved up and down in the housing 1 by the lifting mechanism 3, the surrounding space of the lifting mechanism 3 is compressed and expanded, so that the air is wound. A rise occurs. However, even if this air roll-up occurs, clean air with a sufficient flow rate flows through the FFU 4 to each placement unit 6 and is exhausted from each front, so that dust does not flow into the shelf 2. Absent.
Further, even if the FFU 4 stops operating, the inside of the shelf 4 located downstream of the FFU 4 is in a positive pressure state, so that dust can be prevented from flowing in.

As described above, according to the embodiment of the present invention, in the buffer unit 100, clean air is generated by the operation of the FFU 4, and the clean air passes through the ventilation path 5 from the air inlet 7 to the shelf 5. The supplied clean air is supplied to each placement unit 6 and is mainly exhausted from the air outlet 8 provided in each stage.
With this configuration, a clean air flow with a sufficient flow rate can be formed on the mounting portions 6 of each stage without providing an exhaust device on the downstream side, and the cleanliness in the shelf portion 2 can be ensured.
Therefore, it is not necessary to consider the arrangement of the FFU in the clean room as in the prior art, and the production line can be installed without being restricted by the clean room.
In addition, since there is no need to provide an exhaust device, an increase in equipment costs can be suppressed, and problems (such as backflow when operation is stopped) caused by providing the exhaust device can be eliminated.

In the above embodiment, the example in which the FFU 4 as the clean air supply means is provided on the upper surface (of the casing 20) of the shelf 2 is shown. However, in the substrate buffer unit according to the present invention, The form is not limited. For example, the FFU 4 as the clean air supply means may be provided on the side surface (of the casing 20) of the shelf 2.
Moreover, although the example which applies this invention to a multistage type elevator buffer apparatus was shown, this invention is not limited to the form. For example, a single-stage substrate buffer device may be used instead of a multi-stage type, and the present invention can also be applied to a buffer device that carries in and out a plurality of substrates by a robot arm or the like without using the lifting mechanism 3 of the shelf 2. .

DESCRIPTION OF SYMBOLS 1 Case 2 Shelf part 3 Lifting mechanism 4 FFU (clean air supply means)
5 Ventilation path 6 Placement part 7 Air inlet (air inlet)
8 Air outlet (air outlet)
12 partition member 13 roller transport shaft (substrate transport means)
14 Shaft rotation drive mechanism (conveyance drive means)
15 Cover member (drive system exhaust means)
16 Exhaust pipe (drive system exhaust means)
20 Casing 100 Substrate buffer unit G Glass substrate (substrate)

Claims (7)

In the substrate buffer unit that temporarily accommodates the substrate transported through the substrate transport path and retracts from the substrate transport path,
A box-shaped shelf provided in the middle of the substrate transport path, having a placement unit for placing the substrate, and movably provided at a predetermined position off the substrate transport path;
Clean air supply means that is provided on the upper surface or the side surface of the box-shaped shelf and supplies purified clean air;
An air passage that connects the clean air supply means and one side of the shelf;
The clean air supplied from the clean air supply means is supplied from the air inlet provided on one side of the box-shaped shelf to the placement unit, and the air inlet in the box-shaped shelf Is a substrate buffer unit which is exhausted from an air outlet provided on the opposite side surface. The box-shaped shelf has a box-shaped casing in which a plurality of the shelves are provided in multiple stages.
In one side of the casing, a plurality of the air inlets are provided corresponding to each mounting portion provided in multiple stages,
2. The substrate buffer unit according to claim 1, wherein a distribution rectifying member for distributing clean air to the plurality of air inlets is provided in the ventilation path.   3. The substrate according to claim 1, further comprising an extended rectifying member provided at the air introduction port and configured to expand the clean air supplied from the air introduction port onto the mounting portion in a fan shape. 4. Buffer unit. A plurality of the air outlets are formed on the side surface of the box-shaped shelf opposite to the air inlets, and the cross section has a hollow structure,
The box-shaped shelf is
A substrate transfer means for carrying the substrate in and out of the placement unit;
A transport driving means that is provided on the downstream side of the clean air supplied on the placement section and drives the substrate transport means;
4. The drive system exhaust unit according to claim 1, further comprising a drive system exhaust unit that exhausts only clean air that is separated from the hollow air outlet and is supplied to the transport drive unit. Substrate buffer unit.   5. The substrate buffer unit according to claim 4, wherein each of the plurality of air outlets is provided with a flow restriction means for restricting a flow rate of air flowing through the air outlet. In a gap space between the casing and the casing of the shelf, including a casing that covers at least the casing of the shelf,
A partition member for independently forming a gap space between one side surface of the shelf portion in which the air inlet port and the air outlet port are respectively formed and the inner side surface of the casing facing the one side surface The substrate buffer unit according to claim 2, wherein the substrate buffer unit is provided on an inner wall of the housing. In a gap space between the casing and the casing of the shelf, including a casing that covers at least the casing of the shelf,
A partition member for independently forming a gap space between one side surface of the shelf portion in which the air inlet port and the air outlet port are respectively formed and the inner side surface of the casing facing the one side surface The substrate buffer unit according to claim 2, wherein the substrate buffer unit is provided on an outer wall of the casing.

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