JPH09111496A5 - - Google Patents

Info

Publication number
JPH09111496A5
JPH09111496A5 JP1996247542A JP24754296A JPH09111496A5 JP H09111496 A5 JPH09111496 A5 JP H09111496A5 JP 1996247542 A JP1996247542 A JP 1996247542A JP 24754296 A JP24754296 A JP 24754296A JP H09111496 A5 JPH09111496 A5 JP H09111496A5
Authority
JP
Japan
Prior art keywords
substrate
dispersion
coating
treatment tank
aqueous medium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1996247542A
Other languages
English (en)
Japanese (ja)
Other versions
JPH09111496A (ja
Filing date
Publication date
Priority claimed from US08/531,171 external-priority patent/US5618400A/en
Application filed filed Critical
Publication of JPH09111496A publication Critical patent/JPH09111496A/ja
Publication of JPH09111496A5 publication Critical patent/JPH09111496A5/ja
Pending legal-status Critical Current

Links

JP8247542A 1995-09-19 1996-09-19 電気メッキの方法 Pending JPH09111496A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/531,171 US5618400A (en) 1995-09-19 1995-09-19 Electroplating process
US08/531171 1995-09-19

Publications (2)

Publication Number Publication Date
JPH09111496A JPH09111496A (ja) 1997-04-28
JPH09111496A5 true JPH09111496A5 (https=) 2004-09-30

Family

ID=24116541

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8247542A Pending JPH09111496A (ja) 1995-09-19 1996-09-19 電気メッキの方法

Country Status (4)

Country Link
US (1) US5618400A (https=)
EP (1) EP0771890B1 (https=)
JP (1) JPH09111496A (https=)
DE (1) DE69626460T2 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5738776A (en) * 1996-01-19 1998-04-14 Shipley Company, L.L.C. Electroplating process
GB2332209A (en) * 1997-12-09 1999-06-16 Devex Sa Electroplating involving the use of a preliminary coating
US6524758B2 (en) 1999-12-20 2003-02-25 Electrox Corporation Method of manufacture of printed wiring boards and flexible circuitry
JP4862192B2 (ja) * 2005-09-29 2012-01-25 Ｄｏｗａメタルテック株式会社 複合めっき材の製造方法
KR101537638B1 (ko) * 2010-05-18 2015-07-17 삼성전자 주식회사 그라펜 박막을 이용한 수지의 도금 방법

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE132177C (https=) *
DE904615C (de) * 1951-10-02 1954-02-22 Erwin Mueller Bralitz Dipl Ing Verfahren und Vorrichtung zum Elektrischleitendmachen von nicht leitenden Gegenstaenden fuer die nachfolgende galvanische Metallisierung
US2897409A (en) * 1954-10-06 1959-07-28 Sprague Electric Co Plating process
DE1073197B (https=) * 1955-06-28 1960-01-14
JPS6113688A (ja) * 1984-06-28 1986-01-21 福田金属箔粉工業株式会社 印刷回路用銅箔およびその製造方法
US4897164A (en) * 1989-04-24 1990-01-30 Olin Hunt Specialty Products Inc. Process for preparing the through hole walls of a printed wiring board for electroplating
US5106537A (en) * 1990-04-12 1992-04-21 Olin Hunt Sub Iii Corp. Liquid dispersion for enhancing the electroplating of a non-conductive surface
US5476580A (en) * 1993-05-17 1995-12-19 Electrochemicals Inc. Processes for preparing a non-conductive substrate for electroplating
US5389270A (en) * 1993-05-17 1995-02-14 Electrochemicals, Inc. Composition and process for preparing a non-conductive substrate for electroplating

Similar Documents

Publication Publication Date Title
US3099608A (en) Method of electroplating on a dielectric base
JP3333551B2 (ja) ダイヤモンド上に金属被膜を設ける為の改良された方法およびそれによって得られる物品
EP0244535B1 (en) Improved electroless plating process
US5547558A (en) Process for electroplating nonconductive surface
KR100188481B1 (ko) 유전기질과 도금기질을 직접 전기도금 하는 방법
US5632927A (en) Process for preparing a non-conductive substrate for electroplating
JPH06507449A (ja) 電気めっきのための非伝導性基体を製造するための改善された方法
US5342501A (en) Method for electroplating metal onto a non-conductive substrate treated with basic accelerating solutions for metal plating
JPS6142993A (ja) 樹脂への導体層形成方法
JPH08250865A (ja) 電子ハウジングの製作に利用するシート上での金属ウイスカの形成を防止することにより電子ハウジングの信頼性をより高くする方法
JPS63103075A (ja) マイクロ樹枝状体配列を介して結合された金属層で被覆可能とされる表面を有する樹脂製品並びに該金属層被覆樹脂製品
JPH09111496A5 (https=)
IE55467B1 (en) Process for the metallisation of electrically insulating flexible films of a heat-stable plastic material,and the articles so obtained
US5674373A (en) Method for metallizing non-conductive substrates
WO2013109404A2 (en) Low etch process for direct metalization
JPS5811518B2 (ja) 金属−ダイヤモンドの複合メッキ方法
GB2080630A (en) Printed circuit panels
US4714646A (en) Electrophoretic insulation of metal circuit board core
CN109252197B (zh) 一种渗碳零件电镀银的方法
EP0771890B1 (en) Electroplating process
CN108712830B (zh) 一种电路板的无钯化学镀铜工艺
JPS63317699A (ja) 金属メッキの前処理方法
GB2274853A (en) Process for electroplating nonconductive surface e.g through holes in print wiring board
KR100295144B1 (ko) 비전도성기재의표면에전도성금속을도금하는방법및이를위한촉진용액
JPH0680894B2 (ja) 金属コアプリント基板の製造方法