JPH09111496A - 電気メッキの方法 - Google Patents

電気メッキの方法

Info

Publication number
JPH09111496A
JPH09111496A JP8247542A JP24754296A JPH09111496A JP H09111496 A JPH09111496 A JP H09111496A JP 8247542 A JP8247542 A JP 8247542A JP 24754296 A JP24754296 A JP 24754296A JP H09111496 A JPH09111496 A JP H09111496A
Authority
JP
Japan
Prior art keywords
dispersion
metal
substrate
coating
particles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8247542A
Other languages
English (en)
Japanese (ja)
Other versions
JPH09111496A5 (https=
Inventor
Steven M Florio
スティーブン・エム・フロリオ
Jeffrey P Burress
ジェフリー・ピー・ブレス
Carl J Colangelo
カール・ジェー・コランジェロ
Edward C Couble
エドワード・シー・コーブル
Mark J Kapeckas
マーク・ジェイ・カペッカス
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Electronic Materials International LLC
Original Assignee
Shipley Co LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shipley Co LLC filed Critical Shipley Co LLC
Publication of JPH09111496A publication Critical patent/JPH09111496A/ja
Publication of JPH09111496A5 publication Critical patent/JPH09111496A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Chemically Coating (AREA)
JP8247542A 1995-09-19 1996-09-19 電気メッキの方法 Pending JPH09111496A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/531,171 US5618400A (en) 1995-09-19 1995-09-19 Electroplating process
US08/531171 1995-09-19

Publications (2)

Publication Number Publication Date
JPH09111496A true JPH09111496A (ja) 1997-04-28
JPH09111496A5 JPH09111496A5 (https=) 2004-09-30

Family

ID=24116541

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8247542A Pending JPH09111496A (ja) 1995-09-19 1996-09-19 電気メッキの方法

Country Status (4)

Country Link
US (1) US5618400A (https=)
EP (1) EP0771890B1 (https=)
JP (1) JPH09111496A (https=)
DE (1) DE69626460T2 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007037144A1 (ja) * 2005-09-29 2007-04-05 Dowa Metaltech Co., Ltd. 複合めっき材の製造方法

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5738776A (en) * 1996-01-19 1998-04-14 Shipley Company, L.L.C. Electroplating process
GB2332209A (en) * 1997-12-09 1999-06-16 Devex Sa Electroplating involving the use of a preliminary coating
US6524758B2 (en) 1999-12-20 2003-02-25 Electrox Corporation Method of manufacture of printed wiring boards and flexible circuitry
KR101537638B1 (ko) * 2010-05-18 2015-07-17 삼성전자 주식회사 그라펜 박막을 이용한 수지의 도금 방법

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE132177C (https=) *
DE904615C (de) * 1951-10-02 1954-02-22 Erwin Mueller Bralitz Dipl Ing Verfahren und Vorrichtung zum Elektrischleitendmachen von nicht leitenden Gegenstaenden fuer die nachfolgende galvanische Metallisierung
US2897409A (en) * 1954-10-06 1959-07-28 Sprague Electric Co Plating process
DE1073197B (https=) * 1955-06-28 1960-01-14
JPS6113688A (ja) * 1984-06-28 1986-01-21 福田金属箔粉工業株式会社 印刷回路用銅箔およびその製造方法
US4897164A (en) * 1989-04-24 1990-01-30 Olin Hunt Specialty Products Inc. Process for preparing the through hole walls of a printed wiring board for electroplating
US5106537A (en) * 1990-04-12 1992-04-21 Olin Hunt Sub Iii Corp. Liquid dispersion for enhancing the electroplating of a non-conductive surface
US5476580A (en) * 1993-05-17 1995-12-19 Electrochemicals Inc. Processes for preparing a non-conductive substrate for electroplating
US5389270A (en) * 1993-05-17 1995-02-14 Electrochemicals, Inc. Composition and process for preparing a non-conductive substrate for electroplating

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007037144A1 (ja) * 2005-09-29 2007-04-05 Dowa Metaltech Co., Ltd. 複合めっき材の製造方法
JP2007092141A (ja) * 2005-09-29 2007-04-12 Dowa Holdings Co Ltd 複合めっき材の製造方法

Also Published As

Publication number Publication date
US5618400A (en) 1997-04-08
DE69626460T2 (de) 2004-03-18
EP0771890A1 (en) 1997-05-07
EP0771890B1 (en) 2003-03-05
DE69626460D1 (de) 2003-04-10

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