DE69626460T2 - Verfahren zum Elektroplattieren - Google Patents

Verfahren zum Elektroplattieren Download PDF

Info

Publication number
DE69626460T2
DE69626460T2 DE69626460T DE69626460T DE69626460T2 DE 69626460 T2 DE69626460 T2 DE 69626460T2 DE 69626460 T DE69626460 T DE 69626460T DE 69626460 T DE69626460 T DE 69626460T DE 69626460 T2 DE69626460 T2 DE 69626460T2
Authority
DE
Germany
Prior art keywords
dispersion
substrate
particles
coating
carbonaceous
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69626460T
Other languages
German (de)
English (en)
Other versions
DE69626460D1 (de
Inventor
Steven M. Florio
Jeffrey P. Burress
Carl J. Colangelo
Edward C. Couble
Mark J. Kapeckas
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shipley Co Inc
DuPont Electronic Materials International LLC
Original Assignee
Shipley Co Inc
Shipley Co LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shipley Co Inc, Shipley Co LLC filed Critical Shipley Co Inc
Application granted granted Critical
Publication of DE69626460D1 publication Critical patent/DE69626460D1/de
Publication of DE69626460T2 publication Critical patent/DE69626460T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Chemically Coating (AREA)
DE69626460T 1995-09-19 1996-09-12 Verfahren zum Elektroplattieren Expired - Fee Related DE69626460T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US531171 1995-09-19
US08/531,171 US5618400A (en) 1995-09-19 1995-09-19 Electroplating process

Publications (2)

Publication Number Publication Date
DE69626460D1 DE69626460D1 (de) 2003-04-10
DE69626460T2 true DE69626460T2 (de) 2004-03-18

Family

ID=24116541

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69626460T Expired - Fee Related DE69626460T2 (de) 1995-09-19 1996-09-12 Verfahren zum Elektroplattieren

Country Status (4)

Country Link
US (1) US5618400A (https=)
EP (1) EP0771890B1 (https=)
JP (1) JPH09111496A (https=)
DE (1) DE69626460T2 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5738776A (en) * 1996-01-19 1998-04-14 Shipley Company, L.L.C. Electroplating process
GB2332209A (en) * 1997-12-09 1999-06-16 Devex Sa Electroplating involving the use of a preliminary coating
US6524758B2 (en) 1999-12-20 2003-02-25 Electrox Corporation Method of manufacture of printed wiring boards and flexible circuitry
JP4862192B2 (ja) * 2005-09-29 2012-01-25 Ｄｏｗａメタルテック株式会社 複合めっき材の製造方法
KR101537638B1 (ko) * 2010-05-18 2015-07-17 삼성전자 주식회사 그라펜 박막을 이용한 수지의 도금 방법

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE132177C (https=) *
DE904615C (de) * 1951-10-02 1954-02-22 Erwin Mueller Bralitz Dipl Ing Verfahren und Vorrichtung zum Elektrischleitendmachen von nicht leitenden Gegenstaenden fuer die nachfolgende galvanische Metallisierung
US2897409A (en) * 1954-10-06 1959-07-28 Sprague Electric Co Plating process
DE1073197B (https=) * 1955-06-28 1960-01-14
JPS6113688A (ja) * 1984-06-28 1986-01-21 福田金属箔粉工業株式会社 印刷回路用銅箔およびその製造方法
US4897164A (en) * 1989-04-24 1990-01-30 Olin Hunt Specialty Products Inc. Process for preparing the through hole walls of a printed wiring board for electroplating
US5106537A (en) * 1990-04-12 1992-04-21 Olin Hunt Sub Iii Corp. Liquid dispersion for enhancing the electroplating of a non-conductive surface
US5476580A (en) * 1993-05-17 1995-12-19 Electrochemicals Inc. Processes for preparing a non-conductive substrate for electroplating
US5389270A (en) * 1993-05-17 1995-02-14 Electrochemicals, Inc. Composition and process for preparing a non-conductive substrate for electroplating

Also Published As

Publication number Publication date
JPH09111496A (ja) 1997-04-28
US5618400A (en) 1997-04-08
EP0771890A1 (en) 1997-05-07
EP0771890B1 (en) 2003-03-05
DE69626460D1 (de) 2003-04-10

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee