JPH089787Y2 - Digitizer sensor plate - Google Patents
Digitizer sensor plateInfo
- Publication number
- JPH089787Y2 JPH089787Y2 JP1991065127U JP6512791U JPH089787Y2 JP H089787 Y2 JPH089787 Y2 JP H089787Y2 JP 1991065127 U JP1991065127 U JP 1991065127U JP 6512791 U JP6512791 U JP 6512791U JP H089787 Y2 JPH089787 Y2 JP H089787Y2
- Authority
- JP
- Japan
- Prior art keywords
- sensor
- flat plate
- insulating flat
- plate
- wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Description
【考案の詳細な説明】[Detailed description of the device]
【0001】[0001]
【産業上の利用分野】本考案はCAD用の図形入力機等
に用いられる電磁誘導方式のデジタイザセンサ板に関す
るものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electromagnetic induction type digitizer sensor plate used for a figure input device for CAD.
【0002】[0002]
【従来の技術】従来より、CAD等の情報入力機器には
図4に示す如く構成された電磁誘導方式のデジタイザセ
ンサ板が用いられている。センサ線2は図3に示すよう
にして布線される。まず、絶縁平板3の外側周辺に複数
本のセンサ線布線用ピン4を所定の間隔で配設し、該布
線用ピン4に絶縁被覆を施したセンサ線2をX軸方向及
びY軸方向毎に夫々順次引っ掛け折り返しながら所定パ
ターンに布線し、X軸方向及びY軸方向のそれぞれのセ
ンサ線端末8,8を絶縁平板3から導出させる。次に絶
縁平板3上の周縁部を除くセンサ線2上に接着剤5を塗
布し、センサ線2を平板3上に埋設固着する。その後、
センサ線折り返し部7を布線用ピン4から取り外して平
板3上の接着剤の充填されていない板周縁部11に折り曲
げ配置し、センサ線折り返し部7上に更に接着剤5Aを
塗布して絶縁平板3上の周縁部11にセンサ線折り返し部
7を固着させていた。2. Description of the Related Art Conventionally, an electromagnetic induction type digitizer sensor plate configured as shown in FIG. 4 has been used for an information input device such as CAD. The sensor wire 2 is wired as shown in FIG. First, a plurality of sensor wire arranging pins 4 are arranged around the outer side of the insulating flat plate 3 at a predetermined interval, and the sensor wire 2 having an insulating coating on the wire arranging pins 4 is used for the X-axis direction and the Y-axis. Wiring is performed in a predetermined pattern while being hooked and folded back in each direction, and the sensor line terminals 8, 8 in the X-axis direction and the Y-axis direction are led out from the insulating flat plate 3. Next, the adhesive 5 is applied to the sensor wire 2 excluding the peripheral portion on the insulating flat plate 3, and the sensor wire 2 is embedded and fixed on the flat plate 3. afterwards,
The sensor wire folded-back portion 7 is removed from the wiring pin 4 and is bent and arranged on the plate peripheral portion 11 on the flat plate 3 not filled with the adhesive, and the sensor wire folded-back portion 7 is further coated with the adhesive 5A for insulation. The sensor wire folded portion 7 was fixed to the peripheral portion 11 on the flat plate 3.
【0003】[0003]
【考案が解決しようとする課題】上記従来のデジタイザ
センサ板における絶縁平板外側のセンサ線折り返し部の
処理は接着剤で充填固着するものであった。このため、
センサ線折り返し部に接着剤を塗布固着する作業におい
て、センサ線折り返し部が接着剤層からはみ出したまま
絶縁平板に固着され、製造工程中にこのはみ出したセン
サ線折り返し部で断線を生じる危険性があった。また、
センサ線折り返し部を絶縁平板に接着剤で接着固定する
作業は接着剤の固化に時間を要し、作業性に劣る上、接
着剤の重量分だけセンサ板が重くなる難点があった。In the conventional digitizer sensor plate, the processing of the folded portion of the sensor line on the outer side of the insulating flat plate is performed by filling and fixing with an adhesive. For this reason,
In the work of applying fixing glue to the sensor line folded portion, the sensor wire folded portion is fixed to the left insulating flat plate protruding from the adhesive layer, the risk of causing disconnection in the protruding sensor wire folded portions during the production process there were. Also,
Work to adhere the sensor line folded portion with an adhesive insulating flat plate takes time to solidification of the adhesive, on inferior in workability, there is a drawback that the weight amount corresponding sensor plate of the adhesive becomes heavy.
【0004】 本考案は、前記諸欠点が解消し、簡便な
手段でセンサ線折り返し部を断線の危険から保護し、製
造工程中に取扱い易いデジタイザセンサ板を提供するも
のである。The present invention solves the above-mentioned drawbacks, and provides a digitizer sensor plate that protects the folded portion of the sensor wire from the risk of disconnection by a simple means and is easy to handle during the manufacturing process.
【0005】[0005]
【課題を解決するための手段】絶縁被覆を施したセンサ
線2を絶縁平板3上のX軸及びY軸方向それぞれに所定
の間隔で、絶縁平板3の外側にセンサ線折り返し部7を
設けて蛇行状に布線し、X軸方向及びY軸方向に布線し
たセンサ線2のリード 線端末部8を絶縁平板3から導出
し、絶縁平板周縁部11を除い たセンサ線2を接着剤5
により充填固着するデジタイザセンサ板において、前記
絶縁平板外側のセンサ線折り返し部7が前記接着剤5の
充填されていない絶縁平板周縁部11内に折り曲げられ
て 配置されているとともに、該センサ線折り返し部7に
はセンサ線 折り返し部7を覆う端末リード線導出口を具
備する保護カバー6 が配設されているものである。At predetermined intervals, each X-axis and Y-axis directions on the sensor line 2 an insulating flat plate 3 which has been subjected to insulating coating SUMMARY OF THE INVENTION, by providing a sensor line folded portion 7 on the outer side of the insulating flat plate 3 It was laid in a meandering shape, X-axis direction and the Y-axis direction in the sensor lines 2 laid lead wire end portion 8 derived from insulating flat plate 3, the insulating flat peripheral portion 11 sensor line 2 adhesive was divided 5
More in digitizer sensor plate to be filled fixed, bent on the insulating flat outer sensor lines folded portion 7 is not filled with the adhesive 5 in the insulating flat peripheral portion 11
Together they are arranged Te, to the sensor line folded portion 7
Is a terminal lead wire outlet for covering the sensor wire return part 7.
In which the protective cover 6 for Bei is disposed.
【0006】[0006]
【作用】センサ線折り返し部が絶縁平板周縁部に折り曲
げ配置された後、このセンサ線折り返し部が保護カバー
で覆われたことにより、作業工程中でのセンサ線折り返
し部の断線事故が防止される。また、従来の接着剤に代
えて保護カバーを用いたで、センサ板の軽量化が図ら
れ、製造工程中の取扱いも容易となる。なお、保護カバ
ーは絶縁平板にネジ止め等で着脱自在に固定すれば、セ
ンサ板の補修等の作業の際に好都合である。[Action] After the sensor wire folded portion is arranged bent in the insulating flat plate periphery, by the sensor line folded portion is broken covered with a protective cover, which prevents accidental disconnection of the sensor line folded portion in a working process . In addition, using the protective cover in place of a conventional adhesive, weight of the sensor plate is achieved, the easy handling during the manufacturing process. It should be noted that if the protective cover is detachably fixed to the insulating flat plate by screwing or the like, it is convenient for work such as repair of the sensor plate.
【0007】[0007]
【実施例】以下、本考案を図1,図2,図3に沿って説
明する。図1は本考案の一実施例を示すセンサ板の断面
図で、図2は保護カバーの一実施例を示す部分斜視図、
図3はセンサ線の布線を説明するための図である。図1
において、2は極細マグネットワイヤなどの絶縁被膜を
施したセンサ線であり、3は透明ガラス或はエポキシガ
ラス板等からなる絶縁平板、5は充填層となる接着剤、
6はプラスチック材の保護カバーである。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to FIGS. FIG. 1 is a sectional view of a sensor plate showing an embodiment of the present invention, and FIG. 2 is a partial perspective view showing an embodiment of a protective cover.
FIG. 3 is a diagram for explaining wiring of sensor lines. Figure 1
In the figure, 2 is a sensor wire having an insulating coating such as an ultra-fine magnet wire, 3 is an insulating flat plate made of transparent glass or epoxy glass plate, 5 is an adhesive to be a filling layer
6 is a protective cover made of a plastic material.
【0008】 本考案のデジタイザセンサ板は従来技術
の欄に説明したと同様、次のようにして製造される。ま
ず、図3に示すように絶縁平板3の外側周縁に所定間隔
で配設された複数本のセンサ線布線用ピン4にセンサ線
2を順次引っ掛け折り返しながらX軸方向及びY軸方向
にそれぞれ所定のパターンで布線する。そして、X軸方
向及びY軸方向それぞれのセンサ線2,2の端末リード
8,8を絶縁平板3から導出させる。そして、センサ線
2が所定パターンに布線された絶縁平板3上の周縁部11
を除いたセンサ線2上から接着剤5を塗布し、センサ線
2を絶縁平板3上に固着させる。次に、センサ線2の折
り返し部7をセンサ線布線用ピン4から取り外し、接着
剤5の塗布されていない絶縁平板3上の周縁部11に折り
曲げ配置する。[0008] The present invention of a digitizer sensor board similar to the described in the column of the prior art is manufactured as follows. Well
Instead, as shown in FIG. 3, the sensor wires 2 are sequentially hooked and folded back on a plurality of sensor wire arranging pins 4 arranged at a predetermined interval on the outer peripheral edge of the insulating flat plate 3 in the X-axis direction and the Y-axis direction, respectively. Arrange in a prescribed pattern . Then , the terminal leads 8, 8 of the sensor lines 2, 2 in the X-axis direction and the Y-axis direction are led out from the insulating flat plate 3. Then, the peripheral portion 11 on the insulating flat plate 3 in which the sensor wire 2 is wired in a predetermined pattern
The adhesive 5 is applied from above the sensor wire 2 excluding the above to fix the sensor wire 2 on the insulating flat plate 3. Next, the folded-back portion 7 of the sensor wire 2 is removed from the sensor-wiring pin 4 and is bent and arranged on the peripheral portion 11 on the insulating flat plate 3 to which the adhesive 5 is not applied.
【0009】 次に、図1に示す如く絶縁平板3上に折
り曲げられたセンサ線2の折り返し部7を覆うように保
護カバー6(図2図示する)を絶縁平板3上に配設し、
保護カバー6を絶縁平板3にネジ10等で固定する。この
時、センサ線2,2の端末リード部8,8は保護カバー
6に設けたセンサ線導出口9から導出され、センサ板1
が構成される。なお、保護カバー6の形状は実施例のも
のに限定されることなく種々変更可能なことはいうまで
もない。さらに、保護カバー6を絶縁平板3へ取付け固
定させるに際し、接着剤を用いて固定してもよく、保護
カバー6に溝を設けて保護カバー6を絶縁平板3に嵌着
させてもよい。[0009] Next, disposed on the insulating flat plate 3 the folded portion 7 cover 6 so as to cover the sensor lines 2 which is folded over the insulating flat plate 3 (that shown in FIG. 2 FIG.) As shown in FIG. 1,
The protective cover 6 is fixed to the insulating flat plate 3 with screws 10 or the like. At this time, the terminal lead portions 8, 8 of the sensor wires 2, 2 are led out from the sensor wire lead-out port 9 provided in the protective cover 6, and the sensor plate 1
Is configured. Needless to say, the shape of the protective cover 6 is not limited to that of the embodiment and can be variously changed. Further, when the protective cover 6 is attached and fixed to the insulating flat plate 3, the protective cover 6 may be fixed by using an adhesive, or a groove may be provided in the protective cover 6 and the protective cover 6 may be fitted to the insulating flat plate 3.
【0010】[0010]
【考案の効果】本考案のデジタイザセンサ板は、セ ンサ
線布線時にセンサ線折り返し部が絶縁平板の外側にある
センサ板において、センサ線折り返し部が絶縁平板周縁
内に折り曲げ配置されるとともに、このセンサ線折り返
し部を覆う保護カバーが絶縁平板に配設固定されたもの
であるから、製造工程中の外力等による断線事故の防止
が図られ、信頼性の高いセンサ板が得られる。また、従
来の接着剤に代え保護カバーを用いたことによりセンサ
板の軽量化が図られ、製造工程中の取扱い性も改善され
る。[Effect of devised the present invention of the digitizer sensor plate, sensor
In the sensor board sensor line folded portion is outside the insulating flat plate at line wiring, with the sensor line folded portion is arranged folded in an insulating flat plate periphery, the protective cover insulating flat plate disposed to cover the sensor line folded portion since those fixed, preventing accidental disconnection due to external force or the like during the production process is achieved, a high sensor plate reliability. Further, by using a protective cover instead of the conventional adhesive, the weight of the sensor plate can be reduced and the handleability during the manufacturing process can be improved.
【図1】本考案の一実施例を示すデジタイザセンサ板の
要部断面図である。FIG. 1 is a sectional view of an essential part of a digitizer sensor plate showing an embodiment of the present invention.
【図2】本考案に用いられる保護カバーの部分斜視図で
ある。FIG. 2 is a partial perspective view of a protective cover used in the present invention.
【図3】デジタイザセンサ板製造時のセンサ線布線工程
を説明する図である。FIG. 3 is a diagram illustrating a sensor wire wiring step at the time of manufacturing the digitizer sensor plate.
【図4】従来例のデジタイザセンサ板の断面図である。FIG. 4 is a sectional view of a conventional digitizer sensor plate.
1 デジタイザセンサ板 2 センサ線 3 絶縁平板 4 センサ線布線用ピン 5,5A 接着剤 6 保護カバー 7 センサ線折り返し部 8 センサ線のリード線端末部 9 端末リード線導出口 10 ネジ 11 デジタイザセンサ板の周縁部 1 digitizer sensor plate 2 sensor wire 3 insulating flat plate 4 sensor wire wiring pin 5,5A adhesive 6 protective cover 7 sensor wire folded portion 8 sensor wire lead wire terminal 9 terminal lead wire outlet 10 screw 11 digitizer sensor plate Edge of
Claims (1)
3上のX軸及びY軸方向それぞれに所定の間隔で、絶縁
平板3の外側にセンサ線折り返し部7を設けて蛇行状に
布線し、X軸方向及びY軸方向に布線したセンサ線2の
リード線端末部8を絶縁平板3から導出し、絶縁平板周
縁部11を除いたセンサ線2を接着剤5により充填固着
す るデジタイザセンサ板において、前記絶縁平板外側の
センサ線折り返し部7が前記接着剤5の充填されていな
い絶縁平板周縁部11内に折り曲げられて配置されてい
るとともに、該センサ線折り返し部7にはセンサ線折り
返し部7を覆う端末リード線導出口を具備する保護カバ
ー6が配設されていることを特徴とするデジタイザセン
サ板。1. A sensor wire 2 having an insulating coating is applied to an insulating flat plate.
At predetermined intervals in the X-axis and Y-axis directions on the 3, with a sensor line folded portion 7 on the outer side of the insulating flat plate 3 was laid in a meandering shape, sensor rays laid in the X-axis and Y-axis directions 2 's
Deriving a lead wire end portion 8 of an insulating flat plate 3, and more filling fixed to the adhesive 5 to the sensor line 2 was divided insulating flat peripheral portion 11
In the digitizer sensor board it, the is arranged insulated flat outside of the sensor wire folded portion 7 is bent in the insulating flat peripheral edge 11 which is not filled with the adhesive 5
In addition , the sensor wire folding section 7
Digitizer sensor plate, characterized in that the protective cover 6 having a terminal lead wire outlet to cover the return portion 7 is disposed.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1991065127U JPH089787Y2 (en) | 1991-07-23 | 1991-07-23 | Digitizer sensor plate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1991065127U JPH089787Y2 (en) | 1991-07-23 | 1991-07-23 | Digitizer sensor plate |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0512940U JPH0512940U (en) | 1993-02-19 |
JPH089787Y2 true JPH089787Y2 (en) | 1996-03-21 |
Family
ID=13277901
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1991065127U Expired - Lifetime JPH089787Y2 (en) | 1991-07-23 | 1991-07-23 | Digitizer sensor plate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH089787Y2 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52129094U (en) * | 1976-03-27 | 1977-10-01 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61118327U (en) * | 1985-12-26 | 1986-07-25 |
-
1991
- 1991-07-23 JP JP1991065127U patent/JPH089787Y2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0512940U (en) | 1993-02-19 |
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