JPH0542511Y2 - - Google Patents

Description

[Detailed description of the invention] [Field of industrial application] The present invention relates to a digitizer sensor plate used in information input devices such as CAD, and more specifically, the structure of an electromagnetic induction type digitizer sensor plate, especially the sensor wire. This relates to the structure of the folded portion.

[Conventional technology]

An example of a conventional digitizer sensor plate is shown in FIGS. 4 and 5. Of these, the digitizer sensor plate 11 shown in FIG. 4 is manufactured as follows.
First, as shown in FIG. 3a, a plurality of sensor wires 1
is folded back at the support 7 for wiring the sensor wire 1, and the first
The wires are laid out in a predetermined pattern on the insulating plate 2. Next, the second insulating plate 3 is placed and fixed on the wired sensor wire 1 via the adhesive 4. Then, the folded portion 1' of the sensor wire 1 is removed from the support 7, and the state shown in FIG. 3b is formed. In this state, the two insulating plates 2 and 3
The folded part 1' of the sensor wire 1 protruding outward from between the adhesive 4 applied to the edge of the sensor plate
The digitizer sensor plate 11 as shown in FIG. 4 is manufactured by enclosing and fixing it as it is inside. Also, the fifth
The digitizer sensor plate 12 as shown in the figure is produced in the same manner as the digitizer sensor plate 11 described above, and in the state shown in 3b, the sensor wire 1 protrudes outward from between the two insulating plates 2 and 3. The folded portion 1' was constructed by being sealed and fixed in an adhesive 4 on a reinforcing plastic film 5 attached to a first insulating plate 2.

[The problem that the idea aims to solve]

The conventional digitizer sensor plates 11 and 12 mentioned above
However, the adhesive is easily deformed by mechanical pressure and other shocks received during assembly work or when moving the product, causing it to peel or break easily, and the sensor wire is easily broken at the folded part due to this deformation or breakage. . Furthermore, since the folded portion of the sensor wire is sealed and fixed in the adhesive while remaining exposed to the outside from the edge of the sensor plate, there is a drawback that the sensor plate becomes larger. SUMMARY OF THE INVENTION An object of the present invention is to provide a compact digitizer sensor plate with enhanced protection for the folded portion of the sensor wire.

[Means to solve the problem]

The digitizer sensor board of the present invention includes a first insulating board and a plurality of wiring supports installed at predetermined intervals along the outer periphery of the first insulating board. A digitizer sensor board comprising a plurality of sensor wires wired in a predetermined pattern on the cloth, and a second insulating plate placed and fixed through an adhesive applied from above the sensor wires. The folded part of the sensor wire formed on the wire support section and removed is bent along the edge of the sensor plate,
A structural feature is that it is molded and fixed to the end face of the sensor plate with adhesive.

[Effect]

In the digitizer sensor plate of the present invention, the folded part of the sensor wire is bent along the edge of the sensor plate and fixed to the sensor plate, so that the folded part of the sensor wire is less susceptible to deformation due to mechanical pressure etc. from the surrounding area. This not only increases the adhesive strength of the folded part of the sensor wire, but also reduces the size of the digitizer sensor plate.

〔Example〕

The present invention will be explained below with reference to the drawings. FIG. 1 is a block diagram showing a digitizer sensor plate according to an embodiment of the present invention, and FIG. 2 is a partial cross-sectional view showing the structure of a digitizer sensor plate according to an embodiment of the present invention. Third
The figure is an explanatory view showing the manufacturing process of the digitizer sensor plate. In the figure, numeral 1 is a sensor wire made of a very thin conducting wire such as a magnet wire, numerals 2 and 3 are insulating plates, and numerals 4 and 4' are adhesives. 1' is a folded portion of the sensor wire 1. Reference numeral 6 indicates the edge of the sensor plate 10, specifically the edges of the insulating plates 2 and 3. The digitizer sensor plate 10 of the present invention is manufactured as shown in FIGS. 3a to 3d. First of all,
As shown in FIG. 3a, a plurality of sensor wire wiring supports 7 are installed at predetermined intervals along the outer periphery of the first rectangular insulating plate 2 made of a glass plate or a glass epoxy laminate. A plurality of sensor wires 1 made of ultra-fine wires such as magnet wires are sequentially hooked, folded back, and wired on an insulating plate 2 in a predetermined pattern. Next, an adhesive 4' made of epoxy resin or the like is applied onto the sensor wires laid out in a predetermined pattern on the insulating plate 2, and the second insulating plate 3 is placed and fixed on top of the adhesive 4'. . Subsequently, after the adhesive 4' has hardened, the sensor wire folded portion 1' is removed from the sensor wire wiring support 7, as shown in FIG. 3b. The sensor wire folded portion 1' removed from the sensor wire wiring support 7 is shown in Fig. 3c.
As shown in the figure, the sensor plate 10 is bent along the edge 6. Then, as shown in FIG. 3d, a groove 9 for forming the sensor wire folded portion 1' is formed.
The sensor wire folded portion 1' is molded and fixed along the edge 6 of the sensor plate 10 by the molded plate 8 provided with the digitizer sensor plate 10.

[Effect of idea]

The digitizer sensor plate of the present invention has a structure in which the folded part of the sensor wire is bent along the edge of the sensor plate and is molded and fixed to the sensor plate with adhesive. Less susceptible to deformation due to impact. Therefore, disconnection of the sensor wire due to this deformation is prevented,
A highly reliable digitizer sensor plate can be obtained.
Furthermore, the folded portion of the sensor wire is bent along the edge of the sensor plate, thereby reducing the size of the sensor plate. Furthermore, since the folded portion of the sensor wire is molded and fixed to the sensor plate, a digitizer sensor plate with excellent appearance can be obtained. There is a certain effect.

[Brief explanation of the drawing]

FIG. 1 is a configuration diagram showing a digitizer sensor plate according to an embodiment of the present invention, and FIG. 2 is a partial cross-sectional view showing the configuration of a digitizer sensor plate according to an embodiment of the present invention.
3a to 3d are explanatory diagrams showing the manufacturing process of the digitizer sensor plate of the present invention, and FIGS. 4 and 5 are sectional views each showing the structure of a conventional digitizer sensor plate. 1...Sensor wire, 1'...Folded portion of sensor wire, 2, 3...Insulating plate, 4, 4'...Adhesive, 6
... Edge of sensor plate, 7 ... Wiring support, 8 ... Molded plate, 9 ... Groove, 10 to 12 ... Digitizer sensor plate.

Claims (1)

[Scope of utility model registration request] Wires are laid in a predetermined pattern on the first insulating plate via a first insulating plate and a plurality of wiring supports planted at predetermined intervals along the outer periphery of the first insulating plate. a plurality of sensor wires, and a second sensor wire placed and fixed via an adhesive applied from above the sensor wires.
In the digitizer sensor plate comprising an insulating plate, the folded portion of the sensor wire formed on the wiring support portion and removed is bent along the edge of the sensor plate, and molded and fixed to the sensor plate with adhesive. A digitizer sensor plate characterized by: