JPH0386440U - - Google Patents
Info
- Publication number
- JPH0386440U JPH0386440U JP14623089U JP14623089U JPH0386440U JP H0386440 U JPH0386440 U JP H0386440U JP 14623089 U JP14623089 U JP 14623089U JP 14623089 U JP14623089 U JP 14623089U JP H0386440 U JPH0386440 U JP H0386440U
- Authority
- JP
- Japan
- Prior art keywords
- plate
- sensor
- wiring
- insulating plate
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Description
第１図は、本考案の一実施例のデジタイザセン
サ板の構成図、第２図は本考案の一実施例の部分
横断面図、第３図ａ〜ｄは本考案の一実施例の製
造工程の説明図、第４、第５図はそれぞれ従来の
デジタイザセンサ板の断面図である。
１……センサ板、１′……折り返し部、２，３
……絶縁板、４，４′……接着剤、６……端縁、
７……布線用支柱、８……成型板、９……溝、１
０〜１２……デジタイザセンサ板。
FIG. 1 is a configuration diagram of a digitizer sensor plate according to an embodiment of the present invention, FIG. 2 is a partial cross-sectional view of an embodiment of the present invention, and FIGS. 3 a to d are manufacturing examples of an embodiment of the present invention. The process explanatory diagrams, FIGS. 4 and 5, are sectional views of a conventional digitizer sensor plate, respectively. 1...Sensor plate, 1'...Folded part, 2, 3
...Insulating plate, 4, 4'...Adhesive, 6...Edge,
7... Wiring support, 8... Molded plate, 9... Groove, 1
0-12...Digitizer sensor board.
Claims (1)
された複数の布線用支柱を用いて、複数本のセン
サ線を前記第１の絶縁板上に所定のパターンで布
線し、接着剤を介して第２の絶縁板を載置固定し
たデジタイザセンサ板において、前記布線用支柱
部に形成されるセンサ線の折り返し部をセンサ板
端縁に沿つて折り曲げ、これを接着剤により成型
固着したことを特徴とするデジタイザセンサ板。 Wiring a plurality of sensor wires in a predetermined pattern on the first insulating plate using a plurality of wiring supports planted at predetermined intervals along the outer periphery of the first insulating plate; In a digitizer sensor plate on which a second insulating plate is mounted and fixed via an adhesive, the folded portion of the sensor wire formed on the wiring support portion is bent along the edge of the sensor plate, and this is folded with the adhesive. A digitizer sensor plate characterized by being molded and fixed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14623089U JPH0542511Y2 (en) | 1989-12-19 | 1989-12-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14623089U JPH0542511Y2 (en) | 1989-12-19 | 1989-12-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0386440U true JPH0386440U (en) | 1991-09-02 |
| JPH0542511Y2 JPH0542511Y2 (en) | 1993-10-26 |
Family
ID=31692829
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14623089U Expired - Lifetime JPH0542511Y2 (en) | 1989-12-19 | 1989-12-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0542511Y2 (en) |
-
1989
- 1989-12-19 JP JP14623089U patent/JPH0542511Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0542511Y2 (en) | 1993-10-26 |