JPH0546478U - IC module structure - Google Patents

Abstract

(57) [Summary] [Object] An object of the present invention is to provide a structure of an IC module capable of increasing the breakdown voltage in the vertical direction with respect to the thickness of the IC card without increasing the thickness of the IC module. . According to the IC module of the present invention, at least one of the metal foil electrodes formed on the surface of the insulating substrate of the IC module is projected outward from the insulating substrate and is formed along the edge of the insulating substrate to form an outer edge. Or a metal foil is formed outside the metal foil electrode formed on the surface of the insulating substrate of the IC module so as to be insulated from the metal foil electrode, and the metal foil is projected outward from the insulating substrate to form an outer edge. The outer edge portion was bent toward the back surface side of the insulating substrate at the end portion of the insulating substrate, and the outer edge portion was embedded in the module resin integrally molded.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a structure for increasing strength against bending in the thickness direction of an IC module used for an IC card.

[0002]

[Prior Art]

 In the IC module used in recent IC cards, metal foil electrodes are formed on the front and back sides of an insulating substrate with through holes, and the IC chip mounted on the back side of the substrate and the metal foil electrode on the back side are bonded by wires. After that, the IC chip is sealed by transfer molding.

[0003]

[Problems to be solved by the device]

 To embed such an IC module in an ISO standard IC card, 0. It had to have a thickness of about 5 mm and was weak against a load in the direction perpendicular to the flat surface.

[0004]

[Means for Solving the Problems]

 An object of the present invention is to provide a structure of an IC module capable of increasing the vertical breakdown voltage without increasing the thickness of the IC module, and therefore at least one of the metal foil electrodes formed on the surface of the insulating substrate of the IC module is provided. Module protruding outward from the insulating substrate and formed along the edge of the insulating substrate to form an outer edge portion, and the outer edge portion is bent toward the back surface side of the insulating substrate at the end portion of the insulating substrate, and is integrally molded. A metal foil is formed by burying the outer edge portion in a resin or formed on the surface of an insulating substrate of an IC module and is insulated from the outer metal foil electrode, and the metal foil is insulated. To the outer edge portion, the outer edge portion is bent at the end of the insulating substrate toward the back surface side of the insulating substrate, and the outer edge portion is embedded in the module resin integrally molded. .

[0005]

[Action]

 In the present invention, the ribs are formed by using the metal foil formed on the insulating substrate of the IC module, and the ribs are embedded in the resin that is integrally molded, so that the deformation of the resin against the pressing force is prevented. Therefore, it is possible to provide an IC module that is resistant to bending without increasing its thickness.

[0006]

【Example】

 An embodiment of the present invention will be described with reference to the drawings. 1 and 2 show a preferred embodiment of the present invention. In the IC module 2 of this embodiment, 6a and 6d of the metal foil electrodes 6a to 6f formed on the front surface side of the insulating substrate 4 are projected to the outside of the insulating substrate 4 and along the edge 8 of the insulating substrate. The outer edge portion 10 is formed. The outer edge portion 10 has an end edge portion 12a of the insulating substrate 4 and an intermediate bent portion 12b which are bent at substantially right angles on the back surface side to form ribs 24. After that, the IC chip 14 is adhesively fixed to the back surface of the insulating substrate 4, bonded to the electrode foils 6g to 6l formed on the back surface side by the wire 16, and then sealed by transfer molding to form the resin 18. At the time of sealing, it is important to bury the rib 24 in the resin 18.

If a plurality of through holes 22 are provided in the outer edge portion 10, the bonding force with the resin 18 is increased, and the outer edge portion 10 becomes stronger against deformation in the thickness direction. FIG. 3 shows another embodiment, which is the same as the outer edge portion 10 except that the outer edge portion 10 is bent substantially at a right angle to the back side by the end edge portion 12a of the insulating substrate 4 and the intermediate bent portion 12b. An independent metal foil, which is insulated from the metal foil electrodes 6a to 6f, is formed outside the metal foil electrodes 6a to 6f formed in 4, and the metal foil is projected outward from the insulating substrate to form the outer edge portion 10. It is different in that it is said. In this way, the connection with the insulating substrate can be sufficiently secured, and the bending process can be facilitated.

Although the outer edge portion is formed in two directions in this embodiment, it may be provided over substantially the entire circumference of the insulating substrate. Further, in this embodiment, the bending is performed twice, but it may be performed once.

[0009]

[Effect of the device]

 As described above, according to the present invention, at least one of the metal foil electrodes formed on the surface of the insulating substrate of the IC module is projected to the outside of the insulating substrate and is formed along the edge of the insulating substrate to form the outer edge portion. The outer edge portion is bent at the end portion of the substrate, and the outer edge portion is buried in the module resin integrally formed with the outer edge portion, or at least one of the metal foil electrodes formed on the insulating substrate surface of the IC module is insulated substrate. The outer edge of the insulating substrate, and the outer edge is bent along the edge of the insulating substrate.The outer edge is bent at the edge of the substrate, and the outer edge is embedded in the module resin integrally molded. Therefore, it is possible to provide the structure of the IC module that can increase the withstand voltage in the thickness direction without increasing the thickness of the IC module.

[Brief description of drawings]

FIG. 1 is a perspective view of an IC module according to the present invention.

FIG. 2 is an explanatory view showing a state of an outer edge portion which is not bent.

FIG. 3 is an explanatory view showing a state of an outer edge portion which is not bent according to another embodiment.

[Explanation of symbols]

 2 IC module 4 Insulating substrate 6a-6b Metal foil electrode 10 Outer edge 18 Module resin

Claims (2)

[Scope of utility model registration request] 1. An outer edge portion of at least one of metal foil electrodes formed on a surface of an insulating substrate of an IC module, which projects outward from the insulating substrate and is formed along an edge of the insulating substrate to form an outer edge portion. A structure of an IC module in which the outer edge portion is buried in a module resin integrally molded by bending the portion at the end portion of the insulating substrate to the back surface side of the insulating substrate. 2. A metal foil is formed outside the metal foil electrode formed on the surface of the insulating substrate of the IC module so as to be insulated from the metal foil electrode, and the metal foil is projected outward from the insulating substrate. A structure of an IC module in which an outer edge portion is formed, the outer edge portion is bent toward the back surface side of the insulating substrate at an end portion of the insulating substrate, and the outer edge portion is embedded in a module resin integrally molded.