JPH0516908A - Taping method for electronic part - Google Patents
Taping method for electronic partInfo
- Publication number
- JPH0516908A JPH0516908A JP2309716A JP30971690A JPH0516908A JP H0516908 A JPH0516908 A JP H0516908A JP 2309716 A JP2309716 A JP 2309716A JP 30971690 A JP30971690 A JP 30971690A JP H0516908 A JPH0516908 A JP H0516908A
- Authority
- JP
- Japan
- Prior art keywords
- taping
- external lead
- lead wire
- lead wires
- external
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、ラジアルタイプ電子部品の外部リー ド線を台紙と粘着テープにて固定するテーピング 方法に関する。TECHNICAL FIELD The present invention relates to a taping method for fixing an external lead wire of a radial type electronic component with a mount and an adhesive tape.
従来、この種のラジアルタイプ電子部品のテー ピング方法は、第３図に示すように外部リード線 ２が直線状の状態で、台紙３と粘着テープ４によ り固定する構造となっていた。 Conventionally, a taping method for this type of radial type electronic component has a structure in which the external lead wire 2 is in a linear state as shown in FIG. 3 and is fixed by a mount 3 and an adhesive tape 4.
上述した従来のテーピング方法は、外部リード 線が直線状であり、これを固定する台紙及び粘着 テープが平面状となっているので、外力に対抗す るテーピング強度としては１方向のみが強く、す なわち３方向の力を第３図のようにＦ１，Ｆ２， Ｆ３とすると、Ｆ３のみが強くＦ１，Ｆ２が弱く なり易いという欠点がある。 In the conventional taping method described above, the external lead wire is linear, and the mount and the adhesive tape for fixing the external lead wire are planar. Therefore, the taping strength against external force is strong only in one direction. That is, if the forces in the three directions are F1, F2, and F3 as shown in FIG. 3, there is a disadvantage that only F3 is strong and F1 and F2 tend to be weak.
本発明は、外部リード線を台紙と粘着テープの 間にはさみ固定する電子部品の固定方法におい て、テーピングされる電子部品の外部リードがあ らかじめＬ型に成形されていることを特徴とす る。 The present invention relates to a method of fixing an electronic component in which an external lead wire is sandwiched and fixed between a mount and an adhesive tape, wherein the external lead of the electronic component to be taped is preliminarily formed into an L-shape. Suru
次に、本発明について図面を参照して説明す る。第１図は本発明の第１の実施例の斜視図であ る。ラジアルタイプの電子部品はモールド部１と 外部リード線２により構成され、外部リード線２ は図のようにあらかじめＬ型に成形されている。 Next, the present invention will be described with reference to the drawings. FIG. 1 is a perspective view of the first embodiment of the present invention. The radial type electronic component is composed of a mold part 1 and an external lead wire 2, and the external lead wire 2 is preliminarily molded into an L shape as shown in the figure.
成形部の長さは、外部リード線幅の２〜１０倍と するのが望ましい。この外部リード線２の成形部 をテーピング台紙３の上に粘着テープ４を用いて 接着し固定してテーピングする。The length of the molded portion is preferably 2 to 10 times the width of the external lead wire. The molded portion of the external lead wire 2 is adhered and fixed on the taping mount 3 with an adhesive tape 4 to be taped.
第２図は本発明の第２の実施例の斜視図であ る。この実施例では外部リード線２は貼り付け固 定されるテーピング台紙３に対して垂直方向に成 形されている。従って、外部リード線２がテーピ ング台紙３に固定される時は、テーピング台紙３ をつきさすか、あるいは前もってテーピング台紙 ３にリード線挿入用の穴をあけておくことが必要 となる。この場合、成形部の長さは、外部リード 線幅の１〜２倍とするのが望ましく、またテーピ グ台紙板厚と同等の長さであることが望ましい。 FIG. 2 is a perspective view of the second embodiment of the present invention. In this embodiment, the external lead wire 2 is formed in the vertical direction with respect to the taping mount 3 which is fixedly attached. Therefore, when the external lead wire 2 is fixed to the taping mount 3, it is necessary to attach the taping mount 3 or to make a hole for inserting the lead wire in the taping mount 3 in advance. In this case, it is desirable that the length of the molding portion be 1 to 2 times the width of the external lead wire, and it is desirable that the length be equal to the thickness of the tape mount board.
以上説明したように本発明は、外部リード線を あらかじめＬ型に成形した後に台紙と粘着テープ でテーピングすることにより、第１の実施例では ２次元の方向に有効接着面積を広くとることがで き、更に第２の実施例では３次元の方向に立体的 に固定されるため強固なテーピング強度を得るこ とができ外力により抜けや変形を防止できる効果 がある。 As described above, according to the present invention, the external lead wire is preliminarily formed into an L shape and then taped with the mount and the adhesive tape, so that the effective bonding area can be widened in the two-dimensional direction in the first embodiment. Furthermore, in the second embodiment, since the tape is fixed three-dimensionally in the three-dimensional direction, a strong taping strength can be obtained, and there is an effect that the pull-out and the deformation can be prevented by an external force.
第１図は本発明のテーピング状態の第１の実施 例の斜視図、第２図は本発明の第２の実施例の斜 視図、第３図は従来のテーピング状態の斜視図で 外力の方向に対するテーピング強度の種類を説明 するものである。 １…モールド部、２…外部リード線、３…テー ピング台紙、４…粘着テープ。 FIG. 1 is a perspective view of the first embodiment of the taping state of the present invention, FIG. 2 is a perspective view of the second embodiment of the present invention, and FIG. 3 is a perspective view of the conventional taping state of the external force. It explains the types of taping strength with respect to the direction. 1 ... Mold part, 2 ... External lead wire, 3 ... Taping mount, 4 ... Adhesive tape.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2309716A JPH0516908A (en) | 1990-11-15 | 1990-11-15 | Taping method for electronic part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2309716A JPH0516908A (en) | 1990-11-15 | 1990-11-15 | Taping method for electronic part |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0516908A true JPH0516908A (en) | 1993-01-26 |
Family
ID=17996437
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2309716A Pending JPH0516908A (en) | 1990-11-15 | 1990-11-15 | Taping method for electronic part |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0516908A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20150044910A (en) | 2012-08-17 | 2015-04-27 | 닛키 쇼쿠바이카세이 가부시키가이샤 | Catalyst for hydrocarbon catalytic cracking |
| KR20160003200A (en) | 2013-05-28 | 2016-01-08 | 닛키 쇼쿠바이카세이 가부시키가이샤 | Catalyst for catalytic cracking of hydrocarbon, and process for producing same |
| KR20160135727A (en) | 2014-03-17 | 2016-11-28 | 니끼 쇼꾸바이 카세이 가부시키가이샤 | Device for testing catalyst for use fluid catalytic cracking |
| CN106829020A (en) * | 2015-12-05 | 2017-06-13 | 佛山市欣源电子股份有限公司 | A kind of location technology of braid formula electric capacity |
-
1990
- 1990-11-15 JP JP2309716A patent/JPH0516908A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20150044910A (en) | 2012-08-17 | 2015-04-27 | 닛키 쇼쿠바이카세이 가부시키가이샤 | Catalyst for hydrocarbon catalytic cracking |
| KR20160003200A (en) | 2013-05-28 | 2016-01-08 | 닛키 쇼쿠바이카세이 가부시키가이샤 | Catalyst for catalytic cracking of hydrocarbon, and process for producing same |
| KR20160135727A (en) | 2014-03-17 | 2016-11-28 | 니끼 쇼꾸바이 카세이 가부시키가이샤 | Device for testing catalyst for use fluid catalytic cracking |
| CN106829020A (en) * | 2015-12-05 | 2017-06-13 | 佛山市欣源电子股份有限公司 | A kind of location technology of braid formula electric capacity |
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