JP2995377B2 - Digitizer sensor plate - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electromagnetic induction type digitizer sensor plate used for an information input device such as a CAD.

[0002]

2. Description of the Related Art Conventionally, as an electromagnetic induction type digitizer sensor plate, for example, an insulated sensor wire such as a magnet wire is laid in a X-axis direction and a Y-axis direction on a rectangular hard insulating plate. A sensor wire orthogonal wiring network is formed, and the sensor wire orthogonal wiring network is filled and fixed on the insulating flat plate with an adhesive, and the sensor wire orthogonal wiring network is connected to the insulating flat plate and another insulating flat plate. A configuration in which the components are sandwiched and fixed with an adhesive therebetween has been generally used.

The above-mentioned digitizer sensor plate is generally manufactured as follows. FIG.
First, a plurality of sensor wiring pins 21 are arranged in a predetermined pattern around the outer periphery of a rectangular hard insulating flat plate 20, but different sensor wiring sizes and patterns are used for different sensor wiring. The sensor wiring pins 21 are arranged using a frame (not shown). Next, the insulation sensor wire 26 made of a magnet wire is connected to the wiring pins 2 on the opposite sides.
The sensor wire is hooked and folded back to form a sensor wire folded portion 22 so as to form a sensor wire folded portion 22 to form a sensor wire orthogonal wiring network 23. Then, an ultraviolet curable adhesive 24 is applied on the sensor wire orthogonal wiring net 23, and the applied adhesive 2
4, another insulating flat plate 25 is disposed from above, and the sensor wire orthogonal wiring network 23 is connected to the two insulating flat plates 20 via an adhesive 24.
At 25, the film is pinched and fixed and irradiated with ultraviolet rays. After the adhesive 24 is cured, the sensor wire folded portion 22 removed from the sensor wiring pin 21 is bent to the end surfaces of the two insulating flat plates 20 and 25, and the folded portion 22 is further insulated by the adhesive 24. The digitizer sensor plate was fixed to the end surfaces of the flat plates 20 and 25.

[0004]

In the manufacture of the above-described digitizer sensor plate, a sensor wiring wiring frame base in which the sensor wiring pins 21 can be arranged in a predetermined pattern around the outer periphery of the insulating flat plate 20. Is required for each pattern. Further, after the adhesive 24 has hardened, it is necessary to remove the sensor wire turn-back portion 22 from the sensor wiring pin 21 and fold it on the end surfaces of the two insulating flat plates 20 and 25 and fix them with the adhesive 24. In addition to the large number of steps, the sensor wire return portion 22 is
The work of removing from sensor 1 was manual, and it was easy to break sensor wire 26. Further, the sensor line 26 is easily fixed with a scratch, and there is a problem that the sensor line 26 is disconnected due to distortion after the fixing. For this reason, the digitizer sensor plate was expensive.

An object of the present invention is to provide an inexpensive digitizer sensor plate which solves these difficulties, can share a sensor wiring frame required for each pattern, and can automate the manufacturing process. is there.

[0006]

A square-shaped bottom surface 3 is provided with an outwardly inclined surface 16 at the periphery thereof, and a plurality of sensor wiring pins 2 are integrally formed on the inclined surface 16 to form each edge of the bottom surface 3. A box-shaped transparent hard-wired frame 1 provided with a lead-out port 5 for a lead wire 10 on a peripheral wall 4 provided along the outer wall, or an inclined surface 16 facing outward on a peripheral portion, and a plurality of sensors are provided on the inclined surface 16. The insulating sensor wires 6 are respectively hooked between the sensor wiring pins 2 on opposite sides of the square transparent hard insulating plate 11 in which the wiring pins 2 are integrally formed, and the sensor wires are folded back. An orthogonal wiring net 7 is formed, and a transparent rigid flat plate 8 on the orthogonal wiring network 7 or a box-shaped transparent rigid storage frame 12 provided with a lead wire outlet 5 on the peripheral wall 4 is provided. 5 and the lead wire 10 of the sensor wire 6 is derived,
The orthogonal wiring net 7 is fixed by injecting a visible light curable adhesive 9 from the lead wire outlet 5.

[0007]

Since the sensor wiring pins are integrally molded with a wiring frame having an inclined surface at the periphery or a transparent hard insulating plate having an inclined surface at the periphery, the wiring pins are arranged in a predetermined pattern. The frame for sensor wiring to be installed is shared. Also,
Since there is no need to remove the sensor wire turn-back portion from the sensor wiring pins, workability is improved and disconnection of the sensor wire is prevented. Also, by providing the inclined surface, the wiring frame and the hard insulating plate can be made thinner and lighter, and the sensor wires can be accurately wired by being closely attached to the wiring frame and the hard insulating plate.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to the drawings. Figure 1
FIGS. 2A and 2B are explanatory diagrams each showing a main configuration of a digitizer sensor plate according to the present invention. The digitizer sensor plate of the embodiment shown in FIG. 1 is provided with an inclined surface 16 facing outward at a peripheral portion of a rectangular bottom surface 3, and a plurality of sensor wiring pins 2 are integrally formed on the inclined surface 16 to form a bottom surface 3. And a box-shaped transparent hard-wired frame 1 provided with a lead-out port 5 for a lead wire 10 on a peripheral wall 4 provided along each edge of
A sensor wire orthogonal wiring network 7 in which insulating sensor wires 6 are orthogonally wired, a transparent hard flat plate 8 disposed on the sensor wire orthogonal wiring network 7, and the sensor wire orthogonal wiring network 7; And a visible light curable adhesive 9 for fixing the adhesive.

This digitizer sensor plate is manufactured as follows. First, the wiring frame 1 in a horizontal state with the bottom surface 3 down is fixed to a frame base (not shown) for sensor wiring orthogonal wiring. Next, an insulated sensor wire 6 made of a magnet wire or the like is sequentially hooked between the pins 2 and 2 on the opposite sides, and is orthogonally wired while being folded to form a sensor wire orthogonally wired network 7.

Next, a transparent hard flat plate 8 is arranged from above the orthogonal wiring network 7, and a lead wire 10 of the sensor wire 6 is led out from the outlet 5. Then, a visible light-curable adhesive 9 is injected from the outlet 5 using a syringe, and the adhesive 9 is irradiated with sunlight, which is visible light, to cure the adhesive 9 and manufacture a digitizer sensor plate.

The injection and curing of the adhesive 9 can be performed sequentially after removing the wiring frame 1 from the wiring frame base, so that the wiring frame base can be used efficiently and the productivity is improved. I do.

The digitizer sensor plate of the embodiment shown in FIG. 2 is replaced with the transparent hard wiring frame 1 shown in FIG. 1 and is provided with an outwardly inclined surface 16 at the peripheral portion. A rectangular transparent hard insulating plate 11 integrally formed with the pins 2
And a box-shaped transparent hard storage frame 12 provided with a lead wire outlet 5 on the peripheral wall 4 instead of the transparent hard flat plate 8. Then, the transparent hard storage frame 12 is disposed on the transparent hard insulating plate 11 on which the sensor wire orthogonal wiring network 7 is formed, and the lead wire 10 of the sensor wire 6 is led out from the outlet 5. Then, a visible light curable adhesive 9 is injected from the outlet 5 using a syringe, and the adhesive 9 is irradiated with sunlight, which is visible light, to cure the adhesive 9.

[0013] A digitizer sensor plate according to the present invention comprises a wiring frame having a sensor wire wiring pin provided with an outwardly inclined surface in a peripheral portion, or a transparent hard insulating plate provided with an outwardly inclined surface in a peripheral portion. The integrated molding allows the use of a sensor wiring wiring frame base for arranging wiring pins.
In addition, the provision of the inclined surface reduces the thickness and weight of the wiring frame and the hard insulating plate. It is not necessary to remove the sensor wire turn-back portion from the wiring pins, so that the manufacturing workability is improved, and the disconnection of the sensor wire is prevented.

[0014]

The digitizer sensor plate of the present invention is constituted by using a wiring frame in which the sensor wiring pins are integrally formed or a transparent hard insulating plate, so that the wiring pins are arranged in a predetermined pattern. In order to do so, a plurality of wiring frame bases, which were required in the past, became unnecessary, and the wiring frame base was shared. In addition, the provision of the inclined surface has reduced the thickness and weight of the wiring frame and the rigid insulating plate, and the sensor wires are closely attached to the wiring frame and the rigid insulating plate, and are wired with high accuracy. An inexpensive and inexpensive electromagnetic induction type digitizer sensor plate can be obtained. Further, since it is not necessary to remove the sensor wire turn-back portion from the sensor wiring pins, the disconnection of the sensor wire is eliminated, and the digitizer sensor plate manufacturing process can be automated. In addition, the use of a visible light curable adhesive eliminates the need for a special irradiation device, and facilitates the curing of the adhesive, thereby achieving mass production of digitizer sensor plates. The practical effect is great.

[Brief description of the drawings]

FIG. 1 is an explanatory view showing one embodiment of a digitizer sensor plate of the present invention, wherein FIG. 1 (a) is a plan view showing the outline thereof, and FIG. 1 (b) is a cross section taken along line AA of FIG. 1 (a). FIG.

FIG. 2 is a sectional view of a main part showing another embodiment of the present invention.

FIG. 3 is an explanatory view showing a conventional digitizer sensor plate.
FIG. 1A is an explanatory view showing the manufacturing method, and FIG. 1B is a cross-sectional view showing the structure of the digitizer sensor plate shown in FIG. 1A.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Transparent hard wiring frame 2 Sensor wiring wiring pin 3 Bottom surface 4 Peripheral wall 5 Lead wire outlet 6 Insulated sensor wire 7 Sensor wire orthogonal wiring network 8 Transparent hard flat plate 9 Visible light curing adhesive 10 Lead wire 11 Transparent hard Insulating plate 12 Transparent hard storage frame 16 Inclined surface

Claims (1)

(57) [Claims] 1. An outwardly inclined surface 16 is provided at the periphery of a rectangular bottom surface 3, and a plurality of sensor wiring pins 2 are integrally formed on the inclined surface 16 along each edge of the bottom surface 3. A box-shaped transparent hard wiring frame 1 provided with an outlet 5 for a lead wire 10 on the provided peripheral wall 4, or an outwardly inclined surface 16 is provided in the peripheral portion, and a plurality of sensor wire cloths are provided on the inclined surface 16. The insulating sensor wires 6 are respectively hooked between the sensor wiring pins 2 and 2 on the opposite sides of the square transparent hard insulating plate 11 integrally formed with the wire pins 2 and folded back to form a sensor orthogonal. A wiring net 7 is formed, and a transparent hard flat plate 8 on the orthogonal wiring net 7 or a box-shaped transparent hard storage frame 12 provided with a lead wire outlet 5 on the peripheral wall 4 is provided. The lead wire 10 of the sensor wire 6 is led out from the outlet 5 and the lead wire Digitizer sensor plate, characterized in that it has secured the orthogonal wiring network 7 from the outlet port 5 by injecting a visible light curing adhesive 9.