JPH07281812A - Digitizer sensor plate - Google Patents

Abstract

PURPOSE:To provide an inexpensive electromagnetic induction type digitizer sensor plate which is superior in manufacture operability and high in precision by a simple means. CONSTITUTION:On a sensor line wiring jig constituted so that an insulating hard flat plate 1 is adjustable for position in the vertical direction and pins 4 for sensor line wiring are arrayed and fixed in specific pattern in the outer periphery of the hard flat plate 1, the hard flat plate 1 on which a both-sided adhesive tape 6 is stuck except at the peripheral part of one side is mounted and fixed, the position of the hard flat plate 1 in the vertical direction is adjusted so that the position is lower than the pins 4 for wiring, and an insulating sensor line 3 is hooked to the pins 4 for wiring to form a sensor line orthogonal wire net 8 on the hard flat plate 1 while folded parts 5 are provided, and, the position of the hard flat plate 1 is adjusted, the orthogonal wiring net 8 is adhered to the both-side adhesive tape 6, and a one-sided adhesive tape 7 is pressed against the both-sided adhesive tape 6 and insulating sensor line 3 from above the orthogonal wiring net 8 to fix the orthogonal wiring net 8 to the hard flat plate 1. The folded parts 5 detached from the pins 4 for wiring are folded into the peripheral part of the hard flat plate 1 and fixed to the peripheral part of the hard flat plate 1 with the one-side adhesive tape 7A, thus constituting the digitizer sensor plate.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electromagnetic induction type digitizer sensor plate used for an information input device such as CAD.

[0002]

2. Description of the Related Art In an electromagnetic induction type digitizer sensor plate which has been widely used in the past, for example, as shown in FIG. 4, an insulating sensor wire 3 is formed in each of the X-axis and Y-axis directions of a rectangular insulating hard flat plate 1. Adhesive 9 is applied on the sensor wire orthogonal wiring net 8 formed by laying the sensor wires in a predetermined pattern, and the sensor wire orthogonal wiring net 8 is formed by the hard flat plate 1 and the hard flat plate 2 through the adhesive 9. It was sandwiched and fixed to form a digitizer sensor plate.

[0003]

Therefore, it takes a long time to cure the adhesive, and it is difficult to efficiently manufacture the digitizer sensor plate, and the digitizer sensor plate is expensive. For this reason, a means for shortening the adhesive curing time has been taken by using a two-liquid mixed type adhesive or by heating the adhesive. However, if the adhesive curing time is shortened by these means, the insulating precision flat plate may be bent or twisted due to the contraction of the adhesive that progresses after the adhesive is cured, so that the sensor accuracy cannot be put to practical use. There was a difficulty that it would decrease.

Further, in the manufacturing process of the digitizer sensor plate, there is a problem that stains and offensive odors are generated by the adhesive.

The object of the present invention is to solve these problems,
An object of the present invention is to provide a digitizer sensor plate that is excellent in manufacturing workability and inexpensive.

[0006]

[Means for Solving the Problems] The vertical position of a rectangular insulating hard flat plate placed horizontally can be adjusted, and sensor wire arranging pins are arranged and fixed on the outer periphery of the hard flat plate in a predetermined pattern. On the sensor wire arranging jig configured as described above, place and fix the hard plate on which the double-sided adhesive tape is attached to the part except the peripheral part of one side, and the vertical position of the hard plate is more than the sensor wire arranging pin. Adjust the sensor wire in advance so that it is lower, and hook the insulated sensor wires to the opposing sensor wire wiring pins arranged in a predetermined pattern on the outer periphery of the hard plate in sequence, and harden the sensor wire terminal lead wire while providing the folded portion. The sensor wire is wired so as to lead out from the flat plate to form a sensor wire orthogonal wiring network on the hard flat plate, and the vertical position of the hard flat plate is adjusted to be slightly higher than the sensor wire wiring pin and the sensor wire is adjusted. straight Adhere the wiring network to the double-sided adhesive tape and press the single-sided adhesive tape from above the sensor wire orthogonal wiring network onto the double-sided adhesive tape and the insulated sensor wire to fix the sensor wire orthogonal wiring network to the hard plate. The sensor wire wrapping part is removed from the sensor wire laying pin and folded into the hard plate peripheral part, and the folded sensor line fold part is fixed to the hard plate peripheral part with one-sided adhesive tape to form a digitizer sensor plate. Is.

The double-sided adhesive tape has a small width,
It is advisable to attach it to a hard flat plate at a predetermined interval so as to be oblique to the sensor wire.

[0008]

Since the sensor wire is fixed to the insulating hard plate by the adhesive tape, the manufacturing workability of the digitizer sensor plate is significantly improved and the inexpensive digitizer sensor plate can be obtained. Also, the wiring of the sensor wire is performed by making the vertical position of the insulating hard plate lower than the sensor wire wiring pin in advance.
The sensor wire has no trouble of touching the adhesive tape, and is fixed to the insulating hard flat plate in a predetermined pattern by the strong adhesive force of the double-sided adhesive tape and the single-sided adhesive tape without being displaced.

[0009]

The present invention will be described below with reference to the drawings. FIG. 1 is a cross-sectional view showing the structure of the digitizer sensor plate according to the present invention, and FIG. 2 is an explanatory view showing the outline of the manufacturing process of the digitizer sensor plate according to the present invention.

In the figure, reference numeral 1 denotes an insulating hard plate, and a double-sided adhesive tape 6 is attached to a portion excluding the peripheral portion on one side to form a uniform flat surface. Reference numeral 3 denotes an insulated sensor wire made of an ultrafine wire such as a magnet wire, which is hooked in sequence on a sensor wire arranging pin 4 arranged in a predetermined pattern on the outer periphery of the insulating hard flat plate 1 to form a folded portion 5. On the other hand, the hard flat plate 1 is wired in a predetermined pattern. Reference numeral 8 denotes a sensor wire orthogonal wiring network formed on the insulating hard plate 1. Reference numeral 7 denotes a single-sided adhesive tape, which is adhered to the double-sided adhesive tape 6 side with the adhesive surface 10 facing the sensor wire orthogonal wiring network 8 side. The digitizer sensor plate of the present invention is manufactured as follows.

First, the vertical position of the portion on which the insulating hard plate 1 is placed can be adjusted upward and downward, and the sensor wire arranging pin 4 is arranged and fixed on the outer periphery of the insulating hard plate 1. On the sensor wire laying jig (not shown), the insulating hard flat plate 1 with the double-sided adhesive tape 6 attached so as to form a uniform flat surface on a portion excluding the peripheral portion on one side is placed horizontally. Fix it.

Next, the sensor wire laying pins 4 are arranged and fixed in a predetermined pattern on the outer periphery of the insulating hard flat plate 1, and the vertical position of the insulating hard flat plate 1 is the vertical direction of the sensor wire laying pin 4. The double-sided pressure-sensitive adhesive tape 6 attached to the insulating hard flat plate 1 is set so as not to interfere with the wiring by preliminarily adjusting it so that it is lower than the position.

Then, the insulated sensor wires 3 are successively hooked on the opposing sensor wire wiring pins 4 by using a wiring nozzle or the like,
While forming the sensor wire folded-back portion 5, a sensor wire orthogonal wiring network 8 is formed on the hard flat plate 1 in a predetermined pattern. At this time, the terminal lead wire 11 is fixed to the sensor wire wiring jig so that the terminal lead wire 11 of the sensor wire 3 is led out from the insulating hard plate 1.

After laying the sensor wires 3, the insulating hard flat plate 1 is moved vertically upward by a predetermined distance, and the sensor wire orthogonal wiring net 8 is brought into contact with the adhesive surface on one side of the double-sided adhesive tape 6 and fixed. To do. Then, the one-sided adhesive tape 7 with the adhesive surface 10 facing downward from above the sensor wire orthogonal wiring network 8 is pressed against the double-sided adhesive tape 6 and the sensor wire orthogonal wiring network 8 while applying an appropriate force to the sensor. The wire-orthogonal wiring network 8 is firmly fixed to the insulating hard flat plate 1 with the adhesive tapes 6 and 7.

Next, the sensor wire folding portion 5 is detached from the sensor wire wiring pin 4, the removed sensor wire folding portion 5 is folded into the peripheral portion of the insulating hard flat plate 1, and the folded sensor wire folding portion 5 is adhered to one side. The tape 7A is fixed to the insulating hard plate 1 to form a digitizer sensor plate.

As described above, in the digitizer sensor plate manufactured according to the present invention, the adhesive tape is used to fix the sensor wire orthogonal wiring network to the insulating hard plate, so that the manufacturing process of the sensor plate is simplified. . Further, since the sensor wire is firmly fixed by the two adhesive tapes, the adhesive strength is not inferior to the conventional one using an adhesive, and the sensor wire is not displaced.

FIG. 3 is a perspective view of a digitizer sensor plate showing another embodiment of the present invention. In this embodiment, an adhesive tape 6 for fixing a sensor wire orthogonal wiring network 8 to an insulating hard flat plate 1,
The narrow adhesive tape 6 is used. The adhesive tape 6 is oblique with respect to the wiring direction of the sensor wires and is provided with a predetermined space therebetween to provide the insulating hard flat plate 1.
The adhesive tape 6 can be used in a reduced amount, because the adhesive tape 6 is attached to the.

[0018]

The digitizer sensor plate according to the present invention uses the adhesive tape instead of the adhesive to fix the sensor wire orthogonal wiring network to the insulating hard plate, so that the manufacturing process of the digitizer sensor plate is greatly simplified. And an inexpensive digitizer sensor plate having excellent manufacturing workability can be efficiently manufactured. Further, since the insulating sensor wire is fixed to the insulating hard flat plate by the two adhesive tapes, a high-precision digitizer sensor plate having strong adhesive strength and no positional deviation of the sensor wire can be obtained. Furthermore, the digitizer sensor plate according to the present invention has practical effects such as eliminating stains and offensive odors in the conventional manufacturing process using an adhesive and enabling automation of the manufacturing process.

[Brief description of drawings]

FIG. 1 is a sectional view showing a configuration of a digitizer sensor plate according to the present invention.

FIG. 2 is an explanatory view showing an outline of a manufacturing process of a digitizer sensor plate according to the present invention.

FIG. 3 is a perspective view showing another embodiment of the digitizer sensor plate according to the present invention.

FIG. 4 is an explanatory diagram showing a configuration of a conventional digitizer sensor plate.

[Explanation of symbols]

 1, 2 quadrangular insulated hard flat plate 3 insulated sensor wire 4 sensor wire wiring pin 5 sensor wire folded part 6 double-sided adhesive tape 7,7A single-sided adhesive tape 8 sensor wire orthogonal wiring network 9 adhesive 10 adhesive surface

Claims (2)

[Claims] 1. A sensor configured to adjust a vertical position of a rectangular insulating hard plate placed horizontally and to fix sensor wire arranging pins in a predetermined pattern on an outer periphery of the hard plate. Place a hard plate with double-sided adhesive tape attached on the wire laying jig on the area excluding the peripheral part of one side, and fix it in advance so that the vertical position of the hard plate is lower than the sensor wire laying pin. The insulated sensor wire is adjusted and hooked sequentially on the sensor wire arranging pins facing each other, which are arranged in a predetermined pattern on the outer periphery of the hard plate, and the terminal lead wire of the sensor wire is led out from the hard plate while providing the folded portion. And form a sensor wire orthogonal wiring network on the hard flat plate, and adjust the vertical position of the hard flat plate to be slightly higher than the sensor wire wiring pin, and then the sensor wire orthogonal wiring network Double-sided sticky While adhering to the adhesive tape, press the single-sided adhesive tape from above the sensor wire orthogonal wiring network to the double-sided adhesive tape and the insulated sensor wire to fix the sensor wire orthogonal wiring network to the hard flat plate, and fold back the sensor wire. A digitizer sensor plate characterized in that the portion is removed from the sensor wire arranging pin, folded into the peripheral portion of the hard plate, and the folded back portion of the sensor wire is fixed to the peripheral portion of the hard plate with a single-sided adhesive tape. 2. The digitizer sensor plate according to claim 1, wherein the double-sided adhesive tape has a small width and is attached to a hard flat plate at predetermined intervals so as to be oblique to the sensor line.