JPH06175770A - Digitizer sensor plate - Google Patents

Abstract

PURPOSE:To make a sensor plate thin and light weight and to eliminate disconnection of extra thin wires to improve the workability of sensor plate production by using a plastic sheet as a small piece plate for wiring and forming projections for wiring on the small piece plate for wiring as one body. CONSTITUTION:Plural small piece plates 1 for wiring are arranged like a square to face one another with wiring jigs. Next, extra thin sensor wires 4 are laid, and insulating sensor wire wiring networks 10 are formed on small piece plates facing one another. After the end of wiring, terminal parts 5 of extra thin sensor wires 4 are led to the outside of small piece plates 1 for wiring and are partially fixed to the peripheral parts of small piece plates 1 for wiring by adhesion. A hard plane plate 8 coated with an adhesive 6 in peripheral parts corresponding to projections 2 is put on small piece plates 1 for wiring, and projections 2 for wiring of small piece plates 1 for wiring and the hard plane plate 8 are fixed by adhesion to produce a digitizer sensor plate. In this case, the insulating sensor wire wiring network 10 may be stuck to small piece plates 1 for wiring by an adhesive.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electromagnetic induction type digitizer sensor plate used for information input equipment such as CAD.

[0002]

2. Description of the Related Art As an electromagnetic induction type digitizer sensor plate, as shown in FIG. 9, an insulating sensor wire wiring network 10 formed by orthogonally laying fine sensor wires 4 such as magnet wires is hardened by an adhesive 6. 11 which is adhesively fixed on the flat plate 8, as shown in FIG. 10, the insulated sensor wire wiring network 10 is sandwiched between two hard flat plates 8 and 8 and sandwiched and fixed by the adhesive agent 6, or FIG. As shown in the drawing, a plurality of pin bases 12 formed by arranging and arranging the wiring pins 2 are arranged in a quadrangular shape so as to face each other. The insulated sensor wire wiring net 10 is formed by hanging and wrapping the wire, and the plurality of pin bases 12 are formed.
A digitizer sensor plate or the like in which an adhesive 6 is applied on the top surface and a hard plate 8 is placed and fixed on the pin base 12 has been widely used.

The above-mentioned sensor plate is manufactured by using the sensor plate shown in FIG.
And the ultrafine sensor wire 4 made of a magnet wire is alternately hooked on the wiring pin 2 and folded back to form an insulated sensor wire wiring network 10. Then, the adhesive 6 is applied and cured from the sensor wire distribution network 10 to fix the sensor wire distribution network 10 on the hard flat plate 8 by adhesion. After the adhesive 6 is hardened, the folded portion 13 of the extra fine sensor wire 4 is removed from the wiring pin 2 and the sensor wire folded portion 13 is bonded and fixed on the periphery of the hard plate 8.

Further, in the sensor plate shown in FIG. 10, wiring pins 2 are arranged on opposite sides of a hard plate 8, and extra fine sensor wires 4 made of magnet wires are alternately hooked to the wiring pins 2 and folded back. Wiring is performed, and an insulating sensor wire wiring network 10 is formed on the hard flat plate 8. And the sensor wiring network 1
0, the adhesive 6 is applied and cured from above, another adhesive is applied on the adhesive 6, and another hard flat plate 8 is placed and fixed on the adhesive, and two hard flat plates 8 are attached. , 8 and the sensor wiring network 10 is sandwiched and fixed by adhesion. Next, the folded-back portion 13 of the extra fine sensor wire 4 was removed from the wiring pin 2, and the folded-back portion 13 was adhered and fixed to the end faces of the hard flat plates 8 to manufacture.

Further, in the sensor plate shown in FIG.
A plurality of pin bases 12 in which a plurality of wiring pins 2 are planted and integrally molded are arranged in a quadrangular shape so as to face each other using a wiring jig (not shown). Next, the fine sensor wires 4 are alternately hooked on each of the wiring pins 2 of the opposing pin bases and folded back to form an insulated sensor wire wiring network 10. Then, the adhesive 6 is applied on the top surfaces of the plurality of pin bases 12, and the hard flat plate 8 is placed and fixed on the adhesive 6 for manufacture.

[0006]

In the production of these conventional digitizer sensor plates, in the sensor plate of FIG. 9, the work of adhering the laid ultrafine sensor wires 4 onto the hard flat plate 8 and folding back the ultrafine sensor wires. The work of removing the portion 13 from the wiring pin 2, the folding portion 13 is a hard plate 8
It was necessary to perform work such as adhesion and fixing on the peripheral portion. Then, in the work of removing the sensor wire folded-back portion 13 from the wiring pin 2 or adhering and fixing the sensor wire folded-back portion 13 onto the hard flat plate 8, the extra fine sensor wire 4 is easily broken, and the workability of the sensor plate is difficult. Besides, the sensor plate is expensive.

Further, in the sensor plate of FIG. 10, as in the sensor plate of FIG. 9, the work of removing the extra fine sensor wire folded-back portion 13 from the wiring pin 2, the sensor wire folded-back portion 13 is adhesively fixed to the end faces of the hard flat plates 8, 8. In the work to do, extra fine sensor wire 4
However, there is a problem in that the sensor plate is easily broken and the sensor plate manufacturing workability is difficult, and the sensor plate is expensive. Further, the sensor plate becomes thicker and the sensor plate becomes heavier, which makes it difficult to handle the sensor plate.

In addition, the sensor plate of FIG. 11 requires a large number of molded pin bases 12, which makes the sensor plate expensive.

SUMMARY OF THE INVENTION The present invention provides a digitizer sensor plate which solves the above problems by a simple means, is light in weight, and is easy to handle.

[0010]

[Means for Solving the Problems] A plurality of wiring strips, each having a plurality of wiring projections formed at predetermined intervals, the plastic sheet pieces being formed into hollow projections, and a plurality of wiring strips having a rectangular shape. An insulated sensor wire wiring network that is orthogonally wired between opposing small piece plates through the wiring projections of the small piece plates that are arranged to face each other, and is placed on the wiring projections of the small piece plate for wiring. And a hard flat plate, and the hard flat plate is bonded and fixed around the wiring projections of the small wiring plate.

Also, a plurality of wiring projections formed by molding the plastic sheet pieces into hollow projections at predetermined intervals and the plastic sheet pieces on one side of the wiring projection row are hollow banks. -Shaped small piece plate for wiring provided with a bank portion formed in a rectangular shape and an insulating sensor wire orthogonally wired between the small piece plates facing each other through the wiring projections of the small piece plates arranged in a square shape. A wiring net and a hard flat plate placed on the wiring projection of the wiring small piece plate, and the hard flat plate is arranged around the wiring projection of the wiring small piece plate or around the bank portion. It is advisable to bond and fix the parts.

[0012] The wiring projection may be provided with a smooth inclined surface of 60 to 75 degrees from the surface of the wiring small piece plate to the upper side of the wiring small piece plate. A flat surface may be formed on the tip end side of the protrusion or the upper end side of the bank. Also,
The sensor wire distribution network may be adhesively fixed to the hard plate.

[0013]

[Function] Since the small piece plate for wiring is a plastic sheet, the sensor plate can be made thin and lightweight, and the cost can be reduced. Also, because the wiring projection is integrally molded on the wiring strip, the work of removing the folded portion of the extra-fine sensor wire from the wiring projection and the bonding of the sensor wiring folded portion onto the wiring sheet as in the past Since the work of fixing is unnecessary, the breakage of the ultrafine wire is eliminated, and the workability of manufacturing the sensor plate is greatly improved. Further, the sensor wire is closely arranged on the wiring small piece plate without being displaced from the wiring projection by the inclined surface of the wiring projection. Further, the bank portion is provided, and the small piece plate for wiring and the hard flat plate are more firmly fixed to each other. Further, by providing a flat surface on the wire-wiring projection or the projection and the tip of the bank portion, the height of the wire-wiring projection and the bank portion changes, and the thickness of the sensor plate can be easily adjusted.

[0014]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to FIGS. FIG. 1 is a sectional view of a main part of a sensor plate according to the present invention.
FIG. 3 is an explanatory view of a process for producing the sensor plate of the present invention, FIG. 3 is a perspective view of the sensor plate of the present invention, and FIG. In the figure, 1 is thickness 0.1
A small piece plate for wiring, in which a hollow projection-shaped wiring projection 2 and a hollow bank-shaped bank portion 11 are integrally formed on a thermoplastic plastic sheet piece 9 of 5 to 0.30 mm acrylic resin, 4 is a magnet wire Is an ultrafine sensor wire, 6 is a transparent adhesive, 8 is a hard flat plate made of a rectangular transparent glass plate, and 9 is a plastic sheet piece.

The wiring strip 1 is integrally molded as follows. First, the protrusions 1 as shown in FIG. 5 corresponding to the positions of the wiring projections 2 of the sensor plate shown in FIG.
Lower mold 15 provided with 4 and concave portion 1 corresponding to the convex portion 14
A molding die including an upper die 17 provided with 6 is prepared. Next, the plastic sheet piece 9 is placed between the lower die 15 and the upper die 17, and the sheet piece 9 is warmed by hot air heating or the like. When the sheet piece 9 is warmed and a necessary portion of the sheet 9 is softened and is in a moldable state, the upper mold 17 and the lower mold 15 are fitted to each other. Then, when the molding die cools, the upper die 17 and the lower die 15 are removed, and as shown in FIG.
Is formed at a predetermined interval to form a small piece plate for wiring.

The height of the wiring projection 2 is 2 to 3 mm.
Is appropriate. Further, after the wiring projection 2 is molded, a uniformly heated molding hot plate is pressed from above the projection 2,
As shown in FIG. 6, the tip end side of the wiring projection 2 may be molded into a flat surface 7. In this case, lower the height of the wiring projection 2,
The thickness of the sensor plate can be adjusted, which has the advantage of making the sensor plate thinner. In addition, in the wiring projection 2,
It is advisable to provide a smooth inclined surface 3 of about 60 to 75 ° from the surface of the wiring strip 1 to the outside and upward of the strip 1. The inclined surface 3 prevents the extra-fine sensor wire 4 from coming off the wiring projection 2, and is slid on the inclined surface 3 to be closely attached to the surface of the wiring small piece plate 1 for wiring.

The digitizer sensor plate of the present invention is manufactured as follows. First, a plurality of wiring slabs 1 are arranged in a quadrangular shape by a wiring jig (not shown). Next, as shown in FIG. 2, the extra fine sensor wire 4 is hooked on the wiring projection 2 of the facing small piece plate 1 and folded back to form a wire, and the insulated sensor wire wiring net 10 is placed on the small piece plate 1 for wiring. To form. After the wiring is completed, the terminal portion 5 of the ultrafine sensor wire 4 is led out to the outside of the wiring small piece plate 1, and a part of the terminal portion 5 is adhesively fixed to the peripheral portion of the wiring small piece plate 1.

Then, a hard flat plate 8 having an adhesive 6 applied to the peripheral portion corresponding to the protrusion 2 is placed from above the small piece plate 1 for wiring, and the projection 2 for wiring of the small piece plate 1 for wiring is placed. Hard flat plate 8
A digitizer sensor plate as shown in FIG. 1 is manufactured by adhesively fixing and. At this time, the insulated sensor wire wiring network 10 may be fixed to the wiring small piece plate 1 with an adhesive.

FIG. 7 shows another embodiment of the present invention, in which a hollow bank-shaped bank portion 11 is further provided by heat molding on the inner side of the two wiring projections of the wiring small piece plate 1. The insulated sensor wire wiring network 10 is disposed between the wiring small piece plate 1 and the hard flat plate 8, and the small piece plate 1 is the wiring projection 2 and the bank portion 1.
A sensor plate is formed by being bonded and fixed to the hard flat plate 8 at the front end side. In this case, the extra fine sensor wire 4 is the bank portion 1
Since it is closely adhered and fixed to the hard flat plate 8 on 1,
There is an advantage that the wiring accuracy is good and the sensor sensitivity is improved. It is needless to say that the sensor plate wiring network 10 may be turned over after the adhesive is cured and the sensor wire distribution net 10 may be fixed to the hard plate 8 with an adhesive.

FIG. 8 shows still another embodiment of the present invention,
A bank portion 11 is provided by heat molding on the outside of the two rows of the wiring projections of the wiring small piece plate 1, and the sensor wire wiring network 10 is provided between the wiring small piece plate 1 and the hard flat plate 8. The small wiring board 1 is arranged and bonded to the hard flat plate 8 by the wiring projection 2 and the tip of the bank 11 to form a sensor plate. Needless to say, the sensor plate may be turned over after the adhesive is hardened, filled with the adhesive, and the sensor wiring network 10 may be embedded and fixed in the adhesive.

[0021]

[Effect] Since the digitizer sensor plate of the present invention uses the plastic sheet as the small piece plate for wiring, the sensor plate is thin and lightweight, easy to handle and inexpensive. Also, since the wiring projection is integrally molded on the wiring small piece plate, the work of removing the extra-fine sensor wire folded-back portion from the wiring-wiring projection or the adhesive fixing of the extra-fine sensor wire folded portion to the sheet as in the conventional sensor plate is performed. The work to do is unnecessary. As a result, breakage of the ultrafine sensor wire is eliminated, and the workability of manufacturing the sensor plate is significantly improved. In addition, the height of the wiring projection and the bank portion can be easily adjusted, and the thickness and weight of the sensor plate can be easily adjusted. And so on.

[Brief description of drawings]

FIG. 1 is a sectional view of an essential part showing an embodiment of the present invention.

FIG. 2 is an explanatory diagram of a manufacturing process according to an embodiment of the present invention.

FIG. 3 is a perspective view showing an embodiment of the present invention.

FIG. 4 is a cross-sectional view of an essential part of a small piece plate for wiring used in an embodiment of the present invention.

FIG. 5 is an explanatory view of forming a wiring projection used in the present invention.

FIG. 6 is a cross-sectional view of essential parts showing another embodiment of the present invention.

FIG. 7 is a cross-sectional view of essential parts showing another embodiment of the present invention.

FIG. 8 is a cross-sectional view of essential parts showing another embodiment of the present invention.

FIG. 9 is an explanatory diagram showing a conventional example of a sensor plate.

FIG. 10 is an explanatory view showing another conventional example of the sensor plate.

FIG. 11 is an explanatory view showing another conventional example of the sensor plate.

[Explanation of symbols]

 1 Small piece plate for wiring 2 Protrusion for wiring 3 Sloping surface 4 Extra-fine sensor wire 5 Extra-fine sensor wire terminal 6 Adhesive 7 Flat surface 8 Hard flat plate 9 Plastic sheet piece 10 Insulated sensor wire distribution net 11 Bank part 13 Extra-fine sensor Line folding part

Claims (5)

[Claims] 1. A plurality of small strips for wiring, which are provided on the plastic sheet with a plurality of wiring projections formed by molding the plastic sheet in the shape of a hollow projection, and are arranged in a square shape to face each other. An insulated sensor wire wiring network orthogonally wired between the small piece plates facing each other through the wiring projections of the small piece plate, and a hard flat plate placed on the wiring projections of the small piece plate for wiring. The digitizer sensor plate, wherein the hard flat plate is adhered and fixed around the wiring projections of the wiring small piece plate. 2. A plurality of wiring projections formed by molding the plastic sheet pieces into hollow projections at predetermined intervals, and the plastic sheet pieces are hollow on one side of the wiring projection row. An insulation sensor in which wiring is provided orthogonally between small strips for wiring provided with a bank formed in the shape of a bank and small strips opposed to each other via the projections for wiring of the small strips facing each other in a square shape. The wire laying net and a hard flat plate placed on the wiring projection of the small piece plate for wiring, the hard flat plate being a peripheral portion or a bank portion of the wiring projection of the small piece plate for wiring. A digitizer sensor plate that is adhesively fixed at the periphery. 3. The wiring projection is provided with a smooth inclined surface of 60 to 75 degrees from the surface of the wiring strip to the outside of the wiring strip. 1 or 2
Digitizer sensor plate described. 4. The digitizer sensor plate according to claim 1, wherein a flat surface is formed on a tip end side of the wiring arrangement projection or an upper end side of the bank portion. 5. The digitizer sensor plate according to claim 1, 2, 3, or 4, wherein the sensor wiring network is fixed to the hard plate with an adhesive.