JPH07304044A - Method and material for cleaning mold - Google Patents
Method and material for cleaning moldInfo
- Publication number
- JPH07304044A JPH07304044A JP6121816A JP12181694A JPH07304044A JP H07304044 A JPH07304044 A JP H07304044A JP 6121816 A JP6121816 A JP 6121816A JP 12181694 A JP12181694 A JP 12181694A JP H07304044 A JPH07304044 A JP H07304044A
- Authority
- JP
- Japan
- Prior art keywords
- cleaning
- substrate
- mold
- resin
- resins
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 54
- 238000000034 method Methods 0.000 title claims abstract description 15
- 239000000463 material Substances 0.000 title claims abstract description 13
- 229920005989 resin Polymers 0.000 claims abstract description 45
- 239000011347 resin Substances 0.000 claims abstract description 45
- 239000011538 cleaning material Substances 0.000 claims abstract description 23
- 239000000758 substrate Substances 0.000 claims abstract description 18
- 238000000465 moulding Methods 0.000 claims abstract description 11
- 238000010438 heat treatment Methods 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 239000004744 fabric Substances 0.000 abstract description 2
- 239000011521 glass Substances 0.000 abstract description 2
- 239000002184 metal Substances 0.000 abstract description 2
- 239000002985 plastic film Substances 0.000 abstract description 2
- 229920006255 plastic film Polymers 0.000 abstract description 2
- 239000000123 paper Substances 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 description 7
- 229920000877 Melamine resin Polymers 0.000 description 5
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 5
- 239000000843 powder Substances 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、半導体を樹脂封止する
金型のクリーニング材およびクリーニング方法に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mold cleaning material and a cleaning method for a mold for resin-sealing a semiconductor.
【０００２】[0002]
【従来の技術】各種のモールド方法によって製造される
半導体製品は、近年、形状、サイズの多様化が進み、特
にモールド法により製造される樹脂封止型半導体装置
は、薄型化、小形化が急速に進んでいる。これに伴い、
半導体装置の製造に用いられるモールド金型の形状も複
雑化する傾向にあり、成形回数が増えていくにつれて金
型にはモールド樹脂による汚れが金型表面に堆積する。2. Description of the Related Art In recent years, semiconductor products manufactured by various molding methods have been diversified in shape and size, and in particular, resin-sealed semiconductor devices manufactured by the molding method are rapidly becoming thinner and smaller. Is progressing to. With this,
The shape of a mold used for manufacturing a semiconductor device also tends to be complicated, and as the number of times of molding increases, stains due to the mold resin are deposited on the mold surface on the mold.
【０００３】これらの汚れた金型をクリーニングするに
は、一般にメラミン系のクリーニング樹脂粉末やクリー
ニングシートが用いられる。メラミン系クリーニング樹
脂粉末を用いる方法は、半導体装置と同様な方法で成形
作業を行って金型のクリーニングを行うが、金型形状の
複雑化に伴い、特に薄型では金型の細部までクリーニン
グ樹脂を行き渡らせるための条件設定が大変難しいとい
う欠点がある。また、クリーニングシートを挟み込んで
行う方法は、その性状から金型のコーナー部のクリーニ
ングが十分できないという欠点がある。To clean these dirty molds, a melamine-based cleaning resin powder or a cleaning sheet is generally used. The method using the melamine-based cleaning resin powder performs the molding work in the same manner as in the semiconductor device to clean the mold, but with the complexity of the mold shape, especially in the case of thin type, the cleaning resin is used even in the details of the mold. There is a drawback that it is very difficult to set the conditions for making it spread. Further, the method of sandwiching the cleaning sheet has a drawback that the corner portion of the mold cannot be sufficiently cleaned due to its nature.
【０００４】[0004]
【発明が解決しようとする課題】本発明は、上記の欠点
を解消するためになされたもので、モールド金型の細部
までクリーニング樹脂を行き渡らせ十分にクリーニング
し、かつ作業性に優れたクリーニング材およびそれを用
いたクリーニング方法を提供しようとするものである。SUMMARY OF THE INVENTION The present invention has been made in order to solve the above-mentioned drawbacks, and a cleaning material which has a cleaning resin spread even to the details of a molding die and is sufficiently cleaned, and which is excellent in workability. And a cleaning method using the same.
【０００５】[0005]
【課題を解決するための手段】本発明者は、上記の目的
を達成しようと鋭意研究を重ねた結果、クリーニング樹
脂を基材と一体にさせたものを用いることによって、上
記の目的が達成できることを見いだし、本発明を完成し
たものである。Means for Solving the Problems As a result of intensive studies to achieve the above object, the present inventor can achieve the above object by using a cleaning resin integrated with a substrate. The present invention has been completed and the present invention has been completed.
【０００６】即ち、本発明は、シート又はテープ状の基
材の少なくとも片面に、複数のクリーニング樹脂を金型
キャビティの位置に応じて配置し該基体と一体としてな
ることを特徴とするモールド用金型のクリーニング材で
ある。また、シート又はテープ状の基材の少なくとも片
面に、複数のクリーニング樹脂を金型キャビティの位置
に応じて配置し該基体と一体としてなる金型クリーニン
グ材を、加熱した金型内に挟み込み一定時間加熱加圧し
てクリーニング樹脂を硬化させ、その後クリーニング材
を除去することを特徴とするモールド用金型のクリーニ
ング方法である。That is, the present invention is characterized in that a plurality of cleaning resins are arranged on at least one surface of a sheet or tape-like base material in accordance with the position of a mold cavity and are integrated with the base body. It is a mold cleaning material. Further, a plurality of cleaning resins are arranged on at least one surface of a sheet or tape-shaped base material according to the position of the mold cavity, and a mold cleaning material integrated with the base is sandwiched in a heated mold for a predetermined time. This is a method for cleaning a molding die, which comprises heating and pressing to cure the cleaning resin, and then removing the cleaning material.
【０００７】本発明に用いるシート又はテープ状の基材
としては、樹脂の硬化温度に耐え得る耐熱温度と、所定
大きさの樹脂群を保持できる程度の強度を有したもので
あればよく、特に限定されるものではなく、紙、ガラス
クロス、金属、プラスチックフィルム等が挙げられる。The sheet or tape-shaped substrate used in the present invention may be any one having a heat resistant temperature capable of withstanding the curing temperature of the resin and strength enough to hold a resin group of a predetermined size, and particularly, It is not limited, and examples thereof include paper, glass cloth, metal, and plastic film.
【０００８】本発明に用いるクリーニング樹脂として
は、従来から一般に使用されているメラミン系樹脂等が
用いられるが、特に限定されるものではない。As the cleaning resin used in the present invention, a melamine-based resin or the like which has been generally used conventionally can be used, but the cleaning resin is not particularly limited.
【０００９】まず、上述の基材にクリーニング樹脂を一
体にして金型クリーニング材をつくるが、例えば、一定
の厚さと大きさを有するシートまたはテープに、クリー
ニング樹脂粉体をのせ低温加圧成形（打錠）又は溶融付
着させて容易に作ることができる。基材に確実にクリー
ニング樹脂を固定させる方法は、基材にディンプル（係
止くぼみ）や貫通孔を設けて一体化させるとよい。こう
して作った金型クリーニング材を用いるクリーニング方
法は次のようにして行うことができる。金型クリーニン
グ材を用意し、これを加熱した金型に挟み込み型締め
し、一定時間加熱加圧してクリーニング樹脂を硬化させ
る。次いで型開きを行い、硬化樹脂を基材ごと除去して
金型のクリーニングを行うことができる。First, a cleaning resin is integrated with the above-mentioned base material to form a mold cleaning material. For example, a cleaning resin powder is placed on a sheet or tape having a certain thickness and size, and low temperature pressure molding ( It can be easily made by tableting) or melt adhesion. As a method for reliably fixing the cleaning resin to the base material, it is preferable to provide dimples (locking depressions) or through holes in the base material to integrate them. The cleaning method using the mold cleaning material thus prepared can be performed as follows. A mold cleaning material is prepared, the mold is clamped by being sandwiched between heated molds, and heated and pressed for a certain period of time to cure the cleaning resin. Next, the mold can be opened, the cured resin can be removed together with the base material, and the mold can be cleaned.
【００１０】次に、本発明を図面を用いて説明する。Next, the present invention will be described with reference to the drawings.
【００１１】図１は本発明の一実施例を示すクリーニン
グ材の断面図を、図２は図１の斜視図を示す。図３は本
発明の別の実施例のクリーニング材とそれによるクリー
ニング方法を説明する断面図を示す。FIG. 1 is a sectional view of a cleaning material showing an embodiment of the present invention, and FIG. 2 is a perspective view of FIG. FIG. 3 is a sectional view illustrating a cleaning material according to another embodiment of the present invention and a cleaning method using the same.
【００１２】図１および図２において、シート又はテー
プ等からなる基材１の片面に粉末のクリーニング樹脂２
を打錠又は溶融付着させてクリーニング樹脂２を基体１
に一体にする。このクリーニング樹脂２は金型キャビテ
ィの配置に応じて基体上に複数個作りクリーニング樹脂
２の群を有するクリーニング材とする。また図３に示し
たように、クリーニング樹脂２を基材１に確実に固着さ
せるために、基材１に複数の貫通孔（ディンプルでもよ
い）４を設けて基板両面にクリーニング樹脂２を一体に
してクリーニング材３を作ることもできる。このクリー
ニング材３を加熱した金型５に挟み込み所定時間加熱加
圧してクリーニング樹脂を硬化させ、その後それを基体
ごと除去して金型をクリーニングすることができる。In FIGS. 1 and 2, a powder cleaning resin 2 is provided on one surface of a substrate 1 made of a sheet or tape.
Tableting or melt adhesion of the cleaning resin 2 to the substrate 1
To become one. A plurality of cleaning resins 2 are formed on the substrate according to the arrangement of the mold cavities, and a cleaning material having a group of cleaning resins 2 is used. Further, as shown in FIG. 3, in order to firmly fix the cleaning resin 2 to the base material 1, a plurality of through holes (or dimples) 4 may be provided in the base material 1 to integrate the cleaning resin 2 on both sides of the substrate. The cleaning material 3 can also be made by using. The cleaning material 3 can be sandwiched between heated dies 5 and heated and pressed for a predetermined time to cure the cleaning resin, and then the substrate can be removed to clean the dies.
【００１３】[0013]
【作用】クリーニング樹脂を基材に一体化させたことに
よって、金型内の細部まで樹脂が行渡り、きれいにクリ
ーニングができ、クリーニング終了後は硬化樹脂が基材
についたまま処理できるのでクリーニング作業性も向上
できる。[Function] Since the cleaning resin is integrated with the base material, the resin can be spread to the details inside the mold, and clean cleaning can be performed, and after the cleaning is completed, the cured resin can be treated while the base material remains attached to the cleaning workability. Can be improved.
【００１４】[0014]
【実施例】次に、本発明を実施例によって説明する。EXAMPLES Next, the present invention will be explained by examples.
【００１５】実施例 ポリイミドシートに複数の貫通孔を加工し、その両面に
メラミン系クリーニング樹脂ＥＣＲ（日本カーバイト社
製、商品名）を加圧付着させてクリーニング材をつくっ
た。このクリーニング材を半導体製造金型ＴＳＯＰ（40
0mil）に挟み込み加熱加圧成形してクリーニングを行っ
た。Example A plurality of through holes were formed in a polyimide sheet, and a melamine-based cleaning resin ECR (trade name, manufactured by Nippon Carbide Co., Ltd.) was pressure-bonded to both surfaces of the polyimide sheet to prepare a cleaning material. This cleaning material is used for semiconductor manufacturing mold TSOP (40
It was sandwiched between 0 mil) and heated and pressed to perform cleaning.
【００１６】比較例 半導体製造金型ＴＳＯＰ（400mil）を用いてメラミン系
クリーニング樹脂ＥＣＲ（日本カーバイド社製、商品
名）をトランスファー成形してクリーニングを行った。Comparative Example A melamine-based cleaning resin ECR (trade name, manufactured by Nippon Carbide Co., Ltd.) was transfer molded using a semiconductor manufacturing mold TSOP (400 mil) for cleaning.
【００１７】実施例および比較例の結果を表１に示した
が、本発明は優れており、本発明の効果を確認すること
ができた。The results of Examples and Comparative Examples are shown in Table 1. The present invention was excellent, and the effects of the present invention could be confirmed.
【００１８】[0018]
【表１】 [Table 1]
【００１９】[0019]
【発明の効果】以上の説明および表１から明らかなよう
に、本発明のクリーニング材およびクリーニング方法に
よれば、複雑なモールド金型の細部までクリーニング樹
脂が行きわたり綺麗になると同時に、作業性に優れたも
のである。As is clear from the above description and Table 1, according to the cleaning material and the cleaning method of the present invention, the cleaning resin spreads and cleans even the details of the complicated mold, and at the same time the workability is improved. It is excellent.
【図１】図１は本発明の一実施例を示すクリーニング材
の断面図である。FIG. 1 is a sectional view of a cleaning material showing an embodiment of the present invention.
【図２】図２は図１の斜視図である。FIG. 2 is a perspective view of FIG.
【図３】図３は本発明の別の実施例であるクリーニング
材およびそれによるクリーニング方法を説明する断面図
である。FIG. 3 is a cross-sectional view illustrating a cleaning material and a cleaning method using the same, which is another embodiment of the present invention.
１ シート又はテープ ２ クリーニング樹脂 ３ クリーニング材 ４ 貫通孔 ５ モールド金型 1 sheet or tape 2 cleaning resin 3 cleaning material 4 through hole 5 molding die
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｈ０１Ｌ 21/56 Ｔ // Ｂ２９Ｌ 31:34 ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 6 Identification code Office reference number FI technical display location H01L 21/56 T // B29L 31:34
Claims (2)
片面に、複数のクリーニング樹脂を金型キャビティの位
置に応じて配置し該基体と一体としてなることを特徴と
するモールド用金型のクリーニング材。1. A cleaning material for a molding die, wherein a plurality of cleaning resins are arranged on at least one surface of a sheet-like or tape-like substrate according to the position of a die cavity and are integrated with the substrate. .
片面に、複数のクリーニング樹脂を金型キャビティの位
置に応じて配置し該基体と一体としてなる金型クリーニ
ング材を、加熱した金型内に挟み込み一定時間加熱加圧
してクリーニング樹脂を硬化させ、その後クリーニング
材を除去することを特徴とするモールド用金型のクリー
ニング方法。2. A mold cleaning material having a plurality of cleaning resins arranged on at least one surface of a sheet or tape-shaped base material in accordance with the position of a mold cavity and integrated with the base body is placed in a heated mold. A method for cleaning a molding die, which comprises heating and pressurizing the cleaning resin for a fixed period of time to cure the cleaning resin, and then removing the cleaning material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6121816A JPH07304044A (en) | 1994-05-11 | 1994-05-11 | Method and material for cleaning mold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6121816A JPH07304044A (en) | 1994-05-11 | 1994-05-11 | Method and material for cleaning mold |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH07304044A true JPH07304044A (en) | 1995-11-21 |
Family
ID=14820647
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6121816A Pending JPH07304044A (en) | 1994-05-11 | 1994-05-11 | Method and material for cleaning mold |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07304044A (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004052610A1 (en) * | 2002-12-06 | 2004-06-24 | Nippon Carbide Kogyo Kabushiki Kaisha | Cleaning material for molding metal die, and cleaning method |
| EP1813406A1 (en) | 2006-01-27 | 2007-08-01 | Nitto Denko Corporation | Sheet for regenerating a mold |
| JP2007196587A (en) * | 2006-01-27 | 2007-08-09 | Nitto Denko Corp | Mold regenerating sheet |
| JP2007196586A (en) * | 2006-01-27 | 2007-08-09 | Nitto Denko Corp | Mold regenerating sheet |
| JP2007242924A (en) * | 2006-03-09 | 2007-09-20 | Renesas Technology Corp | Manufacturing method of semiconductor device |
| JP2008132759A (en) * | 2006-10-23 | 2008-06-12 | Nitto Denko Corp | Sheet for regenerating mold |
| JP2008143144A (en) * | 2006-12-13 | 2008-06-26 | Nitto Denko Corp | Sheet for mold reproduction |
| CN100408296C (en) * | 2002-12-06 | 2008-08-06 | 日本碳化物工业株式会社 | Cleaning material for molding metal die, and cleaning method |
| US7537967B2 (en) | 2001-05-18 | 2009-05-26 | Renesas Technology Corp. | Mold cleaning sheet and manufacturing method of a semiconductor device using the same |
| KR20130056162A (en) * | 2011-11-21 | 2013-05-29 | 닛토덴코 가부시키가이샤 | Mold cleaning sheet |
| CN111673960A (en) * | 2020-06-17 | 2020-09-18 | 苏州德林泰精工科技有限公司 | Substrate packaging and encapsulating mold cleaning method based on resin gasket |
-
1994
- 1994-05-11 JP JP6121816A patent/JPH07304044A/en active Pending
Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7943432B2 (en) | 2001-05-18 | 2011-05-17 | Renesas Electronics Corporation | Mold cleaning sheet and manufacturing method of a semiconductor device using the same |
| US7537967B2 (en) | 2001-05-18 | 2009-05-26 | Renesas Technology Corp. | Mold cleaning sheet and manufacturing method of a semiconductor device using the same |
| WO2004052610A1 (en) * | 2002-12-06 | 2004-06-24 | Nippon Carbide Kogyo Kabushiki Kaisha | Cleaning material for molding metal die, and cleaning method |
| CN100408296C (en) * | 2002-12-06 | 2008-08-06 | 日本碳化物工业株式会社 | Cleaning material for molding metal die, and cleaning method |
| US7553784B2 (en) | 2002-12-06 | 2009-06-30 | Nippon Carbide Kogyo Kabushiki Kaisha | Cleaning material for molding metal die, and cleaning method |
| EP1813406A1 (en) | 2006-01-27 | 2007-08-01 | Nitto Denko Corporation | Sheet for regenerating a mold |
| JP2007196587A (en) * | 2006-01-27 | 2007-08-09 | Nitto Denko Corp | Mold regenerating sheet |
| JP2007196586A (en) * | 2006-01-27 | 2007-08-09 | Nitto Denko Corp | Mold regenerating sheet |
| TWI414410B (en) * | 2006-01-27 | 2013-11-11 | Nitto Denko Corp | Sheet for regenerating a mold |
| KR101296981B1 (en) * | 2006-01-27 | 2013-08-14 | 히타치가세이가부시끼가이샤 | Sheet for recycling mold |
| JP2007242924A (en) * | 2006-03-09 | 2007-09-20 | Renesas Technology Corp | Manufacturing method of semiconductor device |
| JP2008132759A (en) * | 2006-10-23 | 2008-06-12 | Nitto Denko Corp | Sheet for regenerating mold |
| JP2008143144A (en) * | 2006-12-13 | 2008-06-26 | Nitto Denko Corp | Sheet for mold reproduction |
| KR20130056162A (en) * | 2011-11-21 | 2013-05-29 | 닛토덴코 가부시키가이샤 | Mold cleaning sheet |
| CN103128884A (en) * | 2011-11-21 | 2013-06-05 | 日东电工株式会社 | Mold cleaning sheet |
| CN105538556A (en) * | 2011-11-21 | 2016-05-04 | 日东电工株式会社 | Mold cleaning sheet |
| CN111673960A (en) * | 2020-06-17 | 2020-09-18 | 苏州德林泰精工科技有限公司 | Substrate packaging and encapsulating mold cleaning method based on resin gasket |
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