JPH0513643A - Lead frame for trial shot and method for removing resin-formed material from lead frame - Google Patents

Abstract

PURPOSE:To re-use a lead frame used for a cleaning shot, which cleans a resin sealing die for semiconductor resin sealing, and for the trial shot of semiconductor resin sealing. CONSTITUTION:A lead frame for a trial shot is provided with at least an area 4 which is equivalent to resin-formed material and a punched-out aligning hole 1 so as to permit the resin-formed material formed by the trial shot to be removed from the lead frame extremely easily.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lead frame used for trial driving in a semiconductor resin encapsulation process, and a method for removing a resin molded product from the lead frame.

[0002]

2. Description of the Related Art FIG. 6 shows a semiconductor lead frame used in a semiconductor assembly process (for example, see Japanese Patent Laid-Open No. 64-53567). In the figure, 1 is a positioning hole, 2 is a tie bar for preventing the sealing resin from flowing out in a state of being positioned by the positioning hole 1, 3 is an outer lead outside the tie bar 2, and 13 is an inner side inside the tie bar 2. Leads 14 are die pads on which chips are placed. The conventional semiconductor lead frame is configured as described above, and when this lead frame is put in a resin sealing mold (see, for example, Japanese Patent Laid-Open No. 59-148343) and is resin-sealed as a trial shot, the sealing resin is used. Passes through the inner leads 13 and the die pad 14 and stops at the tie bar 2, and the sealing resin cures to form a resin molded product 5 (see FIG. 2). The resin molding 5 obviously surrounds the die pad 14 and the inner lead 1 is attached to the lead frame.
3 is in close engagement.

[0003]

In the semiconductor resin encapsulation process, an ordinary semiconductor lead frame shown in FIG. 6 is conventionally used for performing a test shot and a cleaning shot for cleaning a resin encapsulation mold. Was. Once such a lead frame is resin-sealed, it cannot be reused, so this lead frame must be discarded.
Therefore, there is a problem that unnecessary material costs are required. The present invention has been made to solve the above problems, and an object of the present invention is to provide a lead frame that can be reused for trial striking, to reduce the cost, and to efficiently use the lead frame. It is intended to provide a method for removing a resin molded product.

[0004]

A lead frame used for trial punching according to the present invention has at least a region corresponding to a resin molding and a positioning hole. As one means for obtaining the lead frame, the inner lead and die pad inside the tie bar of the ordinary semiconductor lead frame may be punched out. The method of removing the resin molded product in order to reuse the lead frame used for trial driving is to take out the lead frame with the resin molded product from the resin sealing mold and use it for the resin molded product. The resin molded product is removed from the lead frame by placing it on a plate having the above-mentioned opening and further placing a flat plate thereon, and the resin molded product is extruded below the plate through the opening of the plate.

[0005]

Since the lead frame used for trial driving in the present invention does not have the inner lead inside the tie bar, the resin molded product formed after resin sealing can be easily separated from the lead frame.

[0006]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a lead frame used for trial hitting according to the present invention will be described below with reference to the drawings. In FIG. 1, 1 to 3 are exactly the same as the conventional lead frames for semiconductors. Reference numeral 4 is an area where the inner lead and the die pad inside the tie bar 2 are punched out. A resin molding is formed in this area. In FIG. 2, reference numeral 5 denotes a resin molded product obtained by arranging the lead frame used for trial driving shown in FIG. 1 in the resin sealing mold and pouring the sealing resin into the molded product. FIG. 3 shows a state where the resin molded product 5 is separated from the lead frame having the resin molded product 5 shown in FIG. When the lead frame used for the trial shot configured as shown in FIG. 1 is placed in the resin sealing die and the area 4 is resin-sealed, the adhesive surface where the resin molding 5 in FIG. 2 is connected to the lead frame becomes Since the area is only the thickness of the tie bar, the resin molding 5 can be easily separated from the lead frame as shown in FIG. In the above embodiment, the inner lead and die pad on the inner side of the tie bar of the ordinary semiconductor lead frame are punched out to be used for the trial shot, but the same operation can be expected even if the material is changed. Further, the lead frame in FIG. 1 may be plated with good releasability on the sealing resin. Thus, since the mold release property of the encapsulating resin with respect to the lead frame is good, thin burrs and the like can be removed from the lead frame from which the resin molding 5 has been removed, and the lead frame can be immediately used for the next trial shot. In the embodiment shown in FIG. 4, a Teflon frame is used as the material. The lead frame used for this trial shot has the area 4 corresponding to the resin molded product and the positioning hole 1, and the same operation as above can be expected. FIG. 5 shows a method of removing the resin molding 5 resin-sealed using the lead frame from the lead frame. In this removing method, (a) first step: the lead frame resin-sealed in the mold is taken out. (B) Second step: the above lead frame is molded with resin 5
The plate 10 is provided with an opening 11 corresponding to the. This plate is shaped so that it can be positioned without changing the shape of the resin sealing mold. (C) Third step: After setting the lead frame on the plate, the iron plate 9 is placed and pressed down from above. Thus,
The resin molding 5 naturally enters the box 12 below the plate 10. Thus, the lead frame from which the resin molded product has been removed can be used for the next trial shot.

[0007]

As described above, according to the present invention, since the inner lead and the die pad inside the tie bar of the lead frame are not provided, the lead frame used in the trial driving can be reused, and the cost can be significantly reduced. Can be expected. Further, as a method for removing the resin molded product from the lead frame that has been trial-striked, since the plate that can be set in the state where the resin sealing is completed is used, the resin molded product can be efficiently removed.

[Brief description of drawings]

FIG. 1 is a diagram showing an embodiment of a lead frame used for trial driving according to the present invention.

FIG. 2 is a diagram showing a state in which a resin is sealed by a resin sealing die by trial driving.

FIG. 3 is a view showing that the resin molded product shown in FIG. 2 can be easily separated from a lead frame.

FIG. 4 is a view showing still another embodiment of the lead frame used for the trial shot according to the present invention.

FIG. 5 is a diagram showing a method for removing a resin molded product from the lead frame used for the trial shot according to the present invention.

FIG. 6 is a view showing a conventional ordinary semiconductor lead frame.

[Explanation of symbols]

1 Positioning hole 2 tie bars 3 outer leads Area corresponding to 4 resin moldings 5 Resin molding 9 iron plate 10 plates 11 openings 13 Inner lead 14 die pad

Claims (2)

[Claims] 1. A lead frame used for trial punching, wherein at least a region corresponding to a resin molded product and a positioning hole are punched out. 2. A method of removing a resin molded product so that a lead frame used for trial striking can be reused after the trial striking, wherein the lead frame used for the trial striking is prepared from within a resin sealing mold. Then, the resin molded product is taken out and placed on a plate having an opening corresponding to the resin molded product, and a flat plate is placed on the plate to press the resin molded product from the lead frame, and the resin molded product is removed from the lead frame through the opening of the plate. A method for removing a resin molded product, which is characterized by extruding into