JPH07210295A - Digitizer sensor plate and its production - Google Patents

Abstract

PURPOSE:To provide an inexpensive and highly accurate digitizer sensor plate of an electromagnetic induction system which can attain the common use of a sensor wiring frame base and also can attain the automatic of its production process. CONSTITUTION:The sensor wiring pins 2 are molded in a single body at the circumferential part of a square bottom surface 3, and a box-shaped transparent hard wiring frame 1 contains a lead wire draw-out port 5 on a circumferential wall 4 provided along the edge of the bottom 3. An insulated sensor wire 6 is hooked between both pins 2 set on the sides opposite to each other and returned in wiring together with a lead wire 10 drawn out of the port 5. Then a transparent hard flat plate 8 is provided to seal up the frame 1, together with a visible light hardening type adhesive 9 which is injected between the frame 1 and the plate 8 to fix a sensor wire orthogonal wiring net 7. In such a constitution, a digitizer sensor plate is obtained.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electromagnetic induction type digitizer sensor plate used for an information input device such as CAD.

[0002]

2. Description of the Related Art Conventionally, as an electromagnetic induction type digitizer sensor plate, for example, an insulating sensor wire such as a magnet wire is laid in each of the X-axis direction and the Y-axis direction on a rectangular hard insulating flat plate. A sensor wire orthogonal wiring network is formed, and the sensor wire orthogonal wiring network is filled and fixed on the insulating flat plate with an adhesive. The sensor wire orthogonal wiring network is the insulating flat plate and another insulating flat plate. Those which are configured to be sandwiched and fixed with an adhesive in between have been generally used.

By the way, the above-mentioned digitizer sensor plate is generally manufactured as follows. That is, referring to FIG. 10, first, a plurality of sensor wire arranging pins 21 are arranged in a predetermined pattern on the outer periphery of the rectangular hard insulating flat plate 20. Here, in order to arrange the sensor wire laying pins 21 in a predetermined pattern, different sensor wire laying frame bases (not shown) are used depending on the size and pattern of the sensor plate. Next, the insulated sensor wire 26 made of a magnet wire is connected to the wiring pins 21 on the opposite sides,
Hook between 21 and fold it back to fold the sensor wire 22
And forming a sensor wire orthogonal wiring net 23. Then, an ultraviolet curable adhesive 24 is applied onto the sensor wire orthogonal wiring network 23, another insulating flat plate 25 is disposed on the applied adhesive 24, and the sensor wire orthogonal wiring network 23 is bonded. Two insulating flat plates 20, 25 through the agent 24
It is sandwiched and fixed by and is irradiated with ultraviolet rays. And the adhesive 2
After curing of No. 4, the sensor wire folded portion 22 removed from the sensor wire wiring pin 21 is bent to the end faces of the two insulating flat plates 20 and 25, and the folded folded portion 22 is further bonded by an adhesive 24 to the insulating flat plates 20 and 25. Was manufacturing a digitizer sensor plate by sticking to the end face of the.

[0004]

By the way, when the digitizer sensor plate is manufactured by the above-described manufacturing method, the sensor wire arranging pins 21 can be arranged in a predetermined pattern on the outer periphery of the insulating flat plate 20. In addition to the need for a wiring frame for each pattern, there is a drawback that a special device for irradiating ultraviolet rays to cure the adhesive 24 is required. In addition, after the adhesive 24 is cured, the sensor wire folded-back portion 22 is removed from the sensor wire wiring pin 21 to remove the two insulating flat plates 2 from each other.
The number of steps is large because the work of bending the end faces of 0, 25 and fixing with the adhesive 24 is required, and the work of removing the sensor wire folding portion 22 from the sensor wire wiring pin 21 is a manual work. It was easy to break the line 26. Further, the sensor wire 26 is easily fixed in the scratched state, and there is a problem that the sensor wire 26 is broken due to distortion after the fixation. For this reason, the digitizer sensor plate has become expensive.

The object of the present invention is to solve these problems, to enable sharing of the sensor wire laying frame base required for each pattern, and to provide an inexpensive digitizer sensor plate for automating the manufacturing process and its manufacture. It provides a method.

[0006]

A box formed by integrally molding a sensor wire arranging pin on a peripheral portion of a quadrangular bottom surface, and providing a lead wire outlet on a peripheral wall provided along each edge of the bottom surface. -Shaped transparent hard wiring frame or a rectangular transparent hard insulating plate with sensor wire wiring pins integrally molded on the periphery, hook the insulated sensor wires between the pins on opposite sides, and fold them back. Sensor wire orthogonal wiring network is formed, a transparent hard flat plate on the orthogonal wiring network, or a box-shaped transparent hard storage frame provided with lead wire outlets on the peripheral wall is arranged, and the sensor wire is provided from the outlet. Of the lead wire, the visible light curable adhesive is injected from the outlet, and the orthogonal wiring network is fixed to form the digitizer sensor plate.

Further, at least one of the transparent hard wiring frame and the transparent hard flat plate, or at least one of the transparent hard insulating plate and the transparent hard storage frame, the transparent hard wiring frame and the transparent hard flat plate, or the transparent hard wiring plate. A projection for supporting and fixing the hard insulating plate and the transparent hard storage frame at a constant interval may be provided, and the transparent hard wiring frame, or even a peripheral surface of the transparent hard insulating plate may be provided with an inclined surface toward the outside. Good.

Further, a colored plate for light diffusion may be arranged on the orthogonal wiring net, and a transparent hard wiring frame and a transparent hard flat plate,
Or a combination of transparent hard insulation board and transparent hard storage frame,
A transparent conductive paint is applied and fixed to the outer surface of the wiring frame and the transparent hard flat plate, or the surface of the transparent hard insulating plate and the transparent hard storage frame, and the magnetic shielding function is provided on the conductive paint of the wiring frame or the hard insulating plate. It is advisable to fix the VDT filter having

[0009]

Since the sensor wire laying pin is integrally molded with the wire laying frame or the transparent hard insulating plate, the sensor wire laying frame base for arranging the wire laying pins in a predetermined pattern is commonly used. .
Further, since it is not necessary to remove the sensor wire folding portion from the sensor wire arranging pin, workability is improved and disconnection of the sensor wire is prevented. Further, since the projections for supporting and fixing the wiring frame and the hard flat plate at a constant interval are provided, the interval between the sensor wire and the sensor surface becomes constant, and the sensor sensitivity on the sensor surface becomes constant. In addition, the wiring frame and the rigid insulating plate can be made thinner and lighter by providing inclined surfaces in the periphery of the wiring frame and the transparent rigid insulating plate. The wires are closely attached and accurately laid.

Further, since the VDT filter having a magnetic shielding function is fixed on the transparent conductive paint, when the digitizer sensor plate is mounted on the cathode ray tube display device, it is not affected by noise due to magnetism on the cathode ray tube device side. It enables highly reliable and highly accurate input work. Further, since the visible light curing adhesive is used to fix the sensor wire orthogonal wiring network, no special irradiation device is required, mass production is facilitated, the manufacturing process is simplified, and the cost is low and high. A quality digitizer sensor plate is obtained.

[0011]

The present invention will be described below with reference to the drawings. Figure 1
FIG. 9 is an explanatory view showing the essential structure of an embodiment of the digitizer sensor plate according to the present invention. In the digitizer sensor plate of the embodiment shown in FIG. 1, sensor wire arranging pins 2 are integrally molded on the periphery of a rectangular bottom surface 3, and lead wire outlets 5 are provided on a peripheral wall 4 provided at each edge of the bottom surface 3. Box-shaped transparent hard wiring frame 1, a sensor wire orthogonal wiring network 7 in which insulating sensor wires 6 are orthogonally wired between the pins 2 and 2 on each of the opposite sides, and the sensor wire orthogonal wiring A transparent hard flat plate 8 arranged on the net 7,
A visible light curable adhesive 9 for fixing the sensor wire orthogonal wiring network 7 is used.

The digitizer sensor plate is manufactured as follows. First, the wiring frame 1 (or the transparent hard insulating plate 11 as shown in FIG. 4) in a horizontal state with the bottom surface 3 facing downward is fixed to a frame base (not shown) for wiring the sensor wires orthogonally. Next, the insulated sensor wire 6 made of a magnet wire or the like is sequentially hooked between the pins 2 and 2 on each of the opposite sides and orthogonally wired while being folded back to form a sensor wire orthogonal wiring network 7.

Next, a transparent hard flat plate 8 (or a box-shaped transparent hard storage frame 12 having a lead wire lead-out port 5 on the peripheral wall 4 as shown in FIG. 4) is arranged on the orthogonal wiring network 7. At the same time, the lead wire 10 of the sensor wire 6 is led out from the lead-out port 5. Here, using a syringe, the outlet 5
The visible light curable adhesive 9 is injected from the above, and the adhesive 9 is irradiated with sunlight which is visible light to cure the adhesive 9 to manufacture the digitizer sensor plate.

The adhesive 9 is injected and cured by the wiring frame 1
Since (or the transparent hard insulating plate 11) and the like can be removed from the wiring frame and sequentially performed, the wiring frame can be efficiently used and the productivity is improved.

In the digitizer sensor plate of the embodiment shown in FIG. 2, the transparent hard wiring frame 1 shown in FIG.
Is integrally formed with a rectangular transparent hard insulating plate 11, and the transparent hard flat plate 8 is formed with a box-shaped transparent hard storage frame 12 in which a lead wire lead-out port 5 is provided in the peripheral wall 4.

In the digitizer sensor plate of the embodiment shown in FIGS. 3 and 4, the transparent hard wiring frame 1 and the transparent hard flat plate 8 or the transparent hard insulating plate 11 and the transparent hard storage frame 12 are supported and fixed at fixed intervals. The projections 13 for doing so are provided on the transparent hard wiring frame 1 or the transparent hard insulating plate 11. With such a configuration, the distance between the sensor line and the sensor surface becomes constant, and the input sensitivity is uniform, and highly accurate input work is performed.

The digitizer sensor plates of the embodiments shown in FIGS. 5 and 6 are made of a combination of the transparent hard wiring frame 1 and the transparent hard flat plate 8 or the transparent hard insulating plate 11 and the transparent hard storage frame 12 and are cloths on the respective outer sides. Wire frame 1 and hard flat plate 8 or hard insulating plate 1
1 and a transparent conductive paint 14 is applied and fixed to the surfaces of the storage frame 12 and the housing frame 12, and a VDT filter 15 having a magnetic shielding function is further fixed on the transparent conductive paint 14 of the wiring frame 1 or the hard insulating plate 11. Is a digitizer sensor plate. With such a configuration, when the digitizer sensor plate is mounted on the cathode ray tube display device or the like, highly accurate input work can be performed without receiving noise due to magnetism on the cathode ray tube device side.

The digitizer sensor plate of the embodiment shown in FIGS. 7 and 8 is provided with inclined surfaces 16 facing outwards on the bottom surface 3 of the transparent hard wiring frame 1 and the peripheral portions of the transparent hard insulating plate 11, respectively. The sensor wire arranging pin 2 is arranged in the structure 16. With such a configuration, the transparent hard wiring frame 1 or the transparent hard insulating plate 11 can be made thinner and lighter, and the sensor wire can be closely attached to the surface of the wiring frame 1 or the insulating plate 11 with high accuracy. Can be lined.

In the digitizer sensor plate of the embodiment shown in FIG. 9, a light diffusing colored plate 17 is arranged on the sensor wire orthogonal wiring network 7, and the light diffusing colored plate 17 is preliminarily set in the transparent hard storage frame 12.
It is configured by being fixed by an adhesive.

Since the digitizer sensor plate shown in FIGS. 2 to 9 is manufactured in the same manner as the digitizer sensor plate shown in FIG. 1, detailed description thereof will be omitted.

[0021]

As described above, the digitizer sensor plate of the present invention is a wiring frame in which sensor wire wiring pins are integrally molded,
Alternatively, a transparent hard insulating plate is used. Therefore, a plurality of wiring frame bases, which were conventionally required to arrange the wiring pin in a predetermined pattern, are no longer required, and the frame base is shared. Further, since it is not necessary to remove the folded portion of the sensor wire from the pin for laying the sensor wire, disconnection of the sensor wire is eliminated, and automation of the digitizer sensor plate manufacturing process becomes possible. Furthermore, the use of a visible light curable adhesive eliminates the need for a special irradiation device and facilitates the curing of the adhesive, resulting in mass production of digitizer sensor plates. As a result, an inexpensive electromagnetic induction type digitizer sensor plate having no disconnection and excellent quality is obtained, and its practical effect is great.

[Brief description of drawings]

1A and 1B are explanatory views showing an embodiment of a digitizer sensor plate of the present invention, FIG. 1A is a plan view showing a partial cross section thereof, and FIG. 1B is a line AA of FIG. 1A. FIG.

FIG. 2 is a sectional view showing another embodiment of the present invention.

FIG. 3 is a sectional view showing another embodiment of the present invention.

FIG. 4 is a sectional view showing another embodiment of the present invention.

FIG. 5 is a cross-sectional view showing another embodiment of the present invention.

FIG. 6 is a sectional view showing another embodiment of the present invention.

FIG. 7 is a sectional view showing another embodiment of the present invention.

FIG. 8 is a sectional view showing another embodiment of the present invention.

FIG. 9 is a cross-sectional view showing another embodiment of the present invention.

FIG. 10 is an explanatory diagram showing a conventional example of a method for manufacturing a digitizer sensor plate.

[Explanation of symbols]

 1 Transparent Hard Wiring Frame 2 Sensor Wire Wiring Pin 3 Bottom 4 Circumferential Wall 5 Lead Wire Outlet 6 Insulated Sensor Wire 7 Sensor Wire Orthogonal Wiring Network 8 Transparent Hard Flat Plate 9 Visible Light Curing Adhesive 10 Lead Wire 11 Transparent Hard Insulation plate 12 Transparent hard storage frame 13 Protrusion 14 Transparent conductive paint 15 VDT filter 16 Inclined surface 17 Color plate for light diffusion

Claims (6)

[Claims] 1. A plurality of sensor wire arranging pins 2 are integrally molded on a peripheral portion of a quadrangular bottom surface 3, and a peripheral wall 4 provided along each edge of the bottom surface 3 is provided with a lead-out port 5 for a lead wire 10. A box-shaped transparent hard wiring frame 1 or a rectangular transparent hard insulating plate 11 integrally formed with a plurality of sensor wiring wiring pins 2 in the peripheral portion between the pins 2 and 2 on opposite sides. A box in which the insulated sensor wires 6 are hooked and folded back to form a sensor wire orthogonal wiring net 7, and the transparent hard flat plate 8 is provided on the orthogonal wiring net 7 or the lead wire outlet 5 is provided on the peripheral wall 4. -Shaped transparent rigid storage frame 12 is provided, the lead wire 10 of the sensor wire 6 is led out from the lead-out port 5, and the lead-out port 5 is also provided.
The visible light curable adhesive 9 is injected from the
A digitizer sensor plate characterized in that it is configured by fixing. 2. The transparent hard wiring frame 1 and the transparent hard flat plate 8
At least one of them, or at least one of the transparent hard insulating plate 11 and the transparent hard storage frame 12, the transparent hard wiring frame 1 and the transparent hard flat plate 8 or the transparent hard insulating plate 1
The digitizer sensor plate according to claim 1, further comprising a protrusion 13 for supporting and fixing the transparent hard storage frame 1 and the transparent rigid storage frame 12 at a constant interval. 3. A slanting surface 16 directed outward is provided at a peripheral portion of the transparent hard wiring frame 1 or the transparent hard insulating plate 11.
The digitizer sensor plate according to claim 1 or 2, wherein the wiring pin 2 is provided on the inclined surface 16. 4. The wiring frame 1 and the hard flat plate 8, which are the outer sides of the combination of the transparent hard wiring frame 1 and the transparent hard flat plate 8, or the combination of the transparent hard insulating plate 11 and the transparent hard storage frame 12,
Alternatively, the transparent conductive paint 14 is applied and fixed on the surfaces of the insulating plate 11 and the housing frame 12, and the VDT filter 15 having a magnetic shielding function is fixed on the conductive paint 14 of the transparent hard wiring frame 1 or the transparent hard insulating plate 11. The digitizer sensor plate according to claim 1, 2 or 3, characterized in that. 5. A colored plate 17 for light diffusion is arranged on the sensor wire orthogonal wiring network 7,
The digitizer sensor plate described in 3 or 4. 6. The insulated sensor wire 6 is hooked in order between the pins 2 of each of the opposite sides of the box-shaped transparent wiring frame 1 or the rectangular transparent hard insulating plate 11 and folded back. A sensor wire orthogonal wiring network 7 is formed, and a transparent hard flat plate 8 or a box-shaped transparent hard storage frame 12 having a lead wire outlet 5 on the peripheral wall 4 is arranged on the sensor wire orthogonal wiring network 7. The lead wire 10 of the sensor wire 6 is led out from the outlet 5, the visible light curable adhesive 9 is injected from the outlet 5, and the visible light curable adhesive 9 is irradiated with visible light to cause the adhesive 9 Is cured, and the sensor wire orthogonal wiring network 7 is attached to the wiring frame 1 and the hard flat plate 8 or the hard insulating plate 11 and the hard storage frame 1
2. The method according to claim 1, characterized in that it is fixed between the two.
The method for manufacturing a digitizer sensor plate according to 3, 4, or 5.